2SP0115T2C0-12

SCALE™-2 2SP0115T2C0-12 2SP0115T2C0-12 Preliminary Data Sheet Compact, high-performance, plug-and-play dual-channel IGBT driver based on SCALE™-2 technology for individual and parallel-connected modules Abstract The SCALE™-2 plug-and-play driver 2SP0115T2C0-12 is a compact dual-channel intelligent gate driver designed for 1200V 17mm dual IGBT modules. The driver features an electrical interface with a built-in DC/DC power supply. The turn-on and turn-off gate resistors of both channels are not assembled in order to provide maximum flexibility. They must be assembled by the user before start of operation. Please refer to the paragraph on “Gate Resistor Assembly” for the recommended gate resistors. For drivers adapted to other types of high-power and high-voltage IGBT modules, refer to www.power.com/igbt-driver/go/plug-and-play Features Applications  Plug-and-play solution  Allows parallel connection of IGBT modules  Shortens application development time  Extremely reliable; long service life  Built-in DC/DC power supply  20-pin flat cable interface  Duty cycle 0... 100%  Active clamping of V at turn-off  IGBT short-circuit protection  Monitoring of supply voltage  Safe isolation to EN 50178  UL compliant  Suitable for 1200V 17mm dual IGBT modules  Gate resistors not assembled ce www.power.com/igbt-driver  Wind-power converters  Industrial drives  UPS  Power-factor correctors  Traction  Railroad power supplies  Welding  SMPS  Radiology and laser technology  Research  and many others  Page 1 SCALE™-2 2SP0115T2C0-12 Preliminary Data Sheet Safety Notice! The data contained in this data sheet is intended exclusively for technically trained staff. Handling all highvoltage equipment involves risk to life. Strict compliance with the respective safety regulations is mandatory! Any handling of electronic devices is subject to the general specifications for protecting electrostatic-sensitive devices according to international standard IEC 60747-1, Chapter IX or European standard EN 100015 (i.e. the workplace, tools, etc. must comply with these standards). Otherwise, this product may be damaged. Important Product Documentation This data sheet contains only product-specific data. For a detailed description, must-read application notes and common data that apply to the whole series, please refer to “Description & Application Manual for 2SP0115T SCALE-2 IGBT Drivers” on www.power.com/igbt-driver/go/2SP0115T. The gate resistors on this gate driver are not assembled in order to provide maximum flexibility. For the gate resistors required for specific IGBT modules, refer to the paragraph on “Gate Resistor Assembly”. Use of gate resistors other than those specified may result in failure. Mechanical Dimensions Dimensions: Refer to “Description & Application Manual for 2SP0115T SCALE-2 IGBT Drivers” Mounting principle: Soldered onto 17mm dual IGBT module Absolute Maximum Ratings Parameter Remarks Min Supply voltage VCC Logic input and output voltages SOx current Gate peak current Iout Average supply current ICC Output power per gate Turn-on gate resistance Turn-off gate resistance Switching frequency f Test voltage (50Hz/1min.) VCC to GND To GND Fault condition, total current Note 1 Note 2 Ambient temperature ≤70°C (Note 3) Ambient temperature ≤85°C (Note 3) Note 15 Note 15 Note 20 Primary to secondary (Note 16) 0 16 V -0.5 VCC+0.5 V 20 mA -8 +15 A 290 mA 1.2 W 1 W 1.3 Ω 1.8 Ω n.d. kHz 3800 VAC(eff) DC-link voltage |dV/dt| Secondary to secondary (Note 16) Note 4 Rate of change of input to output voltage www.power.com/igbt-driver Max Unit 3800 VAC(eff) 800 V 50 kV/μs Page 2 SCALE™-2 2SP0115T2C0-12 Preliminary Data Sheet Parameter Remarks Operating voltage Operating temperature Storage temperature Primary/secondary, secondary/secondary Min Max Unit -40 -40 1200 +85 +90 Vpeak °C °C Recommended Operating Conditions Parameter Remarks Min Typ Max Unit Supply voltage VCC Resistance from TB to GND To GND Blocking time≠0, ext. value 14.5 128 15 15.5 ∞ V kΩ Min Typ Max Unit Electrical Characteristics Power Supply Remarks Supply current ICC Efficiency η Coupling capacitance Cio Without load Internal DC/DC converter Primary side to secondary side, total, per channel Power Supply Monitoring Remarks Min Typ Max Unit Supply threshold VCC 11.9 11.3 0.35 12.1 11.5 0.35 5 4.7 0.15 12.6 12.0 13.3 12.7 12.6 12.0 13.1 12.5 5.15 4.85 5.3 5 Monitoring hysteresis Primary side, clear fault Primary side, set fault (Note 5) Primary side, set/clear fault Secondary side, clear fault Secondary side, set fault (Note 6) Secondary side, set/clear fault Secondary side, clear fault Secondary side, set fault (Note 6) Secondary side, set/clear fault V V V V V V V V V Logic Inputs and Outputs Remarks Min Typ Max Unit Input impedance Turn-on threshold Turn-off threshold SOx pull-up resistor to VCC SOx output voltage V(INx)=15V (Note 7) V(INx) (Note 8) V(INx) (Note 8) On board Fault condition, I(SOx)550V (Note 9) After the response time (Note 10) After fault (Note 11) Timing Characteristics Remarks Turn-on delay td(on) Turn-off delay td(off) Jitter of turn-on delay Jitter of turn-off delay Output rise time tr(out) Output fall time tf(out) Dead time between outputs Jitter of dead time Transmission delay of fault state Note 12 Note 12 Note 18 Note 18 Gx to Ex (Note 13) Gx to Ex (Note 13) Half-bridge mode (Note 19) Half-bridge mode Note 14 Outputs Remarks Turn-on gate resistor Rg(on) Turn-off gate resistor Rg(off) Gate voltage at turn-on Gate-voltage at turn-off Note 15 Note 15 P=0W P=1.2W Gate resistance to COMx Min Typ Max 10.2 5.4 1.4 90 Min Typ V μs μs ms Max 80 60 ±2 ±2 5 10 3 ±50 400 Min Typ Unit Unit ns ns ns ns ns ns μs ns ns Max not assembled not assembled 15 -9.2 -7.1 4.7 Unit Ω Ω V V V kΩ Electrical Isolation Remarks Min Typ Max Unit Test voltage (50Hz/1s) Primary to secondary side (Note 16) 3800 3850 3900 Veff Secondary to secondary side (Note 16) 3800 3850 3900 Partial discharge extinction volt. Primary to secondary side (Note 17) Secondary to secondary side (Note 17) Primary to secondary side 1220 1200 12.6 Vpeak Vpeak mm Secondary to secondary side 6.6 mm Primary to NTC 6.5 mm Primary to secondary side Secondary to secondary side Primary to NTC 12.3 6.6 6.5 mm mm mm Creepage distance Clearance distance Veff All data refer to +25°C and VCC=15V unless otherwise specified www.power.com/igbt-driver Page 4 SCALE™-2 2SP0115T2C0-12 Preliminary Data Sheet Footnotes to the Key Data 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14) 15) 16) 17) 18) 19) 20) The gate current is limited by the gate resistors located on the driver. If the specified value is exceeded, this indicates a driver overload. It should be noted that the driver is not protected against overload. If the specified value is exceeded, this indicates a driver overload. It should be noted that the driver is not protected against overload. From 70°C to 85°C, the maximum permissible output power can be linearly interpolated from the given data. This limit is due to active clamping. Refer to the “Description & Application Manual for 2SP0115T SCALE-2 IGBT Drivers”. Undervoltage monitoring of the primary-side supply voltage (VCC to GND). If the voltage drops below this limit, a fault is transmitted to the corresponding outputs and the IGBTs are switched off. Undervoltage monitoring of the secondary-side supply voltage (Visox to Veex and Veex to COMx which correspond with the approximate turn-on and turn-off gate-emitter voltages). If the corresponding voltage drops below this limit, the IGBT is switched off and a fault is transmitted to the corresponding output. The input impedance can be modified (customer-specific solution). Turn-on and turn-off threshold values can be modified (customer-specific solution). The resulting pulse width of the direct output of the gate drive unit for short-circuit type I (excluding the delay of the gate resistors) is the sum of response time plus delay to IGBT turn-off. The turn-off event of the IGBT is delayed by the specified time after the response time. Factory set value. The blocking time can be reduced with an external resistor. Refer to the “Description & Application Manual for 2SP0115T SCALE-2 IGBT Drivers”. Measured from the transition of the turn-on or turn-off command at the driver input to direct output of the gate drive unit (excluding the delay of the gate resistors). Output rise and fall times are measured between 10% and 90% of the nominal output swing with an output load of 10Ω and 40nF. The values are given for the driver side of the gate resistors. The time constant of the output load in conjunction with the present gate resistors leads to an additional delay at the load side of the gate resistors. Transmission delay of the fault state from the secondary side to the primary status outputs. The gate resistors are not assembled on this IGBT gate driver. They must be assembled by the user according to the paragraph on “Gate Resistor Assembly”. HiPot testing (= dielectric testing) must generally be restricted to suitable components. This gate driver is suited for HiPot testing. Nevertheless, it is strongly recommended to limit the testing time to 1s slots as stipulated by EN 50178. Excessive HiPot testing at voltages much higher than 850V AC(eff) may lead to insulation degradation. No degradation has been observed over 1min. testing at 3800VAC(eff). The transformer of every production sample shipped to customers has undergone 100% testing at the given value or higher (