LNK454/456-458/460 LinkSwitch-PL Family
™
LED Driver IC with TRIAC Dimming, Single-Stage PFC and Constant Current Control for Non-Isolated Applications
Product Highlights
Dramatically Simplifies Off-line LED Drivers • Flicker-free phase-controlled TRIAC dimming • Single stage power factor correction and accurate constant current (CC) output • Very low component count with small non-electrolytic bulk capacitor for compact replacement lamp designs • Compact SO8, eSOP, and eDIP packages • Completely eliminates control loop compensation Advanced Performance Features • Optimized for non-isolated flyback designs • Frequency jitter greatly reduces EMI filter size and costs • Low dissipation direct sensing of LED current Advanced Protection and Safety Features • Cycle skipping regulation for abnormally low output power to clamp peak output current delivered • 725 V integrated power MOSFET allows small bulk capacitance and maximizes power capability • Short-circuit, overload, open feedback and output overvoltage protection • Hysteretic thermal shutdown • Meets high-voltage creepage between DRAIN and all other pins both on PCB and at package EcoSmart™ - Energy Efficient • High power factor optimizes system lumen per input VA • Control algorithm balances switching and conduction losses over line and load to maintain optimum efficiency
Figure 1.
AC IN
D
LinkSwitch-PL
CONTROL BP
S
FB
PI-5835-060710
Basic Application Schematic.
Output Power Table
Product 2 LNK454D LNK456D LNK457D/K/V LNK458K/V LNK460K/V 85-265 VAC Minimum Output Maximum Output Power Power1 1.5 W 3W 3W 6W 4W 8W 6W 11.5 W 8W 16 W
Description
The LinkSwitch-PL family enables a very small and low cost single-stage power factor corrected constant current driver for solid state lighting. Optimized for direct LED current sensing, the LinkSwitch-PL operates over a wide input voltage range delivering an output power of up to 16 W. The LinkSwitch-PL control algorithm provides flicker-free TRIAC dimming with minimal external components. Each device incorporates a 725 V rated power MOSFET, a novel discontinuous mode variable frequency variable on-time controller, frequency jitter, cycle by cycle current limit and hysteretic thermal shutdown in a monolithic 4-pin IC, available in SO-8C, eSOP-12, and eDIP-12 packages.
Table 1. Output Power Table. Notes: 1. Maximum practical continuous power in an open frame design with adequate heat sinking, measured at +50 °C ambient (see Key Applications Considerations for more information). 2. Packages: D: SO-8C, K: eSOP-12, V: eDIP-12.
Output Current
Number of Serial LEDs 1 2 3 4 5 6 7 8 9 10 11 12
Figure 2.
350 mA LNK454 LNK454 LNK456 LNK456 LNK457 LNK457 LNK458 LNK458 LNK458 LNK460 LNK460 LNK460
500 mA LNK454 LNK456 LNK456 LNK457 LNK458 LNK458 LNK460 LNK460 LNK460
700 mA LNK454 LNK456 LNK457 LNK458 LNK460 LNK460
1000 mA LNK456 LNK457 LNK458 LNK460
Device Selection Based on Length of Output LED Series String and Current. A Typical Voltage Drop of 3.5 V per LED is Assumed.
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November 2010
LNK454/456-458/460
BYPASS (BP) UV 4.9 V ILIM
REGULATOR 5.85 V
DRAIN (D)
ILIM
+
V_ILIM SOA Q VFB(SK)
+
SET
S
CURRENT LIMIT SOA STATE MACHINE
Q
CLR
R
UV
VFB(LO)
+
IFB 1 µA FEEDBACK (FB)
+
VREF DAC
PHASE MEASUREMENT
Zero Crossing
+
V_ZLIM
FILTER Update CLK
DIGITAL INTEGRATOR INC/DEC FREQUENCY/ DUTY CYCLE CONTROLLER
AUTO-RESTART
S
SET
Q
R ON-TIME EXTENSION
CLR
Q
PI-5893-091010
SOURCE (S)
Figure 2.
Functional Block Diagram.
Pin Functional Description
DRAIN (D) Pin: High-voltage power MOSFET drain connection. The internal start-up bias current is drawn from this pin through a switched high-voltage current source. Drain current sensing and associated controller functions are also performed using this pin. SOURCE (S) Pin: Power MOSFET source connection. Ground reference for BYPASS and FEEDBACK pins. BYPASS (BP) Pin: Connection point for the external bypass capacitor for the internally generated 5.85 V supply. FEEDBACK (FB) Pin: LED current sensing pin. During normal operation the 290 mV threshold determines the average value of the current flowing through the load sense resistor. A second threshold clamps excessive output current ripple. A third higher threshold is used to protect against output short-circuit and overvoltage conditions (see Figure 5).
D Package (SO-8C)
FB BP 1 2 8 7 6 D 4 5 S S S S Exposed Pad (On Bottom) Internally Connected to SOURCE Pin
K Package (eSOP-12) NC 1 FB 2 BP 3 NC 4 NC 5 D6 12 S 11 S 10 S 9S 8S 7S
Exposed Pad Internally Connected to SOURCE Pin
V Package (eDIP-12)
S 12 S 11 S 10 S9 S8 S7 1 NC 2 FB 3 BP 4 NC 5 NC 6D
PI-5836a-092710
Figure 3.
Pin Configuration (Top View).
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LNK454/456-458/460
DES
DZOV
AC IN
RES
D
ROV
LinkSwitch-PL
CONTROL BP
S
FB
CF
RSENSE
RF
PI-5837-060710
Figure 4.
Typical Application Schematic.
Functional Description
The LinkSwitch-PL combines a high-voltage power MOSFET switch with a power supply controller in one device. The IC provides a single stage power factor correction plus LED current control. The LinkSwitch-PL controller consists of an oscillator, feedback (sense and logic) circuit, 5.85 V regulator, hysteretic over-temperature protection, frequency jittering, cycle-by-cycle current limit, loop compensation circuitry, autorestart, switching on-time extension, power factor and constant current control. In a direct LED current sensing configuration, the average FEEDBACK pin voltage is a replica of the LED current, scaled by the sense resistor (RSENSE in Figure 4). A small low-pass filter (RF and CF in Figure 4) reduces high frequency noise at the FEEDBACK pin. Figure 5 illustrates the operating regions of the FEEDBACK pin voltage. The LinkSwitch-PL sets its operating point such that the average FEEDBACK pin voltage in steady-state operation is 290 mV. This threshold is set low to minimize the sensing resistor dissipation. The internal MOSFET switching frequency and on-time are updated once every input AC half-cycle to regulate the output current and maintain high power factor. If the FEEDBACK pin peak voltage exceeds 520 mV, cycle skipping mode is triggered and the power processed by the integrated power MOSFET is clamped on a cycle-by-cycle basis. Switching frequency may vary during an input voltage half-cycle to reduce thermal stress on the output LEDs.
Auto-restart protection is triggered by a FEEDBACK pin voltage in excess of 2 V. This feature can be used to provide output overvoltage protection (via DZOV and ROV, in Figure 4), which triggers the IC to enter auto-restart.
Auto-Restart
2V
Cycle Skipping Mode
520 mV
Normal Operation
290 mV
PI-5838-091010
Figure 5.
FEEDBACK Pin Operational Voltage Thresholds.
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LNK454/456-458/460
VFB ϕOS ϕOL ϕOL ϕOS
VFB(ϕ)
VFB(ϕ)
Phase Angle 0° VLINE VTRIAC 180° 0° 180°
Phase Angle
ϕ 0° Phase Angle Conduction Angle
Phase Angle 0° Conduction Angle Trailing Edge Dimmers
ϕ Phase Angle
Phase Angle
Leading Edge TRIAC Dimmers
PI-5894a-091010
Figure 6.
Feedback Voltage vs. Phase Angle Dimming Characteristics.
TRIAC (Phase-Controlled) Dimming
The LinkSwitch-PL integrates several features to improve dimming range and reduce external circuit complexity when using a phase-controlled TRIAC dimmer. The output LED current is controlled by the FEEDBACK pin voltage which changes proportionally to the TRIAC dimmer conduction angle. When the conduction angle decreases, the voltage at the FEEDBACK pin decreases causing the average LED current to decrease. The FEEDBACK pin reference voltage adjustment is initiated at approxi-mately 25% of the AC line half-cycle duration. When this (jOS) threshold is exceeded, VFB and the output LED current are reduced until a second phase angle threshold is reached. At this point, with the TRIAC conduction angle being very limited, the IC runs open loop at constant frequency and duty cycle (j OL region) and the integrated power MOSFET processes as much power as the heavily chopped input voltage will allow creating a light output that is deeply dimmed. The 520 mV clamping feedback threshold is also linearly reduced during dimming to control LED current ripple.
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LNK454/456-458/460
IC Supply and BYPASS Pin The internal 5.85 V regulator charges the bypass capacitor connected to the BYPASS pin to 5.85 V by drawing current from the voltage on the DRAIN pin whenever the power MOSFET is off. The BYPASS pin is the internal supply voltage node. When the power MOSFET is on, the device operates from the energy stored in the bypass capacitor. Extremely low power consumption of the internal circuitry allows LinkSwitch-PL to operate continuously from current it takes from the DRAIN pin. A bypass capacitor value of 1 µF is sufficient for both high frequency decoupling and energy storage. Dimming applications may require a higher bypass capacitor value. During phase angle dimming when the conduction angle is small the AC input voltage is present for only short periods of time. In that case the IC should not rely on the integrated high voltage current source, but instead external bias circuitry should be used to supply the IC from the output (DES and RES in Figure 4). If the output voltage is less than 7 V, external bias circuitry should be implemented. This is accomplished by adding an auxiliary winding on the transformer, which is then rectified and filtered via a diode (ultrafast) and capacitor. The winding voltage (turns) should be selected such that the maximum IC consumption can be supported at the lowest operating output current. Start-up, Switching Frequency and On-time Range At start-up the controller uses an initial switching frequency fMIN and minimum on-time tON(MIN). The charging of the output capacitor together with the energy delivery to the output LEDs determines a step-by-step increase of the power MOSFET switching frequency and on-time updated every half-cycle of the AC input voltage. The steady state switching frequency and on-time are determined by the line voltage, voltage drop across the LEDs and converter efficiency. At light load when the device reaches the minimum frequency fMIN and on-time tON(MIN), the controller regulates by skipping cycles. In this mode of operation the input current is not power factor corrected and the average output current is not guaranteed to fall within the normal range. The FEEDBACK pin cycle skipping threshold is reduced from approximately twice the normal regulation level down to just above the level required to limit output power delivery under these conditions. A properly designed supply will not operate in this mode under normal load conditions. A power supply designed correctly will operate within the switching frequency range [fMIN … fMAX ], with an on-time falling between tON(MIN) and tON(MAX) when connected to a normal load. Overload Protection In case of overload, the system will increase the operating frequency and on-time each AC half-cycle until the maximum frequency and maximum on-time are reached. When this state is reached, the controller enters auto-restart protection, thus inhibiting the gate of the power MOSFET for approximately 1.28 s if the main line frequency is 50 Hz, 1.02 s if it is 60 Hz. After this auto-restart off-time expires, the power MOSFET is re-enabled and a normal start-up is initiated, i.e. at fMIN and tON(MIN), stepping up until regulation is achieved again. In case of a persistent overload condition, the auto-restart duty cycle DCAR is ~33%. Overload protection is inhibited during phase dimming when the TRIAC conduction duty cycle is less than 60%. Output Overvoltage Protection If a no-load condition is present on the output of the supply, the output overvoltage Zener (DZOV in Figure 4) will conduct once its threshold is reached. A voltage VOV in excess of VFB(AR) = 2 V will appear across the FEEDBACK pin and the IC will enter autorestart. Output Short-Circuit If the output of the supply (i.e. the LED load) is short-circuited, then a large amount of energy will be delivered to the sense resistor, generating a high voltage at the FEEDBACK pin. If this condition develops more than 2 V on the FEEDBACK pin, then the IC will interpret this event as an output short-circuit and will enter auto-restart. Safe Operating Area (SOA) Protection If 3 consecutive cycles of the power MOSFET are prematurely terminated due to the power MOSFET current exceeding the current limit after the leading edge blanking time, SOA protection mode is triggered and the IC will enter auto-restart. Hysteretic Thermal Shutdown The thermal shutdown circuitry senses the die junction temperature. The thermal shutdown threshold is set to 142 °C typical with a 75 °C hysteresis. When the die temperature rises above this threshold (142 °C) the power MOSFET is disabled and remains disabled until the die temperature falls by 75 °C, at which point the power MOSFET is re-enabled.
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Rev. A 11/01/10
LNK454/456-458/460
LinkSwitch-PL Application Example
The circuit shown in Figure 7 provides a single constant current output of 350 mA with an LED string voltage of 15 V. The output current can be reduced using a standard AC mains TRIAC dimmer down to 1% (3 mA) without instability and flickering of the LED load. The board is compatible with both low cost leading edge and more sophisticated trailing edge dimmers. The board was optimized to operate over the universal AC input voltage range (85 VAC to 265 VAC, 47 Hz to 63 Hz) but suffers no damage over an input range of 0 VAC to 300 VAC. This increases field reliability and lifetime during line sags and swells. LinkSwitch-PL based designs provide high power factor (>0.9 at 115 VAC / 230 VAC) and low THD ( VFB(SK), TJ = 25 °C 725 50 fMAIN = 50 Hz fMAIN = 60 Hz 1.28 1.02 33
s %
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Typical Performance Characteristics
PI-6005-060210
DRAIN Capacitance (pF)
DRAIN Current (A)
100
Scaling Factors: LNK454 0.3 LNK456 0.6 LNK457 1.0 LNK458 1.55 LNK460 3.1
1 0.8 0.6 0.4 0.2
Scaling Factors: LNK454 0.3 LNK456 0.6 LNK457 1.0 LNK458 1.55 LNK460 3.1 LNK457 TCASE = 25 °C LNK457 TCASE = 100 °C
10
0
0
100
200
300
400
500
600
0 0
Figure 8.
2
4
6
8 10 12 14 16 18 20
DRAIN Voltage (V)
Figure 7. Drain Capacitance vs. Drain Voltage.
DRAIN Voltage (V)
Drain Current vs. Drain Voltage.
PI-2213-012301
Breakdown Voltage (Normalized to 25 °C)
Current Limit (Normalized to 25 °C)
1 0.8 0.6 0.4 0.2
1.0
0.9 -50 -25
Figure 9.
0
25
50
75 100 125 150
0 -50
0 50 100 150
Junction Temperature ( °C)
Breakdown vs. Temperatue.
Figure 10. Standard Current Limit vs. Temperature.
Temperature (°C)
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Rev. A 11/01/10
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PI-6209-102910
1.1
1.2
PI-6006-060210
1000
1.2
LNK454/456-458/460
SO-8C (D Package)
4 B 2 4.90 (0.193) BSC A 8 4 5 GAUGE PLANE 0.10 (0.004) C A-B 2X DETAIL A
D
2 3.90 (0.154) BSC
6.00 (0.236) BSC
SEATING PLANE C 1.04 (0.041) REF 0-8
0.10 (0.004) C D 2X Pin 1 ID 1.27 (0.050) BSC 1 4 0.20 (0.008) C 2X 7X 0.31 - 0.51 (0.012 - 0.020) 0.25 (0.010) M C A-B D 1.25 - 1.65 (0.049 - 0.065) 0.10 (0.004) C 7X SEATING PLANE C H
0.25 (0.010) BSC
0.40 (0.016) 1.27 (0.050)
1.35 (0.053) 1.75 (0.069) 0.10 (0.004) 0.25 (0.010)
DETAIL A
0.17 (0.007) 0.25 (0.010)
Reference Solder Pad Dimensions
Notes: 1. JEDEC reference: MS-012. 2.00 (0.079) 4.90 (0.193) 2. Package outline exclusive of mold flash and metal burr. 3. Package outline inclusive of plating thickness. 4. Datums A and B to be determined at datum plane H. 5. Controlling dimensions are in millimeters. Inch dimensions are shown in parenthesis. Angles in degrees.
PI-4526-040110
D07C
1.27 (0.050)
0.60 (0.024)
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Rev. A 11/01/10
LNK454/456-458/460
eSOP-12 (K Package)
0.356 [9.04] Ref. 0.316 [8.03] Ref. 0.010 [0.25] Ref.
2
0.004 [0.10] C A 2X 2X 7 0.004 [0.10] C B 0.059 [1.50] Ref, Typ 0.059 [1.50] Ref, Typ
0.055 [1.40] Ref.
Pin #1 I.D. (Laser Marked)
0.400 [10.16]
H
12
0.010 [0.25] Gauge Plane 0°- 8° Seating Plane 0.034 [0.85] 0.026 [0.65]
C
0.460 [11.68]
0.350 [8.89]
2
0.213 [5.41] Ref.
DETAIL A (Not drawn to scale)
B
0.008 [0.20] C 2X, 6 Lead Tips
1
2
3
4
5
6
0.023 [0.58] 12× 0.018 [0.46] 0.010 (0.25) M C A B TOP VIEW
3
4
6
1
0.070 [1.78]
0.028 [0.71] Ref.
0.049 [1.23] 0.046 [1.16]
BOTTOM VIEW 0.020 [0.51] Ref.
0.019 [0.48] Ref. 0.022 [0.56] Ref.
0.098 [2.49] 0.086 [2.18]
0.032 [0.80] 0.029 [0.72] Seating Plane Detail A SIDE VIEW
0.092 [2.34] 0.086 [2.18]
3
0.016 [0.41] 0.011 [0.28] 12×
0.006 [0.15] 0.000 [0.00] Seating plane to package bottom standoff
0.004 [0.10] C
C
0.306 [7.77] Ref.
END VIEW
0.067 [1.70]
0.217 [5.51]
Land Pattern Dimensions 12 11 10 0.321 [8.15] 9 8 7 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimensions noted are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. Maximum mold protrusion is 0.007 [0.18] per side. 3. Dimensions noted are inclusive of plating thickness. 4. Does not include inter-lead flash or protrusions. 5. Controlling dimensions in inches [mm]. 6. Datums A & B to be determined at Datum H.
1 0.028 [0.71] 2 3 4 5 6 0.429 [10.90]
PI-5748-082510
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LNK454/456-458/460
eDIP-12 (V Package)
0.004 [0.10] C A
2
Pin #1 I.D. (Laser Marked) 2X 0.004 [0.10] C B
2
0.316 [8.03] Ref. 1 234 5 6
Seating Plane 0.010 [0.25] Ref.
C
0.016 [0.41] 12× 0.011 [0.28] 6
7
0.400 [10.16]
A
1
0.059 [1.50] Ref, typ. Pin #1 I.D. (Laser Marked)
0.350 [8.89]
0.412 [10.46] Ref. 0.213 [5.41] 0.306 [7.77] Ref. Ref.
0.400 [10.16]
0.436 [11.08] 0.406 [10.32] 7
8
0.059 [1.50] Ref, typ. 12 34 0.023 [0.58] 12× 0.018 [0.46] 0.010 [0.25] M C A B BOTTOM VIEW
B
12 11 10 9 8 TOP VIEW
7 Detail A 0.104 [2.65] Ref. END VIEW 5 ° 4° ±
0.019 [0.48] Ref.
0.356 [9.04] Ref.
0.092 [2.34] 0.086 [2.18] 0.049 [1.23] 0.046 [1.16] 0.022 [0.56] Ref.
H
0.192 [4.87] Ref. 0.070 [1.78] 0.020 [0.51] Ref. 0.028 [0.71] Ref. DETAIL A (Not drawn to scale) Notes: 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Dimensions noted are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. Maximum mold protrusion is 0.007 [0.18] per side. 3. Dimensions noted are inclusive of plating thickness. 4. Does not include inter-lead flash or protrusions. 5. Controlling dimensions in inches [mm]. 6. Datums A & B to be determined at Datum H. 7. Measured with the leads constrained to be perpendicular to Datum C. 8. Measured with the leads unconstrained. 9. Lead numbering per JEDEC SPP-012.
PI-5556-110210
0.031 [0.80] 0.028 [0.72]
SIDE VIEW
0.07 [1.78]
0.03 [0.76]
Mounting Hole Pattern Dimensions
0.400 [10.16]
Drill Hole 0.03 [0.76] Round Pad 0.05 [1.27] Solder Mask 0.056 [1.42]
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Rev. A 11/01/10
LNK454/456-458/460
Part Ordering Information
• LinkSwitch Product Family • PL Series Number • Package Identifier D K V G Blank
LNK 454 D G - TL
SO-8C eSOP-12 eDIP-12 GREEN: Halogen Free and RoHS Compliant Standard Configurations Tape & Reel, 2.5 k pcs minimum for D package, 1 k pcs minimum for K package.
• Package Material • Tape & Reel and Other Options TL
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Rev. A 11/01/10
Revision A
Notes Initial Release
Date 11/01/10
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Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. Patent Information The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. Life Support Policy POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, EcoSmart, Clampless, E-Shield, Filterfuse, StakFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©2010, Power Integrations, Inc.
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