LQA16T300 Qspeed™ Family
300 V, 16 A Q-Series Diode
Product Summary
IF(AVG) VRRM QRR (Typ at 125 °C) IRRM (Typ at 125 °C) Softness tb/ta (Typ at 125 °C) 16 300 44 2.65 0.7 A V nC A
General Description
This device has the lowest QRR of any 300 V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers.
Applications Pin Assignment
• AC/DC and DC/DC output rectification • Output and freewheeling diodes • DC-AC Inverters
Features
• Low QRR, Low IRRM, Low tRR • High dIF/dt capable (1000A/µs) • Soft recovery
Benefits
A C
TO-220AC RoHS Compliant
Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21.
• Increases efficiency • Eliminates need for snubber circuits • Reduces EMI filter component size & count • Enables extremely fast switching
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Symbol
VRRM IF(AVG) IFSM IFSM TJ(MAX) TSTG PD
Parameter
Peak repetitive reverse voltage Average forward current Non-repetitive peak surge current Non-repetitive peak surge current Maximum junction temperature Storage temperature Lead soldering temperature Power dissipation
Conditions
TJ = 150 °C, TC = 104 °C 60 Hz, ½ cycle ½ cycle of t=28 µs Sinusoid, TC=25 °C
Rating
300 16 100 350 150 –55 to 150 300 65.8
Units
V A A A °C °C °C W
Leads at 1.6 mm from case, 10 sec TC = 25 °C
Thermal Resistance
Symbol
RθJA RθJC
Resistance from:
Junction to ambient Junction to case
Conditions
TO-220 TO-220
Rating
62 1.9
Units
°C/W °C/W
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January 2011
LQA16T300
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
Symbol
IR VF CJ tRR QRR IRRM S
Parameter
Reverse current Forward voltage Junction capacitance Reverse recovery time Reverse recovery charge Maximum reverse recovery current
Conditions
VR = 300V, TJ = 25 °C VR = 300V, TJ = 125 °C IF = 16A, TJ = 25 °C IF = 16A, TJ = 150 °C VR = 10V, 1 MHz dI/dt =200A/µs VR=200V,IF=16A dI/dt =200A/µs VR=200V,IF=16A dI/dt =200A/µs VR=200V,IF=16A TJ=25 °C TJ=125 °C TJ=25 °C TJ=125 °C TJ =25 °C TJ=125 °C TJ =25 °C TJ=125 °C
Min
-
Typ
0.45 1.6 1.4 50 13 25 11.5 44 1.5 2.65 0.7 0.7
Max
25 1.9 15 1.85 -
Units
µA mA V V pF ns ns nC nC A A
DC Characteristics
Dynamic Characteristics
t Softness factor = b
ta
dI/dt =200A/µs VR=200V,IF=16A
Note to component engineers: Q-Series diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups. (For additional details, see Application Note AN-300.)
VR
L1
D1 DUT
IF dIF/dt
0
tRR ta tb 0.1xIRRM IRRM
15V
Pulse generator
+
Rg Q1
Figure 1. Reverse Recovery Definitions
Figure 2. Reverse Recovery Test Circuit
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LQA16T300
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
50 45 40 35 I F ( A) 30 25 20 15 10 5 0 0.0 0.5 1.0 VF (V) 1.5 2.0 2.5 Tj=25C Tj=125C
I F ( A)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 VF (V) 0.6 0.7 0.8 0.9 1.0 Tj=25C Tj=125C
Figure 3. Typical IF vs VF
200 180 160 140 100 80 60 40 20 0 0 20 40 60 80 100 120 140 160 180 VR (V)
IF(AV) (A) Cj (pF)
Figure 4. Typical IF vs VF
40 35 30 25 20 15 10 5 0 25 50 75 100 125 150 Case Temperature, T C (o C)
120
Figure 5. Typical Typical Cj vs VR
Figure 6. DC Current Derating Curve
80 70 60
QRR (nC)
dI/dt=500A/us
28 26 24
tRR (ns)
dI/dt=200A/us
22 20 18 16 14 dI/dt=500A/us
50 40 30 20 2 4 6 8 10 IF (A) 12 14 16 18 dI/dt=200A/us
2
4
6
8
10 IF (A)
12
14
16
18
Figure 7. Typical QRR vs IF at TJ = 125 °C
Figure 8. Typical tRR vs IF at TJ = 125 °C
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LQA16T300
80 70 60 50 P (W) 40 30 20 10 0 25 50 75 100
o
125
150
60 55 50 45 40 35 30 25 20 15 10 5 0 25 50 75 100 T C(°C) 125
duty cycle=10% duty cycle=30% duty cycle=50% DC
IF (PEA K) (A )
Case Temperature, TC ( C)
150
Figure 9. Power Derating Curve
Figure 10. IF(PEAK) vs TC, f=70 kHz
LQA16T300
1
D= 0.5 D = 0.3
D= 0.1
0.1
Zth(j-c)/Rth(j-c)
D= 0.05
D= 0.02
D= 0.01
0.01
D= 0.005 D= 0.002
Single Pulse
0.001 1.E-06
1.E-05
1.E-04
1.E-03 t1(sec)
1.E-02
1.E-01
1.E+00
Figure 10. Normalized Maximum Transient Thermal Impedance
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Rev 1.7 01/11
LQA16T300
Dimensional Outline Drawings
Millimeters Dim A A1 A2 C D E E1 F F1 H H1 H2 H3 H4 L L1 MIN MAX
4.32 1.14 2.03 0.34 9.65 2.49 4.98 0.508 1.14 14.71 5.84 8.51 3.53 2.54 12.70 -
4.70 1.40 2.79 0.610 10.67 2.59 5.18 1.016 1.78 16.51 6.55 9.25 3.96 3.05 14.22 6.35
Mechanical Mounting Method
Screw through hole in package tab Clamp against package body
Maximum Torque / Pressure specification
1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2
Soldering time and temperature: This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more details.
Ordering Information
Part Number
LQA16T300
Package
TO-220AC
Packing
50 units/tube
The information contained in this document is subject to change without notice.
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Rev 1.7 01/11
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LQA16T300
Revision 1.6 1.7
Notes Released by Qspeed Converted to Power Integrations Document
Date 05/09 01/11
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LQA16T300
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