LQA20T300C

LQA20T300C, LQA20B300C Qspeed™ Family 300 V, 20 A Q-Series Common-Cathode Diode Product Summary IF(AVG) per diode VRRM QRR (Typ at 125 °C) IRRM (Typ at 125 °C) Softness tb/ta (Typ at 125 °C) 10 300 38 2.3 0.7 A V nC A General Description This device has the lowest QRR of any 300 V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. Applications Pin Assignment • AC/DC and DC/DC output rectification • Output & freewheeling diodes • Motor drive circuits • DC-AC inverters Features TO-220AB LQA20T300C TO-263AB LQA20B300C • Low QRR, Low IRRM, Low tRR • High dIF/dt capable (1000A/µs) • Soft recovery A1 A1 A2 Benefits • Increases efficiency • Eliminates need for snubber circuits • Reduces EMI filter component size & count • Enables extremely fast switching K RoHS Compliant Package uses Lead-free plating and Green mold compound.Halogen free per IEC 61249-2-21. Absolute Maximum Ratings Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Symbol VRRM IF(AVG) IFSM IFSM TJ TSTG PD Parameter Peak repetitive reverse voltage Average forward current Non-repetitive peak surge current Non-repetitive peak surge current Maximum junction temperature Storage temperature Lead soldering temperature Power dissipation Conditions Per Diode, TJ = 150 °C, TC = 115 °C Per Device, TJ = 150 °C, TC = 115 °C 60 Hz, ½ cycle ½ cycle of t = 28 µs Sinusoid, TC = 25 °C Rating 300 10 20 80 350 150 –55 to 150 300 52 Units V A A A A °C °C °C W Leads at 1.6mm from case, 10 sec TC = 25 °C Thermal Resistance Symbol RθJA RθJC Resistance from: Junction to ambient Junction to case Conditions TO-220AB (only) Per Diode Per Device Rating 62 2.4 1.2 Units °C/W °C/W °C/W www.powerint.com January 2011 LQA20T300C, LQA20B300C Electrical Specifications at TJ= 25 °C (unless otherwise specified) Symbol IR VF CJ Parameter Reverse current per diode Forward voltage per diode Junction capacitance per diode Reverse recovery time, per diode Reverse recovery charge, per diode Maximum reverse recovery current, per diode Conditions VR = 300 V, TJ = 25 °C VR = 300 V, TJ = 125 °C IF = 10 A, TJ = 25 °C IF = 10 A, TJ = 150 °C VR = 10 V, 1 MHz Min - Typ 0.32 1.58 1.36 33 Max 25 1.9 - Units µA mA V V pF DC Characteristics per diode Dynamic Characteristics per diode tRR QRR IRRM dIF/dt =200 A/µs VR=200, IF=10 A dIF/dt =200 A/µs VR=200, IF=10 A dIF/dt =200 A/µs VR=200, IF=10 A dIF/dt =200 A/µs VR=200, IF=10 A TJ=25 °C TJ=125 °C TJ=25 °C TJ =125 °C TJ =25 °C TJ=125 °C TJ =25 °C TJ=125 °C 12.6 24 10.2 38 1.3 2.3 0.7 0.7 16 1.7 ns ns nC nC A A S t Softness per diode= b ta Note to component engineers: Q-Series diodes employ Schottky technologies in their design and construction. Therefore, component engineers should plan their test setups to be similar to traditional Schottky test setups. (For further details, see application note AN-300.) VR L1 D1 DUT IF dIF/dt 0 tRR ta tb 0.1xIRRM IRRM 15V Pulse generator + Rg Q1 Figure 1. Reverse Recovery Definitions Figure 2. Reverse Recovery Test Circuit 2 www.powerint.com Rev 1.5 01/11 LQA20T300C, LQA20B300C Electrical Specifications at TJ= 25 °C (unless otherwise specified) 20 18 16 14 IF (A) 12 10 8 6 4 2 0 0.0 0.5 1.0 VF ( V) 1.5 2.0 Tj=25C IF (A) 1.0 0.9 Tj=125C Tj=125C 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.1 0.2 0.3 0.4 Tj=25C 0.5 VF ( V) 0.6 0.7 0.8 0.9 1.0 Figure 3. Typical IF vs VF Figure 4. Typical IF vs VF 120 100 80 IF(AV) (A) 30 25 20 15 10 5 0 C j ( pF) 60 40 20 0 0 20 40 60 80 100 120 140 160 180 VR (V) 25 50 75 100 o 125 150 Case Temperature, TC ( C) Figure 5. Typical Cj vs VR Figure 6. DC Current Derating Curve 80 70 60 QRR (nC) tRR (ns) 30 25 dIF /dt=200A/us 50 40 30 20 10 0 0 2 4 6 IF (A) 8 10 dIF /dt=500A/us 20 15 dIF /dt=500A/us 10 5 0 dIF /dt=200A/us 12 14 0 2 4 6 I F (A) 8 10 12 14 Figure 7. Typical QRR vs IF at Tj=125 °C Figure 8. Typical tRR vs IF at Tj=125 °C 3 Rev 1.5 01/11 www.powerint.com LQA20T300C, LQA20B300C 60 50 40 P (W) 30 20 10 0 25 50 75 100 o 125 150 50 45 40 35 30 25 20 15 10 5 0 25 50 75 100 T C(°C) 125 duty cycle=10% duty cycle=30% duty cycle=50% DC IF(PEAK) (A) Case Temperature, TC ( C) 150 Figure 9. Power Derating Curve Figure 10. IF(Peak) vs TC, f=70 kHz LQA20x300C 1 D= 0.5 D = 0.3 D= 0.1 0.1 Zth(j-c)/Rth(j-c) D= 0.05 D= 0.02 D= 0.01 0.01 D=0.005 D=0.002 Single Pulse 0.001 1.E-06 1.E-05 1.E-04 1.E-03 t1(sec) 1.E-02 1.E-01 1.E+00 Figure 11. Normalized Maximum Transient Thermal Impedance 4 www.powerint.com Rev 1.5 01/11 LQA20T300C, LQA20B300C Dimensional Outline Drawings TO-220AB Q E A A1 Dim A A1 Millimeters MIN 4.32 1.11 2.59 0.77 1.23 0.34 14.71 9.05 9.96 2.44 4.98 12.70 – 3.71 2.54 MAX 4.70 1.38 2.79 1.00 1.36 0.47 15.75 9.25 10.36 2.64 5.18 14.22 3.90 3.96 2.90 øP D D1 A2 b b2 C D b2 L1 D1 E e L b e c e1 A2 e1 L L1 ØP Q Mechanical Mounting Method Screw through hole in package tab Clamp against package body Maximum Torque / Pressure specification 1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2 Millimeters TO-263AB Dim A A1 A2 b b2 c2 D E e H L L1 L2 L3 L4 Θ Θ1 Θ2 MIN 4.40 0.00 2.59 0.77 1.23 1.22 9.05 10.06 2.54 BSC 14.70 2.00 1.17 – 0.25 BSC 2.00 BSC 0° 5° 1° MAX 4.70 0.25 2.79 0.90 1.36 1.32 9.25 10.26 2.54 BSC 15.50 2.60 1.40 1.75 0.25 BSC 2.00 BSC 8° 9° 5° 5 Rev 1.5 01/11 www.powerint.com LQA20T300C, LQA20B300C Soldering time and temperature: This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more details. Ordering Information Part Number LQA20T300C LQA20B300C Package TO-220AB TO-263AB Packing 50 units/tube 800 units/reel The information contained in this document is subject to change without notice. 6 www.powerint.com Rev 1.5 01/11 LQA20T300C, LQA20B300C Revision 1.4 1.5 Notes Released by Qspeed Converted to Power Integrations Document Date 06/10 01/11 7 Rev 1.5 01/11 www.powerint.com LQA20T300C, LQA20B300C For the latest updates, visit our website: www.powerint.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. PATENT INFORMATION The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. 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