LXA03D530

LXA03D530 Qspeed™ Family 530 V, 3 A X-Series Diode Product Summary IF(AVG) 3 General Description A VRRM 530 V QRR (Typ at 125 °C) 75 nC IRRM (Typ at 125 °C) 3.2 A Softness tB/tA (Typ at 125 °C) 0.34 Pin Assignment This device is an extremely low reverse recovery 530 V silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. Applications  High-voltage power rectifier  Power factor correction (PFC) boost diode  Motor drive circuits  DC-AC inverters Features  Low QRR, low IRRM, low tRR  High dIF/dt capable  Soft recovery D Package (SO-8C) LXA03D530 A K RoHS Compliant Package uses lead-free plating and green mold compound. Halogen-free per IEC 61249-2-21. Benefits  Reduces peak reverse voltage  Increases efficiency  Eliminates need for snubber circuits  Reduces EMI filter component size & count  Enables extremely fast switching Absolute Maximum Ratings Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Symbol Parameter Conditions Units 530 V VRRM Peak repetitive reverse voltage IF(AVG) Average forward current TJ = 150 °C, TL = 29 °C 3 A IFSM Non-repetitive peak surge current 60 Hz, ½ cycle, TC = 25 °C 25 A IFSM Non-repetitive peak surge current ½ cycle of t = 28 s Sinusoid, TC = 25 °C 350 A TJ(MAX) Maximum junction temperature 150 °C TSTG Storage temperature –55 to 150 °C PD Power dissipation 4.6 W www.power.com TJ = 25 °C Rating TL = 25 °C April 2015 LXA03D530 Thermal Resistance Symbol Resistance Conditions 2 Rating Units RJA Junction to ambient Soldered to 1 sq. in. (645 mm ), 2 oz. Cu. 80 °C/W RJL Junction to lead Lead temperature measured on pin 7 27 °C/W Electrical Specifications at TJ = 25 C (unless otherwise specified) Symbol Parameter Conditions Min Typ Max Units DC Characteristics IR Reverse current VF Forward voltage CJ Junction capacitance VR = 530 V, TJ = 25 °C - 0.4 250 A VR = 530 V, TJ = 125 °C - 0.275 - mA IF = 3 A, TJ = 25 °C - 1.55 1.71 V IF = 3 A, TJ = 150 °C - 1.33 - V VR = 10 V, 1 MHz - 15 - pF - 25 34.3 ns Dynamic Characteristics tRR Reverse recovery time QRR Reverse recovery charge IRRM Maximum reverse recovery current S Softness factor = tB tA dI/dt = 200 A/s VR = 400 V, IF = 3 A TJ = 25 °C TJ = 125 °C - 33 - ns dI/dt = 200 A/s VR = 400 V, IF = 3 A TJ = 25 °C - 39 55 nC TJ = 125 °C - 75 - nC dI/dt = 200 A/s VR = 400 V, IF = 3 A TJ = 25 °C - 2.2 - A TJ = 125 °C - 3.2 - A dI/dt = 200 A/s VR = 400 V, IF = 3 A TJ = 25 °C - 0.7 - TJ = 125 °C - 0.34 - Note to component engineers: X-Series diodes employ Schottky technologies in their design and construction. Therefore, component engineers should plan their test setups to be similar to those for traditional Schottky test set-ups. (For additional details, see Application Note AN-300.) tRR IF dIF/dt tA tB 0 0.4xIRRM IRRM Figure 1. Reverse Recovery Definitions. Figure 2. Reverse Recovery Test Circuit. 2 www.power.com Rev 1.0 04/15 LXA03D530 Electrical Specifications at TJ = 25 C (unless otherwise specified) Figure 3. Typical IF vs. VF. Figure 4. Typical IF vs. VF. Figure 5. Typical CJ vs. VR. Figure 6. DC Current Derating Curve. Figure 7. Typical QRR vs. IF at TJ = 125 °C. Figure 8. Typical tRR vs. IF at TJ = 125 °C. 3 Rev 1.0 04/15 www.power.com LXA03D530 Electrical Specifications at TJ = 25 C (unless otherwise specified) Figure 9. Power Derating Curve. Figure 10. IF (Peak) vs. TL, f = 70 kHz. LXA03D530 1 D = 0.5 ZTH(JC)/RTH(JC) D = 0.3 0.1 D = 0.1 D = 0.05 D = 0.02 0.01 Single Pulse 0.001 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 t1 (sec) Figure 11. Normalized Maximum Transient Thermal Impedance. 4 www.power.com Rev 1.0 04/15 LXA03D530 5 Rev 1.0 04/15 www.power.com LXA03D530 Ordering Information Part Number Package Packing LXA03D530 SO-8C 2500 units/reel The information contained in this document is subject to change without notice. 6 www.power.com Rev 1.0 04/15 LXA03D530 Revision 1.0 Notes Initial Release. Date 04/15 7 Rev 1.0 04/15 www.power.com LXA03D530 For the latest updates, visit our website: www.power.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. Patent Information The products and applications illustrated herein (including transformer construction and circuits’ external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.power.com/ip.htm. Life Support Policy POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. 2. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, LYTSwitch, InnoSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, HiperLCS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, FluxLink, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2015 Power Integrations, Inc. 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