LXA04T600, LXA04B600 QSpeed™ Family
600 V, 4 A X-Series PFC Diode
Product Summary
IF(AVG) VRRM QRR (Typ at 125 °C) IRRM (Typ at 125 °C) Softness tb/ta (Typ at 125 °C) 4 600 50 2.6 0.8 A V nC A
General Description
This device has the lowest QRR of any 600V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers.
Applications Pin Assignment
K
Power Factor Correction (PFC) Boost Diode Motor drive circuits DC-AC Inverters
K
NC NC
K
K A
Features
Low QRR, Low IRRM, Low tRR High dIF/dt capable (1000A/µs) Soft recovery
A
TO-220AC
LXA04T600
TO-263AB
LXA04B600
Benefits
Increases efficiency Eliminates need for snubber circuits Reduces EMI filter component size & count Enables extremely fast switching
A
K
RoHS Compliant
Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21.
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Symbol
VRRM IF(AVG) IFSM IFSM TJ(MAX) TSTG PD VRRM
Parameter
Peak repetitive reverse voltage Average forward current Non-repetitive peak surge current Non-repetitive peak surge current Maximum junction temperature Storage temperature Lead soldering temperature Power dissipation Peak repetitive reverse voltage
Conditions
TJ = 150 °C, TC = 127 °C 60 Hz, ½ cycle ½ cycle of t=28 μs Sinusoid, TC=25 °C
Rating
600 4 30 350 150 –55 to 150 300 52 600
Units
V A A A °C °C °C W V
Leads at 1.6 mm from case, 10 sec TC = 25 °C
Thermal Resistance
Symbol
RJA RJC
Resistance from:
Junction to ambient Junction to case
Conditions
TO-220 (Only)
Rating
62 2.4
Units
°C/W °C/W
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January 2011
LXA04T600, LXA04B600
Electrical Specifications at TJ= 25 C (unless otherwise specified)
Symbol
IR VF CJ tRR QRR IRRM S
Parameter
Reverse current Forward voltage Junction capacitance Reverse recovery time Reverse recovery charge Maximum reverse recovery current
Conditions
VR = 600V, TJ = 25 °C VR = 600V, TJ = 125 °C IF = 4A, TJ = 25 °C IF = 4A, TJ = 150 °C VR = 10V, 1 MHz dI/dt =200 A/s VR=400 V, IF=4 A dI/dt =200A/s VR=400 V, IF=4 A dI/dt =200 A/s VR=400 V, IF=4 A TJ=25 °C TJ=125 °C TJ=25 °C TJ =125 °C TJ =25 °C TJ=125 °C TJ =25 °C TJ=125 °C
Min
-
Typ
0.45 2.42 2.10 21 18.5 27.5 21.1 50.0 1.75 2.6 0.8 0.8
Max
250 2.96 29.0 2.3 -
Units
A mA V V pF ns ns nC nC A A
DC Characteristics
Dynamic Characteristics
t Softness factor = b
ta
dI/dt =200 A/s VR=400 , IF=4 A
Note to component engineers: QSpeed diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups. (For additional details, see Application Note AN-300.)
VR
L1
D1 DUT
IF dIF/dt
0
tRR ta tb 0.1xIRRM IRRM
15V
Pulse generator
+
Rg Q1
Figure 1. Reverse Recovery Definitions
Figure 2. Reverse Recovery Test Circuit
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Rev 1.4 01/11
LXA04T600, LXA04B600
Electrical Specifications at TJ= 25 C (unless otherwise specified)
16 14 12 10 IF ( A) 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 VF (V) 2.5 3.0 3.5 4.0 Tj=25C Tj=125C Cj ( pF)
100 90 80 70 60 50 40 30 20 10 0 0 20 40 60 80 100 120 140 160 180 VR (V)
Figure 3. Typical IF vs VF
100 90 80 70 QRR (nC) dIF /dt=1000A/us dIF /dt=500A/us
Figure 4. Typical Cj vs VR
40 35 30 25 tRR (ns) dIF /dt=200A/us dIF /dt=500A/us
60 50 40 30 20 10 0 0 2 4 IF (A) 6 8 10 dIF /dt=200A/us
20 15 10 5 0 0 2 4 I F (A) 6 8 10 dIF /dt=1000A/us
Figure 5. Typical QRR vs IF at TJ = 125 °C
18 16 14 12 IF(AV) ( A) P (W) 25 50 75 100
o
Figure 6. Typical tRR vs IF at TJ = 125 °C
60 50 40 30 20 10 0
10 8 6 4 2 0 125 150 Case Temperature, TC ( C)
25
50
75
100
o
125
150
Case Temperature, TC ( C)
Figure 7. DC Current Derating Curve
Figure 8. Power Derating Curve
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LXA04T600, LXA04B600
30 25 20 IF(PEAK) (A) 15 10 5 0 25 50 75 100 T C(°C) 125
duty cycle=10% duty cycle=30% duty cycle=50% DC
150
Figure 9. IF(PEAK) vs TC, f=70 kHz
LXA04T600, LXA04B600
1
D= 0.5
D = 0.3
D= 0.1
0.1 Zth(j-c)/Rth(j-c)
D= 0.05
D= 0.02
D= 0.01
0.01
D=0.005
D=0.002 Single Pulse
0.001 1.E-06
1.E-05
1.E-04
1.E-03 t1(sec)
1.E-02
1.E-01
1.E+00
Figure 10. Normalized Maximum Transient Thermal Impedance
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Rev 1.4 01/11
LXA04T600, LXA04B600
Dimensional Outline Drawings TO-220AC
Millimeters Dim Dim A A1 A2 C D E E1 F F1 H H1 H2 H3 H4 L L1 MIN MIN MAX MAX
4.32 1.14 2.03 0.34 9.65 2.49 4.98 0.508 1.14 14.71 5.84 8.51 3.53 2.54 12.70 -
4.70 1.40 2.79 0.610 10.67 2.59 5.18 1.016 1.78 16.51 6.55 9.25 3.96 3.05 14.22 6.35
Mechanical Mounting Method
Screw through hole in package tab Clamp against package body
Maximum Torque / Pressure specification
1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2
Soldering time and temperature: This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more details.
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LXA04T600, LXA04B600
TO-263AB
Dim A A1 A2 b b2
Millimeters MIN 4.40 0.00 2.59 0.77 1.23 1.22 9.05 10.06 2.54 BSC 14.70 2.00 1.17 – 0.25 BSC 2.00 BSC 0° 5° 1° MAX 4.70 0.25 2.79 0.90 1.36 1.32 9.25 10.26 2.54 BSC 15.50 2.60 1.40 1.75 0.25 BSC 2.00 BSC 8° 9° 5°
Ordering Information
c2 D E e H L L1 L2 L3 L4 Θ Θ1 Θ2
Part Number
LXA04T600 LXA04B600
Package
TO-220AC TO-263AB
Packing
50 units/tube 800 units/reel
The information contained in this document is subject to change without notice.
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Rev 1.4 01/11
LXA04T600, LXA04B600
Revision 1.3 1.4
Notes Released by Qspeed Converted to Power Integrations Document
Date 06/10 01/11
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LXA04T600, LXA04B600
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