LXA08T600, LXA08B600, LXA08FP600 Qspeed™ Family
600 V, 8 A X-Series PFC Diode
Product Summary
IF(AVG) VRRM QRR (Typ at 125 °C) IRRM (Typ at 125 °C) Softness tb/ta (Typ at 125 °C) 8 600 82 3.5 0.55 A V nC A
General Description
This device has the lowest QRR of any 600V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers.
Applications Pin Assignment
K
K
• • •
Power Factor Correction (PFC) Boost Diode Motor drive circuits DC-AC Inverters
NC NC
K
K A
Features
• • • • Low QRR, Low IRRM, Low tRR High dIF/dt capable (1000A/µs) Soft recovery FullPak Insulation = 2500VRMS
A
TO-220AC
LXA08T600
TO-263AB
LXA08B600
Benefits
•
K A
TO-220 FullPak
LXA08FP600
A
K
Increases efficiency • Eliminates need for snubber circuits • Reduces EMI filter component size & count • Enables extremely fast switching
RoHS Compliant
Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21.
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Symbol
VRRM IF(AVG) IFSM IFSM TJ(MAX) TSTG
Parameter
Peak repetitive reverse voltage Average forward current Non-repetitive peak surge current Non-repetitive peak surge current Maximum junction temperature Storage temperature Lead soldering temperature Power dissipation
Conditions
TJ = 150 °C, TC = 122 °C (220AC, 263AB) TJ = 150 °C, TC = 81°C. (FullPak) 60 Hz, ½ cycle ½ cycle of t=28 µs Sinusoid, TC=25 °C
Rating
600 8 60 350 150 –55 to 150 300 83 34
Units
V A A A °C °C °C W W
PD
Leads at 1.6 mm from case, 10 sec TC = 25 °C. (220AC, 263AB) TC = 25°C. (FullPak)
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January 2011
LXA08T600/8B600/8FP600
Thermal Resistance
Symbol
RθJA RθJC
Resistance from:
Junction to ambient Junction to case
Conditions
TO-220AC (Only) TO-220AC, TO-263AB TO-220AC FullPak
Rating
62 1.5 3.7
Units
°C/W °C/W °C/W
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LXA08T600/8B600/8FP600
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
Symbol
IR VF CJ tRR QRR IRRM S
Parameter
Reverse current Forward voltage Junction capacitance Reverse recovery time Reverse recovery charge Maximum reverse recovery current
Conditions
VR = 600V, TJ = 25 °C VR = 600V, TJ = 125 °C IF = 8A, TJ = 25 °C IF = 8A, TJ = 150 °C VR = 10V, 1 MHz dI/dt =200 A/µs VR=400V, IF=8 A dI/dt =200 A/µs VR=400V, IF=8 A dI/dt =200 A/µs VR=400V, IF=8 A TJ=25 °C TJ=125 °C TJ=25 °C TJ =125 °C TJ =25 °C TJ=125 °C TJ =25 °C TJ=125 °C
Min
-
Typ
0.85 2.35 2.1 40 21.5 33 31 82 2.2 3.5 0.74 0.55
Max
250 2.94 34 53 (1) 48 130 (1) 2.8 4.5 (1) -
Units
µA mA V V pF ns ns nC nC A A
DC Characteristics
Dynamic Characteristics
t Softness factor = b
ta
dI/dt =200 A/µs VR=400V, IF=8 A
Note to component engineers: X-Series diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups. (For additional details, see Application Note AN-300.)
VR
L1
D1 DUT
IF dIF/dt
0
tRR ta tb 0.1xIRRM IRRM
15V
Pulse generator
+
Rg Q1
Figure 1. Reverse Recovery Definitions
Figure 2. Reverse Recovery Test Circuit
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LXA08T600/8B600/8FP600
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
24 22 20 18 16 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5
160 140 Tj=125C
Cj ( pF)
120 100 80 60 40 20 0
IF (A)
Tj=25C
2.0 VF (V)
2.5
3.0
3.5
4.0
0
20
40
60
80
100
120
140
160
180
VR (V)
Figure 3. Typical IF vs VF
dI/dt=1000A/us
Figure 4. Typical Cj vs VR
dI/dt=200A/us
160 140 120
QRR (nC)
40 35
dI/dt=500A/us
tRR (ns)
30 25 20 15 10 5
dI/dt=500A/us
100 80 60 40 20 0 2 4 6 IF (A) 8 10 12 14 dI/dt=200A/us
dI/dt=1000A/us
0
2
4
6 IF (A)
8
10
12
14
Figure 5. Typical QRR vs IF at TJ = 125 °C
25 20 I F (A V) ( A) 15 10 5 0 25 50 75 100
o
Figure 6. Typical tRR vs IF at TJ = 125 °C
100 90
TO-220 & TO-263
80 70 P (W) 60 50 40 30 20 10 0 125 150 25 50 75 100
o
TO-220 & TO-263
FullPak
FullPak
125
150
Case Temperature, TC ( C)
Case Temperature, TC ( C)
Figure 7. DC Current Derating Curve
Figure 8. Power Derating Curve
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Rev 1.10 01/11
LXA08T600/8B600/8FP600
55 50 45 40 35 30 25 20 15 10 5 0 25 50 75 100 T C(°C) 125
Duty=10% Duty=30% Duty=50% DC
30 25 20 IF (PEAK) (A) 15 10 5 0
Duty=10% Duty=30% Duty=50% DC
IF (PEA K) (A )
150
25
50
75
100 T C(°C)
125
150
Figure 9. IF(PEAK) vs TC, f=70 kHz, TO-220 and TO-263
Figure 10. IF(PEAK) vs TC, f=70 kHz, FullPak
LXA08T600, LXA08B600
1
D= 0.5 D = 0.3
0.1 Zth(j-c)/Rth(j-c)
D= 0.1
D= 0.05
D= 0.02
D= 0.01
0.01
D= 0.005
D= 0.002
Single Pulse
0.001 1.E-06
1.E-05
1.E-04
1.E-03 t1(sec)
1.E-02
1.E-01
1.E+00
Figure 11. Normalized Maximum Transient Thermal Impedance, TO-220 and TO-263
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LXA08T600/8B600/8FP600
LXA08FP600
1
D= 0.5 D = 0.3
0.1
D= 0.1
D= 0.05
Zth(j-c)/Rth(j-c)
D= 0.02
0.01
D= 0.01 D= 0.005
D= 0.002
0.001
Single Pulse
0.0001 1.E-06
1.E-05
1.E-04
1.E-03 t1(sec)
1.E-02
1.E-01
1.E+00
1.E+01
Figure 12. Normalized Maximum Transient Thermal Impedance, FullPak
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Rev 1.10 01/11
LXA08T600/8B600/8FP600
Dimensional Outline Drawings TO-220AC
Millimeters Dim A A1 A2 C D E E1 F F1 H H1 H2 H3 H4 L L1 MIN MAX
4.32 1.14 2.03 0.34 9.65 2.49 4.98 0.508 1.14 14.71 5.84 8.51 3.53 2.54 12.70 -
4.70 1.40 2.79 0.610 10.67 2.59 5.18 1.016 1.78 16.51 6.55 9.25 3.96 3.05 14.22 6.35
FullPak
D H4 H3 H1 H H2
A
A1
Dim A A1 A2 C D E E1
Millimeters MIN MAX
4.54 2.57 2.51 0.42 10.25
4.80 2.83 2.62 0.58 10.72
2.54 (BSC) 5.08 (BSC) 0.624 1.10 15.86 6.06 9.55 2.95 3.15 13.33 3.18 0.776 1.65 16.12 6.56 9.81 3.05 3.25 14.18 3.43
F1
L1
F F1 H
L F E E1 C A2
H1 H2 H3 H4 L L1
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LXA08T600/8B600/8FP600
TO-263AB
Millimeters Dim A A1 A2 b b2 c2 D E e H L L1 L2 L3 L4 Θ Θ1 Θ2 MIN 4.40 0.00 2.59 0.77 1.23 1.22 9.05 10.06 2.54 BSC 14.70 2.00 1.17 – 0.25 BSC 2.00 BSC 0° 5° 1° MAX 4.70 0.25 2.79 0.90 1.36 1.32 9.25 10.26 2.54 BSC 15.50 2.60 1.40 1.75 0.25 BSC 2.00 BSC 8° 9° 5°
Mechanical Mounting Method
Screw through hole in package tab Clamp against package body
Maximum Torque / Pressure specification
1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2
Soldering time and temperature: This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more details.
Ordering Information
Part Number
LXA08T600, LXA08FP600 LXA08B600
Package
TO-220AC, FullPak TO-263AB
Packing
50 units/tube 800 units/reel
The information contained in this document is subject to change without notice.
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LXA08T600/8B600/8FP600
Revision 1.9 1.10
Notes Released by Qspeed Converted to Power Integrations Document
Date 06/10 01/11
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LXA08T600/8B600/8FP600
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Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. PATENT INFORMATION The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2011 Power Integrations, Inc.
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