LXA10T600, LXA10FP600 Qspeed™ Family
600 V, 10 A X-Series PFC Diode
Product Summary
IF(AVG) VRRM QRR (Typ at 125 °C) IRRM (Typ at 125 °C) Softness tb/ta (Typ at 125 °C) 10 600 94 3.85 0.5 A V nC A
General Description
This device has the lowest QRR of any 600V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers.
Applications Pin Assignment
K
• Power Factor Correction (PFC) Boost Diode • Motor drive circuits • DC-AC Inverters
K A
K A
Features FullPak
LXA10FP600 • • • • Low QRR, Low IRRM, Low tRR High dIF/dt capable (1000A/µs) Soft recovery FullPak Insulation = 2500VRMS
TO-220AC
LXA010T600
A
K
Benefits
• Increases efficiency • Eliminates need for snubber circuits • Reduces EMI filter component size & count • Enables extremely fast switching
RoHS Compliant
Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21.
Absolute Maximum Ratings
Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied.
Symbol
VRRM IF(AVG) IFSM IFSM TJ(MAX) TSTG
Parameter
Peak repetitive reverse voltage Average forward current Non-repetitive peak surge current Non-repetitive peak surge current Maximum junction temperature Storage temperature Lead soldering temperature Power dissipation
Conditions
TJ = 150 °C, TC = 118°C (TO-220AC) TJ = 150 °C, TC = 67°C (FullPak) 60 Hz, ½ cycle ½ cycle of t=28 µs Sinusoid, TC=25 °C
Rating
600 10 70 350 150 –55 to 150 300 89 35
Units
V A A A °C °C °C W W
PD
Leads at 1.6 mm from case, 10 sec TC = 25 °C (TO-220AC) TC = 25 °C (FullPak)
Thermal Resistance
Symbol
RθJC RθJC
Resistance from:
Junction to case Junction to case
Conditions
TO-220AC FullPak
Rating
1.4 3.6
Units
°C/W °C/W
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January 2011
LXA10T600, LXA10FP600
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
Symbol
IR VF CJ tRR QRR IRRM S
Parameter
Reverse current Forward voltage Junction capacitance Reverse recovery time Reverse recovery charge Maximum reverse recovery current
Conditions
VR = 600V, TJ = 25 °C VR = 600V, TJ = 125 °C IF = 10A, TJ = 25 °C IF = 10A, TJ = 150 °C VR = 10V, 1 MHz dI/dt =200A/µs VR=400V, IF=10A dI/dt =200A/µs VR=400V, IF=10A dI/dt =200A/µs VR=400V, IF=10A TJ=25 °C TJ=125 °C TJ=25 °C TJ =125 °C TJ =25 °C TJ=125 °C TJ =25 °C TJ=125 °C
Min
-
Typ
1.2 2.4 2.1 51 23 35 36 94 2.35 3.85 0.75 0.5
Max
250 3.0 54 3.2 -
Units
µA mA V V pF ns ns nC nC A A
DC Characteristics
Dynamic Characteristics
t Softness factor = b
ta
dI/dt =200A/µs VR=400V, IF=10A
Note to component engineers: X-Series diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups. (For additional details, see Application Note AN-300.)
VR
L1
D1 DUT
IF dIF/dt
0
tRR ta tb 0.1xIRRM IRRM
15V
Pulse generator
+
Rg Q1
Figure 1. Reverse Recovery Definitions
Figure 2. Reverse Recovery Test Circuit
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Rev 1.1 01/11
LXA10T600, LXA10FP600
Electrical Specifications at TJ= 25 °C (unless otherwise specified)
30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 0.0 0.5 1.0
200 180 160 140 Cj ( pF) 120 100 80 60 40 20 0
Tj=125C
IF ( A)
Tj=25C
1.5
2.0 VF (V)
2.5
3.0
3.5
4.0
0
20
40
60
80
100
120
140
160
180
VR (V)
Figure 3. Typical IF vs VF
250 200 Q R R (nC) 150 100 dIF /dt=200A/us 50 0 0 2 4 6 8 10 12 14 16 18 20 22 dIF /dt=1000A/u dIF /dt=500A/us
Figure 4. Typical Cj vs VR
50 45 40 35 tR R (ns) 30 25 20 15 10 5 0 0 2 4 6 8 10 12 14 16 18 20 22 IF (A) dIF /dt=1000A/us dIF /dt=500A/us
dIF /dt=200A/us
IF (A)
Figure 5. Typical QRR vs IF at TJ = 125 °
30 25 TO-220 20 IF(AV) ( A)
Figure 6. Typical tRR vs IF at TJ = 125 °C
100 90 80 70 P (W) 60 50 40 30 20 10 0 FullPak
TO-220
15 FullPak 10 5 0 25 50 75 100
o
125
150
25
50
75
100
o
125
150
Case Temperature, TC ( C)
Case Temperature, TC ( C)
Figure 7. DC Current Derating Curve
Figure 8. Power Derating Curve
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LXA10T600, LXA10FP600
55 50 45 40 35 30 25 20 15 10 5 0 25 50 75 100 T C(°C) 125
duty cycle=10% duty cycle=30% duty cycle=50% DC
55 50 45 40 35 30 25 20 15 10 5 0 25 50 75 100 T C(°C) 125
duty cycle=10% duty cycle=30% duty cycle=50% DC
IF (PEAK) (A)
150
IF (PEAK) (A)
150
Figure 9. IF(PEAK) vs TC, f=70 kHz, TO-220
Figure 10. IF(PEAK) vs TC, f=70 kHz, FullPak
LXA10T600
1
D= 0.5 D = 0.3
D= 0.1
0.1 Zth(j-c)/Rth(j-c)
D= 0.05
D= 0.02
D= 0.01
0.01
D=0.005 D=0.002
Single Pulse
0.001 1.E-06
1.E-05
1.E-04
1.E-03 t1(sec)
1.E-02
1.E-01
1.E+00
Figure 11. Normalized Maximum Transient Thermal Impedance, TO-220
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Rev 1.1 01/11
LXA10T600, LXA10FP600
LXA10FP600
1
D= 0.5 D = 0.3
0.1
D= 0.1
D= 0.05
Zth(j-c)/Rth(j-c)
D= 0.02
0.01
D= 0.01
D=0.005
D=0.002
0.001
Single Pulse
0.0001 1.E-06
1.E-05
1.E-04
1.E-03 t1(sec)
1.E-02
1.E-01
1.E+00
1.E+01
Figure 12. Normalized Maximum Transient Thermal Impedance, FullPak
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LXA10T600, LXA10FP600
Dimensional Outline Drawings TO-220AC
Millimeters Dim A A1 A2 C D E E1 F F1 H H1 H2 H3 H4 L L1 MIN MAX
4.32 1.14 2.03 0.34 9.65 2.49 4.98 0.508 1.14 14.71 5.84 8.51 3.53 2.54 12.70 -
4.70 1.40 2.79 0.610 10.67 2.59 5.18 1.016 1.78 16.51 6.55 9.25 3.96 3.05 14.22 6.35
FullPak
D H4 H3 H1 H H2 A A1
Dim A A1 A2 C D E E1 Millimeters MIN MAX
4.54 2.57 2.51 0.42 10.25
4.80 2.83 2.62 0.58 10.72
2.54 (BSC) 5.08 (BSC) 0.624 1.10 15.86 6.06 9.55 2.95 3.15 13.33 3.18 0.776 1.65 16.12 6.56 9.81 3.05 3.25 14.18 3.43
F1
L1
F F1 H
L F E E1 C A2
H1 H2 H3 H4 L L1
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Rev 1.1 01/11
LXA10T600, LXA10FP600
Mechanical Mounting Method
Screw through hole in package tab Clamp against package body
Maximum Torque / Pressure specification
1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2
Soldering time and temperature: This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more details.
Ordering Information
Part Number
LXA10T600, LXA10FP600
Package
TO-220, FullPak
Packing
50 units/tube
The information contained in this document is subject to change without notice.
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Rev 1.1 01/11
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LXA10T600, LXA10FP600
Revision 1.0 1.1
Notes Released by Qspeed Converted to Power Integrations Document
Date 06/10 01/11
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LXA10T600, LXA10FP600
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Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. PATENT INFORMATION The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2011 Power Integrations, Inc.
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