LXA10T600

LXA10T600, LXA10FP600 Qspeed™ Family 600 V, 10 A X-Series PFC Diode Product Summary IF(AVG) VRRM QRR (Typ at 125 °C) IRRM (Typ at 125 °C) Softness tb/ta (Typ at 125 °C) 10 600 94 3.85 0.5 A V nC A General Description This device has the lowest QRR of any 600V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. Applications Pin Assignment K • Power Factor Correction (PFC) Boost Diode • Motor drive circuits • DC-AC Inverters K A K A Features FullPak LXA10FP600 • • • • Low QRR, Low IRRM, Low tRR High dIF/dt capable (1000A/µs) Soft recovery FullPak Insulation = 2500VRMS TO-220AC LXA010T600 A K Benefits • Increases efficiency • Eliminates need for snubber circuits • Reduces EMI filter component size & count • Enables extremely fast switching RoHS Compliant Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21. Absolute Maximum Ratings Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Symbol VRRM IF(AVG) IFSM IFSM TJ(MAX) TSTG Parameter Peak repetitive reverse voltage Average forward current Non-repetitive peak surge current Non-repetitive peak surge current Maximum junction temperature Storage temperature Lead soldering temperature Power dissipation Conditions TJ = 150 °C, TC = 118°C (TO-220AC) TJ = 150 °C, TC = 67°C (FullPak) 60 Hz, ½ cycle ½ cycle of t=28 µs Sinusoid, TC=25 °C Rating 600 10 70 350 150 –55 to 150 300 89 35 Units V A A A °C °C °C W W PD Leads at 1.6 mm from case, 10 sec TC = 25 °C (TO-220AC) TC = 25 °C (FullPak) Thermal Resistance Symbol RθJC RθJC Resistance from: Junction to case Junction to case Conditions TO-220AC FullPak Rating 1.4 3.6 Units °C/W °C/W www.powerint.com January 2011 LXA10T600, LXA10FP600 Electrical Specifications at TJ= 25 °C (unless otherwise specified) Symbol IR VF CJ tRR QRR IRRM S Parameter Reverse current Forward voltage Junction capacitance Reverse recovery time Reverse recovery charge Maximum reverse recovery current Conditions VR = 600V, TJ = 25 °C VR = 600V, TJ = 125 °C IF = 10A, TJ = 25 °C IF = 10A, TJ = 150 °C VR = 10V, 1 MHz dI/dt =200A/µs VR=400V, IF=10A dI/dt =200A/µs VR=400V, IF=10A dI/dt =200A/µs VR=400V, IF=10A TJ=25 °C TJ=125 °C TJ=25 °C TJ =125 °C TJ =25 °C TJ=125 °C TJ =25 °C TJ=125 °C Min - Typ 1.2 2.4 2.1 51 23 35 36 94 2.35 3.85 0.75 0.5 Max 250 3.0 54 3.2 - Units µA mA V V pF ns ns nC nC A A DC Characteristics Dynamic Characteristics t Softness factor = b ta dI/dt =200A/µs VR=400V, IF=10A Note to component engineers: X-Series diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups. (For additional details, see Application Note AN-300.) VR L1 D1 DUT IF dIF/dt 0 tRR ta tb 0.1xIRRM IRRM 15V Pulse generator + Rg Q1 Figure 1. Reverse Recovery Definitions Figure 2. Reverse Recovery Test Circuit 2 www.powerint.com Rev 1.1 01/11 LXA10T600, LXA10FP600 Electrical Specifications at TJ= 25 °C (unless otherwise specified) 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 0.0 0.5 1.0 200 180 160 140 Cj ( pF) 120 100 80 60 40 20 0 Tj=125C IF ( A) Tj=25C 1.5 2.0 VF (V) 2.5 3.0 3.5 4.0 0 20 40 60 80 100 120 140 160 180 VR (V) Figure 3. Typical IF vs VF 250 200 Q R R (nC) 150 100 dIF /dt=200A/us 50 0 0 2 4 6 8 10 12 14 16 18 20 22 dIF /dt=1000A/u dIF /dt=500A/us Figure 4. Typical Cj vs VR 50 45 40 35 tR R (ns) 30 25 20 15 10 5 0 0 2 4 6 8 10 12 14 16 18 20 22 IF (A) dIF /dt=1000A/us dIF /dt=500A/us dIF /dt=200A/us IF (A) Figure 5. Typical QRR vs IF at TJ = 125 ° 30 25 TO-220 20 IF(AV) ( A) Figure 6. Typical tRR vs IF at TJ = 125 °C 100 90 80 70 P (W) 60 50 40 30 20 10 0 FullPak TO-220 15 FullPak 10 5 0 25 50 75 100 o 125 150 25 50 75 100 o 125 150 Case Temperature, TC ( C) Case Temperature, TC ( C) Figure 7. DC Current Derating Curve Figure 8. Power Derating Curve 3 Rev 1.1 01/11 www.powerint.com LXA10T600, LXA10FP600 55 50 45 40 35 30 25 20 15 10 5 0 25 50 75 100 T C(°C) 125 duty cycle=10% duty cycle=30% duty cycle=50% DC 55 50 45 40 35 30 25 20 15 10 5 0 25 50 75 100 T C(°C) 125 duty cycle=10% duty cycle=30% duty cycle=50% DC IF (PEAK) (A) 150 IF (PEAK) (A) 150 Figure 9. IF(PEAK) vs TC, f=70 kHz, TO-220 Figure 10. IF(PEAK) vs TC, f=70 kHz, FullPak LXA10T600 1 D= 0.5 D = 0.3 D= 0.1 0.1 Zth(j-c)/Rth(j-c) D= 0.05 D= 0.02 D= 0.01 0.01 D=0.005 D=0.002 Single Pulse 0.001 1.E-06 1.E-05 1.E-04 1.E-03 t1(sec) 1.E-02 1.E-01 1.E+00 Figure 11. Normalized Maximum Transient Thermal Impedance, TO-220 4 www.powerint.com Rev 1.1 01/11 LXA10T600, LXA10FP600 LXA10FP600 1 D= 0.5 D = 0.3 0.1 D= 0.1 D= 0.05 Zth(j-c)/Rth(j-c) D= 0.02 0.01 D= 0.01 D=0.005 D=0.002 0.001 Single Pulse 0.0001 1.E-06 1.E-05 1.E-04 1.E-03 t1(sec) 1.E-02 1.E-01 1.E+00 1.E+01 Figure 12. Normalized Maximum Transient Thermal Impedance, FullPak 5 Rev 1.1 01/11 www.powerint.com LXA10T600, LXA10FP600 Dimensional Outline Drawings TO-220AC Millimeters Dim A A1 A2 C D E E1 F F1 H H1 H2 H3 H4 L L1 MIN MAX 4.32 1.14 2.03 0.34 9.65 2.49 4.98 0.508 1.14 14.71 5.84 8.51 3.53 2.54 12.70 - 4.70 1.40 2.79 0.610 10.67 2.59 5.18 1.016 1.78 16.51 6.55 9.25 3.96 3.05 14.22 6.35 FullPak D H4 H3 H1 H H2 A A1 Dim A A1 A2 C D E E1 Millimeters MIN MAX 4.54 2.57 2.51 0.42 10.25 4.80 2.83 2.62 0.58 10.72 2.54 (BSC) 5.08 (BSC) 0.624 1.10 15.86 6.06 9.55 2.95 3.15 13.33 3.18 0.776 1.65 16.12 6.56 9.81 3.05 3.25 14.18 3.43 F1 L1 F F1 H L F E E1 C A2 H1 H2 H3 H4 L L1 6 www.powerint.com Rev 1.1 01/11 LXA10T600, LXA10FP600 Mechanical Mounting Method Screw through hole in package tab Clamp against package body Maximum Torque / Pressure specification 1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2 Soldering time and temperature: This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more details. Ordering Information Part Number LXA10T600, LXA10FP600 Package TO-220, FullPak Packing 50 units/tube The information contained in this document is subject to change without notice. 7 Rev 1.1 01/11 www.powerint.com LXA10T600, LXA10FP600 Revision 1.0 1.1 Notes Released by Qspeed Converted to Power Integrations Document Date 06/10 01/11 8 www.powerint.com Rev 1.1 01/11 LXA10T600, LXA10FP600 For the latest updates, visit our website: www.powerint.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. PATENT INFORMATION The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations’ patents may be found at www.powerint.com. Power Integrations grants its customers a license under certain patent rights as set forth at http://www.powerint.com/ip.htm. The PI Logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, CAPZero, SENZero, LinkZero, HiperPFS, HiperTFS, Qspeed, EcoSmart, Clampless, E-Shield, Filterfuse, StackFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. 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