RECORDS OF REVISION
Date
2006/04/19
Rev.
0
Description
MASS PRODUCTION
Page
---
Design by
PETER
Total:27 Page
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Contents 1. SPECIFICATIONS
1.1 1.2 1.3 1.4 1.5 1.6 Features Mechanical Specifications Absolute Maximum Ratings DC Electrical Characteristics Optical Characteristics Backlight Characteristics
2. MODULE STRUCTURE
2.1 Counter Drawing 2.2 Interface Pin Description 2.3 Timing Characteristics 2.4 Display Command
3. QUALITY ASSURANCE SYSTEM
3.1 3.2 4.1 Quality Assurance Flow Chart Inspection Specification Reliability Test Condition
4. RELIABILITY TEST 5. PRECAUTION RELATING PRODUCT HANDLING
5.1 Safety 5.2 Handling 5.3 Storage 5.4 Terms of Warranty Appendix A:LCM Drawing Appendix B:Package
Note : For detailed information please refer to IC data sheet : Sitronix --- ST7529-G
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1. SPECIFICATIONS 1.1 Features
Item Display Type LCD Type Driver Condition Viewing Direction Backlight Type Weight Interface Driver IC Standard Value 240 * 128 Dots FSTN , Positive , Transflective LCD Module : 1/160 Duty , 1/10 Bias 6 O’clock LED B/L 50 g
Support 8 Bit Parallel interface with 8080 or 6800 series MPU & IIC serial interface
SITRONIX - ST7529-G
1.2
Mechanical Specifications
Item Outline Dimension Viewing Area Active Area Dot Size Dot Pitch Standard Value 99.2 (L) * 64.2 (w) * 18.04 (H)(Max) 93.0 (L) * 49.0 (w) 82.775 (L) * 44.135 (w) 0.32 (L) * 0.32 (w) 0.345 (L) * 0.345 (w) Unit mm mm mm mm mm
Note : For detailed information please refer to LCM drawing
1.3
Absolute Maximum Ratings
Item Power Supply Voltage LCD Driver Supply Voltage Input Voltage Operating Temperature Storage Temperature Storage Humidity Symbol VDD VLCD -VSS VIN TOP TST HD Condition Ta < 40 °C Min. -0.5 -0.5 -0.5 -20 -30 20 Max. 5.0 +22 VDD + 0.5 70 80 90 Unit V V V °C °C %RH
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1.4
DC Electrical Characteristics
VDD = 3.3 V ± 0.3 , VSS = 0 V , Ta = 25°C Item Logic Supply Voltage High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Input Voltage Supply Current Symbol VDD VIH VIL VOH VOL IDD VOP LCM Driver Voltage VOP VOP NOTE:*1 The VOP test point is Vo – Vss. NOTE:2 :Recommended Power Supply Combinations. Condition VDD = 3.3 V Vo – Vss (-20°C) Vo – Vss (25°C) *1 Vo – Vss (70°C) Min. 3.0 0.7VDD VSS 14.0 12.8 11.7 Typ. 3.3 1.2 14.1 12.95 11.8 Max. 3.6 VDD 0.3VDD 6.2 14.2 13.1 11.9 Unit V V V V V mA V V V
1.5
Optical Characteristics
LCD Panel: 1/160 Duty , 1/13 Bias , VLCD = 15.06 V Ta = 25°C Item View Angle Contrast Ratio Response Time(rise) Response Time(fall) Symbol θ CR Tr Tf Conditions
C>2.0 , ∅ = 270° θ = -5° , ∅ = 270° θ = -5° , ∅ = 270° θ = -5° , ∅ = 270°
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Min. -40° 2 -
Typ. 2.8
Max. +40° -
Reference Note 1 Note 3 Note 2
135 ms 205 ms 300 ms 450 ms
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Note 1.
Optical characteristics-2
Viewing angle
Top (θ=0°) θL θ+ θR
Rear (12H) φ=90°
Left (9H) φ=180°
θ-
Right (3H)
φ=0°
Front (6H) φ=270°
Viewing angle
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Note 2.
Optical characteristics-3 Fig.2 Definition of response time
Positive Type
No selected waveform
Selected waveform
No selected waveform
Transmittance 10% 100% 90%
Tr
Tf
Negative Type
No selected waveform
Selected waveform
No selected
Transmittance 100% 90% 10%
Tr
Tf
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Electrical characteristics-2 ※2 Drive waveform Vop: Drive voltage 1/B: Bias N: Duty (1) Selected waveform 1
fF: Frame frequency fD: Drive frequency
2 V Vop/B Vop/B V
3
N
1
2
3
1/fD 1/fF
(2) Non- Selected waveform 1 2 (1-2/B)Vop Vop/B Vop/B (1-2/B)Vop 3 N 1 2 3
1/fF
1/fD
Note: Frame frequency is defined as follows: Common side supply voltage peak - to - peak /2 = 1 period
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Note 3. : Definition of Vth
Selected waveform 100 Transmittanc 73% No selected waveform
50%
Vth1
Vth2
Drive
Active voltage range Vth1 10° (Selected waveform) 50% Vth2 40° (No selected waveform) 73%
View direction Drive waveform Transmittance
※1 Contrast ratio = (Brightness in OFF state) / (Brightness in ON state)
Outline of Electro-Optical Characteristics Measuring System Photo Detector Human Active
θ
Temperatur e Control Chamber
ψ 正讀 LCD Panel Transmissive Measuring System: Autronic DMS-803
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1.6
Backlight Characteristics
LCD Module with LED Backlight Maximum Ratings Item Forward Current Reverse Voltage Power Dissipation Symbol IF VR PO Conditions Ta =25℃ Ta =25℃ Ta =25℃ Min. Max. 180 5 0.61 Unit mA V W
Electrical / Optical Characteristics Ta =25℃ Item Forward Voltage Reverse Current CIE Color Coordinate (With LCD) Average Brightness (with LCD) *1 Uniformity (With LCD)*2 Color *1 This value will be changed while mass production. *2:△B=B(min) / B(max) Symbol VF IR X IF= 80 mA Y IV △B IF= 80 mA IF= 80 mA 0.35 30 70 White 0.38 50 0.41 cd/m2 % Conditions IF= 80 mA VR= 5V Min. 0.29 Typ. 3.3 0.32 Max. 3.4 60 0.35 Unit V uA
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2. MODULE STRUCTURE
2.1 Counter Drawing
2.1.1 LCM Mechanical Diagram * See Appendix 2.1.2 Block Diagram
A K
LED BACKLIGHT
COM0
………
COM63
240 * 128 DOTS LCD PANEL
…………………………
COM64
…
SEG0
COM127 SEG239
SEG239 COM63
………
…………………………
SEG0
COM80
………
IC-ST7529
COM0
COM143
PIN34
…………………………
PIN1
Please refer interface pin description for detail
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2.2
Interface Pin Description
Symbol A0 Function Register select input pin − A0 = "H": DB0 to DB8 or SI are display data − A0 = "L": DB0 to DB8 or SI are control data Read / Write execution control pin MPU Type 6800 RW_WR RW Description Read / Write control input pin RW = “H” : read RW = “L” : write Write enable clock input pin The data on DB0 to DB8 are latched at the rising edge of the /WR signal.
Pin No. 1
2
RW_WR 8080 /WR
3 4 5 6 7 8 9 10
DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7
They connect to the standard 8-bit MPU bus via the 8 bit bi-directional bus.When the following interface is selected and the XCS pin is high, the following pins become highimpedance, which should be fixed to VDD or VSS. In IIC Interface D7: SCL; D6: SI ; D0, D1: SA1, SA0 D3, D2: Acknowledgement D4, D5, D8 should be fixed to VDD or VSS. Read / Write execution control pin MPU Type 6800 RW_WR E Description Read / Write control input pin -RW = “H”: When E is “H”, DB0 to DB8 are in an output status. -RW = “L”: The data on DB0 to DB8 are latched at the falling edge of the E signal. 8080 /RD Read enable clock input pin When /RD is “L”, DB0 to DB8 are in an output status.
11
E_RD
12
RST
Reset input pin. When RST is “L”, initialization is executed.
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Pin No. 13
Symbol IF1 IF1 H L L IF3 L H L
Function MPU interface type 80 series 8-bit parallel 68 series 8-bit parallel IIC
14
IF3
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
XCS VSS VDD CAP7P CAP1N CAP5P CAP3P CAP1N CAP1P CAP2P CAP2N CAP4P CAP2N CAP6P VLCD
Chip select input pins Data/instruction I/O is enabled only when XCS is "L". When chip select is non-active, DB0 to DB8 may be high impedance. Power supply (VSS=0) Power supply (VDD=3.3V) DC / DC voltage converter. Connect a capacitor between this terminal and the CAP7P terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP1N terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP5P terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP3P terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP1N terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP1P terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP2P terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP2N terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP4P terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP2N terminal. DC / DC voltage converter. Connect a capacitor between this terminal and the CAP6P terminal. LCD supply voltage
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Pin No. Symbol 30 V4
Function LCD driver supply voltages V0In & V0out should be connected together in FPC area. Voltages should have the following relationship: V0 ≧ V1 ≧ V2 ≧ V3 ≧ V4 ≧ VSS When the internal power circuit is active, these voltages are generated as the following table according to the state of LCD bias. LCD Bias 1/N Bias NOTE: N = 5 to 14 V1 V2 V3 V4 (1/N) x V0
31
V3
32
V2
33
V1
(N-1) / N x V0 (N-2) / N x V0 (2/N) x V0
34
V0
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2.3 Timing Characteristics For the 8080 Series MPU
Item Address hold time Address setup time System cycle time Enable L pulse width (Write) Enable H pulse width (Write) Enable L pulse width (Read) Enable H pulse width (Read) WRITE Data setup time WRITE Address hold time READ access time READ Output disable time
Signal
Symbol tAH8 tAW8 tCYC8 tCCLW tCCHW tCCLR tCCHR tDS8 tDH8 tACC8 tOH8
Condition CL=100pF CL=100pF
VDD = 3.3V , Ta = 25ºC Rating Units Min Max 20 20 200 100 100 100 100 150 20 40 30
A0 RW_WR E_RD
ns
DB0 to DB7
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For the 6800 Series MPU
Item Address hold time Address setup time System cycle time Enable L pulse width (Write) Enable H pulse width (Write) Enable L pulse width (Read) Enable H pulse width (Read) WRITE Data setup time WRITE Address hold time READ access time READ Output disable time
Signal
Symbol tAH6 tAW6 tCYC6 tEWLW tEWHW tEWLR tEWHR tDS6 tDH6 tACC6 tOH6
Condition CL=100pF CL=100pF
VDD = 3.3V , Ta = 25ºC Rating Units Min Max 20 20 200 100 100 100 100 150 20 40 30
A0 RW_WR E_RD
ns
DB0 to DB7
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Reset Timing
Item Reset time Reset “L” pulse width
Signal RES
Symbol tR tRW
Condition -
VDD = 3.3V , Ta = 25ºC Rating Units Min Typ Max 1 1 µs µs
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2.4
Display Command
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3. QUALITY ASSURANCE SYSTEM
3.1 Quality Assurance Flow Chart
Customer Info Marketing & Design Request NG Sales R&D Q.A Manufactu Product Inventory Purchase ring control control
Item
Survey Inquiry Project Validation Quote Contract Design check OK Project evaluation
Sample Approval NG
Sample test NG Verification OK Sample approval Pilot OK run & Reliability test
Pilot Run & Mass Product
NG
Verification OK Specification preparation Mass production OK Inspection NG
Ship Out
Shipment Ship out
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Item
Customer Info
Sales Claim
R&D
Q.A
Manufact Product Inventory Purchase uring control control
Failure analysis Sales Service Analysis report Corrective action Tracking
1. ISO 9001 Maintenance Activities Q.A 3. Equipment calibration Activity 5. Standardization Management
2. Process improvement proposal 4. Education And Training Activities
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3.2
Inspection Specification
Inspection Standard : MIL-STD-105E Table Normal Inspection Single Sampling Level II Equipment : Gauge , MIL-STD , Powertip Tester , Sample IQC Defect Level : Major Defect AQL 0.4; Minor Defect AQL 1.5 FQC Defect Level : 100% Inspection OUT Going Defect Level : Sampling Specification : NO Item Specification Judge Level The part number is inconsistent with work order of 1 Part Number N.G. Major production The quantity is inconsistent with work order of 2 Quantity N.G. Major production The display lacks of some patterns. N.G. Major Electronic Missing line. N.G. Major characteristics of 3 The size of missing dot, A is > 1/2 Dot size N.G. Major LCM N.G. Major A=( L + W ) ╱2 There is no function. Output data is error N.G. Major Material is different with work order of production N.G. Major LCD is assembled in inverse direction N.G. Major Bezel is assembled in inverse direction N.G. Major Shadow is within LCD viewing area + 0.5 mm N.G. Major Appearance of The diameter of dirty particle, A is > 0.4 mm N.G. Minor LCD Dirty particle length is > 3.0mm, and 0.01mm < width A=( L + W ) ╱ 2 N.G. Minor ≤ 0.05mm 4 Display is without protective film N.G. Minor Dirty particle Conductive rubber is over bezel 1mm N.G. Minor (Including N.G. Minor scratch、bubble ) Polarizer exceeds over viewing area of LCD Area of bubble in polarizer, A > 1.0mm, the number N.G. Minor of bubble is > 1 piece. 0.4mm < Area of bubble in polarizer, A < 1.0mm, the N.G. Minor number of bubble is > 4 pieces. Burned area or wrong part number is on PCB N.G. Major The symbol, character, and mark of PCB are N.G Minor unidentifiable. The stripped solder mask , A is > 1.0mm N.G. Minor 0.3mm < stripped solder mask or visible circuit, Appearance of N.G. Minor A < 1.0mm, and the number is ≥ 4 pieces PCB 5 There is particle between the circuits in solder mask N.G Minor A=( L + W ) ╱2 The circuit is peeled off or cracked N.G Minor There is any circuits risen or exposed. N.G Minor 0.2mm < Area of solder ball, A is ≤ 0.4mm N.G Minor The number of solder ball is ≥ 3 pieces The magnitude of solder ball, A is > 0.4mm. N.G Minor
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NO
Item
Specification
Judge Level N.G. N.G. N.G. N.G. N.G. N.G. N.G. N.G. N.G. N.G. N.G. N.G. N.G. N.G. N.G. Major Minor Minor Minor Minor Minor Minor Minor Major Major Major Minor Minor Minor Minor
6
7
8
The shape of modeling is deformed by touching. Appearance of Insufficient epoxy: Circuit or pad of IC is visible molding Excessive epoxy: Diameter of modeling is > 20mm A=( L + W ) ╱2 or height is > 2.5mm The diameter of pinhole in modeling, A is > 0.2mm. The folding angle of frame must be > 45°+ 10° Appearance of The area of stripped electroplate in top-view of frame, A is > 1.0mm. frame A=( L + W ) ╱2 Rust or crack is (Top view only) The scratched width of frame is > 0.06mm. (Top view only) The color of backlight is nonconforming Electrical Backlight can’t work normally. characteristic of The LED lamp can’t work normally backlight The unsoldering area of pin for backlight, A=( L + W ) ╱2 A is > 1/2 solder joint area. The height of solder pin for backlight is > 2.0mm The mark or polarity of component is unidentifiable. The height between bottom of component and surface of the PCB is floating > 0.7mm D > 1/4W W D
N.G. Assembly parts A=( L + W ) ╱2
Minor
10
D’ Pad End solder joint width, D’ is > 50% width of component termination or width of pad Side overhang, D is > 25% width of component termination. Component is cracked, deformed, and burned, etc. The polarity of component is placed in inverse direction. Maximum fillet height of solder extends onto the component body or minimum fillet height is < 0.5mm.
N.G. N.G. N.G. N.G. N.G.
Minor Minor Minor Minor Minor
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4. RELIABILITY TEST
4.1
NO 1
Reliability Test Condition
Item High Temperature Storage Low Temperature Storage Test Condition Storage at 80 ± 2°C 96~100 hrs Surrounding temperature, then storage at normal condition 4hrs Storage at -30 ± 2°C 96~100 hrs Surrounding temperature, then storage at normal condition 4hrs 1.Storage 96~100 hrs 60 ± 2°C, 90~95%RH surrounding temperature, then storage at normal condition 4hrs. (Excluding the polarizer).or 2.Storage 96~100 hrs 40 ± 2°C, 90~95%RH surrounding temperature, then storage at normal condition 4 hrs. -20°C → 25°C → 70°C → 25°C (30mins) (5mins) (30mins) (5mins) 10 Cycle
2
3
High Temperature /Humidity Storage
4
Temperature Cycling
5
Vibration
10~55Hz ( 1 minute ) 1.5mm X,Y and Z direction * (each 2hrs) Air Discharge: Contact Discharge: Apply 6 KV with 5 times Apply 250V with 5 times discharge for each polarity +/- discharge for each polarity +/Testing location: Around the face of LCD Packing Weight (Kg) 0 ~ 45.4 Testing location: 1.Apply to bezel. 2.Apply to Vdd, Vss. Drop Height (cm) 122 76 61 46
6
ESD Test
7
Drop Test
45.4 ~ 90.8 90.8 ~ 454 Over 454
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5. PRECAUTION RELATING PRODUCT HANDLING
5.1 SAFETY
5.1.1 5.1.2 If the LCD panel breaks , be careful not to get the liquid crystal to touch your skin. If the liquid crystal touches your skin or clothes , please wash it off immediately by using soap and water. Avoid any strong mechanical shock which can break the glass. Avoid static electricity which can damage the CMOS LSI—When working with the module , be sure to ground your body and any electrical equipment you may be using. Do not remove the panel or frame from the module. The polarizing plate of the display is very fragile. So , please handle it very carefully, do not touch , push or rub the exposed polarizing with anything harder than an HB pencil lead (glass , tweezers , etc.) Do not wipe the polarizing plate with a dry cloth , as it may easily scratch the surface of plate. Do not touch the display area with bare hands , this will stain the display area. Do not use ketonics solvent & aromatic solvent. Use with a soft cloth soaked with a cleaning naphtha solvent. To control temperature and time of soldering is 280 ± 10°C and 3-5 sec. To avoid liquid (include organic solvent) stained on LCM Store the panel or module in a dark place where the temperature is 25°C ± 5°C and the humidity is below 65% RH. Do not place the module near organics solvents or corrosive gases. Do not crush , shake , or jolt the module. Applicable warrant period The period is within thirteen months since the date of shipping out under normal using and storage conditions. Unaccepted responsibility This product has been manufactured to your company’s specification as a part for use in your company’s general electronic products. It is guaranteed to perform according to delivery specifications. For any other use apart from general electronic equipment, we cannot take responsibility if the product is used in nuclear power control equipment, aerospace equipment , fire and security systems or any other applications in which there is a direct risk to human life and where extremely high levels of reliability are required.
5.2 HANDLING
5.2.1 5.2.2 5.2.3 5.2.4
5.2.5 5.2.6 5.2.7 5.2.8 5.2.9 5.3.1 5.3.2 5.3.3 5.4.1
5.3 STORAGE
5.4 TERMS OF WARRANTY
5.4.2
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