ESD4-LFC

05210 Only One Name Means ProTek’Tion™ ESD4-LFC LOW CAPACITANCE FLIP ChIP TvS ARRAy DESCRIPTION The ESD4-LFC is a low capacitance flip chip transient voltage suppressor array, designed to protect portable devices from the effects of Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). This series meets the IEC 610004-2 and 61000-4-4 requirements. This device is ideally suited for portable devices, PCMCIA and SMART phones. The ESD4-LFC features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. 5 BuMP PACkAgE F EATuRES • • • • • • • • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns ESD Protection > 25 kilovolts Unidirectional Configuration Low Capacitance: 15pF Protection for 4 Data Lines RoHS Compliant REACH Compliant APPLICATIONS • • • • • SMART Phones I/O Port Interfaces Portable Devices Ground Positioning Systems (GPS) SMART Cards MEChANICAL ChARACTERISTICS • • • • • • • 5 Bump Flip Chip Package Approximate Weight: 0.73 milligrams Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C Flammability Rating UL 94V-0 8mm Tape per EIA Standard 481 CIRCuIT DIAgRAM G1 05210.R4 1/11 Page 1 www.protekdevices.com 05210 Only One Name Means ProTek’Tion™ ESD4-LFC TyPICAL DEvICE ChARACTERISTICS MAXIMuM RATINgS @ 25°C unless Otherwise Specified PARAMETER DC Power Rating Operating Temperature Storage Temperature SyMBOL P TA TSTG vALuE 200 -40 to 85 -55 to 150 uNITS mW °C °C ELECTRICAL ChARACTERISTICS PER LINE @ 25°C unless Otherwise Specified PART NuMBER MARkINg CODE RATED STAND-OFF vOLTAgE v WM vOLTS ESD4-LFC 1. ±20% tolerance. MINIMuM BREAkDOWN vOLTAgE @ 1mA v(BR) vOLTS 6.0 MAXIMuM CLAMPINg vOLTAgE @ I P = 10mA vC vOLTS 8 TyPICAL FORWARD vOLTAgE @ 10mA vF vOLTS 0.8 MAXIMuM LEAkAgE CuRRENT @ 3.3v ID µA 0.1 TyPICAL CAPACITANCE PER LINE (Note 1) @2.5v, 1Mhz C pF 15 4L 5.0 NOTES 1.6 Cj - Capacitance (Normalized) FIguRE 1 CAPACITANCE vS REvERSE vOLTAgE (Normalized to Capactiance at 2.5v DC & 25°C) 1.2 0.8 0.4 0 0 1 2 3 4 5 6 vR - Reverse voltage - volts 05210.R4 1/11 Page 2 www.protekdevices.com 05210 Only One Name Means ProTek’Tion™ ESD4-LFC SOLDER REFLOW INFORMATION PRINTED CIRCuIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP (Entek Cu Plus 106A) ±50µm ±20µm 60 seconds 270°C vALuE REquIREMENTS Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating. RECOMMENDED NON-SOLDER MASk DEFINED PAD ILLuSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. Maximum Solder Reflow (35-53°C Above Maximum Solder Melt Temp) TP Temperature - °C Ramp-up Solder Melt (Maximum Temp) Ramp-Down Preheat (Stay Below Flux Activation Temp) 30-60 seconds Ramp-up 15 seconds (Minimize) Page 3 Solder-Time 15-20 seconds Ramp-Down 05210.R4 1/11 www.protekdevices.com 05210 Only One Name Means ProTek’Tion™ ESD4-LFC 5 BuMP PACkAgE INFORMATION OuTLINE DIMENSIONS DIM A B C D E F G H I J NOTES MILLIMETERS MIN 0.914 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330 INChES MIN 0.036 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.017 0.013 BOTTOM VIEW A G C O G I 1 SOLDER BUMPS 2 D I J E F H B SIDE VIEW MAX 1.016 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457 MAX 0.040 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.022 0.018 1. Controlling dimensions in millimeters. 2. Solder bumps (63/67 Sn/Pb) 0.30 dia. LAyOuT DIMENSIONS DIM A B C NOTES A MAX 0.010 0.020 0.034 MILLIMETERS MIN 0.25 0.50 0.86 INChES MIN 0.010 0.020 0.034 MAX 0.25 0.50 0.86 Non solder mask defined pad 0.275mm C Solder mask opening 0.325mm Solder stencil opening 0.330mm B 1. Controlling dimensions in millimeters 05210.R4 1/11 Page 4 www.protekdevices.com 05210 Only One Name Means ProTek’Tion™ ESD4-LFC TAPE AND REEL INFORMATION 10 Pitches Cumulative Tolerance on tape ± 0.2 E t D P2 P0 Top Cover Tape K0 A0 B0 Orientation Dot F W P User Direction of Feed SPECIFICATIONS REEL DIA. 178(7”) 1. 2. 3. 4. TAPE WIDTh 8 A0 1.08±0.05 B0 k0 D E F W P0 P2 P Tmax 1.60±0.05 0.72 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.30 4.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10 0.20±0.025 NOTES Dimensions in millimeters. Top view of tape. Solder bumps are face down in tape package. Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7” Reels - 3,000 pieces per reel. Package outline, pad layout and tape specifications per document number 06055.R2 9/09. ORDERINg INFORMATION BASE PART NuMBER ESD4-LFC LEADFREE SuFFIX -LF TAPE SuFFIX -T73 qTy/REEL 3,000 REEL SIZE 7” TuBE qTy n/a 05210.R4 1/11 Page 5 www.protekdevices.com 05210 Only One Name Means ProTek’Tion™ ESD4-LFC COMPANy INFORMATION COMPANy PROFILE ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. CONTACT uS Corporate headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By E-mail: Sales: sales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com Web www.protekdevices.com www.protekanalog.com COPYRIGHT © ProTek Devices 2007 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”. 05210.R4 1/11 Page 6 www.protekdevices.com