LC0408FC3.3C_11

05153 Only One Name Means ProTek’Tion™ LC0408FC3.3C - LC0408FC36C 200w Low CaPaCitanCe FLiP ChiP tvs aRRay DesCRiPtion The LC0408FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In addition, the LC0408FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. F eatuRes • • • • • • • • • • • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns ESD Protection > 25 kilovolts Available in Voltages Ranging from 3.3V to 36V 200 Watts Peak Pulse Power per Line (tp = 8/20µs) Protection for 4 to 7 Lines Bidirectional and Monolithic Structure Low Clamping Voltage Low Capacitance RoHS Compliant REACH Compliant aPPLiCations • • • • • Cellular Phones MCM Boards Wireless Communication Circuits IR LEDs SMART & PCMCIA Cards MeChaniCaL ChaRaCteRistiCs • • • • • • • • Standard EIA Chip Size: 0408 Approximate Weight: 0.73 milligrams Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C Flammability Rating UL 94V-0 8mm Tape per EIA Standard 481 Top Contacts: Solder Bump 0.004” in Height (Nominal) Pin ConFiGuRation 05153.R8 2/11 Page 1 www.protekdevices.com 05153 Only One Name Means ProTek’Tion™ LC0408FC3.3C - LC0408FC36C tyPiCaL DeviCe ChaRaCteRistiCs MaXiMuM RatinGs @ 25°C unless otherwise specified PaRaMeteR Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature syMBoL PPP TA TSTG vaLue 200 -55 to 150 -55 to 150 units Watts °C °C eLeCtRiCaL ChaRaCteRistiCs PeR Line @ 25°C unless otherwise specified PaRt nuMBeR (note 1) RateD stanD-oFF voLtaGe v wM voLts LC0408FC3.3C LC0408FC05C LC0408FC08C LC0408FC12C LC0408FC15C LC0408FC24C LC0408FC36C notes 3.3 5.9 8.0 12.0 15.0 24.0 36.0 MiniMuM BReaKDown voLtaGe @ 1ma v(BR) voLts 4.0 6.0 8.5 13.3 16.7 26.7 40.0 MaXiMuM CLaMPinG voLtaGe (Fig. 2) @ i P = 1a vC voLts 7.0 11.0 13.2 19.8 25.4 37.2 70.0 MaXiMuM CLaMPinG voLtaGe (Fig. 2) @ 8/20µs vC @ i PP 12.5V @ 16A 13.0 @ 15A 18.0V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 80.0V @ 2.5A MaXiMuM LeaKaGe CuRRent (note 2) @vwM iD µa 75* 10** 1 1 1 1 1 tyPiCaL CaPaCitanCe @0v, 1Mhz C pF 70 35 32 30 25 20 18 1. All devices are bidirectional. Electrical characteristics apply in both directions. 2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V. 05153.R8 2/11 Page 2 www.protekdevices.com 05153 Only One Name Means ProTek’Tion™ LC0408FC3.3C - LC0408FC36C tyPiCaL DeviCe ChaRaCteRistiCs FiGuRe 1 PeaK PuLse PoweR vs PuLse tiMe 10,000 PPP - Peak Pulse Power - watts 1,000 200W, 8/20µs Waveform 100 10 0.1 1 10 100 td - Pulse Duration - µs 1,000 10,000 120 iPP - Peak Pulse Current - % of iPP FiGuRe 2 PuLse wave FoRM tf Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs 100 80 % of Rated Power FiGuRe 3 PoweR DeRatinG CuRve Peak Pulse Power 8/20µs 100 80 60 40 20 0 0 5 e-t 60 40 20 0 Average Power td = t/(IPP/2) 10 15 t - time - µs 20 25 30 0 25 50 75 100 125 ta - ambient temperature - °C 150 05153.R8 2/11 Page 3 www.protekdevices.com 05153 Only One Name Means ProTek’Tion™ LC0408FC3.3C - LC0408FC36C tyPiCaL DeviCe ChaRaCteRistiCs FiGuRe 4 oveRshoot & CLaMPinG voLtaGe FoR LC0408FC05C 35 25 5 volts per Division 15 5 -5 esD test Pulse - 25 kilovolt, 1/30ns (waveshape) FiGuRe 5 tyPiCaL CLaMPinG voLtaGe vs PeaK PuLse CuRRent LC0408FC05C 12 vC - Clamping voltage - volts 8 4 0 0 5 10 iPP - Peak Pulse Current - amps 15 20 05153.R8 2/11 Page 4 www.protekdevices.com 05153 Only One Name Means ProTek’Tion™ LC0408FC3.3C - LC0408FC36C soLDeR ReFLow inFoRMation PRinteD CiRCuit BoaRD ReCoMMenDations PaRaMeteR Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP (Entek Cu Plus 106A) ±50µm ±20µm 60 seconds 270°C vaLue RequiReMents Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating. ReCoMMenDeD non-soLDeR MasK DeFineD PaD iLLustRation non-solder Mask Defined Pad 0.275mm Dia. solder Mask opening 0.325mm Dia. solder stencil opening 0.330mm Dia. Maximum solder Reflow (35-53°C above Maximum solder Melt temp) tP temperature - °C Ramp-up solder Melt (Maximum temp) Ramp-Down Preheat (stay Below Flux activation temp) 30-60 seconds Ramp-up 15 seconds (Minimize) Page 5 solder-time 15-20 seconds Ramp-Down 05153.R8 2/11 www.protekdevices.com 05153 Only One Name Means ProTek’Tion™ LC0408FC3.3C - LC0408FC36C 0408 PaCKaGe inFoRMation outLine DiMensions DiM A B C E F G H I notes 0.076 0.406 1.97 0.15 0.127 0.003 0.016 0.98 0.15 SQ 2.03 MiLLiMeteRs Min 0.56 0.86 1.02 inChes Min 0.022 0.034 0.038 0.078 0.006 0.005 0.040 0.080 0.006 SQ MaX MaX 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). TOP A BC G SIDE F E H END I 05153.R8 2/11 Page 6 www.protekdevices.com 05153 Only One Name Means ProTek’Tion™ LC0408FC3.3C - LC0408FC36C 0408 PaCKaGe inFoRMation oPtion 1 - Layout DiMensions DiM A C D E F G H I notes C A D MiLLiMeteRs noMinaL 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 inChes noMinaL 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 SOLDER PRINT 0.010” - 0.012” DIA. SOLDER PADS SOLDER MASK F HG I DIE SOLDER BUMP E 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Usign 0.1mm (0.004”) stencil. oPtion 2 - Layout DiMensions DiM A F G H I notes COPPER CONTACT 0.009”[0.23] DIA. A MiLLiMeteRs noMinaL 0.51 0.15 SQ 0.71 0.99 0.51 inChes noMinaL 0.020 0.006 SQ 0.028 0.039 0.020 HG I DIE SOLDER BUMP 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Usign 0.1mm (0.004”) stencil. F SOLDER PRINT 0.014” [0.36] DIA. SOLDER MASK 05153.R8 2/11 Page 7 www.protekdevices.com 05153 Only One Name Means ProTek’Tion™ LC0408FC3.3C - LC0408FC36C taPe anD ReeL inFoRMation 10 Pitches Cumulative Tolerance on tape ± 0.2 E t D P2 P0 Top Cover Tape K0 A0 B0 F W P User Direction of Feed sPeCiFiCations ReeL Dia. 178(7”) 1. 2. 3. 4. 5. 1. taPe wiDth 8 a0 B0 K0 D e F w P0 P2 P tmax 0.25 0.80 ± 0.10 1.20 ± 0.10 0.70 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.20 4.00 ± 0.12 2.00 ± 0.05 2.00 ± 0.10 notes Dimensions in millimeters. Top view of tape. Solder bumps are face down in tape package. Orientation: preferred stencil - 0.1mm (0.004”). Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7” Reels - 5,000. Marking on reel: part number, date code and lot number. taPe & ReeL oRientation Quad Die - 0408 Package outline, pad layout and tape specifications per document number 06021.R5 9/09. oRDeRinG inFoRMation Base PaRt nuMBeR (xx = voltage) LC0408FCxxC LeaDFRee suFFiX -LF taPe suFFiX -T75-1 qty/ReeL 5,000 ReeL siZe 7” tuBe qty n/a 05153.R8 2/11 Page 8 www.protekdevices.com 05153 Only One Name Means ProTek’Tion™ LC0408FC3.3C - LC0408FC36C CoMPany inFoRMation CoMPany PRoFiLe ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. ContaCt us Corporate headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By e-mail: Sales: sales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com web www.protekdevices.com www.protekanalog.com COPYRIGHT © ProTek Devices 2000 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”. 05153.R8 2/11 Page 9 www.protekdevices.com