05130
SFC05-5
FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Ground Positioning System (GPS) ✔ SMART & PCMCIA Cards
IEC COMPATIBILITY ( EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns ✔ 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line-Gnd) & Level 3(Line-Line) PENTA
FEATURES
✔ ESD Protection > 25 kilovolts ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Protects up to Five (5) Unidirectional and Four (4) Bidirectional Lines ✔ RoHS Compliant
MECHANICAL CHARACTERISTICS
✔ Penta Flip Chip Package ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Lead-Free Plating ✔ Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for Leaded Device Availability ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
6
5
4
1
2 BOTTOM VIEW
3
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SFC05-5
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature
SYMBOL
PPP TA TSTG
VALUE
250 -55 to 150 -55 to 150
UNITS
Watts °C °C
ELECTRICAL CHARACTERISTICS PER LINE
PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 5A VC VOLTS 9.5
@ 25°C Unless Otherwise Specified
MAXIMUM CLAMPING VOLTAGE (See Fig. 2)
MAXIMUM LEAKAGE CURRENT
TYPICAL CAPACITANCE
VWM VOLTS SFC05-5 5.0
@ 1mA V(BR) VOLTS 6.0
@8/20µs VC @ IPP 11.0V @ 24A
@VWM ID µA 10
@0V, 1 MHz Cj pF 150
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
10,000
IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts
120 100 80 60 40 20 0 tf
FIGURE 2 PULSE WAVE FORM
Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs
1,000 250W, 8/20µs Waveform
e-t
100
td = t I /2 PP
10 0.01
1
10 100 td - Pulse Duration - µs
1,000
10,000
0
5
10
15 t - Time - µs
20
25
30
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SFC05-5
GRAPHS
FIGURE 3 POWER DERATING CURVE
Peak Pulse Power 8/20µs
100 80
% Of Rated Power
60
40 20 Average Power 0 0 25 50 75 100 125 TA - Ambient Temperature - °C 150
FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE
35
5 Volts per Division
25
15
5
-5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
14
VC - Clamping Voltage - Volts
FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT
12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 15 20
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SFC05-5
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature
VALUE
0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C
REQUIREMENTS
Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating.
RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Mask Opening 0.325mm DIA.
Solder Stencil Opening 0.330mm DIA.
TP Ramp-up
Temperature - °C
Ramp-down TL TSMAX 155° TSMIN 140° TS - Preheat
t 25°C to Peak 30-60 seconds
Ramp-up 15 seconds
Solder Time 15-20 seconds
Ramp-down
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SFC05-5
PENTA PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
DIM A B C B
SIDE A
PACKAGE DIMENSIONS
MILLIMETERS 0.510 0.510 0.99 ± 0.0254 0.15 NOM 1.5 ± 0.0254 0.15 NOM See Note 3 0.076 MIN I 0.419 NOM INCHES 0.020 0.020 0.039 ± 0.001 0.066 NOM 0.059 ± 0.001 0.006 NOM See Note 3 0.003 MIN 0.0165 NOM
E TOP
C
F G H
G
E F H
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. “H” Dimensions for the SFC05-4 device are from 0.10mm Max and 0.004” Max.
END
I
MOUNTING PAD LAYOUT - Option 1
DIM A A B C D E F G
PAD DIMENSIONS
MILLIMETERS 0.305 0.457 0.203 0.254 0.510 0.990 0.510 INCHES 0.012 0.018 0.008 0.010 0.020 0.039 0.020
DIE SOLDER BUMPS
C
NOTE:
1. Preferred: Using 0.1mm (0.004”) stencil.
F E B
G
SOLDER PADS SOLDER PRINT 0.010” - 0.012” DIA. SOLDER MASK
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SFC05-5
PENTA PACKAGE OUTLINE & DIMENSIONS
MOUNTING PAD LAYOUT - Option 2
DIM A B A
COPPER CONTACTS 0.009” [0.23] DIA.
PACKAGE DIMENSIONS
MILLIMETERS 1.499 0.152 NOM 0.510 0.990 0.510 INCHES 0.059 0.006 NOM 0.020 0.039 0.020
C D E
DIE SOLDER BUMPS
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil.
D C
TAPE & REEL ORIENTATION
E
B
1 2
6 5 4
SOLDER PRINT 0.014” [0.36] DIA.
SOLDER MASK
3
NOTE: 1. Top view of tape. Solder bumps are face down in tape package.
TAPE & REEL ORDERING NOMENCLATURE 1. 2. 3. 4. Surface mount product is taped and reeled in accordance with EIA 481. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-, i.e., SFC05-5-T75-1. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2, i.e., SFC05-5-T75-2. Suffix - LF = Lead-Free, i.e., SFC05-5-LF-T75-2. Outline & Dimensions: Rev 1 - 1/03, 06038
COPYRIGHT © ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com
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