SFC05-5_10

05130 Only One Name Means ProTek’Tion™ SFC05-5 250w FliP ChiP tvS aRRay DeSCRiPtion The SFC05-5 is a 5 Volt, flip chip transient voltage suppressor (TVS) array designed to provide protection for power bus, data, control or I/O lines. Rated at 250 Watts peak pulse power for an 8/20µs waveshape, this device protects 5 unidirectional lines or 4 bidirectional lines. This device is a type of chip scale package (CSP) that can be mounted onto a printed circuit board or in a connector requiring a limited amount of space and is compatible with “pick and place” equipment for automatic assembly. The SFC05-5 is compatible with IEC 61000-4-2 (ESD), 61000-4-4(EFT) and 61000-4-5(Surge) requirements. Penta PaCkage F eatuReS • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns • Compatible with IEC 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line Gnd) & Level 3 (Line - Line) • ESD Protection > 25 kilovolts • 250 Watts Peak Pulse Power per Line (tp = 8/20µs) • Protects up to Five Unidirectional and Four Bidirectional Lines • RoHS Compliant • REACH Compliant aPPliCationS • • • • Cellular Phones SMART Phones PCMCIA Cards Ground Positioning System (GPS) MeChaniCal ChaRaCteRiStiCS • • • • • • • • Penta Flip Chip Package Approximate Weight: 0.73 milligrams Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C Flammability Rating UL 94V-0 8mm Tape per EIA Standard 481 Top Contacts: Solder Bump 0.004” in Height (Nominal) CiRCuit DiagRaM Orientation Mark 6 5 4 1 2 TOP VIEW 3 05130.R9 12/10 Page 1 www.protekdevices.com 05130 Only One Name Means ProTek’Tion™ SFC05-5 tyPiCal DeviCe ChaRaCteRiStiCS MaXiMuM RatingS @ 25°C unless otherwise Specified PaRaMeteR Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature SyMBol PPP TA TSTG value 250 -55 to 150 -55 to 150 unitS Watts °C °C eleCtRiCal ChaRaCteRiStiCS PeR line @ 25°C unless otherwise Specified PaRt nuMBeR RateD StanD-oFF voltage v wM voltS SFC05-5 5.0 MiniMuM BReakDown voltage @ 1ma v(BR) voltS 6.0 MaXiMuM ClaMPing voltage (Fig. 2) @ i P = 5a vC voltS 9.5 MaXiMuM ClaMPing voltage (Fig. 2) @ 8/20µS vC @ i PP 11.0V @ 24.0A MaXiMuM leakage CuRRent @v wM iD µa 10 tyPiCal CaPaCitanCe @0v, 1Mhz Cj pF 150 05130.R9 12/10 Page 2 www.protekdevices.com 05130 Only One Name Means ProTek’Tion™ SFC05-5 tyPiCal DeviCe ChaRaCteRiStiCS FiguRe 1 Peak PulSe PoweR vS PulSe tiMe 10,000 PPP - Peak Pulse Power - watts 1,000 250W, 8/20µs Waveform 100 10 0.1 1 10 100 td - Pulse Duration - µs 1,000 10,000 120 iPP - Peak Pulse Current - % of iPP FiguRe 2 PulSe wave FoRM tf Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs 100 80 % of Rated Power FiguRe 3 PoweR DeRating CuRve Peak Pulse Power 8/20µs 100 80 60 40 20 0 0 5 e-t 60 40 20 0 Average Power td = t/(IPP/2) 10 15 t - time - µs 20 25 30 0 25 50 75 100 125 ta - ambient temperature - °C 150 05130.R9 12/10 Page 3 www.protekdevices.com 05130 Only One Name Means ProTek’Tion™ SFC05-5 tyPiCal DeviCe ChaRaCteRiStiCS FiguRe 4 oveRShoot & ClaMPing voltage 35 25 5 volts per Division 15 5 -5 eSD test Pulse - 25 kilovolt, 1/30ns (waveshape) FiguRe 5 tyPiCal ClaMPing voltage vS Peak PulSe CuRRent 12 vC - Clamping voltage - volts 8 4 0 0 5 10 iPP - Peak Pulse Current - amps 15 20 05130.R9 12/10 Page 4 www.protekdevices.com 05130 Only One Name Means ProTek’Tion™ SFC05-5 SPiCe MoDel FiguRe 1 SPiCe MoDel FoR I/O ABD GND aBD - avalanche Breakdown Diode (tvS) taBle 1 - SPiCe PaRaMeteRS PaRaMeteR BV IBV Cjo IS Vj M N RS TT EG unit V µA pF A V Ohms s eV aBD(tvS) 6 1 20 1E-12 0.33 1 0.28 1E-8 1.11 05130.R9 12/10 Page 5 www.protekdevices.com 05130 Only One Name Means ProTek’Tion™ SFC05-5 SolDeR ReFlow inFoRMation PRinteD CiRCuit BoaRD ReCoMMenDationS PaRaMeteR Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP (Entek Cu Plus 106A) ±50µm ±20µm 60 seconds 270°C value RequiReMentS Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating. ReCoMMenDeD non-SolDeR MaSk DeFineD PaD illuStRation non-Solder Mask Defined Pad 0.275mm Dia. Solder Mask opening 0.325mm Dia. Solder Stencil opening 0.330mm Dia. Maximum Solder Reflow (35-53°C above Maximum Solder Melt temp) tP temperature - °C Ramp-up Solder Melt (Maximum temp) Ramp-Down Preheat (Stay Below Flux activation temp) 30-60 seconds Ramp-up 15 seconds (Minimize) Page 6 Solder-time 15-20 seconds Ramp-Down 05130.R9 12/10 www.protekdevices.com 05130 Only One Name Means ProTek’Tion™ SFC05-5 Penta PaCkage inFoRMation outline DiMenSionS DiM A B C E F G H I noteS 0.076 0.419 1.47 0.15 0.10 0.003 0.0165 0.98 0.15 SQ 1.53 MilliMeteRS Min 0.510 0.510 1.02 inCheS Min 0.020 0.020 0.038 0.058 0.006 0.004 0.040 0.060 0.006 SQ MaX MaX 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). B TOP A C SIDE G F E H END I 05130.R9 12/10 Page 7 www.protekdevices.com 05130 Only One Name Means ProTek’Tion™ SFC05-5 Penta PaCkage inFoRMation oPtion 1 - layout DiMenSionS DiM A B C D E F G noteS A MilliMeteRS Min 0.305 0.457 0.203 0.254 0.510 0.990 0.510 inCheS Min 0.012 0.018 0.008 0.010 0.020 0.039 0.020 MaX MaX DIE SOLDER BUMPS C FE Orientation Dot G B 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. D SOLDER PRINT 0.010” - 0.012” DIA. oPtion 2 - layout DiMenSionS DiM A F G H I noteS A MilliMeteRS Min 0.51 0.15 SQ 0.71 0.99 0.51 inCheS Min 0.020 0.006 SQ 0.028 0.039 0.020 MaX MaX DIE SOLDER BUMPS DC E B 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. SOLDER PRINT 0.014” [0.36] DIA. 05130.R9 12/10 Page 8 www.protekdevices.com 05130 Only One Name Means ProTek’Tion™ SFC05-5 taPe anD Reel inFoRMation 10 Pitches Cumulative Tolerance on tape ± 0.2 E t D P0 P2 Top Cover Tape K0 A0 B0 Orientation Dot F W P User Direction of Feed SPeCiFiCationS Reel Dia. 178(7”) 1. 2. 3. 4. 5. 6. taPe wiDth 8 a0 B0 k0 D e F w P0 P2 P tmax 0.25 0.80 ± 0.10 1.20 ± 0.10 0.70 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.30 4.00 ± 0.12 2.00 ± 0.10 2.00 ± 0.10 noteS Dimensions in millimeters. Top view of tape. Solder bumps are face down in tape package. Orientation: preferred stencil - 0.1mm (0.004”). Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7” Reels - 5,000 pieces per reel. Marking on Reel - part number, date code and lot number. taPe & Reel oRientation 1 2 3 6 5 4 Package outline, pad layout and tape specifications per document number 06038.R2 9/09. oRDeRing inFoRMation BaSe PaRt nuMBeR SFC05-5 leaDFRee SuFFiX -LF taPe SuFFiX -T75-1 qty/Reel 5,000 Reel SiZe 7” tuBe qty n/a 05130.R9 12/10 Page 9 www.protekdevices.com 05130 Only One Name Means ProTek’Tion™ SFC05-5 CoMPany inFoRMation CoMPany PRoFile ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. ContaCt uS Corporate headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By e-mail: Sales: sales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com web www.protekdevices.com www.protekanalog.com COPYRIGHT © ProTek Devices 2007 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”. 05130.R9 12/10 Page 10 www.protekdevices.com