ULLC0408FC05C

05221 ULLC0408FC05C* UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Computers ✔ SMART Cards IEC COMPATIBILITY ( EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns FEATURES ✔ ESD Protection > 25 kilovolts ✔ Low ESD Overshoot Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 4 Isolated Lines ✔ Low Capacitance: 6pF ✔ Low Leakage Current ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ Standard EIA Chip Size: 0408 ✔ Weight 0.73 milligrams (Approximate) ✔ Solder Reflow Temperature: Lead-Free: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel PIN CONFIGURATION 05221.R1 5/07 1 *U.S. Patent No. 6,867,436 www.protekdevices.com ULLC0408FC05C* DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature SYMBOL TA TSTG VALUE -55°C to 150°C -55°C to 150°C UNITS °C °C ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER (See Notes 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE @ 25°C Unless Otherwise Specified MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE V WM VOLTS ULLC0408FC05C Note 1: Device is bidirectional. 5.0 @ 1mA V(BR) VOLTS 6.0 @V WM ID µA 5.0 0V @ 1 MHz C pF 6 05221.R1 5/07 2 www.protekdevices.com ULLC0408FC05C* GRAPHS FIGURE 1 OVERSHOOT & CLAMPING VOLTAGE 35 25 5 Volts per Division 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 2 CAPACITANCE VS REVERSE VOLTAGE 10 8 Cj - Capacitance - pF 6 4 2 0 0 1 2 3 4 5 6 VR - Reverse Voltage - Volts 05221.R1 5/07 3 www.protekdevices.com ULLC0408FC05C* APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Ramp-up Temperature - °C Ramp-down TL TSMAX 155° TSMIN 140° TS - Preheat t 25°C to Peak 30-60 seconds Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down 05221.R1 5/07 4 www.protekdevices.com ULLC0408FC05C* U0408 PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE DIM A B C TOP SIDE PACKAGE DIMENSIONS MILLIMETERS 0.56 NOM 0.86 NOM 0.99 ± 0.0254 0.15 SQ 2.0 ± 0.0254 0.406 NOM INCHES 0.022 NOM 0.034 NOM 0.039 ± 0.001 0.006 SQ 0.079 ± 0.001 0.016 NOM E F I A B C NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). E F Metalized Die Contact END I MOUNTING PAD LAYOUT - Option 1 DIM D C A DIE SOLDER CONTACT PAD DIMENSIONS MILLIMETERS 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 A C D E F G H I NOTE: E H G 1. Preferred: Using 0.1mm (0.004”) stencil. I SOLDER PADS SOLDER PRINT 0.010” - 0.012” DIA. SOLDER MASK F Outline & Dimensions: Rev 3 - 2/04, 06026 05221.R1 5/07 5 www.protekdevices.com ULLC0408FC05C* U0408 PACKAGE OUTLINE & DIMENSIONS MOUNTING PAD LAYOUT - Option 2 DIM A F COPPER CONTACT 0.009” [0.23] DIA. PACKAGE DIMENSIONS MILLIMETERS 0.51 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.006 SQ 0.028 0.039 0.020 A DIE SOLDER CONTACT G H I H G NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. I Outline & Dimensions: Rev 3 - 2/04, 06026 TAPE & REEL ORIENTATION SOLDER PRINT 0.014” [0.36] DIA. SOLDER MASK F Quad Die - 0408 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULLC0408FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., ULLC0408FC05C-T75-2). COPYRIGHT © ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05221.R1 5/07 6 www.protekdevices.com