ULLC0408FC05C_11

05221 Only One Name Means ProTek’Tion™ ULLC0408FC05C UnbUmPed Low CaPaCitanCe FLiP ChiP tvs aRRay desCRiPtion The ULLC0408FC05C Flip Chip employs advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. This low capacitance device is ideally suited for handheld devices, PCMCIA and SMART cards. The ULLC0408FC05C provides ESD protection greater than 25 kilovolts and features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. The low inductance virtually eliminates overshoot voltage due to package inductance. F eatURes • • • • • • • • • • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns ESD Protection > 25 kilovolts Low ESD Overshoot Voltage Bidirectional Configuration & Monolithic Structure Protects 4 Isolated Lines Low Capacitance: 6pF Low Leakage Current RoHS Compliant REACH Compliant aPPLiCations • Cellular Phones • Portable Electronics • SMART Cards meChaniCaL ChaRaCteRistiCs • • • • • • • Standard EIA Chip Size: 0408 Approximate Weight: 0.73 milligrams Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C Flammability Rating UL 94V-0 8mm Tape per EIA Standard 481 Pin ConFiGURation 05221.R2 3/11 Page 1 www.protekdevices.com 05221 Only One Name Means ProTek’Tion™ ULLC0408FC05C tyPiCaL deviCe ChaRaCteRistiCs maXimUm RatinGs @ 25°C Unless otherwise specified PaRameteR Operating Temperature Storage Temperature symboL TA TSTG vaLUe -55 to 150 -55 to 150 Units °C °C eLeCtRiCaL ChaRaCteRistiCs PeR Line @ 25°C Unless otherwise specified PaRt nUmbeR (note 1) Rated stand-oFF voLtaGe v wm voLts ULLC0408FC05C 1. Device is bidirectional. minimUm bReaKdown voLtaGe @ 1ma v(bR) voLts 6.0 maXimUm LeaKaGe CURRent @vwm id µa 5.0 tyPiCaL CaPaCitanCe @0v, 1mhz C pF 6 5.0 notes 05221.R2 3/11 Page 2 www.protekdevices.com 05221 Only One Name Means ProTek’Tion™ ULLC0408FC05C tyPiCaL deviCe ChaRaCteRistiCs FiGURe 1 oveRshoot & CLamPinG voLtaGe 35 5 volts per division 25 15 5 -5 esd test Pulse - 25 kilovolt, 1/30ns (waveshape) FiGURe 2 CaPaCitanCe vs ReveRse voLtaGe 8 Cj - Capactiance - pF 4 0 0 2 4 vR - Reverse voltage - volts 6 05221.R2 3/11 Page 3 www.protekdevices.com 05221 Only One Name Means ProTek’Tion™ ULLC0408FC05C soLdeR ReFLow inFoRmation PRinted CiRCUit boaRd ReCommendations PaRameteR Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity (Only applies to bumped devices) Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP (Entek Cu Plus 106A) ±50µm ±20µm 60 seconds 270°C vaLUe ReqUiRements Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating. ReCommended non-soLdeR masK deFined Pad iLLUstRation non-solder mask defined Pad 0.275mm dia. solder mask opening 0.325mm dia. solder stencil opening 0.330mm dia. maximum solder Reflow (35-53°C above maximum solder melt temp) tP temperature - °C Ramp-Up solder melt (maximum temp) Ramp-down Preheat (stay below Flux activation temp) 30-60 seconds Ramp-Up 15 seconds (minimize) Page 4 solder-time 15-20 seconds Ramp-down 05221.R2 3/11 www.protekdevices.com 05221 Only One Name Means ProTek’Tion™ ULLC0408FC05C U0408 PaCKaGe inFoRmation oUtLine dimensions dim A B C E F I notes 1.97 0.406 0.98 0.15 SQ 2.03 miLLimeteRs min 0.56 0.86 1.02 inChes min 0.022 0.034 0.038 0.078 0.016 0.040 0.080 0.006 SQ maX maX 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). TOP A BC SIDE F E Metalized Die Contacts END I 05221.R2 3/11 Page 5 www.protekdevices.com 05221 Only One Name Means ProTek’Tion™ ULLC0408FC05C U0408 PaCKaGe inFoRmation oPtion 1 - LayoUt dimensions dim A C D E F G H I notes C A D miLLimeteRs nominaL 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 inChes nominaL 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 SOLDER PRINT 0.010” - 0.012” DIA. SOLDER PADS SOLDER MASK F HG I DIE CONTACTS E 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Usign 0.1mm (0.004”) stencil. oPtion 2 - LayoUt dimensions dim A F G H I notes COPPER CONTACT 0.009”[0.23] DIA. A miLLimeteRs nominaL 0.51 0.15 SQ 0.71 0.99 0.51 inChes nominaL 0.020 0.006 SQ 0.028 0.039 0.020 HG I DIE CONTACTS 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Usign 0.1mm (0.004”) stencil. F SOLDER PRINT 0.014” [0.36] DIA. SOLDER MASK 05221.R2 3/11 Page 6 www.protekdevices.com 05221 Only One Name Means ProTek’Tion™ ULLC0408FC05C taPe and ReeL inFoRmation 10 Pitches Cumulative Tolerance on tape ± 0.2 E t D P2 P0 Top Cover Tape K0 A0 B0 F W P User Direction of Feed sPeCiFiCations ReeL dia. 178(7”) 1. 2. 3. 4. 5. 6. taPe width 8 a0 b0 K0 d e F w P0 P2 P tmax 0.25 0.80 ± 0.10 1.20 ± 0.10 0.70 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.20 4.00 ± 0.12 2.00 ± 0.05 2.00 ± 0.10 notes Dimensions in millimeters. Top view of tape. Metal contacts are face down in tape package. Orientation: preferred stencil - 0.1mm (0.004”). Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7” Reels - 5,000 Marking on reel: Part Number, Date Code and Lot Number. taPe & ReeL oRientation Quad Die - 0408 Package outline, pad layout and tape specifications per document number 06026.R4 9/09. oRdeRinG inFoRmation base PaRt nUmbeR ULLC0408FC05C LeadFRee sUFFiX n/a taPe sUFFiX -T75-1 qty/ReeL 5,000 ReeL siZe 7” tUbe qty n/a 05221.R2 3/11 Page 7 www.protekdevices.com 05221 Only One Name Means ProTek’Tion™ ULLC0408FC05C ComPany inFoRmation ComPany PRoFiLe ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. ContaCt Us Corporate headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA by telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 by Fax General: 602-431-2288 by e-mail: Sales: sales@protekdevices.com Customer Service: service@protekdevices.com Technical Support: support@protekdevices.com web www.protekdevices.com www.protekanalog.com COPYRIGHT © ProTek Devices 2007 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”. 05221.R2 3/11 Page 8 www.protekdevices.com