ASM3I2111BG-08SR

February 2007 rev 0.2 Peak EMI Reducing Solution Features • • • Generates an EMI optimized clock at the output. Input frequency: 25MHz. Frequency outputs: • 60MHz (unmodulated) • 2 x 48MHz (unmodulated) • 66.6MHz (modulated): -1.7% down spread • • • • • Modulation rate: 30KHz. Supply voltage range: 3.3V ± 0.3V. Available in 8-pin SOIC Package. Commercial and Industrial Temperature range. RoHS Compliant ASM3P2111B allows significant system cost savings by reducing the number of circuit board layers and shielding that are required to pass EMI regulations. The ASM3P2111B modulates the output of PLL in order to spread the bandwidth of a synthesized clock, thereby decreasing the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most clock generators. Lowering EMI by increasing a signal’s bandwidth is called spread spectrum clock generation. Applications ASM3P2111B is targeted towards EMI management for Product Description The ASM3P2111B is a versatile spread spectrum frequency modulator that reduces electromagnetic interference (EMI) at the clock source. The ASM3P2111B high speed digital applications such as PC peripheral devices, consumer electronics and embedded controller systems. Block Diagram VDD XIN /CLKIN Crystal Oscillator XOUT PLL1 60 MHz 48 MHz_1 48 MHz_2 48 MHz_1 PLL2 66.6 MHz Modulated VSS PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. February 2007 rev 0.2 Pin Configuration ASM3P2111B XIN/ CLKIN XOUT VDD 60MHz 1 2 3 4 8 7 VSS 66.6MHz 48MHz_1 48MHz_2 ASM3P2111B 6 5 Pin Description Description Connection to crystal Connection to crystal Power supply for the analog and digital blocks (+3.3V) Clock output-1 60MHz un-modulated Clock output-2 48MHz_2 un-modulated Clock output-3 48MHz_1 un-modulated Clock output-4 66.6MHz modulated Ground to entire chip. Connect to System Ground Pin # 1 2 3 4 5 6 7 8 Pin Name XIN / CLKIN XOUT VDD 60MHz 48MHz_2 48MHz_1 66.6MHz VSS Type I O P O O O O P Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 2 of 8 February 2007 rev 0.2 Absolute Maximum Ratings Symbol VDD, VIN TSTG TA Ts TJ TDV Storage temperature Operating temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) ASM3P2111B Parameter Voltage on any pin with respect to Ground Rating -0.5 to +4.6 -65 to +125 -40 to +85 260 150 2 Unit V °C °C °C °C KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Operating Conditions Symbol VDD FXIN CL Parameter Supply Voltage Crystal Resonator Frequency Output Driver Load Capacitance Condition / Description 3.3V ± 0.3V Min 3 25 - Typ 3.3 - Max 3.6 15 Unit V MHz pF Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 3 of 8 February 2007 rev 0.2 DC Electrical Characteristics Parameter Overall Supply Current, Dynamic Supply Current, Static All input pins High-Level Input Voltage Low-Level Input Voltage High-Level Input Current Low-Level Input Current (pull-up) High-Level Output Source Current Low-Level Output Sink Current Clock Outputs High-Level Output Source Current Low-Level Output Sink Current Output Impedance IOH IOL ZOH ZOL VO=2.5V VO=0.4V VO=0.5 VDD; output driving high Vo=0.5 VDD; output driving low -20 23 29 27 VIH VIL IIH IIL IxOH IxOL VDD=V (XIN) = 3.3V, VO=0.4V VDD=3.3V, V (XIN)=VO=2.5V VDD=3.3V VDD=3.3V 2.0 VSS-0.3 -1 -20 -36 3 3 IDD IDDL VDD=3.3V, FCLK =25MHz, CL=15pF VDD = 3.3V, Clock Input = 0 41 20 48 25 ASM3P2111B Symbol Conditions / Description Min Typ Max Unit 62 35 mA mA VDD+0.3 0.8 1 -80 - V V µA µA mA mA - mA mA Ω AC Electrical Characteristics Parameter Rise Time Fall Time Clock Duty Cycle Symbol tr tf Conditions/ Description VO = 0.8V to 2.0V; CL = 15pF VO = 2.0V to 0.8V; CL = 15pF Ratio of pulse width (as measured from rising edge to next falling edge at VDD /2) to one clock period Min 300 360 Typ 800 800 Max 900 900 Unit pS pS 45 - 55 % * CL = 15 pF, Input clock frequency = 25MHz Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 4 of 8 February 2007 rev 0.2 Typical Crystal Oscillator Circuit ASM3P2111B Crystal R1 = 510Ω C1 =18 pF C2 = 18 pF Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency Frequency tolerance Operating temperature range Storage temperature Load capacitance Shunt capacitance ESR 25MHz ± 50 ppm or better at 25°C -25°C to +85°C -40°C to +85°C 18pF 7pF maximum 25Ω Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 5 of 8 February 2007 rev 0.2 Package Information 8-lead (150-mil) SOIC Package ASM3P2111B E H D A2 A θ e B A 1 C L D Dimensions Symbol Min A1 A A2 B C D E e H L θ Inches Max 0.010 0.069 0.059 0.020 0.010 0.004 0.053 0.049 0.012 0.007 Millimeters Min Max 0.10 1.35 1.25 0.31 0.18 4.90 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0° 1.27 8° 0.25 1.75 1.50 0.51 0.25 0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0° 0.050 8° Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 6 of 8 February 2007 rev 0.2 Ordering Codes Part number ASM3P2111BF-08ST ASM3P2111BF-08SR ASM3I2111BF-08ST ASM3I2111BF-08SR ASM3P2111BG-08ST ASM3P2111BG-08SR ASM3I2111BG-08ST ASM3I2111BG-08SR ASM3P2111B Marking 3P2111BF 3P2111BF 3I2111BF 3I2111BF 3P2111BG 3P2111BG 3I2111BG 3I2111BG Package Configuration 8-pin SOIC TUBE, Pb Free 8-pin SOIC TAPE & REEL, Pb Free 8-pin SOIC TUBE, Pb Free 8-pin SOIC TAPE & REEL, Pb Free 8-pin SOIC TUBE, Green 8-pin SOIC TAPE & REEL, Green 8-pin SOIC TUBE, Green 8-pin SOIC TAPE & REEL, Green Temperature Range Commercial Commercial Industrial Industrial Commercial Commercial Industrial Industrial Ordering Information ASM3P2111BF-08 SR R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 7 of 8 February 2007 rev 0.2 ASM3P2111B PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Copyright © PulseCore Semiconductor All Rights Reserved Part Number: ASM3P2111B Document Version: v0.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 © Copyright 2007 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Peak Reducing EMI Solution Notice: The information in this document is subject to change without notice. 8 of 8