May 2007 rev 0.4
ASM3P622S00A/B/J/E/K
Low Frequency Timing-Safe™ Peak EMI reduction IC
General Features
• • • • Low Frequency Clock distribution with TimingSafe™ Peak EMI Reduction Input frequency range: 4MHz - 20MHz Zero input - output propagation delay Low-skew outputs • Output-output skew less than 250pS • Device-device skew less than 700pS • • Less than 200pS cycle-to-cycle jitter Available in 16pin, 150mil SOIC, 4.4mm TSSOP (ASM3P622S00E/K), and in 8pin, 150 mil SOIC, 4.4mm TSSOP Packages (ASM3P622S00A/B/J) • • • • 3.3V Operation Industrial temperature range Advanced CMOS technology The First True Drop-in Solution
one reference input and drives out one low-skew clock. All parts have on-chip PLLs that lock to an input clock on the XIN/CLKIN pin. The PLL feedback is on-chip and is obtained from the CLKOUT pad, internal to the device. Multiple ASM3P622S00E/K devices can accept the same input clock and distribute it. In this case, the skew between the outputs of the two devices is guaranteed to be less than 700pS. All outputs have less than 200pS of Cycle-to-cycle jitter. The input and output propagation delay is guaranteed to be less than ±350pS, and the output-to-output skew is guaranteed to be less than 250pS. Refer “Spread Spectrum Control and Input-Output Skew
Functional Description
ASM3P622S00A/B/J/E/K is a versatile, 3.3V Zero-delay buffer designed to distribute low frequency Timing-Safe™ clocks with Peak EMI reduction. ASM3P622S00E/K accepts one reference input and drives out eight low-skew clocks. It is available in a 16pin Package. The ASM3P622S00A/B/J is the eight-pin version and accepts
Table”
for
deviations
and
Input-Output
Skew for
ASM3P622S00A/B/J and ASM3P622S00E/K devices The ASM3P622S00A/B/J and ASM3P622S00E/K are available in two different packages, as shown in the ordering information table.
Block Diagram
VDD
SSON
SS%
Modulation XIN/CLKIN XOUT Crystal Oscillator Reference Divider Feedback Divider Phase Detector Loop Filter
PLL
VCO
Feedforward Divider CLKOUT
GND
PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com
Notice: The information in this document is subject to change without notice.
May 2007 rev 0.4
Spread Spectrum Frequency Generation
The clocks in digital systems are typically square waves with a 50% duty cycle and as frequencies increase the edge rates also get faster. Analysis shows that a square wave is composed of fundamental frequency and harmonics. The fundamental frequency and harmonics generate the energy peaks that become the source of EMI. Regulatory agencies test electronic equipment by measuring the amount of peak energy radiated from the equipment. In fact, the peak level allowed decreases as the frequency increases. The standard methods of reducing EMI are to use shielding, filtering, multi-layer
ASM3P622S00A/B/J/E/K
PCBs etc. These methods are expensive. Spread spectrum clocking reduces the peak energy by reducing the Q factor of the clock. This is done by slowly modulating the clock frequency. The ASM3P622S00A/B/J/E/K uses the center modulation spread spectrum technique in which the modulated output frequency varies above and below the reference frequency with a specified modulation rate. With center modulation, the average frequency is the same as the unmodulated frequency and there is no performance degradation
Timing-Safe™ technology
Timing-Safe™ technology is the ability to modulate a clock source with Spread Spectrum technology and maintain synchronization with any associated data path.
Pin Configuration
CLKIN NC SS%
1 2
8 7 6 5
NC VDD CLKOUT SSON
ASM3P622S00A/B
3
GND 4
XIN / CLKIN XOUT SS%
1 2
8 7
NC VDD CLKOUT SSON
ASM3P622S00J
3 6 5
GND 4
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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ASM3P622S00A/B/J/E/K
CLKIN CLKOUT1 VDD SS% GND CLKOUT2 CLKOUT3
1 2 3 4
16 15 14 13
CLKOUT CLKOUT7 CLKOUT6 VDD GND CLKOUT5 CLKOUT4 SSON
ASM3P622S00E
5 6 7 12 11 10 9
DLY CNTRL 8
XIN / CKLIN XOUT CLKOUT1 VDD SS% GND CLKOUT2 CLKOUT3
1 2 3 4
16 15 14 13
CLKOUT CLKOUT7 CLKOUT6 VDD GND CLKOUT5 CLKOUT4 SSON
ASM3P622S00K
5 6 7 8 12 11 10 9
Pin Description for ASM3P622S00A/B Pin #
1 2 3 4 5 6 7 8
Pin Name
CLKIN NC SS%
2
Description
Input reference frequency, 5V tolerant input No Connect Spread Spectrum Selection Ground Spread Spectrum enable and disable option When SSON is HIGH, the spread spectrum is enabled and when LOW, it turns off the spread spectrum.
GND SSON2 CLKOUT VDD NC
1
Buffered clock output 3.3V supply No Connect
Notes: 1. Weak pull-down on all outputs 2. Weak pull-up on these Inputs 3. Buffered clock output is Timing-Safe™
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.4
Pin Description for ASM3P622S00J Pin #
1 2 3 4 5 6 7 8
ASM3P622S00A/B/J/E/K
Pin Name
XIN/CLKIN XOUT SS%2 GND SSON2 CLKOUT VDD NC
1
Description
Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. Crystal connection. If using an external reference, this pin must be left unconnected. Spread Spectrum Selection Ground Spread Spectrum enable and disable option When SSON is HIGH, the spread spectrum is enabled and when LOW, it turns off the spread spectrum. Buffered clock output 3.3V supply No Connect
Notes: 1. Weak pull-down on all outputs 2. Weak pull-up on these Inputs 3. Buffered clock output is Timing-Safe™
Pin Description for ASM3P622S00E Pin #
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Pin Name
CLKIN CLKOUT1 VDD SS%
2 1
Description
Input reference frequency, 5V tolerant input Buffered clock output 3.3V supply Spread Spectrum Selection Ground
GND CLKOUT2 CLKOUT3
1 1
Buffered clock output Buffered clock output The pin is used to skew the outputs such that they align with the input. The skew is in the range of 100-200pS Spread Spectrum enable and disable option. When SSON is HIGH, the spread spectrum is enabled and when LOW, it turns off the spread spectrum.
DLY CNTRL SSON3 CLKOUT4 CLKOUT5 GND VDD CLKOUT6 CLKOUT7 CLKOUT
1 1 1 1
Buffered clock output Buffered clock output Ground 3.3V supply Buffered clock output Buffered clock output Buffered clock output
1
Notes: 1. Weak pull-down on all outputs 2. Weak pull-up on these Inputs 3. Buffered clock outputs are Timing-Safe™
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.4
Pin Description for ASM3P622S00K Pin #
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
ASM3P622S00A/B/J/E/K
Pin Name
XIN/CLKIN XOUT CLKOUT11 VDD SS%
2
Description
Crystal connection or external reference frequency input. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. Crystal connection. If using an external reference, this pin must be left unconnected. Buffered clock output 3.3V supply Spread Spectrum Selection Ground Buffered clock output Buffered clock output Spread Spectrum enable and disable option. When SSON is HIGH, the spread spectrum is enabled and when LOW, it turns off the spread spectrum.
GND CLKOUT21 CLKOUT3 SSON2 CLKOUT4 CLKOUT5 GND VDD CLKOUT6 CLKOUT7 CLKOUT
1 1 1 1 1
Buffered clock output Buffered clock output Ground 3.3V supply Buffered clock output Buffered clock output Buffered clock output
1
Notes: 1. Weak pull-down on all outputs 2. Weak pull-up on these Inputs 3. Buffered clock outputs are Timing-Safe™
Spread Spectrum Control and Input-Output Skew Table Device
ASM3P622S00A/B/J/E/K
Input Frequency
12MHz
SS %
0 1
Deviation
±0.25 % ±0.50 %
Input-Output Skew(±TSKEW)
0.063 0.125
Note: TSKEW is measured in units of the Clock Period
Absolute Maximum Ratings Symbol
VDD TSTG Ts TJ TDV Storage temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B)
Parameter
Voltage on any pin with respect to Ground
Rating
-0.5 to +4.6 -65 to +125 260 150 2
Unit
V °C °C °C KV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability.
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.4
Operating Conditions for ASM3P622S00A/B/J/E/K Devices Parameter
VDD TA CL CIN Supply Voltage Operating Temperature (Ambient Temperature) Load Capacitance Input Capacitance
ASM3P622S00A/B/J/E/K
Description
Min
3.0 -40
Max
3.6 +85 30 7
Unit
V °C pF pF
Electrical Characteristics for ASM3P622S00A/B/J/E/K Parameter
VIL VIH IIL IIH VOL VOH IDD Zo
Description
Input LOW Voltage Input LOW Current Input HIGH Current Output LOW Voltage Supply Current Output Impedance
2 2 1 1
Test Conditions
Min
2.0
Typ
Max
0.8
Unit
V V µA µA V V mA Ω
Input HIGH Voltage
VIN = 0V VIN = VDD IOL = 8mA IOH = -8mA Unloaded outputs 2.4 15 23
50 100 0.4
Output HIGH Voltage
Note: 1. CLKIN input has a threshold voltage of VDD/2 2. Parameter is guaranteed by design and characterization. Not 100% tested in production
Switching Characteristics for ASM3P622S00A/B/J/E/K1 Parameter
1/t1 t3 t4 t5 t6 t7 tJ tLOCK
Description
Output Frequency Duty Cycle = (t2 / t1) * 100 Output Rise Time Output Fall Time
2 2 2 2
Test Conditions
30pF load Measured at VDD/2 Measured between 0.8V and 2.0V Measured between 2.0V and 0.8V All outputs equally loaded Measured at VDD /2 Measured at VDD/2 on the CLKOUT pins of the device Loaded outputs Stable power supply, valid clock presented on CLKIN pin
Min
4 40
Typ
50
Max
20 60 2.5 2.5 250 ±350 700 200 1.0
Unit
MHz % nS nS pS pS pS pS mS
Output-to-output skew CLKOUT Rising Edge
Delay, CLKIN Rising Edge to
2
Device-to-Device Skew 2 Cycle-to-cycle jitter 2 PLL Lock Time
2
Note: 1. All parameters specified with loaded outputs. 2. Parameter is guaranteed by design and characterization. Not 100% tested in production
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.4
Switching Waveforms Duty Cycle Timing
t1 t2
VDD/2 VDD/2 VDD/2
ASM3P622S00A/B/J/E/K
All Outputs Rise/Fall Time
2.0 V 0.8 V t3 t4 2.0 V 0.8 V 3.3 V 0V
OUTPUT
Output - Output Skew
VDD/2 OUTPUT VDD/2 OUTPUT
t5
Input - Output Propagation Delay
VDD / 2
INPUT
VDD/2
OUTPUT
t6
Device - Device Skew
/ V DD 2
CLKOUT, Device 1
CLKOUT, Device 2
V DD/ 2
t7
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.4
Input-Output Skew
Input Timing-Safe™ Output
ASM3P622S00A/B/J/E/K
Test Circuit
+3.3V VDD 0.1uF OUTPUT CLKOUT LOAD VDD One clock cycle N=1 0.1uF GND
TSKEW -
TSKEW+
+3.3V
when spread spectrum is ON For example, TSKEW = ± 0.125 for an Input clock12MHz, translates in to (1/12MHz) * 0.125=10.41nS
TSKEW represents input-output skew
A Typical example of Timing-Safe™ waveform
Input Input
CLKOUT with SSOFF
Timing-Safe™ CLKOUT
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.4
Package Information
ASM3P622S00A/B/J/E/K
8-lead (150-mil) SOIC Package
E
H
D
A2
A
θ
e B A 1
C L
D
Dimensions
Symbol Min
A1 A A2 B C D E e H L θ
Inches Max
0.010 0.069 0.059 0.020 0.010 0.004 0.053 0.049 0.012 0.007
Millimeters Min Max
0.10 1.35 1.25 0.31 0.18 4.90 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0° 1.27 8° 0.25 1.75 1.50 0.51 0.25
0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0° 0.050 8°
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
9 of 16
May 2007 rev 0.4
ASM3P622S00A/B/J/E/K
8-lead TSSOP (4.40-MM Body)
H
E D A2 A θ e B A1 L C
Dimensions Symbol Min
A A1 A2 B c D E e H L θ 0.020 0° 0.002 0.033 0.008 0.004 0.114 0.169 0.026 BSC 0.252 BSC 0.028 8° 0.50 0°
Inches Max
0.043 0.006 0.037 0.012 0.008 0.122 0.177 0.05 0.85 0.19 0.09 2.90 4.30
Millimeters Min Max
1.10 0.15 0.95 0.30 0.20 3.10 4.50 0.65 BSC 6.40 BSC 0.70 8°
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
10 of 16
May 2007 rev 0.4
ASM3P622S00A/B/J/E/K
16-lead (150 Mil) Molded SOIC Package
8
1
PIN 1 ID
E
H
9 D
16 Seating Plane A e
B
h
A2
D
0.004
θ L
C
A1
Dimensions Symbol Min
A A1 A2 B C D E e H h L θ 0.228 0.010 0.016 0° 0.053 0.004 0.049 0.013 0.008 0.386 0.150 0.050 BSC 0.244 0.016 0.035 8° 5.80 0.25 0.40 0°
Inches Max
0.069 0.010 0.059 0.022 0.012 0.394 0.157
Millimeters Min
1.35 0.10 1.25 0.33 0.19 9.80 3.80 1.27 BSC 6.20 0.41 0.89 8°
Max
1.75 0.25 1.50 0.53 0.27 10.01 4.00
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.4
ASM3P622S00A/B/J/E/K
16-lead TSSOP (4.40-MM Body)
8
1
PIN 1 ID E H
9
16
A
Seating Plane θ L C
e D
A2
B
A1
D
Dimensions Symbol Min
A A1 A2 B C D E e H L θ 0.020 0° 0.002 0.031 0.007 0.004 0.193 0.169 0.026 BSC 0.252 BSC 0.030 8° 0.50 0°
Inches Max
0.043 0.006 0.041 0.012 0.008 0.201 0.177 0.05 0.80 0.19 0.09 4.90 4.30
Millimeters Min Max
1.20 0.15 1.05 0.30 0.20 5.10 4.50 0.65 BSC 6.40 BSC 0.75 8°
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
12 of 16
May 2007 rev 0.4
Ordering Codes Ordering Code
ASM3P622S00AF-08-ST ASM3I622S00AF-08-ST ASM3P622S00AF-08-SR ASM3I622S00AF-08-SR ASM3P622S00AF-08-TT ASM3I622S00AF-08-TT ASM3P622S00AF-08-TR ASM3I622S00AF-08-TR ASM3P622S00BF-08-ST ASM3I622S00BF-08-ST ASM3P622S00BF-08-SR ASM3I622S00BF-08-SR ASM3P622S00BF-08-TT ASM3I622S00BF-08-TT ASM3P622S00BF-08-TR ASM3I622S00BF-08-TR ASM3P622S00JF-08-ST ASM3I622S00JF-08-ST ASM3P622S00JF-08-SR ASM3I622S00JF-08-SR ASM3P622S00JF-08-TT ASM3I622S00JF-08-TT ASM3P622S00JF-08-TR ASM3I622S00JF-08-TR ASM3P622S00EF-16-ST ASM3I622S00EF-16-ST ASM3P622S00EF-16-SR ASM3I622S00EF-16-SR ASM3P622S00EF-16-TT ASM3I622S00EF-16-TT ASM3P622S00EF-16-TR ASM3I622S00EF-16-TR ASM3P622S00KF-16-ST
ASM3P622S00A/B/J/E/K
Marking
3P622S00AF 3I622S00AF 3P622S00AF 3I622S00AF 3P622S00AF 3I622S00AF 3P622S00AF 3I622S00AF 3P622S00BF 3I622S00BF 3P622S00BF 3I622S00BF 3P622S00BF 3I622S00BF 3P622S00BF 3I622S00BF 3P622S00JF 3I622S00JF 3P622S00JF 3I622S00JF 3P622S00JF 3I622S00JF 3P622S00JF 3I622S00JF 3P622S00EF 3I622S00EF 3P622S00EF 3I622S00EF 3P622S00EF 3I622S00EF 3P622S00EF 3I622S00EF 3P622S00KF
Package Type
8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 16-pin 150-mil SOIC-TUBE, Pb Free 16-pin 150-mil SOIC-TUBE, Pb Free 16-pin 150-mil SOIC-TAPE & REEL, Pb Free 16-pin 150-mil SOIC-TAPE & REEL, Pb Free 16-pin 4.4-mm TSSOP - TUBE, Pb Free 16-pin 4.4-mm TSSOP - TUBE, Pb Free 16-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 16-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 16-pin 150-mil SOIC-TUBE, Green
Temperature
Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
13 of 16
May 2007 rev 0.4
Ordering Codes (cont’d ) Ordering Code
ASM3I622S00KF-16-ST ASM3P622S00KF-16-SR ASM3I622S00KF-16-SR ASM3P622S00KF-16-TT ASM3I622S00KF-16-TT ASM3P622S00KF-16-TR ASM3I622S00KF-16-TR ASM3P622S00AG-08-ST ASM3I622S00AG-08-ST ASM3P622S00AG-08-SR ASM3I622S00AG-08-SR ASM3P622S00AG-08-TT ASM3I622S00AG-08-TT ASM3P622S00AG-08-TR ASM3I622S00AG-08-TR ASM3P622S00BG-08-ST ASM3I622S00BG-08-ST ASM3P622S00BG-08-SR ASM3I622S00BG-08-SR ASM3P622S00BG-08-TT ASM3I622S00BG-08-TT ASM3P622S00BG-08-TR ASM3I622S00BG-08-TR ASM3P622S00JG-08-ST ASM3I622S00JG-08-ST ASM3P622S00JG-08-SR ASM3I622S00JG-08-SR ASM3P622S00JG-08-TT ASM3I622S00JG-08-TT ASM3P622S00JG-08-TR ASM3I622S00JG-08-TR ASM3P622S00EG-16-ST ASM3I622S00EG-16-ST ASM3P622S00EG-16-SR
ASM3P622S00A/B/J/E/K
Marking
3I622S00KF 3P622S00KF 3I622S00KF 3P622S00KF 3I622S00KF 3P622S00KF 3I622S00KF 3P622S00AG 3I622S00AG 3P622S00AG 3I622S00AG 3P622S00AG 3I622S00AG 3P622S00AG 3I622S00AG 3P622S00BG 3I622S00BG 3P622S00BG 3I622S00BG 3P622S00BG 3I622S00BG 3P622S00BG 3I622S00BG 3P622S00JG 3I622S00JG 3P622S00JG 3I622S00JG 3P622S00JG 3I622S00JG 3P622S00JG 3I622S00JG 3P622S00EG 3I622S00EG 3P622S00EG
Package Type
16-pin 150-mil SOIC-TUBE, Green 16-pin 150-mil SOIC-TAPE & REEL, Green 16-pin 150-mil SOIC-TAPE & REEL, Green 16-pin 4.4-mm TSSOP - TUBE, Green 16-pin 4.4-mm TSSOP - TUBE, Green 16-pin 4.4-mm TSSOP - TAPE & REEL, Green 16-pin 4.4-mm TSSOP - TAPE & REEL, Green 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TUBE, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 150-mil SOIC-TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TUBE, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 8-pin 4.4-mm TSSOP - TAPE & REEL, Pb Free 16-pin 150-mil SOIC-TUBE, Green 16-pin 150-mil SOIC-TUBE, Green 16-pin 150-mil SOIC-TAPE & REEL, Green
Temperature
Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
14 of 16
May 2007 rev 0.4
Ordering Codes (cont’d ) Ordering Code
ASM3I622S00EG-16-SR ASM3P622S00EG-16-TT ASM3I622S00EG-16-TT ASM3P622S00EG-16-TR ASM3I622S00EG-16-TR ASM3P622S00KG-16-ST ASM3I622S00KG-16-ST ASM3P622S00KG-16-SR ASM3I622S00KG-16-SR ASM3P622S00KG-16-TT ASM3I622S00KG-16-TT ASM3P622S00KG-16-TR ASM3I622S00KG-16-TR
ASM3P622S00A/B/J/E/K
Marking
3I622S00EG 3P622S00EG 3I622S00EG 3P622S00EG 3I622S00EG 3P622S00KG 3I622S00KG 3P622S00KG 3I622S00KG 3P622S00KG 3I622S00KG 3P622S00KG 3I622S00KG
Package Type
16-pin 150-mil SOIC-TAPE & REEL, Green 16-pin 4.4-mm TSSOP - TUBE, Green 16-pin 4.4-mm TSSOP - TUBE, Green 16-pin 4.4-mm TSSOP - TAPE & REEL, Green 16-pin 4.4-mm TSSOP - TAPE & REEL, Green 16-pin 150-mil SOIC-TUBE, Green 16-pin 150-mil SOIC-TUBE, Green 16-pin 150-mil SOIC-TAPE & REEL, Green 16-pin 150-mil SOIC-TAPE & REEL, Green 16-pin 4.4-mm TSSOP - TUBE, Green 16-pin 4.4-mm TSSOP - TUBE, Green 16-pin 4.4-mm TSSOP - TAPE & REEL, Green 16-pin 4.4-mm TSSOP - TAPE & REEL, Green
Temperature
Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial Commercial Industrial
Device Ordering Information
ASM3P622S00BF-08-TR
R = Tape & Reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE, LEAD FREE, and RoHS PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70
PulseCore Semiconductor Mixed Signal Product
Licensed under US patent #5,488,627, #6,646,463 and #5,631,920.
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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May 2007 rev 0.4
ASM3P622S00A/B/J/E/K
PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com
Copyright © PulseCore Semiconductor All Rights Reserved Preliminary Information Part Number: ASM3P622S00A/B/J/E/K Document Version: 0.4
Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 Timing-Safe™ US Patent Pending.
© Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use.
Low Frequency Timing-Safe™ Peak EMI Reduction IC
Notice: The information in this document is subject to change without notice.
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