H5610NLT

High Density 1Gigabit PoE/PoE+ SMD Modules BGA Quad/Dual/Single port for flexible PCB placement HX52xxNL, HX54xxNL, HX5610NL, and HX6xxxHL Compact SMT 1Gigabit PoE modules offering less than 140mm2 /port density Reliable surface mount ball grid array Standard and Industrial Temperature range Modular construction exceeds IEEE802.3u/ab Options support 4pair PoE+ (70W) of DC power Designed to fit behind 2xN connectors RoHS-6, peak reflow temperature rating 245°C Supplied in Trays or Tape and Reel Standard Range RoHS-6 Compliant Part Number Number of Ports H5610NL H5200NL H5201NL H5400NL H5401NL 1 2 2 4 4 Electrical Specifications @ 25°C - Operating Temperature 0°C to +70°C Insertion Loss (dB Max) Return Loss (dB Min) 1-100MHz 1.5 1.5 1.5 1.5 1.5 1-30MHz -18 -18 -18 -18 -18 1.5 1.5 1.5 1.5 1.5 -18 -18 -18 -18 -18 Industrial Range HX5610NL HX5200NL HX5201NL HX5400NL HX5401NL 1 2 2 4 4 Power over Ethernet 6 H6600NL HX6621NL H6200NL HX6221NL H6400NL HX6400NL 1 1 2 2 4 4 1.5 1.5 1.5 1.5 1.5 1.5 -18 -18 -18 -18 -18 -18 40MHz 50MHz 60-80MHz 100MHz 30-60MHZ 80-100MHz 125MHz -16 -14 -11 -10 -32 -25 -19 -16 -14 -11 -10 -32 -25 -19 -16 -14 -11 -10 -32 -25 -19 -16 -14 -11 -10 -32 -25 -19 -16 -14 -11 -10 -32 -25 -19 Electrical Specifications @ 25°C - Operating Temperature -40°C to +80°C -16 -14 -10 -10 -32 -25 -19 -16 -14 -10 -10 -32 -25 -19 -16 -14 -10 -10 -32 -25 -19 -16 -14 -10 -10 -32 -25 -19 -16 -14 -10 -10 -32 -25 -19 Electrical Specifications @ 25°C - Operating Temperature 0°C to + 70°C / -40°C to +80°C -16 -14 -11 -10 -32 -25 -19 -16 -14 -10 -10 -32 -25 -19 -16 -14 -11 -10 -32 -25 -19 -16 -14 -10 -10 -32 -25 -19 -16 -14 -11 -10 -32 -25 -19 -16 -14 -10 -10 -32 -25 -19 Notes: 1. Header DAP with flamability Rating UL-94V-0 2. MSL = Moisture Sensitivity Level: 1 per J-STD-020 3. J-STD-075 R7m 235°C maximum 4. Compliance to J-STD-002 Solderable at 245°C 5. Reflow Profile, J-STD-020: LEVEL 1 6. RoHS-6: Product does not contain 5 out of the 6 banned substances specified in the RoHS directive. Some internal connections may contain lead in high-temperature solder (solder alloys containing more than 85% lead) 1 Common Mode Rejection [CMMR] (dB Min) PulseElectronics.com Crosstalk (dB Min) 4P PoE Rating 30MHz 60MHz 100MHz -44 -37 -33 -44 -37 -33 -44 -37 -33 -44 -37 -33 -44 -37 -33 (Watts) 35max 35max 30max 35max 30max -44 -44 -44 -44 -44 -37 -37 -37 -37 -37 -33 -33 -33 -33 -33 35max 35max 30max 35max 30max -44 -44 -44 -44 -44 -44 -37 -37 -37 -37 -37 -37 -33 -33 -33 -33 -33 -33 70max 70max 70max 70max 70max 70max 7. Operating Temperature: Standard "H" parts 0°C to +70°C Industrial "HX" products -40°C to +85°C 8. Storage Temperature: Standard "H" parts - 20°C to +125°C, Indusrial "HX" parts -50°C to +125°C 9. Contact Pulse for other connector option via the "Resources" link on he Pulse Electronics website. 10. To order parts in Tape and Reel Packaging add a "T" suffix to the part number (*ie. HX6221NL becomes HX6221NLT). H551.A (04/23) High Density 1Gigabit PoE/PoE+ SMD Modules BGA Quad/Dual/Single port for flexible PCB placement HX52xxNL, HX54xxNL, HX5610NL, and HX6xxxHL Mechanical SINGLE PORT - H5610NL, HX5610NL, H6600NL and HX6621NL Weight. . . . . . . . . . . . . 2.5 grams Tray/Box. . . . . . . . . . . . . . 60/600 Reel/Box. . . . . . . . . . . . 300/1500 SUGGESTED FOOTPRINT Dimensions: COMPONENT/TOP VIEW Inches mm Unless otherwise specified, all tolerances are ± 0.10 0,25 DUAL PORT - H520xNL, HX520xNL, H6200NL and HX6221NL Weight. . . . . . . . . . . 5 grams Tray/Box. . . . . . . . . . . 84/420 Reel/Box. . . . . . . . . . 170/850 Dimensions: COMPONENT/TOP VIEW 2 PulseElectronics.com Inches mm Unless otherwise specified, all tolerances are ± 0.10 0,25 H551.A (04/23) High Density 1Gigabit PoE/PoE+ SMD Modules BGA Quad/Dual/Single port for flexible PCB placement HX52xxNL, HX54xxNL, HX5610NL, and HX6xxxHL Mechanical QUAD PORT - H540xNL, HX540xNL, H6400NL and HX6400NL Weight. . . . . . . . . . 11 grams Tray/Box. . . . . . . . . . 60/300 Reel/Box. . . . . . . . . 170/850 Dimensions: BOTTOM VIEW SUGGESTED FOOTPRINT Inches mm Unless otherwise specified, all tolerances are ± 0.10 0,25 COMPONENT/TOP VIEW Schematic H/HX5200NL, H/HX5400NL, H6600NL, HX6621NL, H6200NL, HX6221NL, H/HX6400NL Schematic shown for one port DUAL and QUAD designs use the same pad numbering for the 2 and 4 ports 3 PulseElectronics.com H551.A (04/23) High Density 1Gigabit PoE/PoE+ SMD Modules BGA Quad/Dual/Single port for flexible PCB placement HX52xxNL, HX54xxNL, HX5610NL, and HX6xxxHL Schematic H/HX5201NL, H/HX5401NL Schematic shown for one port DUAL and QUAD designs use the same pad numbering for the 2 and 4 ports Soldering Information Solder reflow profile conditions Profile ProfileFeature Feature Typical reflow profile Lead-free Lead-freeSolder* Solder* °° Pre-heat Pre-heat °° Reflow Reflow nndd * *See See 4 PulseElectronics.com H551.A (04/23) High Density 1Gigabit PoE/PoE+ SMD Modules BGA Quad/Dual/Single port for flexible PCB placement HX52xxNL, HX54xxNL, HX5610NL, and HX6xxxHL Tape & Reel P2 CARRIER TAPE - SEE TABLES BELOW P P0 E D1 F B0 S0 W A0 T K0 K1 8 20 0 0 14 T 0.50±0.05 1 0 0 1 1 2 2 2 -------- 1 11 30 0 D1 1 0 0 ±0.10 1.50 -0.00 32 0 -------- 0 14 20 00 44 0 0 20 0 0 1 1 2 -------- 1 11 20 D1 0 ±0.10 1.50 -0.00 1 1 2 -------- 1 11 20 0 ±0.10 1.50 -0.00 11 0 170 28 2 0 14 2 2 11 0 0 2 0 0.50±0.05 1 40 0 0 W+0.5mm All Dimensions meet EIA-481-D requirements. 0 0 -------- -------- D1 T T 24 24 170 300 1 Component For More Information: Americas - prod_info_network_americas@yageo.com | Europe - prod_info_network_emea@yageo.com | Asia - prod_info_network_apac@yageo.com Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names mentioned herein may be trademarks or registered trademarks of their respective owners. © Copyright, 2023. Pulse Electronics, Inc. All rights reserved. 5 PulseElectronics.com H551.A (04/23)