SEMICONDUCTOR
TECHNICAL SPECIFICATION
RECTRON ECTRON
SMALL SIGNAL DIODE
VOLTAGE RANGE 75 Volts CURRENT 250 mAmpere
1N4448W
FEATURES
* Fast Switching Speed * Surface Mount Package ldeally Suited for Automatic Insertion * For General Purpose Switching Applicationgs * High Conductance
SOD-123
MECHANICAL DATA
* * * * * Case: Molded plastic Epoxy: UL 94V-O rate flame retardant Lead: MIL-STD-202E method 208C guaranteed Mounting position: Any Weight: 0.01 gram
.110(2.800) .102(2.600) .067(1.700) .059(1.500)
.026(.650) .018(.450)
.152(3.850) .140(3.550)
.006(.150)
.003(.080)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 o C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.
.049(1.250) .041(1.050) .004(.100) .000(0.00)
REF .020(0.500)
Dimensions in inches and (millimeters) MAXIMUM RAT INGS (@ TA=25 OC unless otherwise noted) RATINGS Non-Repetitive Peak Reverse Voltage Maximum R epetitive Peak R everse Voltage Maximum Working Peak reverse Voltage Maximum DC Blocking Voltage Maximum RMS V oltage Maximum Forward Comtinuous Current Maximum Average Forward Rectified Current Non-Repetitive Peak Forward Surge Current Typical Reverse Recovery Time (Note 1) Typical Junction Capacitance (Note 2) M aximum P ower Dissipation (Note 3) Typical Thermal Resistance Operating and Storage Temperature Range SYMBOL VRM VRRM VRWM VR VRMS IFM IO
@t=1.0uS @t=1.0S
1N4448W 100 75 53 500 250
4.0 2.0
UNITS Volts Volts Volts mAmps mAmps Amps nS pF mW
O
IFSM Trr CJ PD R ΘJA TJ, TSTG
4 4 400 315 -65 to + 150 1N4448W
0.715 0.855 1.0 25 25 2.5
C/W O C
ELECTRICAL CHARACTERISTICS (@TA=25 OC unless otherwise noted) SYMBOL CHARACTERISTICS Maximum Instantaneous Forward Voltage
@IF=1.0mA @IF=10mA @IF=50mA @IF=150mA @VR=20V @VR=75V
UNITS
Volts n Amps uAmps
VF
Maximum I nstantaneous Reverse Current
IR
. N OTES : 1. Measured at I F=I R=10mA, I RR=0.1I R A nd R L=100 . 2 . Measured at 1MHz and applied reverse voltage of 0 volts. 3 . Part mounted on FR-4 PC board with minimunm recommended pad layout.
2006-3
RATING AND CHARACTERISTICS CURVES ( 1N4448W )
300
Pd, POWER DISSIPATION (mW) IF, FORWARD CURRENT (mA) 100
200
10
Ta=25OC
Ta=50OC
100
1
Ta=85OC
Ta=0OC Ta=30OC
0
0
25
50
0.1
75
100
O
125
150
0
200
400
600
800
1000
TA, AMBIENT TEMPERATURE ( C)
VF, FORWARD VOLTAGE (mV)
FIG.1 Power Derating Curve
10.0
FIG.2 Typicall Forward Chatacteristics IG.2 Typica Forward Chatacteristics
2.5 trr, REVERSE RECOVERY TIME(nS)
80
IR, LEAKAGE CURRENT (A)
1.0
Ta=100OC Ta=75OC
2.0 1.5 1.0 0.5 0
0.10
Ta=50OC Ta=25OC
0.01
Ta=-30 C
O
Ta=0 C
O
0.001
0
20
40
60
0
2
4
6
8
10
VR, REVERSE VOLTAGE (V)
IF, FORWARD CURRENT (mA)
FIG.3 Typica Reverse Characteristics FIG.3 Typicall Reverse Characteristics
4 CT, TOTAL CAPCITANCE (pF)
f=1 MHz
FIG.4 Reverse Recovery Time vs Forward Current FIG.4 Reverse Recovery Time vs. Forward Current
3
2
1
0
0
1
2
3
4
5
6
IF, FORWARD CURRENT (mA)
FIG.5 Tota Capacicance vs. Reverse Voltage FIG.5 Totall Capacicance vs Reverse Voltage
R ECTRON
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