GNSG70-B00E

SEMICONDUCTOR TECHNICAL SPECIFICATION RECTRON GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E STANDARD GPP CHIP - 70MIL PRODUCT SPECIFICATIONS CHIPS FOR STD GPP/SOLDERING TYPE TYPE: GNSG70 SERIES CHIP APPEARANCE CHIP DIMENSIONS CHIP SIZE 47mil 70mil GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E 70 x 70 mils Contact area 47 x 47 mils Total CHIP THICKNESS 11 mils 10.2mil 11mil SOLDERABLE METALLIZATION Ni / Au FEATURES * Silicon chip with Boron / Phosphorus dopants * Solderable metallization Ni / Au * Glass passivated junction R AT I N G S Maximum Recurrent Peak Reverse Voltage Maximum Average Forward Rectified Current at Derating Case Temperature Maximum Instantaneous Forward Voltage at 2A DC Maximum Average Reverse Current at Rated DC Blocing Voltage Operating Temperature Range Storage Temperature Range @ TA=25OC @ TA=100OC SYMBOL VR IO VF IR TJ TSTG GNSG70-500E 400 GNSG70-700E 600 2 1.1 5 50 150 -55 to + 150 GNSG70-900E 800 GNSG70-B00E 1000 UNITS Volts Amps Volts uAmps 0 0 C C