1338-31DCGI

DATASHEET REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM IDT1338 General Description Features The IDT1338 is a serial real-time clock (RTC) device that consumes ultra-low power and provides a full binary-coded decimal (BCD) clock/calendar with 56 bytes of battery backed Non-Volatile Static RAM. The clock/calendar provides seconds, minutes, hours, day, date, month, and year information. The clock operates in either the 24-hour or 12-hour format with AM/PM indicator. The end of the month date is automatically adjusted for months with fewer than 31 days, including corrections for leap year. Access to the clock/calendar registers is provided by an I2C interface capable of operating in fast I2C mode. Built-in Power-sense circuitry detects power failures and automatically switches to the backup supply, maintaining time and date operation. • Real-Time Clock (RTC) counts seconds, minutes, hours, day, date, month, and year with leap-year compensation valid up to 2100 • 56-Byte battery-backed Non Volatile RAM for data storage • • • • Fast mode I2C Serial interface Automatic power-fail detect and switch circuitry Programmable square-wave output Packaged in 8-pin MSOP, 8-pin SOIC, or 16-pin SOIC (surface-mount package with an integrated crystal) • Industrial temperature range (-40°C to +85°C) Applications • Telecom (Routers, Switches, Servers) • Handheld (GPS, Point of Sale POS terminals) • Consumer Electronics (Set-Top Box, Digital Recording, Network Applications, Digital photo frames) • Office (Fax/Printers, Copiers) • Medical (Glucometer, Medicine Dispensers) • Others (Thermostats, Vending Machines, Modems, Utility Meters) Block Diagram Crystal inside package for 16-pin SOIC ONLY X1 1 Hz/4.096 kHz/ 8.192 kHz/32.768 kHz 32.768 kHz Oscillator and Divider MUX/ Buffer SQW/OUT X2 VCC GND VBAT Power Control Control Logic I2C Interface 56 Byte RAM Clock, Calendar Counter SCL SDA IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 1 1 Byte Control 7 Bytes Buffer IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM Pin Assignment (8-pin MSOP/8-pin SOIC) X1 8 1 X2 2 VBAT 3 GND 4 IDT 1338 7 VCC SQW/OUT RTC Pin Assignment (16-pin SOIC) SCL 1 16 SQW/OUT 2 15 GND 3 14 VBAT 13 NC 12 NC SDA 6 SCL VCC 5 SDA NC 4 NC 5 NC 6 11 NC NC 7 10 NC NC 8 9 NC IDT 1338C Pin Descriptions Pin Number 8MSOP, 8SOIC 16SOIC Pin Name 1 — X1 2 — X2 3 14 VBAT Backup Supply Input for Lithium Coin Cell or Other Energy Source. Battery voltage must be held between the minimum and maximum limits for proper operation. Diodes placed in series between the backup source and the VBAT pin may prevent proper operation. If a backup supply is not required, VBAT must be connected to ground. 4 15 GND Connect to ground. 5 16 SDA Serial data input/output. SDA is the input/output pin for the I2C serial interface. It is an open-drain output and requires an external pull-up resistor (2 Kohm typical). 6 1 SCL Serial clock input. SCL is used to synchronize data movement on the serial interface. It is an open-drain output and requires an external pull-up resistor (2 Kohm typical) 7 2 8 3 VCC Device power supply. When voltage is applied within specified limits, the device is fully accessible by I2C and data can be written and read. — 4 - 13 NC No connect. These pins are unused and must be connected to ground for proper operation. Pin Description/Function Connections for standard 32.768 kHz quartz crystal. The internal oscillator circuitry is designed for operation with a crystal having a specified load capacitance (CL) of 12.5 pF. An external 32.768 kHz oscillator can also drive the IDT1338. In this configuration, the X1 pin is connected to the external oscillator signal and the X2 pin is left floating. SQW/OUT Square-Wave/Output driver. When enabled and the SQWE bit set to 1, the SQW/OUT pin outputs one of four square-wave frequencies (1 Hz, 4 kHz, 8 kHz, 32 kHz). It is an open drain output and requires an external pull-up resistor (10K ohm typical). Operates when the device is powered with VCC or VBAT. IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 2 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Typical Operating Circuit VCC VCC 2k 2k CRYSTAL VCC X1 VCC X2 SCL CPU SDA 10k SQW/OUT IDT1338 GND VBAT + - Detailed Description The following sections discuss in detail the Oscillator block, Power Control block, Clock/Calendar Register Block and Serial I2C block. Oscillator Block Selection of the right crystal, correct load capacitance and careful PCB layout are important for a stable crystal oscillator. Due to the optimization for the lowest possible current in the design for these oscillators, losses caused by parasitic currents can have a significant impact on the overall oscillator performance. Extra care needs to be taken to maintain a certain quality and cleanliness of the PCB. Crystal Selection The key parameters when selecting a 32 kHz crystal to work with IDT1338 RTC are: • Recommended Load Capacitance • Crystal Effective Series Resistance (ESR) • Frequency Tolerance Effective Load Capacitance Please see diagram below for effective load capacitance calculation. The effective load capacitance (CL) should match the recommended load capacitance of the crystal in order for the crystal to oscillate at its specified parallel resonant frequency with 0ppm frequency error. IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 3 In the above figure, X1 and X2 are the crystal pins of our device. Cin1 and Cin2 are the internal capacitors which include the X1 and X2 pin capacitance. Cex1 and Cex2 are the external capacitors that are needed to tune the crystal frequency. Ct1 and Ct2 are the PCB trace capacitances between the crystal and the device pins. CS is the shunt capacitance of the crystal (as specified in the crystal manufacturer's datasheet or measured using a network analyzer). Note: IDT1338CSRI integrates a standard 32.768 kHz crystal in the package and contributes an additional frequency error of 10ppm at nominal VCC (+3.3 V) and TA=+25°C. IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC the oscillator circuit locally on this separated island. The ground connections for the load capacitors and the oscillator should be connected to this island. ESR (Effective Series Resistance) Choose the crystal with lower ESR. A low ESR helps the crystal to start up and stabilize to the correct output frequency faster compared to high ESR crystals. PCB Layout Frequency Tolerance The frequency tolerance for 32 KHz crystals should be specified at nominal temperature (+25°C) on the crystal manufacturer datasheet. The crystals used with IDT1338 typically have a frequency tolerance of +/-20ppm at +25°C. Specifications for a typical 32kHz crystal used with our device are shown in the table below. Parameter Symbol Nominal Freq. fO Series Resistance ESR Load Capacitance CL Min Typ Max Units 32.768 kHz 110 12.5 kΩ pF PCB Design Consideration • Signal traces between IDT device pins and the crystal must be kept as short as possible. This minimizes parasitic capacitance and sensitivity to crosstalk and EMI. Note that the trace capacitances play a role in the effective crystal load capacitance calculation. • Data lines and frequently switching signal lines should be routed as far away from the crystal connections as possible. Crosstalk from these signals may disturb the oscillator signal. • Reduce the parasitic capacitance between X1 and X2 signals by routing them as far apart as possible. • The oscillation loop current flows between the crystal and PCB Assembly, Soldering and Cleaning Board-assembly production process and assembly quality can affect the performance of the 32 KHz oscillator. Depending on the flux material used, the soldering process can leave critical residues on the PCB surface. High humidity and fast temperature cycles that cause humidity condensation on the printed circuit board can create process residuals. These process residuals cause the insulation of the sensitive oscillator signal lines towards each other and neighboring signals on the PCB to decrease. High humidity can lead to moisture condensation on the surface of the PCB and, together with process residuals, reduce the surface resistivity of the board. Flux residuals on the board can cause leakage current paths, especially in humid environments. Thorough PCB cleaning is therefore highly recommended in order to achieve maximum performance by removing flux residuals from the board after assembly. In general, reduction of losses in the oscillator circuit leads to better safety margin and reliability. the load capacitors. This signal path (crystal to CL1 to CL2 to crystal) should be kept as short as possible and ideally be symmetric. The ground connections for both capacitors should be as close together as possible. Never route the ground connection between the capacitors all around the crystal, because this long ground trace is sensitive to crosstalk and EMI. • To reduce the radiation / coupling from oscillator circuit, an isolated ground island on the GND layer could be made. This ground island can be connected at one point to the GND layer. This helps to keep noise generated by IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 4 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM Power Control RTC Table 1. Power Control A precise, temperature-compensated voltage reference and a comparator circuit provides power-control function that monitors the VCC level. The device is fully accessible and data can be written and read when VCC is greater than VPF. However, when VCC falls below VPF, the internal clock registers are blocked from any access. If VPF is less than VBAT, the device power is switched from VCC to VBAT when VCC drops below VPF. If VPF is greater than VBAT, the device power is switched from VCC to VBAT when VCC drops below VBAT. The registers are maintained from the VBAT source until VCC is returned to nominal levels (Table 1). After VCC returns above VPF, read and write access is allowed after tREC (see the “Power-Up/Down Timing” diagram). Supply Condition Read/Write Access Powered By VCC < VPF, VCC < VBAT No VBAT VCC < VPF, VCC > VBAT No VCC VCC > VPF, VCC < VBAT Yes VCC VCC > VPF, VCC > VBAT Yes VCC Power-up/down Timing Table 2. Power-up/down Characteristics Ambient Temperature -40 to +85° C Parameter Symbol Conditions Min. Typ. Max. Units 2 ms Recovery at Power-up tREC (see note below) VCC Fall Time; VPF(MAX) to VPF(MIN) tVCCF IDT1338-18 1 ms IDT1338-31 300 µs 0 µs VCC Rise Time; VPF(MIN) to VPF(MAX) tVCCR Note: This delay applies only if the oscillator is running. If the oscillator is disabled or stopped, no power-up delay occurs. IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 5 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC RTC and RAM Address Map The address map for the RTC and RAM registers shown in Table 3. The RTC registers and control register are located in address locations 00H to 07H The RAM registers are located in address locations 08H to 3FH. During a multibyte access, when the register pointer reaches 3FH (the end of RAM space) it wraps around to location 00H (the beginning of the clock space). On an I2C START, STOP, or register pointer incrementing to location 00H, the current time and date is transferred to a second set of registers. The time and date in the secondary registers are read in a multibyte data transfer, while the clock continues to run. This eliminates the need to re-read the registers in case of an update of the main registers during a read. Table 3. RTC and RAM Address Map Address Bit 7 Bit 6 Bit 5 00H CH 10 seconds 01H 0 10 minutes 02H 0 12/24 03H 0 0 04H 0 0 05H 0 0 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Function Range Seconds Seconds 00 - 59 Minutes Minutes 00 - 59 Hour Hours 1 - 12 + AM/PM 00 - 23 Day 1-7 Date Date 01 - 31 Month Month 01 - 12 Year Year 00 - 99 AM/PM 06H 07H 10 hour 10 hour 0 0 0 Day 10 date 0 10 month 10 year OUT 0 OSF SQWE 0 08H 3FH 0 RS1 RS0 Control RAM 56 x 8 00H - FFH Note: Bits listed as “0” should always be written and read as 0. Clock and Calendar Table 3 shows the address map of the RTC registers. The time and date information is obtained by reading the appropriate register bytes. The time and calendar are set or initialized by writing the appropriate register bytes. The contents of the time and calendar registers are in the BCD format. Bit 7 of Register 0 is the clock halt (CH) bit. When this bit is set to 1, the oscillator is disabled. When cleared to 0, the oscillator is enabled. The clock can be halted whenever the timekeeping functions are not required, which decreases VBAT current. date registers, the user buffers are synchronized to the internal registers on any start or stop, and when the address pointer rolls over to zero. The countdown chain is reset whenever the seconds register is written. Write transfers occurs on the acknowledge pulse from the device. To avoid rollover issues, once the countdown chain is reset, the remaining time and date registers must be written within one second. If enabled, the 1 Hz square-wave output transitions high 500 ms after the seconds data transfer, provided the oscillator is already running. The day-of-week register increments at midnight. Values that correspond to the day of week are user-defined but must be sequential (i.e., if 1 equals Sunday, then 2 equals Monday, and so on). Illogical time and date entries result in undefined operation. Note that the initial power-on state of all registers, unless otherwise specified, is not defined. Therefore, it is important to enable the oscillator (CH = 0) during initial configuration. When reading or writing the time and date registers, secondary (user) buffers are used to prevent errors when the internal registers update. When reading the time and IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 6 The IDT1338 runs in either 12-hour or 24-hour mode. Bit 6 of the hours register is defined as the 12-hour or 24-hour mode-select bit. When high, the 12-hour mode is selected. In the 12-hour mode, bit 5 is the AM/PM bit, with logic high IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC being PM. In the 24-hour mode, bit 5 is the second 10-hour bit (20–23 hours). If the 12/24-hour mode select is changed, the hours register must be re-initialized to the new format. On an I2C START, the current time is transferred to a second set of registers. The time information is read from these secondary registers, while the clock continues to run. This eliminates the need to re-read the registers in case of an update of the main registers during a read. Table 4. Control Register (07H) The control register controls the operation of the SQW/OUT pin and provides oscillator status. Bit # Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Name OUT 0 OSF SQWE 0 0 RS1 RS0 POR 1 0 1 1 0 0 1 1 Bit 7: Output Control (OUT). Controls the output level of the SQW/OUT pin when the square-wave output is disabled. If SQWE = 0, the logic level on the SQW/OUT pin is 1 if OUT = 1; it is 0 if OUT = 0. Bit 5: Oscillator Stop Flag (OSF). A logic 1 in this bit indicates that the oscillator has stopped or was stopped for some time period and can be used to judge the validity of the clock and calendar data. This bit is edge triggered, and is set to logic 1 when the internal circuitry senses the oscillator has transitioned from a normal run state to a STOP condition. The following are examples of conditions that may cause the OSF bit to be set: 1) The first time power is applied. 2) The voltage present on VCC and VBAT are insufficient to support oscillation. 3) The CH bit is set to 1, disabling the oscillator. 4) External influences on the crystal (i.e., noise, leakage, etc.). This bit remains at logic 1 until written to logic 0. This bit can only be written to logic 0. Attempting to write OSF to logic 1 leaves the value unchanged. Bit 4: Square-Wave Enable (SQWE). When set to logic 1, this bit enables the oscillator output to operate with either VCC or VBAT applied. The frequency of the square-wave output depends upon the value of the RS0 and RS1 bits. Bits 1 and 0: Rate Select (RS1 and RS0). These bits control the frequency of the square-wave output when the square-wave output has been enabled. The table below lists the square-wave frequencies that can be selected with the RS bits. Table 5. Square Wave Output OUT RS1 RS0 SQW Output SQWE X 0 0 1 Hz 1 X 0 1 4.096 kHz 1 X 1 0 8.192 kHz 1 X 1 1 32.768 kHz 1 0 X X 0 0 1 X X 1 0 IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 7 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM I2C Serial Data Bus The IDT1338 supports the I2C bus protocol. A device that sends data onto the bus is defined as a transmitter and a device receiving data as a receiver. The device that controls the message is called a master. The devices that are controlled by the master are referred to as slaves. The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus access, and generates the START and STOP conditions. The IDT1338 operates as a slave on the I2C bus. Within the bus specifications, a standard mode (100 kHz maximum clock rate) and a fast mode (400 kHz maximum clock rate) are defined. The IDT1338 works in both modes. Connections to the bus are made via the open-drain I/O lines SDA and SCL. The following bus protocol has been defined (see the “Data Transfer on I2C Serial Bus” figure): • Data transfer may be initiated only when the bus is not busy. • During data transfer, the data line must remain stable RTC Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The master device must generate an extra clock pulse that is associated with this acknowledge bit. A device that acknowledges must pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. A master must signal an end of data to the slave by not generating an acknowledge bit on the last byte that has been clocked out of the slave. In this case, the slave must leave the data line HIGH to enable the master to generate the STOP condition. Timeout: Timeout is where a slave device resets its interface whenever Clock goes low for longer than the timeout, which is typically 35mSec. This added logic deals with slave errors and recovering from those errors. When timeout occurs, the slave interface should re-initialize itself and be ready to receive a communication from the master, but it will expect a Start prior to any new communication. whenever the clock line is HIGH. Changes in the data line while the clock line is HIGH are interpreted as control signals. Accordingly, the following bus conditions have been defined: Bus not busy: Both data and clock lines remain HIGH. Start data transfer: A change in the state of the data line, from HIGH to LOW, while the clock is HIGH, defines a START condition. Stop data transfer: A change in the state of the data line, from LOW to HIGH, while the clock line is HIGH, defines the STOP condition. Data valid: The state of the data line represents valid data when, after a START condition, the data line is stable for the duration of the HIGH period of the clock signal. The data on the line must be changed during the LOW period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a START condition and terminated with a STOP condition. The number of data bytes transferred between START and STOP conditions is not limited, and is determined by the master device. The information is transferred byte-wise and each receiver acknowledges with a ninth bit. IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 8 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Data Transfer on I2C Serial Bus Depending upon the state of the R/W bit, two types of data transfer are possible: 1) Data transfer from a master transmitter to a slave receiver. The first byte transmitted by the master is the slave address. Next follows a number of data bytes. The slave returns an acknowledge bit after each received byte. Data is transferred with the most significant bit (MSB) first. 2) Data transfer from a slave transmitter to a master receiver. The first byte (the slave address) is transmitted by the master. The slave then returns an acknowledge bit. This is followed by the slave transmitting a number of data bytes. The master returns an acknowledge bit after all received bytes other than the last byte. At the end of the last received byte, a “not acknowledge” is returned. The master device generates all of the serial clock pulses and the START and STOP conditions. A transfer is ended with a STOP condition or with a repeated START condition. Since a repeated START condition is also the beginning of the next serial transfer, the bus is not released. Data is transferred with the most significant bit (MSB) first. The IDT1338 can operate in the following two modes: 1) Slave Receiver Mode (Write Mode): Serial data and clock are received through SDA and SCL. After each byte is received an acknowledge bit is transmitted. START and STOP conditions are recognized as the beginning and end of a serial transfer. Address recognition is performed by hardware after reception of the slave address and direction IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 9 bit (see the “Data Write–Slave Receiver Mode” figure). The slave address byte is the first byte received after the START condition is generated by the master. The slave address byte contains the 7-bit IDT1338 address, which is 1101000, followed by the direction bit (R/W), which is 0 for a write. After receiving and decoding the slave address byte the slave outputs an acknowledge on the SDA line. After the IDT1338 acknowledges the slave address + write bit, the master transmits a register address to the IDT1338. This sets the register pointer on the IDT1338, with the IDT1338 acknowledging the transfer. The master may then transmit zero or more bytes of data, with the IDT1338 acknowledging each byte received. The address pointer increments after each data byte is transferred. The master generates a STOP condition to terminate the data write. 2) Slave Transmitter Mode (Read Mode): The first byte is received and handled as in the slave receiver mode. However, in this mode, the direction bit indicates that the transfer direction is reversed. Serial data is transmitted on SDA by the IDT1338 while the serial clock is input on SCL. START and STOP conditions are recognized as the beginning and end of a serial transfer (see the “Data Read–Slave Transmitter Mode” figure). The slave address byte is the first byte received after the START condition is generated by the master. The slave address byte contains the 7-bit IDT1338 address, which is 1101000, followed by the direction bit (R/W), which is 1 for a read. After receiving and decoding the slave address byte the slave outputs an acknowledge on the SDA line. The IDT1338 then begins to transmit data starting with the register address pointed to by IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC the register pointer. If the register pointer is not written to before the initiation of a read mode the first address that is read is the last one stored in the register pointer. The address pointer is incremented after each byte is transferred. The IDT1338 must receive a “not acknowledge” to end a read. Data Write – Slave Receiver Mode Data Read (from current Pointer location) – Slave Transmitter Mode Data Read (Write Pointer, then Read) – Slave Receive and Transmit IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 10 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Handling, PCB Layout, and Assembly The IDT1338 package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions should be taken to ensure that excessive shocks are avioded. Ultarsonic cleaning equipment should be avioded to prevent damage to the crystal. Avoid running signal traces under the package, unless a ground plane is placed between the package and the signal line. All NC (no connect) pins must be connected to ground. Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-sensitive device (MSD) classifications. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the IDT1338. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Voltage Range on Any Pin Relative to Ground -0.3 V to +6.0 V Storage Temperature -55 to +125° C Soldering Temperature 260° C Recommended DC Operating Conditions (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 3.3 V, TA = +25°C, unless otherwise noted.) (Note 1) Parameter Symbol Min. TA -40 VBAT Input Voltage, Note 2 VBAT 1.3 Pull-up Resistor Voltage (SQW/OUT), Note 2 VPU Logic 1, Note 2 VIH Logic 0, Note 2 VIL Ambient Operating Temperature Typ. 3.0 Max. Units +85 °C 3.7 5.5 V 0.7VCC VCC + 0.3 V -0.3 +0.3VCC V Supply Voltage IDT1338-18 IDT1338-31 VCC VPF 1.8 5.5 VPF 3.3 5.5 1.40 1.62 1.71 2.45 2.7 2.97 V Power Fail Voltage IDT1338-18 IDT1338-31 IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 11 VPF IDT1338 V REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC DC Electrical Characteristics (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C, unless otherwise noted. Typical values are at VCC = 3.3 V, TA = +25°C, unless otherwise noted.) (Note 1) Parameter Symbol Conditions Min. Typ. Max. Units Input Leakage ILI Note 3 1 µA I/O Leakage ILO Note 4 1 µA VCC > 2 V; VOL = 0.4 V 3.0 mA VCC < 2 V; VOL = 0.2VCC 3.0 VCC > 2 V; VOL = 0.4 V 3.0 mA 1.71 V < VCC < 2 V; VOL = 0.2VCC 3.0 mA 1.3 V < VCC < 1.71 V; VOL = 0.2VCC 250 µA SDA Logic 0 Output SQW/OUT Logic 0 Output Active Supply Current (Note 5) Standby Current (Note 6) VBAT Leakage Current (VCC Active) IOLSDA IOLSQW ICCA ICCS IDT1338-18 7.5 15 IDT1338-31; VCC < 3.63 V 12 20 IDT1338-31; 3.63 V < VCC < 5.5 V 14 25 IDT1338-18 1 2 IDT1338-31; VCC < 3.63 V 1 2 IDT1338-31; 3.63 V < VCC < 5.5 V 2 5 25 100 IBATLKG µA µA nA DC Electrical Characteristics (VCC = 0V, TA = -40°C to +85°C, unless otherwise noted. Typical values are at VBAT = 3.0 V, TA = +25°C, unless otherwise noted.) (Note 1) Parameter Symbol Conditions Min. Typ. Max. Units VBAT Current (OSC ON); VBAT =3.7 V, SQW/OUT OFF IBATOSC1 Note 7 800 1200 nA VBAT Current (OSC ON); VBAT =3.7 V, SQW/OUT ON IBATOSC2 Note 7 1025 1400 nA 10 100 nA VBAT Data-Retention Current (OSC OFF); VBAT =3.7 V IBATDAT Note 7 IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 12 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC AC Electrical Characteristics (VCC = VCC(MIN) to VCC(MAX), TA = -40°C to +85°C) (Note 1) Parameter SCL Clock Frequency Symbol fSCL Conditions Fast Mode Min. Hold Time (Repeated) START Condition, Note 8 Low Period of SCL Clock High Period of SCL Clock tBUF tHD:STA tLOW tHIGH Setup Time for a Repeated START Condition tSU:STA Data Hold Time (Notes 9, 10) tHD:DAT Data Setup Time (Note 11) tSU:DAT Rise Time of Both SDA and SCL Signals (Note 12) tR Fall Time of Both SDA and SCL Signals (Note 12) tF Setup Time for STOP Condition tSU:STO Max. Units 100 400 0 100 Standard Mode Bus Free Time Between a STOP and START Condition Typ. Fast Mode 1.3 Standard Mode 4.7 Fast Mode 0.6 Standard Mode 4.0 Fast Mode 1.3 Standard Mode 4.7 Fast Mode 0.6 Standard Mode 4.0 Fast Mode 0.6 Standard Mode 4.7 Fast Mode 0 Standard Mode 0 Fast Mode 100 Standard Mode 250 kHz µs µs µs µs µs 0.9 µs ns Fast Mode 20 + 0.1CB 300 Standard Mode 20 + 0.1CB 1000 Fast Mode 20 + 0.1CB 300 Standard Mode 20 + 0.1CB 300 Fast Mode 0.6 Standard Mode 4.0 Capacitive Load for Each Bus Line (Note 12) CB I/O Capacitance (SDA, SCL) CI/O Note 13 Oscillator Stop Flag (OSF) Delay tOSF Note 14 ns ns µs 100 400 pF 10 pF ms WARNING: Negative undershoots below -0.3 V while the device is in battery-backed mode may cause loss of data. Note 1: Limits at -40°C are guaranteed by design and are not production tested. Note 2: All voltages referenced to ground. Note 3: SCL only. Note 4: SDA and SQW/OUT. Note 5: ICCA—SCL clocking at max frequency = 400 kHz. Note 6: Specified with the I2C bus inactive. IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 13 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Note 7: Measured with a 32.768 kHz crystal on X1 and X2. Note 8: After this period, the first clock pulse is generated. Note 9: A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHMIN of the SCL signal) to bridge the undefined region of the falling edge of SCL. Note 10: The maximum tHD:DAT need only be met if the device does not stretch the LOW period (tLOW) of the SCL signal. Note 11: A fast-mode device can be used in a standard-mode system, but the requirement tSU:DAT > to 250 ns must then be met. This is automatically the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next data bit to the SDA line tR(MAX) + tSU:DAT = 1000 + 250 = 1250 ns before the SCL line is released. Note 12: CB—total capacitance of one bus line in pF. Note 13: Guaranteed by design. Not production tested. Note 14: The parameter tOSF is the period of time the oscillator must be stopped for the OSF flag to be set over the voltage range of 0.0V < VCC < VCCMAX and 1.3 V < VBACKUP < 3.7 V. Timing Diagram IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 14 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Typical Operating Characteristics IBAT vs VBAT (IDT1338-31) Icc vs Vcc (IDT1338-31) 734 25 654 SQWE=1 614 SQWE=0 574 Supply Current (uA) Supply current (nA) 694 534 494 20 15 SCL=400kHz SCL=0Hz 10 5 0 1.3 1.8 2.3 2.8 3.3 2.7 3.2 3.7 VBat (V) 4.7 5.2 Oscillator Frequency vs Supply Voltage IBAT vs Temperature 32767.950000 700 SQWE=1 600 SQWE=0 500 Frequency (Hz) 800 IBAT (nA) 4.2 Vcc (V) 32767.900000 Freq 32767.850000 32767.800000 400 -40 -20 0 20 40 60 80 Temperature (C) IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 15 32767.750000 2.7 3.2 3.7 4.2 4.7 5.2 Oscillator Supply Voltage (V) IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Thermal Characteristics for 8MSOP Parameter Symbol Thermal Resistance Junction to Ambient θJA Thermal Resistance Junction to Case θJC Conditions Min. Still air Typ. Max. Units 95 ° C/W 48 ° C/W Thermal Characteristics for 8SOIC Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case Symbol Conditions Min. Typ. Max. Units θ JA Still air 150 ° C/W θ JA 1 m/s air flow 140 ° C/W θ JA 3 m/s air flow 120 ° C/W 40 ° C/W θ JC Thermal Characteristics for 16SOIC Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case Symbol Conditions Min. Typ. Max. Units θJA Still air 120 ° C/W θJA 1 m/s air flow 115 ° C/W θJA 3 m/s air flow 105 ° C/W 58 ° C/W θJC IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 16 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM Marking Diagram (8 MSOP) RTC Marking Diagram (16 SOIC) 16 38GI YWW$ 18GI YWW$ IDT1338-31DVGI 8 5 IDT 1338AC-31 SRI YYWW**$ IDT1338-18DVGI Marking Diagram (8 SOIC) 9 1 8 8 IDT1338AC-31SRI 5 16 IDT1339 -18DCGI #YYWW$ IDT1338 -31DCGI #YYWW$ 1 4 IDT1338-31DCGI 1 IDT 1338AC-18 SRI YYWW$ 4 IDT1338-18DCGI 9 1 8 IDT1338AC-18SRI Notes: 1. ‘#’ is the lot number. 2. ‘$’ is the assembly mark code. 3. ‘**’ is the lot sequence. 4. YYWW is the last two digits of the year and week that the part was assembled. 5. “G” denotes RoHS compliant package. 6. “I” denotes industrial grade. 7. Bottom marking: country of origin if not USA. IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 17 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 8 Symbol E Min A A1 B C D E e H h L α H INDEX AREA 1 2 D A Inches Max Min 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0° 8° Max .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .1890 .1968 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0° 8° h x 45 A1 C -Ce B SEATING PLANE L .10 (.004) C IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 18 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Package Outline and Package Dimensions (8-pin MSOP, 3.00 mm Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 8 Symbol E1 A A1 A2 b C D E E1 e L α aaa E IN D E X AREA 1 2 D Min Max -1.10 0 0.15 0.79 0.97 0.22 0.38 0.08 0.23 3.00 BASIC 4.90 BASIC 3.00 BASIC 0.65 Basic 0.40 0.80 0° 8° 0.10 Inches* Min Max -0.043 0 0.006 0.031 0.038 0.008 0.015 0.003 0.009 0.118 BASIC 0.193 BASIC 0.118 BASIC 0.0256 Basic 0.016 0.032 0° 8° 0.004 *For reference only. Controlling dimensions in mm. A 2 A A 1 c -C e b S E A T IN G P LA N E L aaa C IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 19 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Package Outline and Package Dimensions (16-pin SOIC, 300 mil Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 16 Symbol E1 A A1 A2 b c D E E1 e L α aaa E INDEX AREA 1 2 D A 2 Min Inches* Max -2.65 0.10 -2.05 2.55 0.33 0.51 0.18 0.32 10.10 10.50 10.00 10.65 7.40 7.60 1.27 Basic 0.40 1.27 0° 8° 0.10 Min Max -0.104 0.0040 -0.081 0.100 0.013 0.020 0.007 0.013 0.397 0.413 0.394 0.419 0.291 0.299 0.050 Basic 0.016 0.050 0° 8° 0.004 *For reference only. Controlling dimensions in mm. A A 1 c - Ce b SEATING PLANE L aaa C IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 20 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Ordering Information Part / Order Number 1338-18DVGI 1338-18DVGI8 1338-18DCGI 1338-18DCGI8 1338AC-18SRI 1338AC-18SRI8 1338-31DVGI 1338-31DVGI8 1338-31DCGI 1338-31DCGI8 1338AC-31SRI 1338AC-31SRI8 Marking Shipping Packaging Package see page 17 Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel Tubes Tape and Reel 8-pin MSOP 8-pin MSOP 8-pin SOIC 8-pin SOIC 16-pin SOIC 16-pin SOIC 8-pin MSOP 8-pin MSOP 8-pin SOIC 8-pin SOIC 16-pin SOIC 16-pin SOIC Temperature -40 to +85° -40 to +85° -40 to +85° -40 to +85° -40 to +85° -40 to +85° -40 to +85° -40 to +85° -40 to +85° -40 to +85° -40 to +85° -40 to +85° C C C C C C C C C C C C The IDT1338 packages are RoHS compliant. Packages without the integrated crystal are Pb-free; packages that include the integrated crystal (as designated with a “C” before the dash number) may include lead that is exempt under RoHS requirements. The lead finish is JESD91 category e3. “A” is the device revision designator and will not correlate to the datasheet revision. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 21 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Revision History Rev. Originator Date A J. Sarma 01/29/08 New device. Preliminary release. B J.Sarma 03/28/08 Added new note to Part Ordering information pertaining to RoHS compliance and Pb-free devices. C J.Sarma 04/03/04 combined -3 and -33 parts to -31 D J.Sarma 05/19/08 The part number for 16pin RoHS complaint part has now changed from IDT1338C-31SOGI to IDT1338C-31SRI and the IDT1338C-18SOGI changed to IDT1338C-18SRI E J.Sarma 10/29/08 F J.Sarma 11/10/08 Updated Block Diagram; Typical Operating Characteristics charts. G J.Sarma 11/13/08 Updated graphs in “Typical Operating Characteristics; added “Typical Operating Circuit” diagram H J.Sarma 11/18/08 Updated graphs in “Typical Operating Characteristics; updated Block Diagram; added “Battery Backed” to device title. I J.Sarma 12/02/08 Updated Typical Operating Characteristics graphs; added marking diagrams. 11/10/09 Added “Handling, PCB Layout, and Assembly” section. J Description of Change K S.S. 03/29/10 Added “Timeout” paragraph on page 8. L L Larsen 04/13/11 Updated Supply Current speficiations M S.S. 09/22/11 Changed “VCC Fall Time; VPF(MAX) to VPF(MIN)” spec from 300 µs Min. to 1ms Min. (Table 2, “Power-Up/Down Characteristics) N S.S. 10/17/11 Added separate item for tVCCF in “Power-up/Down Conditions” table for 1338-31; 300 µs min. P J. Chao 09/20/12 1. Moved all from Fab4 to TSMC. QA requested change in the marking of only the 16-pin SOIC device with internal crystal to add "A" due to the fact that TSMC uses a different crystal than Fab4. Notification of a change in orderables was initiated with PCN A1208-06. 2. Updated 16-pin SOIC marking diagram and ordering information to include "A". IDT® REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM 22 IDT1338 REV P 092012 IDT1338 REAL-TIME CLOCK WITH BATTERY BACKED NON-VOLATILE RAM RTC Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2012 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT, ICS, and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA