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252PMILFT

252PMILFT

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SOIC8_150MIL

  • 描述:

    IC CLK SYNTHESIZER FP DUAL 8SOIC

  • 数据手册
  • 价格&库存
252PMILFT 数据手册
DATASHEET FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER Description Features The ICS252 is a low cost, dual-output, field programmable clock synthesizer. The ICS252 can generate two output frequencies from 314 kHz to 200 MHz using up to two independently configurable PLLs. The outputs may employ Spread Spectrum techniques to reduce system electro-magnetic interference (EMI). • • • • • • • • • • ™ Using IDT’s VersaClock software to configure the PLL and output, the ICS252 contains a One-Time Programmable (OTP) ROM to allow field programmability. Programming features include 2 selectable configuration registers. The device employs Phase-Locked Loop (PLL) techniques to run from a standard fundamental mode, inexpensive crystal, or clock. It can replace multiple crystals and oscillators, saving board space and cost. ICS252 8-pin SOIC package – Pb-free, RoHS compliant Two addressable registers Input crystal frequency of 5 to 27 MHz Clock input frequency of 3 to 150 MHz Output clock frequencies up to 200 MHz Configurable Spread Spectrum Modulation Operating voltage of 3.3 V Replaces multiple crystals and oscillators Controllable output drive levels Advanced, low-power CMOS process The device also has a power-down feature that tri-states the clock outputs and turns off the PLLs when the PDTS pin is taken low. The ICS252 is also available in factory programmed custom versions for high-volume applications. Block Diagram VDD SEL OTP ROM with PLL Values PLL1 PLL2 X1 Divide Logic and Output Enable Control CLK1 CLK2 Crystal Oscillator Crystal X2 External capacitors are required. GND PDTS IDT® FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER 1 ICS252 REV K 030212 ICS252 FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER Pin Assignment EPROM CLOCK SYNTHESIZER Output Clock Selection Table SEL 1 8 PDTS VDD 2 7 GND X1/ICLK 3 6 CLK2 X2 4 5 CLK1 SEL CLK1 (MHz) CLK2 (MHz) Spread Percentage 0 User Configurable User Configurable User Configurable User Configurable User Configurable User Configurable 1 8-pin (150 mil) SOIC Pin Descriptions Pin Number Pin Name Pin Type Pin Description 1 SEL Input Select pin for frequency selection on CLK1 and CLK2. Internal pull-up resistor. 2 VDD Power 3 X1/ICLK XI Connect to +3.3 V. Connect this pin to a crystal or external clock input. 4 X2 XO 5 CLK1 Output Clock1 output. Weak internal pull-down, low when power down. Connect this pin to a crystal, or float for clock input. 6 CLK2 Output Clock2 output. Weak internal pull-down, low when power down. 7 GND Power 8 PDTS Input Connect this to ground. Powers down entire chip. Tri-states CLK outputs when low. No internal pull-up resistor. The pin must be tied either directly or through the external resistor to VDD ro GND. External resistor value must be less than 15kOhm. External Components The ICS252 requires a minimum number of external components for proper operation. Series Termination Resistor Clock output traces over one inch should use series termination. To series terminate a 50Ω trace (a commonly used trace impedance), place a 33Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20Ω. Decoupling Capacitor As with any high-performance mixed-signal IC, the ICS252 must be isolated from system power supply noise to perform optimally. A decoupling capacitor of 0.01µF must be connected between VDD and the PCB ground plane. Crystal Load Capacitors The device crystal connections should include pads for small capacitors from X1 to ground and from X2 to ground. These capacitors are used to adjust the stray capacitance of the board to match the nominally required crystal load capacitance. Because load capacitance can only be increased in this trimming process, it is important to keep stray capacitance to a minimum by using very short PCB traces (and no vias) between the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X2 to ground. The value (in pF) of these crystal caps should equal (CL -6 pF)*2. In this equation, CL= crystal load capacitance in pF. Example: For a crystal with a 16 pF load capacitance, each crystal capacitor would be 20 pF [(16-6) x 2 = 20]. IDT® FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER 2 ICS252 REV K 030212 ICS252 FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER EPROM CLOCK SYNTHESIZER PCB Layout Recommendations Output Drive Control For optimum device performance and lowest output phase noise, the following guidelines should be observed. The ICS252 has two output drive settings. Low drive should be selected when outputs are less than 100 MHz. High drive should be selected when outputs are greater than 100 MHz. (Consult the AC Electrical Characteristics for output rise and fall times for each drive option.) 1) The 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between the decoupling capacitor and VDD pin. The PCB trace to VDD pin should be kept as short as possible, as should the PCB trace to the ground via. Distance of the ferrite bead and bulk decoupling from the device is less critical. 2) The external crystal should be mounted just next to the device with short traces. The X1 and X2 traces should not be routed next to each other with minimum spaces, instead they should be separated and away from other traces. 3) To minimize EMI, the 33Ω series termination resistor (if needed) should be placed close to the clock output. 4) An optimum layout is one with all components on the same side of the board, minimizing vias through other signal layers. Other signal traces should be routed away from the ICS252. This includes signal traces just underneath the device, or on layers adjacent to the ground plane layer used by the device. ICS252 Configuration Capabilities The architecture of the ICS252 allows the user to easily configure the device to a wide range of output frequencies, for a given input reference frequency. The frequency multiplier PLL provides a high degree of precision. The M/N values (the multiplier/divide values available to generate the target VCO frequency) can be set within the range of M = 1 to 2048 and N = 1 to 1024. The ICS252 also provides separate output divide values, from 2 through 20, to allow the two output clock banks to support widely differing frequency values from the same PLL. Each output frequency can be represented as: OutputFreq = REFFreq -------------------------------------OutputDivide ⋅ M ----N IDT VersaClock Software IDT applies years of PLL optimization experience into a user friendly software that accepts the user’s target reference clock and output frequencies and generates the lowest jitter, lowest power configuration, with only a press of a button. The user does not need to have prior PLL experience or determine the optimal VCO frequency to support multiple output frequencies. VersaClock software quickly evaluates accessible VCO frequencies with available output divide values and provides an easy to understand, bar code rating for the target output frequencies. The user may evaluate output accuracy, performance trade-off scenarios in seconds. Spread Spectrum Modulation The ICS252 utilizes frequency modulation (FM) to distribute energy over a range of frequencies. By modulating the output clock frequencies, the device effectively lowers energy across a broader range of frequencies; thus, lowering a system’s electro-magnetic interference (EMI). The modulation rate is the time from transitioning from a minimum frequency to a maximum frequency and then back to the minimum. Spread Spectrum Modulation can be applied as either “center spread” or “down spread”. During center spread modulation, the deviation from the target frequency is equal in the positive and negative directions. The effective average frequency is equal to the target frequency. In applications where the clock is driving a component with a maximum frequency rating, down spread should be applied. In this case, the maximum frequency, including modulation, is the target frequency. The effective average frequency is less than the target frequency. The ICS252 operates in both center spread and down spread modes. For center spread, the frequency can be modulated between +/- 0.125% to +/-2.0%. For down spread, the frequency can be modulated between -0.25% to -4.0%. IDT® FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER 3 ICS252 REV K 030212 ICS252 FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER EPROM CLOCK SYNTHESIZER Both output frequency banks will utilize identical spread spectrum percentage deviations and modulation rates, if a common VCO frequency can be identified. Spread Spectrum Modulation Rate The spread spectrum modulation frequency applied to the output clock frequency may occur at a variety of rates. For applications requiring the driving of “down-circuit” PLLs, Zero Delay Buffers, or those adhering to PCI standards, the spread spectrum modulation rate should be set to 30-33 kHz. For other applications, a 120 kHz modulation option is available. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS252. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Parameter Condition Min. Supply Voltage, VDD Referenced to GND Inputs Clock Outputs Max. Units -0.5 4.6 V Referenced to GND -0.5 VDD+ 0.5 V Referenced to GND -0.5 VDD+ 0.5 V -65 150 °C 260 °C 125 °C Storage Temperature Soldering Temperature Typ. Max 10 seconds Junction Temperature Recommended Operation Conditions Parameter Min. Typ. Max. Units Ambient Operating Temperature (ICS252M) 0 +70 °C Ambient Operating Temperature (ICS252MI) -40 +85 °C +3.465 V 4 ms Power Supply Voltage (measured in respect to GND) +3.135 Power Supply Ramp Time IDT® FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER 4 +3.3 ICS252 REV K 030212 ICS252 FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER EPROM CLOCK SYNTHESIZER DC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C Parameter Operating Voltage Symbol Conditions VDD Min. Typ. Max. Units 3.135 3.3 3.465 V Configuration Dependent - See VersaClockTM Operating Supply Current Input High Voltage IDD mA Two 33.3333 MHz output, PDTS = 1, no load Note 1 16 mA 500 μA V Input High Voltage VIH PDTS = 0 SEL Input Low Voltage VIL SEL Input High Voltage, PDTS VIH Input Low Voltage, PDTS VIL Input High Voltage VIH ICLK Input Low Voltage VIL ICLK Output High Voltage (CMOS High) VOH IOH = -4 mA VDD-0.4 V Output High Voltage VOH IOH = -8 mA (Low Drive); IOH = -12 mA (High Drive) 2.4 VDD-0.4 V Output Low Voltage VOL IOL = 8 mA (Low Drive); IOL = 12 mA (High Drive) Short Circuit Current IOS ±70 mA Nominal Output Impedance ZO 20 Ω VDD/2+1 0.4 VDD-0.5 V V 0.4 VDD/2+1 V V VDD/2-1 0.4 V V Internal Pull-up Resistor RPUP SEL 120 kΩ Internal Pull-down Resistor RPD Clock outputs CLK1 and CLK2 120 kΩ Input Capacitance CIN inputs 4 pF Note 1: Example with 25 MHz crystal input with output of 33.3 MHz, no load, and VDD = 3.3 V. IDT® FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER 5 ICS252 REV K 030212 ICS252 FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER EPROM CLOCK SYNTHESIZER AC Electrical Characteristics Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C Parameter Input Frequency Symbol FIN Conditions Min. Typ. Max. Units Fundamental Crystal 5 27 MHz Input Clock 2 150 MHz 0.314 200 MHz Output Frequency Output Rise Time tOR 20% to 80%, Note 1 1 ns Output Fall Time tOF 80% to 20%, Note 1 1 ns Duty Cycle Note 2 Power-up Time One Sigma Clock Period Jitter Maximum Absolute Jitter tja 40 49-51 60 % PLL lock time from power-up 4 10 ms PDTS goes high until stable CLK output, Spread Spectrum Off .6 2 ms PDTS goes high until stable CLK output, Spread Spectrum On 4 7 ms PDTS goes high until spread spectrum is stable, Spread Spectrum On 10 50 ms Configuration Dependent 50 ps Deviation from Mean. Configuration Dependent +200 ps Note 1: Measured with 15 pF load. Note 2: Duty Cycle is configuration dependent. Most configurations are minimum 45% and maximum 55%. Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case Symbol Conditions Min. Typ. Max. Units θJA Still air 150 ° C/W θJA 1 m/s air flow 140 ° C/W θJA 3 m/s air flow 120 ° C/W 40 ° C/W θJC IDT® FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER 6 ICS252 REV K 030212 ICS252 FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER EPROM CLOCK SYNTHESIZER Marking Diagram 8 5 252PML ###### YYWW 1 4 8 5 252PMIL ###### YYWW 1 4 Notes: 1. ###### is the lot number. 2. YYWW is the last two digits of the year and week that the part was assembled. 3. “I” denotes industrial temperature range (if applicable). 4. “L” denotes RoHS compliant package. 5. Bottom marking: country of origin. IDT® FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER 7 ICS252 REV K 030212 ICS252 FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER EPROM CLOCK SYNTHESIZER Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 8 Symbol E Min A A1 B C D E e H h L α H INDEX AREA 1 2 D A Inches Max Min 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0° 8° Max .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .1890 .1968 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0° 8° h x 45 A1 C -Ce B SEATING PLANE L .10 (.004) C Ordering Information Part / Order Number 252PMLF 252PMILF 252M-XXLF 252MI-XXLF 252M-XXLFT 252MI-XXLFT Marking Shipping Packaging Package Temperature 252MXXL 252MIXXL 252MXXL 252MIXXL Tubes Tubes Tubes Tubes Tape and Reel Tape and Reel 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 0 to +70° C -40 to +85° C 0 to +70° C -40 to +85° C 0 to +70° C -40 to +85° C “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant. The 252M-XXLF and 252MI-XXLF are factory programmed versions of the 252PMLF and 252PMILF. A unique “-XX” suffix is assigned by the factory for each custom configuration, and a separate data sheet is kept on file. For more information on custom part numbers programmed at the factory, please contact your local IDT sales and marketing representative. While the information presented herein has been checked for both accuracy and reliability, IDT assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT® FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER 8 ICS252 REV K 030212 ICS252 FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER EPROM CLOCK SYNTHESIZER Revision History Rev. Originator Date Description of Change A R.Willner 04/08/05 Preliminary release. B R.Willner 01/16/06 Corrected Block Diagram. Released from Prelim to Final. C R.Willner 06/13/06 Added "-XX" part ordering information and specific note pertaining to custom configurations of device. D R.Willner 08/10/07 Removed “Inernal pull-up resistor” info from PDTS pin description and added extrenal pull-up resistor statement/information. E R.Willner 08/20/07 Changed S1 pin name to “SEL”; removed references to PDTS pin; changed pull-up resistor value from 190 to 120 kOhms. F R.Willner 03/16/09 Correct page 1 text to have 2 selectable configuration registers. G — 08/18/09 Added EOL note per PDN U-09-01. H — 05/13/10 Removed EOL note and non-green orderables. J RDW 05/20/10 Changed max VDD Supply Voltage from 7V to 4.6V. K A.T. 03/02/12 Added PDTS#/spread spectrum condition and values to "Power-up Time" parameter IDT® FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER 9 ICS252 REV K 030212 ICS252 FIELD PROGRAMMABLE DUAL OUTPUT SS VERSACLOCK SYNTHESIZER EPROM CLOCK SYNTHESIZER Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2010 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT, ICS, and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. Printed in USA IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.
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