2SK2800-E

2SK2800 Silicon N Channel MOS FET High Speed Power Switching REJ03G1035-0900 (Previous: ADE-208-513G) Rev.9.00 Sep 07, 2005 Features • Low on-resistance RDS(on) = 15 mΩ typ. • High speed switching • Low drive current • 4 V gate drive device can be driven from 5 V source Outline RENESAS Package code: PRSS0004AC-A (Package name: TO-220AB) D G 1. Gate 2. Drain (Flange) 3. Source S 1 2 3 Rev.9.00 Sep 07, 2005 page 1 of 7 2SK2800 Absolute Maximum Ratings (Ta = 25°C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Notes: 1. PW ≤ 10µs, duty cycle ≤ 1 % 2. Value at Tc = 25°C 3. Value at Tch = 25°C, Rg ≥ 50Ω Symbol VDSS VGSS ID ID(pulse)Note1 IDR IAP Note 3 EAR Note 3 Pch Note 2 Tch Tstg Ratings 60 ±20 40 160 40 40 137 50 150 –55 to +150 Unit V V A A A A mJ W °C °C Electrical Characteristics (Ta = 25°C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body–drain diode forward voltage Body–drain diode reverse recovery time Note: 4. Pulse test Symbol V(BR)DSS V(BR)GSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss td(on) tr td(off) tf VDF trr Min 60 ±20 — — 1.5 — — 20 — — — — — — — — — Typ — — — — — 15 25 35 1500 720 200 20 180 200 200 0.95 70 Max — — ±10 10 2.5 20 40 — — — — — — — — — — Unit V V µA µA V mΩ mΩ S pF pF pF ns ns ns ns V V Test Conditions ID = 10 mA, VGS = 0 IG = ±100 µA, VDS = 0 VGS = ±16 V, VDS = 0 VDS = 60 V, VGS = 0 ID = 1 mA, VDS = 10V ID = 20 A, VGS = 10V Note4 ID = 20 A, VGS = 4 V Note4 ID = 20 A, VDS = 10 V Note4 VDS = 10 V, VGS = 0, f = 1 MHz ID = 20 A, RL = 1.5 Ω, VGS = 10 V IF = 40 A, VGS = 0 IF = 40 A, VGS = 0 diF/ dt =50 A/µs Rev.9.00 Sep 07, 2005 page 2 of 7 2SK2800 Main Characteristics Power vs. Temperature Derating 100 1000 300 10 Maximum Safe Operation Area Channel Dissipation Pch (W) Drain Current ID (A) 75 100 30 10 3 1 0.3 DC PW Op er = 10 on µs 0µ s 1m s 10 ms (1 sh ot) 50 ati 25 Operation in this area is limited by RDS(on) Ta = 25°C 0.3 1 3 (T c= 25 °C ) 0 50 100 150 200 0.1 0.1 10 30 100 Case Temperature TC (°C) Drain to Source Voltage VDS (V) Typical Output Characteristics 50 10 V 6V 4.5 V 50 4V Pulse Test 30 3.5 V 20 Typical Transfer Characteristics VDS = 10 V Pulse Test Drain Current ID (A) Drain Current ID (A) 40 40 30 Tc = 75°C 25°C 20 –25°C 10 VGS = 3 V 10 0 2 4 6 8 10 0 1 2 3 4 5 Drain to Source Voltage VDS (V) Drain to Source Saturation Voltage vs. Gate to Source Voltage Gate to Source Voltage VGS (V) Static Drain to Source on State Resistance vs. Drain Current 0.5 Pulse Test 0.2 0.1 0.05 VGS = 4 V Drain to Source Saturation Voltage VDS (on) (V) 2.0 Pulse Test 1.6 1.2 ID = 50 A 0.8 Static Drain to Source on State Resistance RDS (on) (Ω) 0.02 0.01 0.005 1 2 5 10 20 50 100 10 V 0.4 20 A 10 A 4 8 12 16 20 0 Gate to Source Voltage VGS (V) Drain Current ID (A) Rev.9.00 Sep 07, 2005 page 3 of 7 2SK2800 Static Drain to Source on State Resistance vs. Temperature Forward Transfer Admittance yfs (S) 0.05 Pulse Test 0.04 ID = 20 A VGS = 4 V Static Drain to Source on State Resistance RDS (on) (Ω) Forward Transfer Admittance vs. Drain Current 100 50 Tc = –25°C 25°C 75°C 0.03 10 A 20 10 5 0.02 50 A 10, 20 A 10 V 0.01 0 –40 2 1 1 2 5 10 VDS = 10 V Pulse Test 0 40 80 120 160 20 50 100 Case Temperature TC (°C) Body to Drain Diode Reverse Recovery Time 1000 5000 Drain Current ID (A) Typical Capacitance vs. Drain to Source Voltage VGS = 0 f = 1 MHz Reverse Recovery Time trr (ns) 500 Capacitance C (pF) 2000 1000 500 Ciss 200 100 50 20 10 0.1 di / dt = 50 A / µs VGS = 0, Ta = 25°C 0.3 1 3 10 30 100 Coss 200 100 50 Crss 0 10 20 30 40 50 Reverse Drain Current IDR (A) Drain to Source Voltage VDS (V) Dynamic Input Characteristics Drain to Source Voltage VDS (V) ID = 40 A VDD = 10 V 25 V 50 V VDS Switching Characteristics Switching Characteristics Gate to Source Voltage VGS (V) 100 20 1000 300 100 30 10 3 1 0.1 tr td(on) td(off) tf 60 VGS 12 40 8 20 VDD = 50 V 25 V 10 V 4 0 40 Switching Time t (ns) 80 16 VGS = 10 V, VDD = 30 V PW = 5 µs, duty < 1 % 0 8 16 24 32 0.3 1 3 10 30 100 Gate Charge Qg (nc) Drain Current ID (A) Rev.9.00 Sep 07, 2005 page 4 of 7 2SK2800 Reverse Drain Current vs. Source to Drain Voltage Maximum Avalanche Energy vs. Channel Temperature Derating (A) 50 Repetitive Avalanche Energy EAR (mJ) 200 IAP= 40 A VDD = 25 V duty < 1 % Rg > 50 Ω Reverse Drain Current IDR 40 10 V 30 5V 20 VGS = 0, –5 V 160 120 80 10 Pulse Test 0 0.4 0.8 1.2 1.6 2.0 40 0 25 50 75 100 125 150 Source to Drain Voltage VSD (V) Channel Temperature Tch (°C) Normalized Transient Thermal Impedance vs. Pulse Width Normalized Transient Thermal Impedance γs (t) 3 Tc = 25°C 1 D=1 0.5 0.3 0.2 0.1 0.1 0.05 θ ch – c(t) = γ s (t) • θ ch – c θ ch – c = 2.5°C/W, Tc = 25°C PDM PW T 0.03 0.02 1 lse 0.0 t pu o h 1s D= PW T 0.01 10 µ 100 µ 1m 10 m 100 m 1 10 Pulse Width Avalanche Test Circuit VDS Monitor L IAP Monitor PW (S) Avalanche Waveform EAR = 1 2 • L • IAP2 • VDSS VDSS – VDD V(BR)DSS IAP Rg D. U. T VDD VDS ID Vin 15 V 50 Ω 0 VDD Rev.9.00 Sep 07, 2005 page 5 of 7 2SK2800 Switching Time Test Circuit Vin Monitor D.U.T. RL Vin Vin 10 V 50 Ω VDD = 30 V Vout 10% 10% 10% Vout Monitor Switching Time Waveforms 90% 90% td(on) tr 90% td(off) tf Rev.9.00 Sep 07, 2005 page 6 of 7 2SK2800 Package Dimensions JEITA Package Code SC-46 RENESAS Code PRSS0004AC-A Package Name TO-220AB / TO-220ABV MASS[Typ.] 1.8g Unit: mm 11.5 Max 2.79 ± 0.2 10.16 ± 0.2 9.5 8.0 φ 3.6 +0.2 –0.1 +0.1 –0.08 4.44 ± 0.2 1.26 ± 0.15 6.4 18.5 ± 0.5 15.0 ± 0.3 1.27 2.7 Max 7.8 ± 0.5 0.76 ± 0.1 14.0 ± 0.5 1.5 Max 2.54 ± 0.5 2.54 ± 0.5 0.5 ± 0.1 Ordering Information Part Name 2SK2800-E Quantity 500 pcs Box (Sack) Shipping Container Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.9.00 Sep 07, 2005 page 7 of 7 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. 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