8
-bit MICROCOMPUTER 38000 Series
- Differences Between The 3803L Group/3803H Group/3803 Group Differences
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
3803L/3803H/3803 Groups Products 3803L/3803H/3803 Groups Products
3803L Group Part Number
Mask ROM ver.
ROM size
60 K
RAM size
2048
3803H Group Part Number
M38039G4H-XXXHP/KP M38039G6H-XXXHP/KP
ROM size
16 K 24 K 32 K 48 K 16 K 24 K 32 K 48 K 16 K 24 K 32 K 48 K 60 K 60 K
RAM size
2048
M38039MFL-XXXSP/HP/KP/WG (*1)
Flash Memory ver.
M38039FFLSP/HP/KP/WG (*1)
60 K
QzROM ver.
M38039G8H-XXXHP/KP M38039GCH-XXXHP/KP/WG M38039G4HSP/HP/KP M38039G6HSP/HP/KP M38039G8HSP/HP/KP M38039GCHSP/HP/KP/WG M38034M4H-XXXSP/FP/HP/KP (*2)
*1: 3803L features - Reduced current consumption in 32 kHz(low-speed) wait mode (Flash memory version) - Reduced EMI (unwanted radiation) noise level
Mask ROM ver.
3803 Group Part Number
Mask ROM ver.
M38034M4-XXXSP/FP/HP (*2) M38037M6-XXXSP/FP/HP (*2) M38037M8-XXXSP/FP/HP (*2) M38039MC-XXXSP/FP/HP (*2) M38039MF-XXXSP/FP/HP (*2) M38039FFSP/FP/HP (*2)
ROM size
16 K 24 K 32 K 48 K 60 K 60 K
RAM size
640 1024
640 1024
M38037M6H-XXXSP/FP/HP/KP (*2) M38037M8H-XXXSP/FP/HP/KP (*2) M38039MCH-XXXSP/FP/HP/KP (*2) M38039MFH-XXXSP/FP/HP/KP/WG (*2) M38039FFHSP/FP/HP/KP/WG (*2)
2048
2048
Flash Memory ver.
2048
Flash Memory ver.
*2: Recommended to replace. Please refer to page 22.
2
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
3803L/3803H/3803 Groups Pin Configuration (SP) 3803L/3803H/3803 Groups Pin Configuration (SP)
C mpletely Coompletely Pin Compatible Pin Compatible
V CC V REF AV SS P6 7 /AN 7 P6 6 /AN 6 P6 5 /AN 5 P6 4 /AN 4 P6 3 /AN 3 P6 2 /AN 2 P6 1 /AN 1 P6 0 /AN 0 P5 7 /INT 3 P5 6 /PWM P5 5 /CNTR 1 P5 4 /CNTR 0 P5 3 /S RDY2 P5 2 /S CLK2 P5 1 /S OUT2 P5 0 /S IN2 P4 7 /S RDY1 /CNTR 2 P4 6 /S CLK1 P4 5 /T X D 1 P4 4 /R X D 1 P4 3 /INT 2 P4 2 /INT 1 CNV SS V PP RESET P4 1 /INT 00 /X CIN P4 0 /INT 40 /X COUT X IN X OUT V SS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 P3 0 /DA 1 P3 1 /DA 2 P3 2 P3 3 P3 4 /R X D 3 P3 5 /T X D 3 P3 6 /S CLK3 P3 7 /S RDY3 P0 0 /AN 8 P0 1 /AN 9 P0 2 /AN 10 P0 3 /AN 11 P0 4 /AN 12 P0 5 /AN 13 P0 6 /AN 14 P0 7 /AN 15 P1 0 /INT 41 P1 1 /INT 01 P1 2 P1 3 P1 4 P1 5 P1 6 P1 7 P2 0 (LED 0 ) P2 1 (LED 1 ) P2 2 (LED 2 ) P2 3 (LED 3 ) P2 4 (LED 4 ) P2 5 (LED 5 ) P2 6 (LED 6 ) P2 7 (LED 7 )
Outline SP: PRDP0064BA-A (64P4B) (1.78 mm pitch)
M3803XMXH-XXXSP M38039MFL-XXXSP M3803XMX-XXXSP M38039FFHSP M38039FFLSP M38039FFSP M38039GXHSP
3
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
3803L/3803H/3803 Groups Pin Configuration (FP/HP/KP) 3803L/3803H/3803 Groups Pin Configuration (FP/HP/KP)
P00/AN8 P01/AN9 P02/AN10 P03/AN11 P04/AN12 P05/AN13 P06/AN14 P07/AN15 P10/INT41 P11/INT01 P12 P13 P14 P15 P16 P17
34 47 45 42 40 39 37 36 48 46 44 43 41 38 35 33
Completely Completely Pin Compatible Pin Compatible
Note: KP for 3808H/3803L Groups only. FP for 3803/3803H Groups (Mask/Flash memory versions) only.
P37/SRDY3 P36/SCLK3 P35/TXD3 P34/RXD3 P33 P32 P31/DA2 P30/DA1 VCC VREF AVSS P67/AN7 P66/AN6 P65/AN5 P64/AN4 P63/AN3
49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 1
32 31
M3803XMXH-XXXFP/HP/KP M38039MFL-XXXHP/KP M3803XMX-XXXFP/HP M38039FFHFP/HP/KP M38039FFLHP/KP M38039FFFP/HP M38039GXH-XXXHP/KP M38039GXHHP/KP
30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
P20(LED0) P21(LED1) P22(LED2) P23(LED3) P24(LED4) P25(LED5) P26(LED6) P27(LED7) VSS XOUT XIN P40/INT40/XCOUT P41/INT00/XCIN RESET CNVSS VPP P42/INT1
10
11
12
13
14
Outline KP: PLQP0064GA-A (64P6U-A) (0.8 mm pitch, 14 mm square, 1.7 mm mounting height) FP: PRQP0064GA-A (64P6N-A) (0.8 mm pitch, 14 mm square, 3.05 mm mounting height) HP: PLQP0064KB-A (64P6Q-A) (0.5 mm pitch, 10 mm square, 1.7 mm mounting height)
4
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
P54/CNTR0 P53/SRDY2 P52/SCLK2 P51/SOUT2 P50/SIN2 P47/SRDY1/CNTR2 P46/SCLK1 P45/TXD1 P44/RXD1 P42/INT2
P62/AN2 P61/AN1 P60/AN0 P57/INT3 P56/PWM P55/CNTR1
Rev.4.01
15
2
3
5
6
4
7
8
9
Date: Jul.02.08
3803L/3803H Groups Pin Configu ation (WG) 3803L/3803H Groups Pin Configurration(WG)
Completely Completely Pin Compatible Pin Compatible
8
(TOP view)
A B C D E F G H
50
P36/SCLK3
46 47
P01/AN9
44 45
P03/AN11
41 42
P06/AN14
40
P10/INT41
32
P25 (LED0)
31
P21 (LED1)
30
P22 (LED2)
8
P02/AN10 P04/AN12 P07/AN15
7
51
P35/TxD3
39
P11/INT01
27
P25 (LED5)
29
P23 (LED3)
28
P24 (LED4)
30
7
P22 (LED2)
The pin number corresponds to the flat package.
6
53
P33
52
P34/RxD3
48
P00/AN8
43
P05/AN13
38
P12
37
P13
26
P26 (LED6)
25
P27 (LED7)
6
5
56
P30/DA1
55
P31/DA2
54
P32
49
P37/SRDY3
33
P17
36
P14
35
P15
34
P16
5
Package top view
4
4
1
P62/AN2
64
P63/AN3
58
VREF
59
AVss
57
VCC
24
VSS
22
XIN
23
XOUT
3
60
P67/AN7
61
P66/AN6
4 5 6
C
7 8 9
D
12
P47/SRDY1/CNTR2
14
P45/TxD1
21
P40/INT40/XCOUT
20
P41/INT40/XCIN
3
P57/INT3 P54/CNTR0
2
62
P65/AN5
63
P64/AN4
10 11
P50/SIN2
13 15
P44/RxD1
17
P42/INT1
19
RESET
2
P56/PWM P53/SRDY2 P51/SOUT2 P46/SCLK1
1
2
P61/AN1
3
B
16
P43/INT2
18
CNVSS
1
P60/AN0 P55/CNTR1 P52/SCLK2
M38039GCH -XXXWG M38039GCHWG M38039MFH -XXXWG M38039MFL -XXXWG M38039FFHWG M38039FFLWG
A
E
F
G
H
Outline WG: PTLG0064JA-A (64F0G) (6 mm square FLGA package, 1.05 mm height)
5
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Differences Between 3803L/3803H/3803 Groups (1) Differences Between 3803L/3803H/3803 Groups (1)
3803L Group Mask ROM ver. Program Memory Program Memory /RAM size Package Operating Power Source Voltage Mask ROM 60K/2K Flash Memory ver. Flash memory 60K/2K Mask ROM ver. Mask ROM 16K/640, 24K/1K, 32K/1K, 48K/2K, 60K/2K SP, FP, HP, KP, WG 1.8 to 5.5 V 2.0 to 5.5 V (8-bit A/D mode) 2.2 to 5.5 V (10-bit A/D mode) – – – – 3803H Group Flash Memory ver. Flash memory 60K/2K QzROM ver. QzROM 16K/2K, 24K/2K, 32K/2K, 48K/2K SP, HP, KP, WG 1.8 to 5.5 V 2.0 to 5.5 V (8-bit A/D mode) 2.2 to 5.5 V (10-bit A/D mode) – – Address FFDBh – 3803 Group Mask ROM ver. Mask ROM 16K/640, 24K/1K, 32K/1K, 48K/2K, 60K/2K SP, FP, HP 2.7 to 5.5 V 2.7 to 5.5 V (8-bit A/D mode) 2.7 to 5.5 V (10-bit A/D mode) – – – – Flash Memory ver. Flash memory 60K/2K
SP, HP, KP, WG 1.8 to 5.5 V
SP, HP, KP, WG 2.7 to 5.5 V 2.7 to 5.5 V (8-bit A/D mode) 2.7 to 5.5 V (10-bit A/D mode) Addresses FFD4 to FFDAh Address FFDBh – Flash Memory control registers 0 to 2 Addresses 0FE0h to 0FE2h Single power source (Vcc = 2.7 to 5.5 V)
SP, FP, HP, KP, WG 2.7 to 5.5V 2.7 to 5.5V (8-bit A/D mode) 2.7 to 5.5 V (10-bit A/D mode) Addresses FFD4 to FFDAh Address FFDBh – Flash Memory control registers 0 to 2 Addresses 0FE0h to 0FE2h Single power source (Vcc = 2.7 to 5.5 V)
SP,FP,HP 4.0 to 5.5V 4.0 to 5.5V (8-bit A/D mode) 4.0 to 5.5 V (10-bit A/D mode) – – – Flash Memory control register Address 0FFEh Flash command register Address 0FFFh Dual power source (Vcc = 5 V ± 0.5 V, Vpp = 11.7 to 12.6 V) CPU Rewrite Mode Parallel I/O Mode Standard serial I/O Mode
Power Source Voltage 2.0 to 5.5 V (8-bit A/D mode) When using A/D 2.2 to 5.5 V Converter (10-bit A/D mode) Flash Memory ID Code Flash Memory ROM Code Protect QzROM ROM Code Protect Flash Memory Control Register – – – –
Program/Erase Power Source (Program-only for QzROM ver.) Program/Erase Mode (Program-only for QzROM ver.)
–
–
Dual power source – (Vcc = 2.7 V to 5.5 V, Vpp = 7.9 V ± 0.1 V) Serial I/O mode –
–
CPU Rewrite Mode Parallel I/O Mode Standard serial I/O Mode
–
CPU Rewrite Mode Parallel I/O Mode Standard serial I/O Mode
6
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Differences Between 3803L/3803H/3803 Groups (2) Differences Between 3803L/3803H/3803 Groups (2)
3803L Group Mask ROM ver. A/D Converter Bit 4 of AD Conversion Register 2 Time until Flash Memory can Operate after Returning from Stop Mode Power Source Circuit Characteristics Internal Power Source Stable Time at Power-on : td (P-R) Electrical Characteristics Recommended Operating Conditions 0 when reading (*1) Flash Memory ver. 0 when reading Mask ROM ver. Same as bit 4 of AD Conversion Register 2 (*1) 3803H Group Flash Memory ver. 0 when reading QzROM ver. 0 when reading (*1) 3803 Group Mask ROM ver. 0 when reading Flash Memory ver. 0 when reading
Not needed
Needed: 100 μsec
Not needed
Needed: 100 μsec
Not needed
Not needed
Not needed
Not needed
Needed
Not needed
Needed
Not needed
Not needed
Not needed
The power source current of the Flash memory version differs between the Groups. Also, the operating conditions differs according to different operating voltages. For details, refer to the corresponding datasheet.
*1: Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).
7
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Improvemen in 3803H (L) & 3803 Groups Operating Frequency Characteristics Improvementtin 3803H (L) & 3803 Groups Operating Frequency Characteristics
Mask & QzROM versions
f (Xin)
High-speed mode 16.8 MHz 12.5 MHz 8.4 MHz 4.2 MHz 2.1 MHz 16.8 MHz 12.5 MHz
Flash memory version
f (Xin)
High-speed mode
Spec.H Spec.L
8.4 MHz
Standard
Spec.H Standard Spec.L
2.0 V 2.2 V 2.7 V
4.0 V 4.5 V 5.5 V
Vcc f (Xin)
16.8 MHz 12.5 MHz
2.7 V
4.0 V 4.5 V 5.5 V
Vcc
f (Xin)
16.8 MHz 12.5 MHz 8.4 MHz 6.3 MHz
Middle-speed mode
Middle-speed mode
Spec.H Spec.L
1.8 V 2.2 V 2.7 V
Standard
Spec.H Spec.L Standard
4.0 V 4.5 V 5.5 V
Vcc
Rev.4.01 Date: Jul.02.08
2.7 V
4.0 V 4.5 V 5.5 V
Vcc
8
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Differences Between Memory Maps of 3803L/3803H/3803 Groups Differences Between Memory Maps of 3803L/3803H/3803 Groups
Zero page
Mask ROM version 000016
SFR area
Qz-ROM version 000016 004016 010016 083F16
SFR area
000016 004016 010016 083F16
Flash memory version Flash memory version 3803 Group 3803L, 3803H Group 000016 SFR area SFR area 004016 010016 083F16
004016 RAM 010016
RAM size 640 1024 2048
XXXX 02BF 043F 083F
XXXX16
Not used
Not used
Not used
Not used
0FE016 SFR (incl. Reservation) 0FF616
Not used
0FE016 SFR (incl. Reservation) 0FF616
Not used
0FE016 SFR (incl. Reservation) 0FF616 Not used 100016 ZZZZ16
0FF016 SFR (incl. Reservation) 0FFF16
Not used
YYYY16 Reserved ROM area ZZZZ16 ROM
ROM size YYYY ZZZZ 16384 24576 32768 49152 61440 C000 C080 A000 8000 4000 1000 A080 8080 4080 1080
YYYY16 ZZZZ16
Reserved ROM area
100016 ZZZZ16
FF0016
Special page
FF0016
FF0016
FF0016
FFD416 FFDA16 FFDB16 FFDC16 Interrupt vector area FFFE16 Reserved ROM area FFFF16
FFD416 FFDA16 FFDB16 Protect address FFDC16 Interrupt vector area FFFE16 FFFF16 Reserved ROM area
FFD416
FFD416
ID code
FFDA16 Protect address FFDB16 FFDC16 Interrupt vector area FFFE16 Reserved ROM area FFFF16
FFDA16 FFDB16 FFDC16 Interrupt vector area FFFE16 Reserved ROM area FFFF16
9
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Replacemen Notes (1) ReplacementtNotes (1)
According to the differences in the specifications shown in P.6 and 7, the following notes are suggested. Please also refer to P.6 and 7. 1. Program Memory Depending on the memory type, program/erase specifications as well as applicable programmers and adaptors differ. Confirm the programmer applicable for your product. 2. Program Memory/ RAM Sizes - As for the combination of the program memory and RAM sizes, the RAM of the QzROM version is 2K regardless of the program memory size. Even with the same program memory size, the RAM size may differ between the QzROM/Mask ROM versions. - In the QzROM version, 60K program memory is not available. 3. Packages - In the QzROM version, the SP-package product is not available for programming before shipment. - The WG-package product is available only with 60K program memory version in the 3803H/3803L Groups. - In the 3803H Group QzROM version and the 3803L Group, the FP-package product is not available, but the thin KP package product is available for 0.8 mm-pitch. Even if the FP package product is available in other products, the KP package is recommended as 0.8 mm-pitch, because of its excellence in thinness, heat radiation, and stress characteristics. Confirm the mounting pad design standards of FP package and KP package on Renesas Surface Mount Package User's Manual (Document No.: REJ11K0001) 4. Operating Power Source Voltage - The operating power source voltage for the 3803H Group Mask ROM/QzROM versions and the 3803L Group Mask ROM version ranges from 1.8 to 5.5V. This range differs for other products, so confirm the operating power source voltage for your product. 5. Power Source Voltage when Using A/D Converter - As the operating power source differs, the power source voltage range when using an A/D converter also differs. Confirm the voltage when using an A/D converter for your product. - In the 3803H Group Mask ROM/QzROM versions and the 3803L Group Mask ROM version, the power source voltage ranges from 2.0 to 5.5 V for 8-bit A/D mode, and 2.2 to 5.5 V for 10-bit A/D mode.
10
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Replacemen Notes (2) ReplacementtNotes (2)
6. Flash Memory ID code and ROM Code Protect In the 3803H/3803L Groups Flash memory version, ID codes are assigned to addresses FFD to FFDA16, and ROM code protect is assigned to address FFDB16. Please note that these addresses are included in the user ROM area. The data of these addresses must be set to programming data before programming. 7. QzROM ROM Code Protect In the QzROM version, ROM code protect is assigned to address FFDB16. If you select write to protect bit with a serial programmer or select programming by Renesas Technology before shipment to enable protect, “0016” (all area protected) or “FE16” (protect area 1 protected) is written into this address. Otherwise, “FF16” is written to this address. The address cannot be used by user programs. 8. Flash Memory Control Registers - In the 3803H/3803L Group Flash memory version, Flash Memory control registers 0 to 2 are assigned to addresses 0FE0 to 0FE216. - In the 3803 Group Flash memory version, Flash Memory control register is assigned to address 0FFE16 and Flash command register is assigned to address 0FFF16. - In the Mask ROM/QzROM versions, nothing is allocated to these addresses, so writing can be performed to them. When read, their values are undefined. 9. Program/Erase Power Source The program/erase power source voltage as well as the absolute maximum ratings of the pins differ for each product. Ensure that the specified programmer is connected to your product to prevent a voltage that exceeds the ratings from being applied to the pins. 10. Program/Erase Mode In the QzROM version, only serial I/O mode is available in program/erase mode. When requesting off-board programming, please prepare a separate board for that purpose. MCU units for serial programming may also be available from the programmer manufacturer. 11. Time until Flash Memory can Operate after Returning from Stop Mode In the 3803H/3803L Group Flash memory version, the internal power supply circuit is switched to low power consumption mode for reducing consumption current during STP instruction. Although the internal power supply circuit is automatically switched to the normal operation mode when returning from the STP instruction, a certain time is required until the flash memory can operate after the power supply restarts. Therefore, set 100 μsec or more by the oscillation stabilization time setting function after the STP instruction which uses timer 1 is released.
11
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Replacemen Notes (3) ReplacementtNotes (3)
12. Internal Power Source Stable Time at Power-on In the 3803H/3803L Group Flash memory version, input to the RESET pin at power-on (power-on reset) in the following procedure. (1) Input “L” level to RESET pin. (2) Increase the power source voltage to 2.7 V. (3) Wait for td(P-R) (*1) until internal power source has stabilized. (4) Input clock for 16 cycles or more to XIN pin. (5) Input “H” level to RESET pin. (*1) td(P-R): Internal power source stable time at power-on. Refer to Power Source Circuit timing Characteristics in the data sheet. 13. Oscillation Circuit Constants The oscillation circuit structure differs between the 3803, 3803H, and 3803L Groups. This also applies between the 3803H Group Mask ROM/Flash memory versions and the QzROM version. Furthermore, the XIN-XOUT and XCIN-XCOUT oscillation circuit constants differ from product to product. Contact the oscillator manufacturer to select an appropriate oscillator and oscillation circuit constants so that the product used for mass production will obtain an stable operating clock with your system and conditions. Additional consideration is required when the voltage range or the temperature range is wide. Also, we recommend considering the wiring patterns of the feedback resistors, the damping resistors, and the load capacity beforehand when designing circuits. 14. Differences between Mask ROM, Flash Memory, and QzROM Versions The Flash memory, Mask ROM, and QzROM versions differ in their manufacturing processes and mask patterns because of the different ROM types used. This also applies when the ROM type is the same but the memory capacities differ. Because of these differences, characteristics values, operation margins, noise immunity, noise radiation, and oscillation circuit constants may vary. When developing application products, perform careful system evaluations for each product. Additional care is required when replacing products (for example, replacing a Mask ROM version with a QzROM version). Careful system evaluations should be performed with replacement products before the mass production phase of application products.
12
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Program change at replacing (1) Program change at replacing (1)
Details about a program are described as follows. Please make sure to check there are some differences of memory size every product. Note: Program checksum When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation. When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and calculated values of the checksum are also undefined. (1) Standard mask ROM version Spec. L mask ROM version Basically, to change a program is not necessary. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00). (2) Standard flash memory version Spec. L flash memory version 1. When using the addresses FFD4h to FFDAh, check the followings: The codes written in these addresses are the ID codes of the Spec. L flash memory version when using a serial programmer. To input this code is necessary as the ID code for flash memory reprogramming by a serial programmer. Check the above only when using a serial programmer because the addresses can be executed as an instruction. 2. The bits 7 to 2 of the address FFDBh are the protect set bits of the Spec. L flash memory version when using a parallel programmer. When the set condition is not unexpected, to change a program is necessary. Since the protect set bits do not affect when using a serial programmer, there is no problem. This address can be executed as an instruction same as the addresses FFD4h to FFDAh. 3. When accessing the addresses 0FE0h to 0FEFh, to change a program not to access these addresses is necessary. 4. Nothing is assigned on the addresses 0FFEh and 0FFFh of Spec. L flash memory version. To change a program is not necessary even if programming in standard flash memory version is performed. 5. To change a program is necessary when the oscillation stabilization time after the STP instruction is released is less than 100 μ sec in stop mode. Set 100 μ sec or more by the oscillation stabilization time setting function after the STP instruction which uses timer 1 is released. 6. When using CPU rewrite mode, to change general processes regarding CPU rewrite mode is necessary. (3) Spec. H mask ROM version Spec. L mask ROM version Basically, to change a program is not necessary. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).
13
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Program change at replacing (2) Program change at replacing (2)
Details about a program are described as follows. Please make sure to check there are some differences of memory size every product. Note: Program checksum When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation. When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and calculated values of the checksum are also undefined. (4) Spec. H flash memory version Spec. L flash memory version To change a program is not necessary. (5) Standard mask ROM version Spec. H QzROM version 1. QzROM version does not have the ROM 60 Kbytes version. 2. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect address. Set this address FFh on a user program. 3. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00). (6) Standard flash memory version Spec. H QzROM version 1. QzROM version does not have the ROM 60 Kbytes version. 2. When using the first 128 bytes and last 2 bytes of ROM area, to change a program is necessary. Since the first 128 bytes and last 2 bytes of ROM area for QzROM version are reserved areas for the product inspection, those area cannot be used by a user program. 3. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect address. Set this address FFh on a user program. 4. When accessing the addresses 0FE3h to 0FEFh, to change a program not to access these addresses is necessary. 5. Nothing is assigned on the addresses 0FFEh and 0FFFh of Spec. H QzROM version. To change a program is not necessary even if programming in standard flash memory version is performed. 6. When using CPU rewrite mode, delete processes regarding CPU rewrite mode. 7. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).
14
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Program change at replacing (3) Program change at replacing (3)
Details about a program are described as follows. Please make sure to check there are some differences of memory size every product. Note: Program checksum When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation. When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and calculated values of the checksum are also undefined. (7) Spec. H/L mask ROM version Spec. H QzROM version 1. QzROM version does not have the ROM 60 Kbytes version. 2. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect address. Set this address FFh on a user program. 3. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00). (8) Spec. H/L flash memory version Spec. H QzROM version 1. QzROM version does not have the ROM 60 Kbytes version. 2. When using the first 128 bytes and last 2 bytes of ROM area, to change a program is necessary. Since the first 128 bytes and last 2 bytes of ROM area for QzROM version are reserved areas for the product inspection, those area cannot be used by a user program. 3. When using address FFDBh, to change a program is necessary. Address FFDBh of QzROM version is the ROM code protect address. Set this address FFh on a user program. 4. Although the ID code (addresses FFD4h to FFDAh) does not have any functions in Spec. H QzROM version, to change a program is not necessary. 5. Nothing is assigned on the addresses 0FE0h to 0FE2h of Spec. H QzROM version. To change a program is not necessary even if programming in Spec. H/L flash memory version is performed. 6. When using CPU rewrite mode, delete processes regarding CPU rewrite mode. 7. Refer to the technical update, Note on 3803 Group A/D Converter (TN-380-A067B/E Rev.2.00).
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©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Reference: M38039FFH (L) and M38039GXH Serial Rewriting Circuit Reference: M38039FFH (L) and M38039GXH Serial Rewriting Circuit when Using Suisei Electronics System Serial Unit when Using aaSuisei Electronics System Serial Unit
The pin number indicates the flat package version. T_VDD T_TXD T_SCLK
Note: T_VPP is not needed.
Flash Memory ver. M38039FFH M38039FFL
(Standard serial I/O Mode 1)
Note:
Differences
QzROM ver. M38039GXH
(QzROM Programming Mode)
*2
57 Vcc 15 RXD (P44/RXD1) 13 SCLK (P46/SCLK1) 12 BUSY (P47/SRDY1/CNTR2) 14 TXD (P45/TXD1) 18 CNVSS
T_VDD
*3
57
Vcc
T_SCLK
Note: T_BUSY is not needed.
N.C. 15 RXD (P44/RXD1) 13 ESCLK (P46/SCLK1) 12 4.7 kΩ 14 18 4.7 kΩ
T_PGM/OE/MD T_TXD*1 T_RXD T_VPP
T_BUSY
ESPGMB (P47/SRDY1/CNTR2) ESDA (P45/TXD1) CNVSS
T_RXD T_PGM/OE/MD
T_RESET T_RESET USER RST GND 19 RESET(RESET) 24 Vss XIN XOUT USER RST GND
19
RESET(RESET)
24 Vss
XIN
XOUT
Perform the same pin processing as in single chip mode.
Perform the same pin processing as in single chip mode.
As programming specifications differ for each product, specify the part number before programming. As the MCU programming pins are common, writing can be performed on the same board in the QzROM/Flash Memory versions. *1: For the QzROM version, connect both the serial unit’s T_TXD and T_RXD to TxD pin, and leave RxD pin open. *2: Supply the power source voltage (Vcc) from the user so that it will meet the Vcc of the output buffer used on the programmer. *3: The VDD power source is supplied from the programmer. When the user power consumption is high (20 mA or more for other than the MCU), supply the VDD from the user.
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©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Reference: M38039FF and M38039FFH (L) Serial Rewriting Circuit Reference: M38039FF and M38039FFH (L) Serial Rewriting Circuit when Using Suisei Electronics System Serial Unit when Using aaSuisei Electronics System Serial Unit
The pin number indicates the flat package version.
Note:
Differences *2 57 15 13
M38039FF
(Standard serial I/O Mode)
M38039FFH M38039FFL
(Standard serial I/O Mode 1)
T_VDD T_TXD *1 T_RXD T_SCLK T_PGM/OE/MD T_BUSY
*3
57 15 13 49 12 N.C. 14
Vcc SDA (P44/RXD1) SCLK (P46/SCLK1) OE (P37/SRDY3) BUSY (P47/SRDY1 /CNTR2) TXD (P45/TXD1) VPP (CNVSS)
T_VDD T_TXD T_SCLK
Vcc RXD (P44/RXD1) SCLK (P46/SCLK1)
T_BUSY
12
BUSY (P47/SRDY1/CNTR2)
T_RXD T_PGM/OE/MD
Note: T_VPP is not needed.
14 TXD (P45/TXD1) 18 CNVSS
T_VPP
18
T_RESET USER RST GND
19 24
T_RESET RESET(RESET) Vss XIN XOUT USER RST GND
19 24
RESET(RESET) Vss XIN XOUT
Perform the same pin processing as in single chip mode.
Perform the same pin processing as in single chip mode.
As programming specifications differ for each product, specify the part number before programming. As the MCU programming pins are common, writing can be performed on the same board in the QzROM/Flash memory versions. *1: For the standard version, connect both the serial unit’s T_TXD and T_RXD to SDA (RxD pin), and leave TxD pin open. *2: Supply the power source voltage (Vcc) from the user so that it will meet the Vcc of the output buffer used on the programmer. *3: The VDD power source is supplied from the programmer. When the user power consumption is high (20 mA or more for other than the MCU), supply the VDD from the user.
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©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Renesas Renesas 33803L/3803H/3803Groups Development Support Tools 803L/3803H/3803 Groups Development Support Tools
Except programmers, development support tools are common to the Groups.
Development Support Tool Assembler package Compiler Package Simulator Debugger On-chip Debugging Emulator (3803L Group) Compact Emulator System Compact Emulator Part Number M3T-SRA74 (Simulator debugger incl. Integrated Development Environment with HEW) M3T-ICC740 (Simulator debugger incl. Integrated Development Environment with HEW) M3T-SRA74, M3T-ICC740 or M3T-PD38SIM accessory (discontinued) E8a (incl. HEW, 740 E8a emulator debugger, M3T-SRA74 free evaluation version, M3T-ICC740 free evaluation version, FDT free evaluation version, and more) M38000T2-CPE (incl. 740 Compact emulator debugger, M3T-ICC740 (with HEW), and M3T-SRA74 (with HEW) ) M38049RLSS 740 PC4701 emulator debugger or M3T-PD38 (discontinued) PC4701U (emulator debugger license bundled) M38000TL2-FPD (low voltage operation supported) (discontinued) M38049RLSS R0K338039S001BR (Refer to the next page) M38007T-ADS (pin processing board for Emulator MCU)
Emulator MCU PC4701 Emulator System
(Discontinued Product)
Emulator Debugger Emulator Emulation Pod Emulator MCU Package Converter Pin processing board
RSK (Renesas Starter Kit for 3803L) Accessory
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©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Connecting Emulator and Target System Connecting Emulator and Target System
PC4701 System (discontinued) Emulation Pod M38000TL2-FPD (discontinued) *Emulator Pod Probe type 30-pin narrow pitch connector x 1 Compact emulator system Compact emulator M38000T-CPE
M3T-28DP-WS *1
M3T-28DP-WT
*1. This converter is included in Emulator Pod Package. *2. These 3 parts are as one set. *3. These 4 parts are as one set. *4. Available from Tokyo Eletech Corporation. * The mark indicates the location of No.1 pin.
FP/KP package boardmounted evaluation HP package sample Board-mounted evaluation M3T-64DIP-DMS
FP package : HQPACK064SA (Sold Separately) *4 KP package : HQPACK064SA160 *3 (Sold Separately) *4
RSS type emulator MCU M38049RLSS
M38007T-PRB M3T-64LCC-QSD
64-pin SDIP socket (SP package)
YQSOCKET064SDF2 (Sold Separately) *4
HQPACK064SD (Sold Separately) *4
*2
YQPACK064SD (Sold Separately) *4
HP package version FP/KP package version
M3T-64LCC-QSD 64-pin 0.5 mm pitch QFP NQPACK064SD-ND (Sold Separately) *4 (HP package) 64-pin 0.5 mm pitch QFP (HP package)
M3T-DUMMY64 M3T-FLX-64NSA 64-pin 0.8 mm pitch QFP 64pin (FP package) 0.8 mm pitch QFP/LQFP (FP/KP package)
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©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
3803H/3803L Groups 3803H/3803L Groups Suisei Electronics System Flash Memory/QzROM Programmers Suisei Electronics System Flash Memory/QzROM Programmers
Main unit Serial/Parallel Unit On-board reprogramming/programming M38039FFH M38039FFL Flash memory version (Serial programming) EFP-S2V EFP-S2 in common M38039GXH QzROM version (Serial programming) Off-board reprogramming/programming M38039FFH M38039FFL Flash memory version (Parallel programming) EF1CNT-96P + Parallel unit EF3803F-64H (for HP) EF3803F-64F (for FP) EF3803F-64U (for KP) EF3803F-64S (for SP) EF3803F-64FL (for WG) Parallel unit EF3803F-64H (for HP) EF3803F-64F (for FP) EF3803F-64U (for KP) EF3803F-64S (for SP) EF3803F-64FL (for WG) M38039GXH QzROM version (Serial programming + MCU unit for programming) EF1SRP-01US2 (or EF1CNT-96P + EF1SRP-05U) + MCU unit MS3803-64H (for HP) MS3803-64U (for KP) MS3803-64S (for SP) EF1SRP-05U + MCU unit MS3803-64H (for HP) MS3803-64U (for KP) MS3803-64S (for SP)
EF1SRP-01US2
EF1CNT-96P + EF1SRP-01U EFP-I EF1SRP-01U
EF1CNT-96P + EF1SRP-05U EF1SRP-05U
EF1CNT-96P: Connector converter unit Each unit for EFP-I can be connected to EFP-S2 or EFP-S2V by EF1CNT-96P. As a Renesas Flash memory/QzROM programmer, the Flash Development Toolkit (FDT) and the E8 can be used together for on-board programming. (IC socket boards are required for the QzROM on-board programming.)
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©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
3803 Group Programmers 3803 Group Programmers
Tools RENESAS Programming Adapter Flash Memory Programmer 3803 Group Products PCA4738HF-64 (for 0.5 mm-pitch LQFP package) PCA4738FF-64 (for 0.8 mm-pitch QFP package) PCA4738SF-64 (for 1.778 mm-pitch SDIP package) EFP-I for Serial Interface Available from Suisei Electronics System Co., Ltd. R4945, R4945A for Parallel Interface Available from ADVANTEST Corp. (RENESAS Programming Adapter required) AF9709, AF9708, AF9723 for Standard Parallel Interface Available from Flash Support Group, Inc. (RENESAS Programming Adapter required)
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©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
Recommended 3803 Group Replacements Recommended 3803 Group Replacements
The following 3803 Group products are recommended to replace with the products shown as below. Please consider these replacements when adopting the applicable products to a new system.
Applicable Products M38034M4-XXXSP M38034M4-XXXFP M38034M4-XXXHP M38037M6-XXXSP M38037M6-XXXFP M38037M6-XXXHP M38037M8-XXXSP M38037M8-XXXFP M38037M8-XXXHP M38039MC-XXXSP M38039MC-XXXFP M38039MC-XXXHP M38039MF-XXXSP M38039MF-XXXFP M38039MF-XXXHP M38039FFSP M38039FFFP M38039FFHP Replacement product M38039G4HSP (*1) M38039G4H-XXXKP M38039G4H-XXXHP M38039G6HSP (*1) M38039G6H-XXXK M38039G6H-XXXHP M38039G8HSP (*1) M38039G8H-XXXKP M38039G8H-XXXHP M38039GCHSP (*1) M38039GCH-XXXKP M38039GCH-XXXHP M38039MFL-XXXSP M38039MFL-XXXKP M38039MFL-XXXHP M38039FFLSP M38039FFLKP M38039FFLHP Applicable Products M38034M4H-XXXSP M38034M4H-XXXFP M38034M4H-XXXHP M38034M4H-XXXKP M38037M6H-XXXSP M38037M6H-XXXFP M38037M6H-XXXHP M38037M6H-XXXKP M38037M8H-XXXSP M38037M8H-XXXFP M38037M8H-XXXHP M38037M8H-XXXKP M38039MCH-XXXSP M38039MCH-XXXFP M38039MCH-XXXHP M38039MCH-XXXKP M38039MFH-XXXSP M38039MFH-XXXFP M38039MFH-XXXHP M38039MFH-XXXKP M38039MFH-XXXWG M38039FFHSP M38039FFHFP M38039FFHHP M38039FFHKP M38039FFHWG Date: Jul.02.08 Replacement product M38039G4HSP (*1) M38039G4H-XXXKP M38039G4H-XXXHP M38039G4H-XXXKP M38039G6HSP (*1) M38039G6H-XXXKP M38039G6H-XXXHP M38039G6H-XXXKP M38039G8HSP (*1) M38039G8H-XXXKP M38039G8H-XXXHP M38039G8H-XXXKP M38039GCHSP (*1) M38039GCH-XXXKP M38039GCH-XXXHP M38039GCH-XXXKP M38039MFL-XXXSP M38039MFL-XXXKP M38039MFL-XXXHP M38039MFL-XXXKP M38039MFL-XXXWG M38039FFLSP M38039FFLKP M38039FFLHP M38039FFLKP M38039FFLWG
3803H Group
3803 Group
3803L Group
3803H Group
(*1): If requesting writing by Renesas, M38039MFL-XXXSP in the 3803L Group mask ROM version is recommended as replacement. Please refer to the Differences between the 3803L/3803H/3803 Groups (P.6 and 7).
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©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
3803L Group
3803H Group
REVISION HISTORY
Rev. 4.00 Date May 08, 2008 Page 1 2 2 to 5 6 7 9 10 11 Summary Title revised Page 2 to 4 in the previous version (Rev.3.03) deleted Table layout revised 3803L Group Flash memory version: Marks (**) for under development products deleted (1) added at end of the page title Program/erase power supply of QzROM version: Vcc revised Page added because of new items Newly added (1) Added at end of the page title Page title added Item 7: Values to be written for protection added Item 11, 12: Added Page title added Item No. revised according to additions Newly added On-chip debugging emulator added Renesas Starter Kit for 3803L: Part number added PC4701 system: “(discontinued)” added Part number revised: NQPACK064SD NQPACK064SD-ND Version revised: Flash memory version HP package version, FP/KP package version 3803L Group Flash memory version: Marks (**) for under development products deleted Replacements QzROM version SP package products: Note added ROM size in table changed: ZZZZ 1000 1080
12 13 to 15 18 19
20 22 4.01 Jun. 16, 2008 9 10 7,13,14,15
Item 3: Information about mounting pad added Spec.H QzROM version: “Refer to the technical update, Note on 3803 Group A/D Converter (TN-380A067B/E).” added
23
©2008. Renesas Technology Corp., All rights reserved.
REJ99B0048-0401
Rev.4.01
Date: Jul.02.08
©2008. Renesas Technology Corp., All rights reserved.
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1st, 2010 Renesas Electronics Corporation
Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry.
Notice
1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. 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You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. “Standard”:
2.
3. 4.
5.
6.
7.
8.
9.
10.
11. 12.
(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.