3804

8 -bit MICROCOMPUTER 38000 Series - Differences Between The 3804L Group/3804H Group/3804 Group Differences ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 3804L/3804H/3804 Groups Products 3804L/3804H/3804 Groups Products 3804L Group* Part Number Flash Memory ver. ROM size 60 K RAM size 2048 3804 Group Part Number Mask ROM ver. M38044M4-XXXSP/FP/HP M38047M6-XXXSP/FP/HP M38047M8-XXXSP/FP/HP M38049MC-XXXSP/FP/HP M38049MF-XXXSP/FP/HP M38049FFSP/FP/HP (Note) ROM size 16 K 24 K 32 K 48 K 60 K 60 K RAM size 640 1024 M38049FFLSP/HP/KP/WG 3804H Group Part Number Flash Memory ver. ROM size 60 K RAM size 2048 2048 * 3804L features - Reduced current consumption in 32 kHz (low-speed) wait mode (Flash memory version) - Reduced EMI (unwanted radiation) noise level Note: Recommended to replace. Please consider a replacement with 3804L Group. 2 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Flash Memory ver. M38049FFHSP/FP/HP/KP (Note) Date: Aug.04.08 3804L/3804H/3804 Groups Pin Configuration (SP) 3804L/3804H/3804 Groups Pin Configuration (SP) Completely Completely Pin Compatible Pin Compatible VCC VREF AVSS P6 7 /AN7 P6 6 /AN6 P6 5 /AN5 P6 4 /AN4 P6 3 /AN3 P6 2 /AN2 P6 1 /AN1 P6 0 /AN0 P5 7 /INT 3 P5 6 /PWM P5 5 /CNTR 1 P5 4 /CNTR 0 P5 3 /S RDY2 P5 2 /S CLK2 P5 1 /S OUT2 P5 0 /S IN2 P4 7 /S RDY1 /CNTR 2 P4 6 /S CLK1 P4 5 /TX D 1 P4 4 /R X D 1 P4 3 /INT 2 P4 2 /INT 1 VPP CNV SS RESET P4 1 /INT 00 /X CIN P4 0 /INT 40 /X COUT XIN XOUT VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 P3 0 /DA1 P3 1 /DA2 P32/SDA P33/SCL P3 4 /R X D 3 P3 5 /TX D3 P3 6 /SCLK3 P3 7 /SRDY3 P0 0 /AN8 P0 1 /AN9 P0 2 /AN10 P0 3 /AN11 P0 4 /AN12 P0 5 /AN13 P0 6 /AN14 P0 7 /AN15 P1 0 /INT 41 P1 1 /INT 01 P1 2 P1 3 P1 4 P1 5 P1 6 P1 7 P2 0 (LED 0 ) P2 1 (LED 1 ) P2 2 (LED 2 ) P2 3 (LED 3 ) P2 4 (LED 4 ) P2 5 (LED 5 ) P2 6 (LED 6 ) P2 7 (LED 7 ) Outline SP: PRDP0064BA-A (64P4B) (1.78mm pitch) M3804XMX-XXXSP M38049FFHSP M38049FFLSP M38049FFSP 3 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 3804L/3804H/3804 Groups Pin Configuration (FP/HP/KP) 3804L/3804H/3804 Groups Pin Configuration (FP/HP/KP) P00/AN8 P01/AN9 P02/AN10 P03/AN11 P04/AN12 P05/AN13 P06/AN14 P07/AN15 P10/INT41 P11/INT01 P12 P13 P14 P15 P16 P17 47 45 42 40 39 34 48 46 44 43 41 38 37 36 P37/SRDY3 P36/SCLK3 P35/TXD3 P34/RXD3 SCL/P33 SDA/P32 P31/DA2 P30/DA1 VCC VREF AVSS P67/AN7 P66/AN6 P65/AN5 P64/AN4 P63/AN3 35 33 Completely Completely Pin Compatible Pin Compatible 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 Note: KP for 3804H/3804L Groups only. FP for 3804/3804H Groups only. 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 10 11 14 12 13 15 16 1 2 3 4 6 5 7 8 9 M3804XMX-XXXFP/HP M38049FFHFP/HP/KP M38049FFLHP/KP M38049FFFP/HP P20(LED0) P21(LED1) P22(LED2) P23(LED3) P24(LED4) P25(LED5) P26(LED6) P27(LED7) VSS XOUT XIN P40/INT40/XCOUT P41/INT00/XCIN RESET CNVSS VPP P42/INT1 Outline KP :PLQP0064GA-A (64P6U-A) (0.8mm pitch, 14mm square, 1.7mm mounting height) FP : PRQP0064GA-A (64P6N-A) (0.8mm pitch, 14mm square, 3.05mm mounting height) HP : PLQP0064KB-A (64P6Q-A) (0.5mm pitch, 10mm square, 1.7mm mounting height) 4 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 P54/CNTR0 P53/SRDY2 P52/SCLK2 P51/SOUT2 P50/SIN2 P47/SRDY1/CNTR2 P46/SCLK1 P45/TXD1 P44/RXD1 P42/INT2 P62/AN2 P61/AN1 P60/AN0 P57/INT3 P56/PWM P55/CNTR1 Rev.1.00 Date: Aug.04.08 3804L Groups Pin Configu ation (WG) 3804L Groups Pin Configurration(WG) Completely Completely Pin Compatible Pin Compatible 8 (TOP view) A B C D E F G H 50 P36/SCLK3 46 47 P01/AN9 44 45 P03/AN11 41 42 P06/AN14 40 P10/INT41 32 P25(LED0) 31 P21(LED1) 30 P22(LED2) 8 P02/AN10 P04/AN12 P07/AN15 7 51 P35/TxD3 39 P11/INT01 27 P25(LED5) 29 P23(LED3) 28 P24(LED4) 30 7 P22(LED2) The pin number corresponds to the flat package. 6 53 P33/SCL 52 P34/RxD3 48 P00/AN8 43 P05/AN13 38 P12 37 P13 26 P26(LED6) 25 P27(LED7) 6 5 56 P30/DA1 55 P31/DA2 54 P32/SDA 49 P37/SRDY3 33 P17 36 P14 35 P15 34 P16 5 4 1 P62/AN2 64 P63/AN3 58 VREF 59 AVss 57 VCC 24 VSS 22 XIN 23 XOUT 4 Package top view 3 60 P67/AN7 61 P66/AN6 4 5 6 C D 7 8 9 E 12 P47/SRDY1/CNTR2 14 P45/TxD1 21 P40/INT40/XCOUT 20 P41/INT40/XCIN 3 P57/INT3 P54/CNTR0 2 62 P65/AN5 63 P64/AN4 10 11 P50/SIN2 13 15 P44/RxD1 17 P42/INT1 19 RESET 2 M38049FFLWG P56/PWM P53/SRDY2 P51/SOUT2 P46/SCLK1 1 2 P61/AN1 3 B 16 P43/INT2 18 CNVSS 1 P60/AN0 P55/CNTR1 P52/SCLK2 A F G H Outline WG: PTLG0064JA-A (64F0G) (6mm FLGA package, 1.05mm height) Date: Aug.04.08 5 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Differences Between 804L/3804H/3804 Groups Differences Between 33804L/3804H/3804Groups 3804L Group Flash Memory ver. Program Memory Program Memory/RAM size Package Operating Power Source Voltage Flash Memory ID Code Flash Memory ROM Code Protect Flash Memory Control Register Flash memory 60K/2K SP, HP, KP, WG 2.7 to 5.5 V Addresses FFD4 to FFDAh Address FFDBh Flash Memory control registers 0 to 2 Addresses 0FE0h to 0FE2h 3804H Group Flash Memory ver. Flash memory 60K/2K SP, FP, HP, KP 2.7 to 5.5V Addresses FFD4 to FFDAh Address FFDBh Flash Memory control registers 0 to 2 Addresses 0FE0h to 0FE2h Mask ROM ver. Mask ROM 16K/640, 24K/1K, 32K/1K, 48K/2K, 60K/2K SP, FP, HP 2.7 to 5.5 V – – – 3804 Group Flash Memory ver. Flash memory 60K/2K SP, FP, HP 4.0 to 5.5V – – Flash Memory control register Address 0FFEh Flash command register Address 0FFFh Dual power source (Vcc = 5 V ± 0.5 V, Vpp = 11.7 to 12.6 V) CPU Rewrite Mode Parallel I/O Mode Standard serial I/O Mode Not needed Program/Erase Power Source Program/Erase Mode Single power source (Vcc = 2.7 to 5.5 V) CPU Rewrite Mode Parallel I/O Mode Standard serial I/O Mode Needed: 100 μsec Single power source (Vcc = 2.7 to 5.5 V) CPU Rewrite Mode Parallel I/O Mode Standard serial I/O Mode Needed: 100 μsec – – Time until Flash Memory can Operate after Returning from Stop Mode Not needed Power Source Circuit Characteristics Needed Internal Power Source Stable Time at Power-on : td (P-R) Electrical Characteristics Recommended Operating Conditions Needed Not needed Not needed The power source current of the Flash memory version differs between the Groups. Also, the operating conditions differs according to different operating voltages. For details, refer to the corresponding datasheet. 6 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 Improvemen in 3804L(H)/3804 Groups Operatin Frequency Characteristics Improvementtin 3804L(H)/3804 Groups OperatinggFrequency Characteristics Mask version f(Xin) High-speed mode 16.8 MHz 12.5 MHz 8.4 MHz 16.8 MHz 12.5 MHz 8.4 MHz Flash memory version f(Xin) High-speed mode 3804 Group 3804L Group 3804H Group 2.7 V 3804 Group 2.7 V 4.0 V 4.5 V 5.5 V Vcc f(Xin) 16.8 MHz 12.5 MHz 4.0 V 4.5 V 5.5 V Vcc f(Xin) 16.8 MHz 12.5 MHz 8.4 MHz Middle-speed mode Middle-speed mode 3804 Group 3804L Group 3804H Group 3804 Group 2.7 V 4.0 V 4.5 V 5.5 V Vcc Rev.1.00 Date: Aug.04.08 2.7 V 4.0 V 4.5 V 5.5 V Vcc 7 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Differences Between Memory Maps of 3804L/3804H/3804 Groups Differences Between Memory Maps of 3804L/3804H/3804 Groups Mask ROM version Zero page Flash memory version 3804L, 3804H Group 000016 SFR area 004016 010016 083F16 Flash memory version 3804 Group 000016 SFR area 004016 010016 083F16 000016 004016 RAM RAM size 640 1024 2048 XXXX 02BF 043F 083F SFR area 010016 XXXX16 Not used Not used Not used 0FE016 SFR (incl. Reservation) 0FF616 Not used 0FE016 SFR (incl. Reservation) 0FF616 Not used 0FF016 SFR area 0FFF16 Not used YYYY16 ZZZZ16 Reserved ROM area 100016 ZZZZ16 100016 ZZZZ16 ROM ROM size YYYY ZZZZ 16384 24576 32768 49152 61440 C000 C080 A000 8000 4000 1000 A080 8080 1080 4080 FF0016 FF0016 Special page FF0016 FFD416 FFDA16 FFDB16 FFDC16 Interrupt vector area FFFE16 Reserved ROM area FFFF16 FFD416 FFD416 ID code FFDA16 FFDB16 Protect address FFDC16 Interrupt vector area FFFE16 Reserved ROM area FFFF16 FFDA16 FFDB16 FFDC16 Interrupt vector area FFFE16 Reserved ROM area FFFF16 8 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 Replacemen Notes (1) ReplacementtNotes (1) According to the differences in the specifications shown in P.6, the following notes are suggested. Please also refer to P.6. 1. Program Memory Depending on the memory type, program/erase specifications as well as applicable programmers and adaptors differ. Confirm the programmer applicable for your product. 2. Packages - The WG-package product is available only in the 3804L Group. - In the 3804L Group, the FP package product is not available, but the thin KP package product is available for 0.8 mm-pitch. As a 0.8 mm-pitch, the KP package has better excellence in thinness, heat radiation, and stress characteristics than FP package. Confirm the mounting pad design standards of FP package and KP package on Renesas Surface Mount Package User's Manual (Document No.: REJ11K0001) 3. Operating Power Source Voltage - The operating power source voltage for the 3804 Group Mask ROM version and the 3804H/3804L Groups ranges from 2.7 to 5.5V. It ranges from 4.0 to 5.5 V for 3804 Group Flash memory version. Confirm the operating power source voltage for your product. 4. Flash Memory ID Code and ROM Code Protect In the 3804H/3804L Groups Flash memory version, ID codes are assigned to addresses FFD4 to FFDA16, and ROM code protect is assigned to address FFDB16. Please note that these addresses are included in the user ROM area. The data of these addresses must be set to programming data before programming. 5. Flash Memory Control Registers - In the 3804H/3804L Group Flash memory version, Flash Memory control registers 0 to 2 are assigned to addresses 0FE0 to 0FE216. - In the 3804 Group Flash memory version, Flash Memory control register is assigned to address 0FFE16 and Flash command register is assigned to address 0FFF16. - In the Mask ROM versions, nothing is allocated to these addresses, so writing can be performed to them. When read, their values are undefined. 9 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 Replacemen Notes (2) ReplacementtNotes (2) 6. Program/Erase Power Source, Program/Erase Mode The program/erase power source voltage as well as the absolute maximum ratings of the pins differ between 3804 Group Flash memory version and 3804H/3804L Groups. Further more, the program specification (pin used, program algorithm, etc) differs, too. Make sure to connect the specified programmer with your product to prevent a voltage that exceeds the ratings from being applied to the pins. 7. Stop Mode In the 3804H and 3804 L Groups, waiting time (more than 100 μsec) until Flash memory can operate after returning from stop mode is necessary. Use oscillation stabilization time setting function after the STP instruction is released to set it. 8. Internal Power Source Stable Time at Power-on In the 3804H and 3804 L Groups, internal power source stable time at power-on (td (P-R): max. 2msec) is necessary. Set Vcc to more than 2.7 V and reset input “L” to td(P-R) + XIN16 cycles or more. 9. Oscillation Circuit Constants The oscillation circuit structure differs between the 3804, 3804H, and 3804L Groups. The XIN-XOUT and XCIN-XCOUT oscillation circuit constants differ from product to product. Contact the oscillator manufacturer to select an appropriate oscillator and oscillation circuit constants so that the product used for mass production will obtain an stable operating clock with your system and conditions. Additional consideration is required when the voltage range or the temperature range is wide. Also, we recommend considering the wiring patterns of the feedback resistors, the damping resistors, and the load capacity beforehand when designing circuits. 10. Differences between Mask ROM and Flash Memory Versions The Flash memory and Mask ROM versions differ in their manufacturing processes and mask patterns because of the different ROM types used. Because of these differences, characteristics values, operation margins, noise immunity, noise radiation, and oscillation circuit constants may vary. When developing application products, perform careful system evaluations for each product. Additional care is required when replacing products (for example, replacing a Mask ROM version with a Flash memory version). Careful system evaluations should be performed with replacement products before the mass production phase of application products. 10 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 Program change at replacing Program change at replacing Details about a program are described as follows regarding whether the same program can be used without change when replacing between standards, Spec. H and Spec. L of the 3804 Group. Please make sure to check there are some differences of memory size in every product. Refer to the datasheets and technical updates of the 3804 Group for detailed specifications of products. Confirm the operation using replaced product. Note: Program checksum When calculating the checksum of ROM area by a program, make sure to check the difference of areas for calculation. When the unused area and reserved ROM area are included in target areas of replaced products, the read values are undefined and calculated values of the checksum are also undefined. (1) Standard flash memory version Spec. L flash memory version 1. When using the addresses FFD4h to FFDAh, check the followings: The codes written in these addresses are the ID codes of the Spec. L flash memory version when using a serial programmer. To input this code is necessary as the ID code for flash memory reprogramming by a serial programmer. Check the above only when using a serial programmer because the addresses can be executed as an instruction. 2. The bits 7 to 2 of the address FFDBh are the protect set bits of the Spec. L flash memory version when using a parallel programmer. When the set condition is not unexpected, to change a program is necessary. Since the protect set bits do not affect when using a serial programmer, there is no problem. This address can be executed as an instruction same as the addresses FFD4h to FFDAh. 3. When accessing the addresses 0FE0h to 0FEFh, to change a program not to access these addresses is necessary. 4. Nothing is assigned on the addresses 0FFEh and 0FFFh of Spec. L flash memory version. To change a program is not necessary even if programming in standard flash memory version is performed. 5. To change a program is necessary when the oscillation stabilization time after the STP instruction is released is less than 100 μ sec in stop mode. Set 100 μ sec or more by the oscillation stabilization time setting function after the STP instruction which uses timer 1 is released. 6. When using CPU rewrite mode, to change general processes regarding CPU rewrite mode is necessary. (2) Spec. H flash memory version Spec. L flash memory version To change a program is not necessary. 11 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 Reference: M38049FF and M38049FFH (L) Serial Rewriting Circuit Reference: M38049FF and M38049FFH (L) Serial Rewriting Circuit when Using Suisei Electronics System Serial Unit when Using aaSuisei Electronics System Serial Unit The pin number indicates the flat package version. Note: Differences *2 57 15 13 M38049FF (Standard serial I/O Mode) M38049FFH M38049FFL (Standard serial I/O Mode 1) T_VDD T_TXD *1 T_RXD T_SCLK T_PGM/OE/MD T_BUSY *3 57 15 13 49 12 N.C. 14 Vcc SDA (P44/RXD1) SCLK (P46/SCLK1) OE (P37/SRDY3) BUSY (P47/SRDY1 /CNTR2) TXD (P45/TXD1) VPP (CNVSS) T_VDD T_TXD T_SCLK Vcc RXD (P44/RXD1) SCLK (P46/SCLK1) T_BUSY 12 BUSY (P47/SRDY1/CNTR2) T_RXD T_PGM/OE/MD Note: T_VPP is not needed. 14 TXD (P45/TXD1) 18 CNVSS T_VPP 18 T_RESET USER RST GND 19 24 T_RESET RESET(RESET) Vss XIN XOUT USER RST GND 19 24 RESET(RESET) Vss XIN XOUT Perform the same pin processing as in single chip mode. Perform the same pin processing as in single chip mode. As programming specifications differ for each product, specify the part number before programming. As the MCU programming pins are common, writing can be performed on the same board in the QzROM/Flash memory versions. *1: For the standard version, connect both the serial unit’s T_TXD and T_RXD to SDA (RxD pin), and leave TxD pin open. *2: Supply the power source voltage (Vcc) from the user so that it will meet the Vcc of the output buffer used on the programmer. *3: The VDD power source is supplied from the programmer. When the user power consumption is high (20 mA or more for other than the MCU), supply the VDD from the user. 12 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 Renesas Renesas 33804L/3804H/3804Groups Development Support Tools 804L/3804H/3804 Groups Development Support Tools Except programmers and on-chip debugging emulators, development support tools are common to the Groups. Development Support Tool Assembler package Compiler Package Simulator Debugger On-chip Debugging Emulator (3804L Group) Compact Emulator System Compact Emulator Part Number M3T-SRA74 (Simulator debugger incl. Integrated Development Environment with HEW) M3T-ICC740 (Simulator debugger incl. Integrated Development Environment with HEW) M3T-SRA74, M3T-ICC740 or M3T-PD38SIM accessory (discontinued) E8a (incl. HEW, 740 E8a emulator debugger, M3T-SRA74 free evaluation version, M3T-ICC740 free evaluation version, FDT free evaluation version, and more) M38000T2-CPE (incl. 740 Compact emulator debugger, M3T-ICC740 (with HEW), and M3T-SRA74 (with HEW) ) M38049RLSS 740 PC4701 emulator debugger or M3T-PD38 (discontinued) PC4701U (emulator debugger license bundled) M38000TL2-FPD (low voltage operation supported) (discontinued) M38049RLSS (Refer to the next page) M38007T-ADS (pin processing board for Emulator MCU) Emulator MCU PC4701 Emulator System (Discontinued Product) Emulator Debugger Emulator Emulation Pod Emulator MCU Package Converter Pin processing board Accessory 13 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 Connecting Emulator and Target System Connecting Emulator and Target System PC4701 System (discontinued) Emulation Pod M38000TL2-FPD (discontinued) *Emulator Pod Probe type 30-pin narrow pitch connector x 1 Compact emulator system Compact emulator M38000T-CPE M3T-28DP-WS *1 M3T-28DP-WT *1. This converter is included in Emulator Pod Package. *2. These 3 parts are as one set. *3. These 4 parts are as one set. *4. Available from Tokyo Eletech Corporation. * The mark indicates the location of No.1 pin. FP/KP package boardmounted evaluation HP package sample Board-mounted evaluation M3T-64DIP-DMS FP package : HQPACK064SA (Sold Separately) *4 KP package : HQPACK064SA160 (Sold Separately) *4 RSS type emulator MCU M38049RLSS M38007T-PRB M3T-64LCC-QSD YQSOCKET064SDF2 HQPACK064SD (Sold Separately) 64-pin SDIP socket (SP package) (Sold Separately) *4 *4 *2 *3 YQPACK064SD (Sold Separately) HP package version FP/KP package version *4 M3T-64LCC-QSD 64-pin 0.5 mm pitch QFP NQPACK064SD-ND (Sold Separately) *4 (HP package) 64-pin 0.5 mm pitch QFP (HP package) M3T-DUMMY64 M3T-FLX-64NSA 64-pin 0.8 mm pitch QFP 64pin (FP package) 0.8 mm pitch QFP/LQFP (FP/KP package) 14 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 3804H/3804L Groups 3804H/3804L Groups Suisei Electronics System Flash Memory Programmers Suisei Electronics System Flash Memory Programmers Main unit On-board reprogramming M38049FFH M38049FFL Flash memory version (Serial programming) EFP-S2V EFP-S2 in common EF1SRP-01US2 Serial/Parallel Unit Off-board reprogramming M38049FFH M38049FFL Flash memory version (Parallel programming) EF1CNT-96P + Parallel unit EF3803F-64H (for HP) EF3803F-64F (for FP) EF3803F-64U (for KP) EF3803F-64S (for SP) EF3803F-64FL (for WG) Parallel unit EF3803F-64H (for HP) EF3803F-64F (for FP) EF3803F-64U (for KP) EF3803F-64S (for SP) EF3803F-64FL (for WG) EF1CNT-96P + EF1SRP-01U EF1SRP-01U EFP-I EF1CNT-96P: Connector converter unit Each unit for EFP-I can be connected to EFP-S2 or EFP-S2V by EF1CNT-96P. As a Renesas Flash memory/QzROM programmer, the Flash Development Toolkit (FDT) and the E8 can be used together for on-board programming. (IC socket boards are required for the QzROM on-board programming.) 15 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 3804 Group Programmers 3804 Group Programmers Tools RENESAS Programming Adapter Flash Memory Programmer 3804 Group Products PCA4738HF-64 (for 0.5 mm-pitch LQFP package) PCA4738FF-64 (for 0.8 mm-pitch QFP package) PCA4738SF-64 (for 1.778 mm-pitch SDIP package) EFP-I for Serial Interface Available from Suisei Electronics System Co., Ltd. R4945, R4945A for Parallel Interface Available from ADVANTEST Corp. (RENESAS Programming Adapter required) AF9709, AF9708, AF9723 for Standard Parallel Interface Available from Flash Support Group, Inc. (RENESAS Programming Adapter required) 16 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 REVISION HISTORY Rev. 1.00 Date Aug. 04, 2008 Page First edition issued Summary 17 ©2008. Renesas Technology Corp., All rights reserved. REJ99B2001-0100 Rev.1.00 Date: Aug.04.08 ©2008. Renesas Technology Corp., All rights reserved. To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. 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You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. “Standard”: 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.