553MILF

DATASHEET ICS553 LOW SKEW 1 TO 4 CLOCK BUFFER Description Features The ICS553 is a low skew, single input to four output, clock buffer. Part of IDT’s ClockBlocksTM family, this is our lowest skew, small clock buffer. • • • • • • • • See the ICS552-02 for a 1 to 8 low skew buffer. For more than eight outputs, see the MK74CBxxx BuffaloTM series of clock drivers. IDT makes many non-PLL and PLL based low skew output devices as well as Zero Delay Buffers to synchronize clocks. Contact us for all of your clocking needs. Extremely low skew outputs (50 ps maximum) Packaged in 8-pin SOIC Pb (lead) free package Low power CMOS technology Operating voltages of 2.5 V to 5 V Output Enable pin tri-states outputs 5 V tolerant input clock Commercial (0 to +70°C) and Industrial (-40 to +85°C) temperature ranges available Block Diagram Q0 Q1 ICLK Q2 Q3 Output Enable IDT® LOW SKEW 1 TO 4 CLOCK BUFFER 1 ICS553 REV N 051310 ICS553 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Pin Assignment V DD 1 8 OE Q0 2 7 Q3 Q1 3 6 Q2 GN D 4 5 I CL K 8 - p i n S OI C Pin Descriptions Pin Pin Number Name Pin Type Pin Description 1 VDD Power Connect to +2.5 V, +3.3 V or +5.0 V. 2 Q0 Output Clock output 0. 3 Q1 Output Clock output 1. 4 GND Power Connect to ground. 5 ICLK Input Clock input, 5 V tolerant input. 6 Q2 Output Clock Output 2. 7 Q3 Output Clock Output 3. 8 OE Input Output Enable. Tri-states outputs when low. Connect to VDD for normal operation. External Components A minimum number of external components are required for proper operation. A decoupling capacitor of 0.01 µF should be connected between VDD on pin 1 and GND on pin 4, as close to the device as possible. A 33 Ω series terminating resistor may be used on each clock output if the trace is longer than 1 inch. To achieve the low output skew that the ICS553 is capable of, careful attention must be paid to board layout. Essentially, all four outputs must have identical terminations, identical loads and identical trace geometries. If they do not, the output skew will be degraded. For example, using a 30Ω series termination on one output (with 33Ω on the others) will cause at least 15 ps of skew. IDT® LOW SKEW 1 TO 4 CLOCK BUFFER 2 ICS553 REV N 051310 ICS553 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS553. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V Output Enable and All Outputs -0.5 V to VDD+0.5 V ICLK -0.5 V to 5.5 V Ambient Operating Temperature (commercial) 0 to +70° C Ambient Operating Temperature (industrial) -40 to +85° C Storage Temperature -65 to +150° C Junction Temperature 125° C Soldering Temperature 260° C Recommended Operation Conditions Parameter Min. Max. Units 0 +70 °C -40 +85 °C +2.375 +5.25 V Ambient Operating Temperature (commercial) Ambient Operating Temperature (industrial) Power Supply Voltage (measured in respect to GND) Typ. DC Electrical Characteristics VDD=2.5 V ±5%, Ambient temperature -40 to +85° C, unless stated otherwise Parameter Operating Voltage Symbol Conditions VDD Input High Voltage, ICLK VIH Note 1 Input Low Voltage, ICLK VIL Note 1 Input High Voltage, OE VIH Input Low Voltage, OE VIL Output High Voltage VOH IOH = -16 mA Output Low Voltage VOL IOL = 16 mA Operating Supply Current IDD No load, 135 MHz Nominal Output Impedance ZO Input Capacitance CIN Short Circuit Current IOS IDT® LOW SKEW 1 TO 4 CLOCK BUFFER Min. Typ. Max. Units 2.375 2.625 V VDD/2+0.5 5.5 V VDD/2-0.5 V VDD V 0.7 V 1.8 ICLK, OE pin 3 2 V 0.4 V 25 mA 20 Ω 5 pF ±28 mA ICS553 REV N 051310 ICS553 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER DC Electrical Characteristics (continued) VDD=3.3 V ±5% , Ambient temperature -40 to +85° C, unless stated otherwise Parameter Operating Voltage Symbol Conditions VDD Input High Voltage, ICLK VIH Note 1 Input Low Voltage, ICLK VIL Note 1 Input High Voltage, OE VIH Input Low Voltage, OE VIL Output High Voltage VOH IOH = -25 mA Output Low Voltage VOL IOL = 25 mA Output High Voltage (CMOS Level) VOH IOH = -12 mA Operating Supply Current IDD No load, 135 MHz Nominal Output Impedance ZO Input Capacitance CIN Short Circuit Current IOS Min. Typ. Max. Units 3.15 3.45 V VDD/2+0.7 5.5 V VDD/2-0.7 V VDD V 0.8 V 2 2.4 V 0.4 VDD-0.4 V V 35 mA 20 Ω 5 pF ±50 mA ICLK, OE pin VDD=5 V ±5% , Ambient temperature -40 to +85° C, unless stated otherwise Parameter Operating Voltage Symbol Conditions VDD Input High Voltage, ICLK VIH Note 1 Input Low Voltage, ICLK VIL Note 1 Input High Voltage, OE VIH Input Low Voltage, OE VIL Output High Voltage VOH IOH = -35 mA Output Low Voltage VOL IOL = 35 mA Output High Voltage (CMOS Level) VOH IOH = -12 mA Operating Supply Current IDD No load, 135 MHz Nominal Output Impedance ZO Input Capacitance CIN Short Circuit Current IOS Min. Typ. Max. Units 4.75 5.25 V VDD/2+1 5.5 V VDD/2-1 V VDD V 0.8 V 2 ICLK, OE pin 2.4 V 0.4 VDD-0.4 V V 45 mA 20 Ω 5 pF ±80 mA Notes: 1. Nominal switching threshold is VDD/2 IDT® LOW SKEW 1 TO 4 CLOCK BUFFER 4 ICS553 REV N 051310 ICS553 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER AC Electrical Characteristics VDD = 2.5 V ±5%, Ambient Temperature -40 to +85° C, unless stated otherwise Parameter Symbol Conditions Input Frequency Min. Typ. 0 Max. Units 200 MHz Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 1.0 1.5 ns Output Fall Time tOF 2.0 to 0.8 V, CL=15 pF 1.0 1.5 ns 3 5 ns 1 ps 50 ps 500 ps Propagation Delay Note 1 2.2 Additive Period Jitter Output to Output Skew Note 2 Device to Device Skew Rising edges at VDD/2 0 Rising edges at VDD/2 VDD = 3.3 V ±5%, Ambient Temperature -40 to +85° C, unless stated otherwise Parameter Symbol Conditions Input Frequency Min. Typ. 0 Max. Units 200 MHz Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 0.6 1.0 ns Output Fall Time tOF 2.0 to 0.8 V, CL=15 pF 0.6 1.0 ns 2.4 4 ns 1 ps 50 ps 500 ps Propagation Delay Note 1 2.0 Additive Period Jitter Output to Output Skew Note 2 Device to Device Skew Rising edges at VDD/2 0 Rising edges at VDD/2 VDD = 5 V ±5%, Ambient Temperature -40 to +85° C, unless stated otherwise Parameter Symbol Conditions Input Frequency Min. Typ. 0 Max. Units 200 MHz Output Rise Time tOR 0.8 to 2.0 V, CL=15 pF 0.3 0.7 ns Output Fall Time tOF 2.0 to 0.8 V, CL=15 pF 0.3 0.7 ns 2.5 4 ns 1 ps 50 ps 500 ps Propagation Delay Note 1 1.8 Additive Period Jitter Output to Output Skew Device to Device Skew Note 2 Rising edges at VDD/2 Rising edges at VDD/2 0 Notes: 1. With rail to rail input clock 2. Between any 2 outputs with equal loading. 3. Duty cycle on outputs will match incoming clock duty cycle. Consult IDT for tight duty cycle clock generators. IDT® LOW SKEW 1 TO 4 CLOCK BUFFER 5 ICS553 REV N 051310 ICS553 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Thermal Characteristics Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θJA Still air 150 ° C/W θJA 1 m/s air flow 140 ° C/W θJA 3 m/s air flow 120 ° C/W Thermal Resistance Junction to Case θJC 40 ° C/W Marking Diagrams 8 5 8 553MILF LOT YYWW 553MLF LOT YYWW 1 5 4 1 4 Notes: 1. “LOT” is the lot number. 2. YYWW is the last two digits of the year and week that the part was assembled. 3 “LF” denotes RoHS compliant package. 4. “I” denotes industrial temperature range device. 5. Bottom marking: country of origin. IDT® LOW SKEW 1 TO 4 CLOCK BUFFER 6 ICS553 REV N 051310 ICS553 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 8 E H INDEX AREA Symbol Min Max Min Max A 1.35 1.75 .0532 .0688 A1 0.10 0.25 .0040 .0098 B 0.33 0.51 .013 .020 C 0.19 0.25 .0075 .0098 D 4.80 5.00 .1890 .1968 E 3.80 4.00 .1497 .1574 e 1 2 D Inches* 1.27 BASIC 0.050 BASIC H 5.80 6.20 .2284 .2440 h 0.25 0.50 .010 .020 L 0.40 1.27 .016 .050 α 0° 8° 0° 8° *For reference only. Controlling dimensions in mm. A h x 45 A1 C -Ce SEATING PLANE B L .10 (.004) C Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature 553MLF 553MLFT 553MILF 553MILFT 553MLF 553MLF 553MILF 553MILF Tubes Tape and Reel Tubes Tape and Reel 8-pin SOIC 8-pin SOIC 8-pin SOIC 8-pin SOIC 0 to +70° C 0 to +70° C -40 to +85 ° C -40 to +85 ° C "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. IDT® LOW SKEW 1 TO 4 CLOCK BUFFER 7 ICS553 REV N 051310 ICS553 LOW SKEW 1 TO 4 CLOCK BUFFER FAN OUT BUFFER Innovate with IDT and accelerate your future networks. Contact: www.IDT.com For Sales For Tech Support 800-345-7015 408-284-8200 Fax: 408-284-2775 www.idt.com/go/clockhelp Corporate Headquarters Integrated Device Technology, Inc. www.idt.com © 2012 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. IDT and the IDT logo are trademarks of Integrated Device Technology, Inc. Accelerated Thinking is a service mark of Integrated Device Technology, Inc. All other brands, product names and marks are or may be trademarks or registered trademarks used to identify products or services of their respective owners. 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