DATASHEET
IDT5V41065
2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Recommended Applications
Features/Benefits
2 Output synthesizer for PCIe Gen1/2 and Ethernet
• 16-pin TSSOP and QFN packages; small board footprint
• Spread-spectrum capable; reduces EMI
• Outputs can be terminated to LVDS; can drive a wider
General Description
variety of devices
The IDT5V41065 is a PCIe Gen2 compliant spread
spectrum capable clock generator. The device has 2
differential HCSL outputs and can be used in
communication or embedded systems to substantially
reduce electro-magnetic interference (EMI). The spread
amount and output frequency are selectable via select pins.
The IDT5V41065 can also supply 25 MHz, 125 MHz and
200 MHz outputs for applications such as Ethernet.
• 25 MHz, 125 MHz and 200 MHz output frequencies;
TSSOP only
• 100MHz and 200MHz output frequencies; VFQFPN
package
• OE control pin; greater system power management
• Spread% and frequency pin selection; no software
required to configure device
Output Features
• Industrial temperature range available; supports
• 2 - 0.7V current mode differential HCSL output pairs
• For PCIe Gen3 applications, see the 5V41235
demanding embedded applications
Key Specifications
• Cycle-to-cycle jitter < 100 ps
• Output-to-output skew < 50 ps
• PCIe Gen2 phase jitter < 3.0ps RMS
Block Diagram
VDD
2
SS1:SS0
2
S1:S0
CLK0
Control
Logic
2
X1/ICLK
25 MHz
crystal or clock X2
Optional tuning crystal
capacitors
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
CLK0
Phase Lock Loop
CLK1
Clock
Buffer/
Crystal
Oscillator
CLK1
2
GND
1
Rr(IREF)
OE
IDT5V41065
APRIL 17, 2017
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
CLK0
SS0
3
14
CLK0
CLK0#
15
16 15 14 13
S1
SS0
X1/CLK
X2
1
2
3
4
X1/ICLK
4
13
GNDODA
X2
5
12
VDDODA
OE
6
11
CLK1
5
GNDXD
7
10
CLK1
SS1
8
9
IREF
12
11
10
9
5V41065
6
7
GNDODA
VDDODA
CLK1
CLK1#
8
IREF
2
CLK0
S1
SS1
VDDXD
VDDXD
16
GNDXD
1
OE
S0
S0
Pin Assignment
16-pin VFQFPN
16-pin (173 mil) TSSOP
Output Select Table 1 (MHz)–TSSOP only
Output/Spread Select Table 3 - VFQFPN Only
S1
S0
CLK(1:0), CLK(1:0)
S1
S0
SS1
SS0
Output
Spread%
0
0
25M
0
0
0
0
100MHz
-0.5
0
1
100M
0
0
0
1
200MHz
-0.5
0
1
0
100MHz
No spread
1
0
125M
0
1
1
200M
0
0
1
1
0
1
0
0
100MHz
-1
0
1
0
1
200MHz
-1
1
1
0
Reserved
Reserved
Spread Selection Table 2–TSSOP only
Reserved
SS1
SS0
Spread%
0
0
0
No Spread
0
1
1
1
0
1
Down -0.5
1
0
0
0
100MHz
-1.5
1
0
Down -0.75
1
0
0
1
200MHz
-1.5
No Spread
1
0
1
0
Reserved
1
0
1
1
Reserved
1
1
0
0
Reserved
1
1
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
2
1
1
0
1
1
1
1
0
200MHz
Reserved
1
1
1
1
Reserved
IDT5V41065
No spread
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IDT5V41065
2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Pin Descriptions
VFQFPN TSSOP
Pin
Pin
Number Number
Pin
Name
Pin
Type
Pin Description
16
1
S0
Input
Select pin 0. See Table1. Internal pull-up resistor.
1
2
S1
Input
Select pin 1. See Table 1. Internal pull-up resistor.
2
3
SS0
Input
Spread Select pin 0. See Table 2. Internal pull-up resistor.
3
4
X1/ICLK
Input
Crystal or clock input. Connect to a 25 MHz crystal or single ended clock.
4
5
X2
5
6
OE
Input
6
7
GNDXD
Power
7
8
SS1
Input
8
9
IREF
Output Precision resistor attached to this pin is connected to the internal current
reference.
9
10
CLK1
Output HCSL complementary clock output 1.
Output HCSL true clock output 1.
Output Crystal connection. Leave unconnected for clock input.
Output enable. Tri-states outputs and device is not shut down. Internal
pull-up resistor.
Connect to ground.
Spread Select pin 1. See Table 2. Internal pull-up resistor.
10
11
CLK1
11
12
VDDODA
Power
Connect to voltage supply +3.3 V for output driver and analog circuits
12
13
GNDODA
Power
Connect to ground.
13
14
CLK0
Output HCSL complementary clock output 0.
Output HCSL true clock output 0.
14
15
CLK0
15
16
VDDXD
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Power
Connect to voltage supply +3.3 V for crystal oscillator and digital circuit.
3
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Applications Information
Output Structures
External Components
A minimum number of external components are required for
proper operation.
IREF
=2.3 mA
6*IREF
Decoupling Capacitors
Decoupling capacitors of 0.01F should be connected
between each VDD pin and the ground plane, as close to
the VDD pin as possible. Do not share ground vias between
components. Route power from power source through the
capacitor pad and then into ICS pin.
Crystal
A 25 MHz fundamental mode parallel resonant crystal
should be used. This crystal must have less than 300 ppm
of error across temperature in order for the IDT5V41065 to
meet PCI Express specifications.
R R 475
See Output Termination
Sections - Pages 3 ~ 5
Crystal Capacitors
General PCB Layout Recommendations
Crystal capacitors are connected from pins X1 to ground
and X2 to ground to optimize the accuracy of the output
frequency.
For optimum device performance and lowest output phase
noise, the following guidelines should be observed.
1. Each 0.01µF decoupling capacitor should be mounted on
the component side of the board as close to the VDD pin as
possible.
CL= Crystal’s load capacitance in pF
Crystal Capacitors (pF) = (CL- 8) * 2
2. No vias should be used between decoupling capacitor
and VDD pin.
For example, for a crystal with a 16 pF load cap, each
external crystal cap would be 16 pF. (16-8)*2=16.
3. The PCB trace to VDD pin should be kept as short as
possible, as should the PCB trace to the ground via.
Distance of the ferrite bead and bulk decoupling from the
device is less critical.
Current Source (Iref) Reference Resistor - RR
If board target trace impedance (Z) is 50, then RR = 475
(1%), providing IREF of 2.32 mA. The output current (IOH) is
equal to 6*IREF.
4. An optimum layout is one with all components on the
same side of the board, minimizing vias through other signal
layers (any ferrite beads and bulk decoupling capacitors can
be mounted on the back). Other signal traces should be
routed away from the IDT5V41065.This includes signal
traces just underneath the device, or on layers adjacent to
the ground plane layer used by the device.
Output Termination
The PCI-Express differential clock outputs of the
IDT5V41065 are open source drivers and require an
external series resistor and a resistor to ground. These
resistor values and their allowable locations are shown in
detail in the PCI-Express Layout Guidelines section.
The IDT5V41065 can also be configured for LVDS
compatible voltage levels. See the LVDS Compatible
Layout Guidelines section.
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Layout Guidelines
SRC Reference Clock
Common Recommendations for Differential Routing
L1 length, route as non-coupled 50ohm trace
L2 length, route as non-coupled 50ohm trace
L3 length, route as non-coupled 50ohm trace
Rs
Rt
D imension or Value
0.5 max
0.2 max
0.2 max
33
49.9
Unit
inch
inch
inch
ohm
ohm
Figure
1
1
1
1
1
Down Device Differential Routing
L4 length, route as coupled microstrip 100ohm differential trace
L4 length, route as coupled stripline 100ohm differential trace
2 min to 16 max
1.8 min to 14.4 max
inch
inch
1
1
Differential Routing to PCI Express Connector
L4 length, route as coupled microstrip 100ohm differential trace
L4 length, route as coupled stripline 100ohm differential trace
0.25 to 14 max
0.225 min to 12.6 max
inch
inch
2
2
Figure 1: Down Device Routing
L2
L1
Rs
L4
L4'
L2'
L1'
Rs
Rt
HCSL Output Buffer
Rt
L3'
PCI Express
Down Device
REF_CLK Input
L3
Figure 2: PCI Express Connector Routing
L2
L1
Rs
L4
L4'
L2'
L1'
Rs
Rt
HCSL Output Buffer
Rt
L3'
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
5
PCI Express
Add-in Board
REF_CLK Input
L3
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Alternative Termination for LVDS and other Common Differential Signals (figure 3)
Vdiff
Vp-p
Vcm
R1
R2
R3
R4
Note
0.45v
0.22v
1.08
33
150
100
100
0.58
0.28
0.6
33
78.7
137
100
0.80
0.40
0.6
33
78.7
none
100
ICS874003i-02 input compatible
0.60
0.3
1.2
33
174
140
100
Standard LVDS
R1a = R1b = R1
R2a = R2b = R2
Figure 3
L2
L1
R3
R1a
R4
L4
L4'
L2'
L1'
R1b
R2a
HCSL Output Buffer
R2b
L3'
Down Device
REF_CLK Input
L3
Cable Connected AC Coupled Application (figure 4)
Component
Value
Note
R5a, R5b
8.2K 5%
R6a, R6b
1K 5%
Cc
0.1 µF
Vcm
0.350 volts
Figure 4
3.3 Volts
R5a
R5b
R6a
R6b
Cc
L4
L4'
Cc
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
6
PCIe Device
REF_CLK Input
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Typical PCI-Express (HCSL) Waveform
700 mV
0
tOR
500 ps
500 ps
0.525 V
0.175 V
tOF
0.525 V
0.175 V
Typical LVDS Waveform
1325 mV
1000 mV
tOR
500 ps
500 ps
1250 mV
1150 mV
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
tOF
1250 mV
1150 mV
7
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the IDT5V41065. These ratings are stress ratings
only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of
the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product
reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.
Item
Rating
Supply Voltage, VDDXD, VDDODA
4.6 V
All Inputs and Outputs
-0.5 V to VDD+0.5 V
Ambient Operating Temperature (commercial)
0 to +70C
Ambient Operating Temperature (industrial)
-40 to +85C
Storage Temperature
-65 to +150C
Junction Temperature
125C
Soldering Temperature
260C
ESD Protection (Input)
2000 V min. (HBM)
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±5%, Ambient Temperature -40 to +85C
Parameter
Symbol
Supply Voltage
Conditions
V
Input High Voltage
1
Min.
Typ.
Max.
Units
3.135
3.3
3.465
V
VIH
S0, S1, OE, ICLK, SS0, SS1
2.2
VDD +0.3
V
VIL
S0, S1, OE, ICLK, SS0, SS1
VSS-0.3
0.8
V
Input Leakage Current
IIL
0 < Vin < VDD
5
A
Operating Supply Current
@100 MHz
IDD
RS=33RP=50, CL=2 pF
63
85
mA
OE =Low
42
50
mA
7
pF
Input Low Voltage
1
2
Input Capacitance
IDDOE
CIN
-5
Input pin capacitance
Output Capacitance
COUT
6
pF
X1, X2 Capacitance
CINX
5
pF
Pin Inductance
LPIN
5
nH
Output Impedance
Pull-up Resistor
ZO
RPU
Output pin capacitance
CLK outputs
3.0
S0, S1, OE, SS0, SS1
k
100
k
1. Single edge is monotonic when transitioning through region.
2. Inputs with pull-ups/-downs are not included.
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
AC Electrical Characteristics - CLK0/CLK1, CLK0/CLK1
Unless stated otherwise, VDD=3.3 V ±5%, Ambient Temperature -40 to +85C
Parameter
Symbol
Conditions
Min.
Typ.
Input Frequency
25
200
MHz
LVDS termination
25
100
MHz
850
mV
VOH
HCSL
Voltage1,2
VOL
HCSL
-150
Absolute
250
Voltage1,2
Crossing Point Voltage1,2,4
mV
Variation over all edges
Jitter, Cycle-to-Cycle1,3
Frequency Synthesis Error
All outputs
Modulation Frequency
Rise Time1,2
Fall
Time1,2
Rise/Fall Time
MHz
HCSL termination
Output High Voltage1,2
Crossing Point
Units
25
Output Frequency
Output Low
Max.
550
mV
140
mV
100
ps
0
32.9
ppm
Spread spectrum
30
33
kHz
tOR
From 0.175 V to 0.525 V
175
700
ps
tOF
From 0.525 V to 0.175 V
175
700
ps
125
ps
Variation1,2
Output to Output Skew
Duty Cycle1,3
45
50
ps
55
%
Output Enable
Time5
All outputs
50
100
ns
Output Disable
Time5
All outputs
50
100
ns
Stabilization Time
tSTABLE
From power-up VDD=3.3 V
Spread Spectrum Transition
Time
tSPREAD
Stabilization time after spread
spectrum changes
7
1.8
ms
30
ms
Note 1: Test setup is RS=33RP=50 with CL=2 pF, Rr = 475 (1%).
Note 2: Measurement taken from a single-ended waveform.
Note 3: Measurement taken from a differential waveform.
Note 4: Measured at the crossing point where instantaneous voltages of both CLK and CLK are equal.
Note 5: CLK pins are tri-stated when OE is low asserted. CLK is driven differential when OE is high.
Electrical Characteristics - Differential Phase Jitter
Parameter
Jitter, Phase
Symbol
Conditions
Min
Typ
Max
Units
Notes
tjphasePLL
PCIe Gen1
32
86
ps (p-p)
1,2,3
tjphaseLO
PCIe Gen2, 10 kHz < f < 1.5 MHz
0.8
3
ps (RMS)
1,2,3
PCIe Gen2, 1.5 MHz < f < Nyquist (50 MHz)
2.3
3.1
ps (RMS)
1,2,3
tjphaseHIGH
Note 1. Guaranteed by design and characterization, not 100% tested in production.
Note 2. See http://www.pcisig.com for complete specs.
Note 3: Applies to 100MHz, spread off and 0.5% down spread only.
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Thermal Characteristics (16TSSOP)
Parameter
Thermal Resistance Junction to
Ambient
Symbol
JA
JA
JA
Thermal Resistance Junction to Case
Conditions
Min.
Still air
1 m/s air flow
3 m/s air flow
JC
Typ.
Max. Units
78
C/W
70
C/W
68
C/W
37
C/W
Thermal Characteristics(16VFQFPN)
Parameter
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Symbol
Conditions
Min.
Typ.
Max. Units
JA
Still air
63.2
C/W
JA
1 m/s air flow
55.9
C/W
JA
3 m/s air flow
51.4
C/W
65.8
C/W
JC
10
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Marking Diagram (5V41065PGG)
16
Marking Diagram (5V41065PGGI)
16
9
IDT5V410
65PGGI
YYWW$
IDT5V410
65PGG
YYWW$
1
9
1
8
8
Notes:
1. Line 1 and 2: IDT part number.
2. Line 3: YYWW – Date code; $ – Assembly location.
3. “G” after the two-letter package code designates RoHS compliant package.
4. “I” at the end of part number indicates industrial temperature range.
5. Bottom marking: country of origin if not USA.
Marking Diagram (5V41065NLGI)
Marking Diagram (5V41065NLGI)
XXX
YWW$
065G
XXX
YWW$
065GI
Notes:
1. Line 1: Lot number.
2. Line 2: YWW – Date code; $ – Assembly location.
3. “G” designates RoHS compliant package.
4. “I” at the end of part number indicates industrial temperature range.
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
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Package Outline and Package Dimensions (16-pin QFN)
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
IDT5V41065
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
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Package Outline and Package Dimensions (16-pin QFN), cont.
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
IDT5V41065
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
14
Package Outline and Package Dimensions (16-pin TSSOP)
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
IDT5V41065
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
15
Package Outline and Package Dimensions (16-pin TSSOP), cont.
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
IDT5V41065
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2 OUTPUT PCIE GEN1/2 SYNTHESIZER
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Package Outline and Package Dimensions (16-pin TSSOP), cont.
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
IDT5V41065
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IDT5V41065
2 OUTPUT PCIE GEN1/2 SYNTHESIZER
Ordering Information
Part / Order Number
Marking
5V41065PGG
See Page 11
Shipping Packaging
Package
Temperature
Tubes
16-pin TSSOP
0 to +70 C
5V41065PGG8
Tape and Reel
16-pin TSSOP
0 to +70 C
5V41065PGGI
Tubes
16-pin TSSOP
-40 to +85 C
5V41065PGGI8
Tape and Reel
16-pin TSSOP
-40 to +85 C
Trays
16-pin QFN
0 to +70 C
5V41065NLG8
5V41065NLG
See Page 11
Tape and Reel
16-pin QFN
0 to +70 C
5V41065NLGI
Trays
16-pin QFN
-40 to +85 C
5V41065NLGI8
Tape and Reel
16-pin QFN
-40 to +85 C
“G” after the two-letter package code are the Pb-Free configuration, RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes
no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No
other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications
such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not
recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT
does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.
Revision History
Rev.
Originator
A
Date
Description of Change
07/15/08
New datasheet; Preliminary initial release.
B
RDW
01/13/10
Added Gen2 to title; update Electrical tables per char; added Differential Phase Jitter table.
C
RDW
04/27/10
Updated electrical tables per char; VDD is now 3.3 ±5%; released to final.
D
RDW
07/19/10
1. Updated title and general description
2. Updated cycle-to-cycle jitter spec from 125 to 100 ps.
E
RDW
11/21/11
1. Changed title to “2 Output PCIe GEN1/2 Synthesizer”
2. Added note to Features section: “For PCIe Gen3 applications, see 5V41235”
3. Updated Differential Phase Jitter table.
F
J, Chao
08/26/13
1. Added 16VFQFPN notes in Features section
2. Added pinout and “Output/Spread Selection” table for 16VFQFPN.
3. Updated Pin Description table to include VFQFPN pin descriptions.
4. Added Thermal Characteristics table for 16VFQFPN.
5. Added marking diagrams for 16VFQFPN.
6. Added Package Dimensions/Drawing for 16VFQFPN.
7. Updated Ordering Information to include 16VFQFPN.
G
C.P.
04/17/17
1. Replaced package outline drawings with latest NLG16 and PGG16 drawings.
2. Updated legal disclaimer.
IDT® 2 OUTPUT PCIE GEN1/2 SYNTHESIZER
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(Rev.1.0 Mar 2020)
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