709379
*709369
HIGH-SPEED 32/16K x 18
SYNCHRONOUS PIPELINED
DUAL-PORT STATIC RAM
*SPECIFIED PART IS OBSOLETE NOT RECOMMENDED FOR NEW DESIGNS
Features
◆
◆
◆
◆
◆
◆
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed clock to data access
– Commercial: 7.5/9/12ns (max.)
– Insustrial: 9ns (max.)
Low-power operation
– IDT709379/69L
Active: 1.2W (typ.)
Standby: 2.5mW (typ.)
Flow-Through or Pipelined output mode on either Port via
the FT/PIPE pins
Counter enable and reset features
Dual chip enables allow for depth expansion without
additional logic
◆
◆
◆
◆
◆
◆
Full synchronous operation on both ports
– 4ns setup to clock and 0ns hold on all control, data, and
address inputs
– Data input, address, and control registers
– Fast 7.5ns clock to data out in the Pipelined output mode
– Self-timed write allows fast cycle time
– 10ns cycle time, 100MHz operation in Pipelined output mode
Separate upper-byte and lower-byte controls for
multiplexed bus and bus matching compatibility
TTL- compatible, single 5V (±10%) power supply
Industrial temperature range (–40°C to +85°C) is
available for selected speeds
Available in a 100-pin Thin Quad Flatpack (TQFP) package
Green parts available, see ordering information
Note that information regarding recently obsoleted parts is included in this datasheet for customer convenience.
Functional Block Diagram
R/WL
R/WR
UBL
UBR
CE0L
1
0
0/1
CE1L
CE0R
1
0
0/1
CE1R
LBL
OEL
LBR
OER
FT/PIPEL
0/1
1b 0b
b a
0a 1a
1a 0a
I/O9L-I/O17L
a
0b 1b
b
0/1
FT/PIPER
I/O9R-I/O17R
I/O
Control
I/O
Control
I/O0L-I/O8L
I/O0R-I/O8R
A14L(1)
A0L
CLKL
ADSL
CNTENL
CNTRSTL
A14R(1)
Counter/
Address
Reg.
MEMORY
ARRAY
Counter/
Address
Reg.
A0R
CLKR
ADSR
CNTENR
CNTRSTR
4845 drw 01
NOTE:
1. A14X is a NC for IDT709369.
FEBRUARY 2018
1
©2018 Integrated Device Technology, Inc.
DSC-4845/8
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Description
The IDT709379/69 is a high-speed 32/16K x 18 bit synchronous
Dual-Port RAM. The memory array utilizes Dual-Port memory cells to
allow simultaneous access of any address from both ports. Registers on
control, data, and address inputs provide minimal setup and hold
times. The timing latitude provided by this approach allows systems
to be designed with very short cycle times.
Industrial and Commercial Temperature Ranges
With an input data register, the IDT709379/69 has been optimized for
applications having unidirectional or bidirectional data flow in bursts.
An automatic power down feature, controlled by CE0 and CE1, permits
the on-chip circuitry of each port to enter a very low standby power
mode. Fabricated using CMOS high-performance technology, these
devices typically operate on only 1.2W of power.
A8L
A7L
A6L
A5L
A4L
A3L
A2L
A1L
A0L
CNTEN L
CLKL
ADSL
GND
GND
ADSR
CLKR
CNTEN R
A0R
A1R
A2R
A3R
A4R
A5R
A6R
A 7R
Pin Configurations(1,2,3)
INDEX
A9L
A10L
A11L
A12L
A13L
4
72
5
71
6
70
7
69
8
68
9
67
10
11
12
709379/69PF
PN100(5)
13
14
15
66
65
64
63
100-Pin TQFP
Top View(6)
62
61
16
60
17
59
18
58
19
57
20
56
21
55
22
54
23
53
24
52
51
25
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
I/O 9L
I/O 8L
VCC
I/O 7L
I/O 6L
I/O 5L
I/O 4L
I/O 3L
I/O 2L
GND
I/O1 L
I/O 0L
GND
I/O 0R
I/O 1R
I/O 2R
I/O 3R
I/O 4R
I/O 5R
I/O 6R
V CC
I/O 7R
I/O 8R
I/O 9R
I/O 10R
A14L(1)
NC
LBL
UBL
CE0L
CE1L
CNTRSTL
R/WL
OEL
VCC
FT/PIPEL
I/O17L
I/O16L
GND
I/O15L
I/O14L
I/O13L
I/O12L
I/O11L
I/O10L
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
1
75
2
74
3
73
NOTES:
1. A14x is a NC for IDT709369.
2. All VCC pins must be connected to power supply.
3. All GND pins must be connected to ground.
4. Package body is approximately 14mm x 14mm x 1.4mm
5. This package code is used to reference the package diagram.
6. This text does not indicate orientation of the actual part-marking.
2
6.42
A8R
A9R
A10R
A11R
A12R
A13R
A14R(1)
NC
LBR
UBR
CE0R
CE1R
CNTRSTR
R/WR
GND
OER
.
FT/PIPER
I/O17R
GND
I/O16R
I/O15R
I/O14R
I/O13R
I/O12R
I/O11R
4845 drw 02
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Pin Names
Left Port
Right Port
Names
CE0L, CE1L
CE0R, CE1R
Chip Enables (3)
R/WL
R/WR
Read/Write Enable
OEL
Output Enable
OER
(1)
(1)
A0L - A14L
A0R - A14R
Address
I/O0L - I/O17L
I/O0R - I/O17R
Data Input/Output
CLKL
CLKR
Clock
UBL
UBR
Upper Byte Select(2)
LBL
LBR
Lower Byte Selectt(2)
ADSL
ADSR
Address Strobe
CNTENL
CNTENR
Counter Enable
CNTRSTL
CNTRSTR
Counter Reset
FT/PIPEL
FT/PIPER
Flow-Through/Pipeline
VCC
Power
GND
Ground
NOTES:
1. A14x is a NC for IDT709369.
2. LB and UB are single buffered regardless of state of FT/PIPE.
3. CEo and CE1 are single buffered when FT/PIPE = VIL,
CEo and CE1 are double buffered when FT/PIPE = VIH,
i.e. the signals take two cycles to deselect.
4845 tbl 01
Truth Table I—Read/Write and Enable Control(1,2,3)
OE
CLK
CE0
CE1
UB
LB
R/W
Upper Byte
I/O9-17
Lower Byte
I/O0-8
X
↑
H
X
X
X
X
High-Z
High-Z
Deselected—Power Down
X
↑
X
L
X
X
X
High-Z
High-Z
Deselected—Power Down
X
↑
L
H
H
H
X
High-Z
High-Z
Both Bytes Deselected
X
↑
L
H
L
H
L
DATAIN
High-Z
Write to Upper Byte Only
X
↑
L
H
H
L
L
High-Z
DATAIN
Write to Lower Byte Only
X
↑
L
H
L
L
L
DATAIN
DATAIN
Write to Both Bytes
L
↑
L
H
L
H
H
DATAOUT
High-Z
Read Upper Byte Only
L
↑
L
H
H
L
H
High-Z
DATAOUT
Read Lower Byte Only
L
↑
L
H
L
L
H
DATAOUT
DATAOUT
Read Both Bytes
H
X
L
H
L
L
X
High-Z
High-Z
Outputs Disabled
Mode
4845 tbl 02
NOTES:
1. "H" = VIH, "L" = VIL, "X" = Don't Care.
2. ADS, CNTEN, CNTRST = X.
3. OE is an asynchronous input signal.
3
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Truth Table II—Address Counter Control(1,2,6)
External
Address
Previous
Internal
Address
Internal
Address
Used
CLK
An
X
An
↑
ADS
CNTEN
CNTRST
I/O(3)
X
H
DI/O (n)
L(4)
MODE
External Address Used
X
An
An + 1
↑
H
L
H
DI/O(n+1)
Counter Enabled—Internal Address generation
X
An + 1
An + 1
↑
H
H
H
DI/O(n+1)
External Address Blocked—Counter disabled (An + 1 reused)
X
X
A0
↑
X
X
L(4)
DI/O(0)
(5)
Counter Reset to Address 0
4845 tbl 03
NOTES:
1. "H" = VIH, "L" = VIL, "X" = Don't Care.
2. CE0, LB, UB, and OE = VIL; CE1 and R/W = VIH.
3. Outputs configured in Flow-Through Output mode: if outputs are in Pipelined mode the data out will be delayed by one cycle.
4. ADS is independent of all other signals including CE0, CE1, UB and LB.
5. The address counter advances if CNTEN = VIL on the rising edge of CLK, regardless of all other signals including CE0, CE1, UB and LB.
6. While an external address is being loaded (ADS = VIL), R/W = VIH is recommended to ensure data is not written arbitrarily.
Recommended Operating
Temperature and Supply Voltage
Grade
Commercial
Industrial
Recommended DC Operating
Conditions
Symbol
Ambient
Temperature(2)
GND
VCC
0OC to +70OC
0V
5.0V + 10%
-40OC to +85OC
0V
5.0V + 10%
NOTES:
1. This is the parameter TA. This is the "instant on" case temperature.
Parameter
VCC
Supply Voltage
GND
Ground
Min.
Typ.
Max.
Unit
4.5
5.0
5.5
V
0
0
0
V
VIH
Input High Voltage
2.2
____
VIL
Input Low Voltage
-0.5(2)
____
4845 tbl 04
(1)
6.0
0.8
V
V
4845 tbl 05
NOTES:
1. VTERM must not exceed VCC + 10%.
2. VIL > -1.5V for pulse width less than 10ns.
Capacitance(1)
Absolute Maximum Ratings(1)
Symbol
Commercial
& Industrial
Unit
Terminal Voltage
with Respect
to GND
-0.5 to +7.0
V
TBIAS
Temperature Under Bias
TSTG
VTERM
(2)
Rating
(TA = +25°C, f = 1.0MHz)
Symbol
CIN
Input Capacitance
(3)
COUT
-55 to +125
o
C
Storage Temperature
-65 to +150
o
C
TJN
Junction Temperature
+150
o
C
IOUT
DC Output Current
50
mA
Parameter
Output Capacitance
Conditions(2)
Max.
Unit
VIN = 3dV
9
pF
VOUT = 3dV
10
pF
4845 tbl 07
NOTES:
1. These parameters are determined by device characterization, but are not
production tested.
2. 3dV references the interpolated capacitance when the input and output switch from
0V to 3V or from 3V to 0V.
3. COUT also references CI/O.
4845 tbl 06
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
2. VTERM must not exceed VCC + 10% for more than 25% of the cycle time or 10ns
maximum, and is limited to < 20mA for the period of VTERM > VCC + 10%.
3. Ambient Temperature Under Bias. No AC Conditions. Chip Deselected.
4
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
DC Electrical Characteristics Over the Operating
Temperature Supply Voltage Range (VCC = 5.0V ± 10%)
709379/69L
Symbol
Parameter
Test Conditions
(1)
Min.
Max.
Unit
5
µA
|ILI|
Input Leakage Current
VCC = 5.5V, VIN = 0V to VCC
___
|ILO|
Output Leakage Current
CE0 = VIH or CE1 = VIL, VOUT = 0V to VCC
___
5
µA
VOL
Output Low Voltage
IOL = +4mA
___
0.4
V
VOH
Output High Voltage
IOH = -4mA
2.4
___
V
4845 tbl 08
NOTE:
1. At Vcc < 2.0V input leakages are undefined.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(3) (VCC = 5V ± 10%)
709379/69L7
Com'l Only
Symbol
ICC
ISB1
ISB2
ISB3
ISB4
Parameter
Test Condition
Version
709379/69L9
Com'l
& Ind
709379/69L12
Com'l Only
Typ.(4)
Max.
Typ.(4)
Max.
Typ.(4)
Max.
Unit
mA
Dynamic Operating
Current
(Both Ports Active)
CEL and CER= V IL
Outputs Disabled
f = fMAX(1)
COM'L
L
250
440
250
400
230
355
IND
L
____
____
300
430
____
____
Standby Current
(Both Ports - TTL
Level Inputs)
CEL = CER = V IH
f = fMAX(1)
COM'L
L
65
145
80
135
70
110
IND
L
____
____
95
160
____
____
Standby Current
(One Port - TTL
Level Inputs)
CE"A" = V IL and
CE"B" = V IH(3)
Active Port Outputs
Disabled, f=fMAX(1)
COM'L
L
160
295
175
275
150
240
IND
L
____
____
175
295
____
____
Full Standby Current
(Both Ports CMOS Level Inputs)
Both Ports CER and
CEL > V CC - 0.2V
V IN > V CC - 0.2V or
V IN < 0.2V, f = 0(2)
COM'L
L
0.2
5.0
0.5
3.0
0.5
3.0
IND
L
____
____
0.5
6.0
____
____
Full Standby Current
(One Port CMOS Level Inputs)
CE"A" < 0.2V and
CE"B" > V CC - 0.2V (5)
V IN > V CC - 0.2V or
V IN < 0.2V, Active Port
Outputs Disabled, f = fMAX(1)
COM'L
L
150
290
170
270
140
225
IND
L
____
____
190
290
____
____
mA
mA
mA
mA
4845 tbl 09
NOTES:
1. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency clock cycle of 1/tCYC, using "AC TEST CONDITIONS" at input levels of
GND to 3V.
2. f = 0 means no address, clock, or control lines change. Applies only to input at CMOS level standby.
3. Port "A" may be either left or right port. Port "B" is the opposite from port "A".
4. VCC = 5V, TA = 25°C for Typ, and are not production tested. ICC DC(f=0) = 150mA (Typ).
5. CEX = VIL means CE0X = VIL and CE1X = VIH
CEX = VIH means CE0X = VIH or CE1X = VIL
CEX < 0.2V means CE0X < 0.2V and CE1X > VCC - 0.2V
CEX > VCC - 0.2V means CE0X > VCC - 0.2V or CE1X < 0.2V
"X" represents "L" for left port or "R" for right port.
5
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
AC Test Conditions
Input Pulse Levels
GND to 3.0V
Input Rise/Fall Times
3ns Max.
Input Timing Reference Levels
1.5V
Output Reference Levels
1.5V
Output Load
Figures 1,2 and 3
4845 tbl 10
5V
5V
893Ω
893Ω
DATAOUT
DATAOUT
30pF
347Ω
4845 drw 04
4845 drw 05
Figure 1. AC Output Test load.
8
7
Figure 2. Output Test Load
(For tCKLZ, tCKHZ, tOLZ, and tOHZ).
*Including scope and jig.
10pF is the I/O capacitance
of this device, and 30pF is the
AC Test Load Capacitance
6
tCD1,
tCD2
(Typical, ns)
5
4
3
2
1
0
-1
5pF*
347Ω
20 40 60 80 100 120 140 160 180 200
Capacitance (pF)
4845 drw 06
Figure 3. Typical Output Derating (Lumped Capacitive Load).
6
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the Operating Temperature Range
(Read and Write Cycle Timing)(3) (VCC = 5V ± 10%)
709379/69L7
Com'l Only
Symbol
tCYC1
Parameter
Clock Cycle Time (Flow-Through)(2)
(2)
709379/69L9
Com'l
& Ind
709379/69L12
Com'l Only
Min.
Max.
Min.
Max.
Min.
Max.
Unit
22
____
25
____
30
____
ns
ns
tCYC2
Clock Cycle Time (Pipelined)
12
____
15
____
20
____
tCH1
Clock High Time (Flow-Through)(2)
7.5
____
12
____
12
____
ns
tCL1
(2)
ns
7.5
____
12
____
12
____
tCH2
Clock High Time (Pipelined)
(2)
5
____
6
____
8
____
ns
tCL2
Clock Low Time (Pipelined)(2)
5
____
6
____
8
____
ns
tR
Clock Rise Time
____
3
____
3
____
3
ns
tF
Clock Fall Time
____
3
____
3
____
3
ns
tSA
Address Setup Time
4
____
4
____
4
____
ns
tHA
Address Hold Time
0
____
1
____
1
____
ns
tSC
Chip Enable Setup Time
4
____
4
____
4
____
ns
tHC
Chip Enable Hold Time
0
____
1
____
1
____
ns
tSB
Byte Enable Setup Time
4
____
4
____
4
____
ns
tHB
Byte Enable Hold Time
0
____
1
____
1
____
ns
tSW
R/W Setup Time
4
____
4
____
4
____
ns
tHW
R/W Hold Time
0
____
1
____
1
____
ns
tSD
Input Data Setup Time
4
____
4
____
4
____
ns
tHD
Input Data Hold Time
0
____
1
____
1
____
ns
tSAD
ADS Setup Time
4
____
4
____
4
____
ns
ADS Hold Time
0
____
1
____
1
____
ns
CNTEN Setup Time
4
____
4
____
4
____
ns
CNTEN Hold Time
0
____
1
____
1
____
ns
ns
tHAD
tSCN
tHCN
Clock Low Time (Flow-Through)
CNTRST Setup Time
4
____
4
____
4
____
tHRST
CNTRST Hold Time
0
____
1
____
1
____
ns
tOE
Output Enable to Data Valid
____
7.5
____
9
____
12
ns
tOLZ
Output Enable to Output Low-Z
(1)
2
____
2
____
2
____
ns
tOHZ
Output Enable to Output High-Z(1)
1
7
1
7
1
7
ns
tCD1
Clock to Data Valid (Flow-Through)(2)
____
18
____
20
____
25
ns
____
7.5
____
9
____
12
ns
2
____
2
____
2
____
ns
tSRST
(2)
tCD2
Clock to Data Valid (Pipelined)
tDC
Data Output Hold After Clock High
tCKHZ
Clock High to Output High-Z
(1)
2
9
2
9
2
9
ns
tCKLZ
Clock High to Output Low-Z(1)
2
____
2
____
2
____
ns
Port-to-Port Delay
tCWDD
Write Port Clock High to Read Data Delay
____
28
____
35
____
40
ns
tCCS
Clock-to-Clock Setup Time
____
10
____
15
____
15
ns
4845 tbl 11
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). This parameter is guaranteed by device characterization, but is not production tested.
2. The Pipelined output parameters (tCYC2, tCD2) to either the Left or Right ports when FT/PIPE = VIH. Flow-Through parameters (tCYC1, tCD1) apply when FT/PIPE = VIL for
that port.
3. All input signals are synchronous with respect to the clock except for the asynchronous Output Enable (OE), FT/PIPER and FT/PIPEL.
7
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Timing Waveform of Read Cycle for
Flow-Through Output (FT/PIPE"X" = VIL)(3,7)
tCYC1
tCH1
tCL1
CLK
CE0
tSC
tSC
tHC
tHC
(4)
CE1
tSB
tHB
UB, LB
tHB
tSB
R/W
tSW
tHW
tSA
tHA
(5)
ADDRESS
An
An + 1
tCD1
tCKLZ
An + 3
tCKHZ (1)
Qn
DATAOUT
OE
An + 2
tDC
Qn + 1
(1)
tOHZ
Qn + 2
(1)
tOLZ
tDC
(1)
(2)
tOE
4845 drw 07
Timing Waveform of Read Cycle for Pipelined Operation
(FT/PIPE"X" = VIH)(3,7)
tCYC2
tCH2
tCL2
CLK
CE0
tSC
tSC
tHC
tHC
(4)
CE1
tSB
UB, LB
tSB
tHB
R/W
(5)
ADDRESS
tSW
tHW
tSA
tHA
An
An + 1
(1 Latency)
An + 2
Qn
tCKLZ
An + 3
tDC
tCD2
DATAOUT
OE
tHB
(6)
Qn + 1
(1)
tOHZ
Qn + 2
(1)
tOLZ
(6)
(1)
(2)
tOE
4845 drw 08
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
2. OE is asynchronously controlled; all other inputs are synchronous to the rising clock edge.
3. ADS = VIL and CNTRST = VIH.
4. The output is disabled (High-Impedance state) by CE0 = VIH, CE1 = VIL, UB = VIH, or LB = VIH following the next rising edge of the clock. Refer to Truth Table 1.
5. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers
are for reference use only.
6. If UB or LB was HIGH, then the Upper Byte and/or Lower Byte of DATAOUT for Qn + 2 would be disabled (High-Impedance state).
7. "X" here denotes Left or Right port. The diagram is with respect to that port.
8
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Timing Waveform of a Bank Select Pipelined Read(1,2)
tCH2
tCYC2
tCL2
CLK
tSA
A0
ADDRESS(B1)
CE0(B1)
tHA
tSC
A6
A5
A4
A3
A2
A1
tHC
tSC tHC
tCD2
Q0
DATAOUT(B1)
tCD2
Q3
tCKLZ
(3)
tCKHZ (3)
tHA
A0
ADDRESS(B2)
tCKHZ
Q1
tDC
tDC
tSA
(3)
tCD2
A6
A5
A4
A3
A2
A1
tSC tHC
CE0(B2)
tSC
tHC
tCKHZ (3)
tCD2
DATAOUT(B2)
tCKLZ
(3)
Q2
tCD2
Q4
tCKLZ (3)
4845 drw 09
Timing Waveform of Write with Port-to-Port Flow-Through Read(4,5,7)
CLK "A"
tSW tHW
R/W "A"
tSA
ADDRESS "A"
NO
MATCH
MATCH
tSD
DATAIN "A"
tHA
tHD
VALID
tCCS
(6)
CLK "B"
tCD1
R/W "B"
ADDRESS "B"
tSW
tHW
tSA
tHA
NO
MATCH
MATCH
tCWDD
(6)
tCD1
DATAOUT "B"
VALID
VALID
tDC
tDC
4845 drw 10
NOTES:
1. B1 Represents Bank #1; B2 Represents Bank #2. Each Bank consists of one IDT709379/69 for this waveform, and are setup for depth expansion in this
example. ADDRESS(B1) = ADDRESS(B2) in this situation.
2. UB, LB, OE, and ADS = VIL; CE1(B1), CE1(B2), R/W and CNTRST = VIH.
3. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
4. CE0, UB, LB, and ADS = VIL; CE1 and CNTRST = VIH.
5. OE = VIL for the Right Port, which is being read from. OE = VIH for the Left Port, which is being written to.
6. If tCCS < maximum specified, then data from right port READ is not valid until the maximum specified for tCWDD.
If tCCS > maximum specified, then data from right port READ is not valid until tCCS + tCD1. tCWDD does not apply in this case.
7. All timing is the same for both Left and Right ports. Port "A" may be either Left or Right port. Port "B" is the opposite from Port "A".
9
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Timing Waveform of Pipelined Read-to-Write-to-Read (OE = VIL)(3)
tCYC2
tCH2
tCL2
CLK
CE0
tSC
tHC
tSB
tHB
CE1
UB, LB
tSW tHW
R/W
(4)
ADDRESS
tSW tHW
An
tSA tHA
An +1
An + 2
An + 3
An + 2
An + 4
tSD tHD
DATAIN
Dn + 2
tCD2
(2)
tCKHZ
(1)
(1)
tCKLZ
tCD2
Qn + 3
Qn
DATAOUT
(5)
READ
NOP
WRITE
READ
4845 drw 11
Timing Waveforn of Pipelined Read-to-Write-to-Read (OE Controlled)(3)
tCH2
tCYC2
tCL2
CLK
CE0
tSC
tHC
tSB
tHB
CE1
UB, LB
tSW tHW
R/W
(4)
ADDRESS
tSW tHW
An
tSA tHA
An +1
An + 2
tSD
DATAIN
An + 4
An + 5
tHD
Dn + 2
tCD2
(2)
An + 3
Dn + 3
tCKLZ(1)
tCD2
Qn
DATAOUT
Qn + 4
tOHZ(1)
OE
READ
WRITE
READ
4845 drw 12
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
2. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.
3. CE0, UB, LB, and ADS = VIL; CE1 and CNTRST = VIH. "NOP" is "No Operation".
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.
5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
10
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Timing Waveform of Flow-Through Read-to-Write-to-Read (OE = VIL)(3)
tCH1
tCYC1
tCL1
CLK
CE0
tSC
tHC
tSB
tHB
CE1
UB, LB
tSW tHW
R/W
tSW tHW
(4)
ADDRESS
tSA
An
tHA
An +1
An + 2
An + 4
An + 3
An + 2
tSD tHD
DATAIN
Dn + 2
tCD1
(2)
tCD1
Qn
DATAOUT
tCD1
tCD1
Qn + 3
Qn + 1
tDC
tCKHZ
(5)
NOP
READ
(1)
tCKLZ
WRITE
(1)
tDC
READ
4845 drw 13
Timing Waveform of Flow-Through Read-to-Write-to-Read (OE Controlled)(3)
tCYC1
tCH1
tCL1
CLK
CE0
tSC tHC
CE1
tSB
tHB
UB, LB
tSW tHW
R/W
tSW tHW
(4)
ADDRESS
tSA
An
tHA
An +1
An + 2
DATAIN
Dn + 2
(2)
DATAOUT
An + 3
An + 4
An + 5
tSD tHD
Dn + 3
tDC
tCD1
Qn
tOE
tCD1
(1)
tOHZ
tCKLZ
(1)
tCD1
Qn + 4
tDC
OE
READ
WRITE
READ
4845 drw 14
NOTES:
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
2. Output state (High, Low, or High-impedance is determined by the previous cycle control signals.
3. CE0, UB, LB, and ADS = VIL; CE1 and CNTRST = VIH. "NOP" is "No Operation".
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.
5. "NOP" is "No Operation." Data in memory at the selected address may be corrupted and should be re-written to guarantee data integrity.
11
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Timing Waveform of Pipelined Read with Address Counter Advance(1)
tCH2
tCYC2
tCL2
CLK
tSA
ADDRESS
tHA
An
tSAD tHAD
ADS
tSAD tHAD
CNTEN
tSCN tHCN
tCD2
DATAOUT
Qx - 1(2)
Qn + 2(2)
Qn + 1
Qn
Qx
Qn + 3
tDC
READ
EXTERNAL
ADDRESS
READ
WITH
COUNTER
COUNTER
HOLD
READ WITH COUNTER
4845 drw 15
Timing Waveform of Flow-Through Read with Address Counter Advance(1)
tCH1
tCYC1
tCL1
CLK
tSA
ADDRESS
tHA
An
tSAD tHAD
ADS
tSAD tHAD
tSCN tHCN
CNTEN
tCD1
DATAOUT
Qx(2)
Qn
Qn + 1
Qn + 2
Qn + 3(2)
Qn + 4
tDC
READ
EXTERNAL
ADDRESS
READ WITH COUNTER
COUNTER
HOLD
READ
WITH
COUNTER
4845 drw 16
NOTES:
1. CE0, OE, UB, and LB = VIL; CE1, R/W, and CNTRST = VIH.
2. If there is no address change via ADS = VIL (loading a new address) or CNTEN = VIL (advancing the address), i.e. ADS = VIH and CNTEN = VIH, then the data output
remains constant for subsequent clocks.
12
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Timing Waveform of Write with Address Counter Advance
(Flow-Through or Pipelined Outputs)(1)
tCH2
tCYC2
tCL2
CLK
tSA
tHA
An
ADDRESS
INTERNAL(3)
ADDRESS
An(7)
An + 2
An + 1
An + 4
An + 3
tSAD tHAD
ADS
CNTEN
tSD tHD
Dn + 1
Dn
DATAIN
WRITE
EXTERNAL
ADDRESS
Dn + 1
Dn + 4
Dn + 3
Dn + 2
WRITE
WRITE
WITH COUNTER COUNTER HOLD
WRITE WITH COUNTER
4845 drw 17
Timing Waveform of Counter Reset (Pipelined Outputs)(2)
tCH2
tCYC2
tCL2
CLK
tSA tHA
ADDRESS(4)
INTERNAL(3)
ADDRESS
An
Ax(6)
0
1
An + 2
An + 1
An + 1
An
tSW tHW
R/W
ADS
CNTEN
tSRST tHRST
CNTRST
tSD
tHD
D0
DATAIN
Qn
Q1
Q0
DATAOUT(5)
.
COUNTER(6)
RESET
WRITE
ADDRESS 0
READ
ADDRESS 0
READ
ADDRESS 1
READ
ADDRESS n
READ
ADDRESS n+1
4845 drw 18
NOTES:
1. CE0, UB, LB, and R/W = VIL; CE1 and CNTRST = VIH.
2. CE0, UB, LB = VIL; CE1 = VIH.
3. The "Internal Address" is equal to the "External Address" when ADS = VIL and equals the counter output when ADS = VIH.
4. Addresses do not have to be accessed sequentially since ADS = VIL constantly loads the address on the rising edge of the CLK; numbers are for reference use only.
5. Output state (High, Low, or High-impedance) is determined by the previous cycle control signals.
6. No dead cycle exists during counter reset. A READ or WRITE cycle may be coincidental with the counter reset cycle.
7. CNTEN = VIL advances Internal Address from ‘An’ to ‘An +1’. The transition shown indicates the time required for the counter to advance. The ‘An +1’ Address is written
to during this cycle.
13
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
A Functional Description
Depth and Width Expansion
The IDT709379/69 provides a true synchronous Dual-Port Static
RAM interface. Registered inputs provide minimal set-up and hold
times on address, data, and all critical control inputs. All internal
registers are clocked on the rising edge of the clock signal, however,
the self-timed internal write pulse is independent of the LOW to HIGH
transition of the clock signal.
An asynchronous output enable is provided to ease asynchronous
bus interfacing. Counter enable inputs are also provided to stall the
operation of the address counters for fast interleaved memory applications.
CE0 = VIH or CE1 = VIL for one clock cycle will power down the
internal circuitry to reduce static power consumption. Multiple chip
enables allow easier banking of multiple IDT709379/69's for depth
expansion configurations. When the Pipelined output mode is enabled, two cycles are required with CE0 = VIL and CE1 = VIH to reactivate the outputs.
The IDT709379/69 features dual chip enables (refer to Truth Table
I) in order to facilitate rapid and simple depth expansion with no requirements for external logic. Figure 4 illustrates how to control the various
chip enables in order to expand two devices in depth.
The IDT709379/69 can also be used in applications requiring expanded width, as indicated in Figure 4. Since the banks are allocated at
the discretion of the user, the external controller can be set up to drive the
input signals for the various devices as required to allow for 36-bit
or wider applications.
A15/A14(1)
IDT709379/69
CE0
CE1
CE1
VCC
CE1
IDT709379/69
VCC
CE1
CE0
CE0
Control Inputs
CE0
Control Inputs
Control Inputs
IDT709379/69
IDT709379/69
Control Inputs
4845 drw 19
Figure 4. Depth and Width Expansion with IDT709379/69
NOTE:
1. A14 is for IDT709369.
14
6.42
CNTRST
CLK
ADS
CNTEN
R/W
LB, UB
OE
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Ordering Information
XXXXX
A
99
A
Device
Type
Power
Speed
Package
A
A
A
Process/
Temperature
Range
Blank
8
Tube or Tray
Tape & Reel
Blank
I(1)
Commercial (0 C to +70 C)
Industrial (-40 C to +85 C)
G(2)
Green
PF
100-pin TQFP (PN100)
7
9
12
Commercial Only
Commercial & Industrial
Commercial Only
Speed in nanoseconds
L
Low Power
709379
709369
576K (32K x 18-Bit) Synchronous Dual-Port RAM
288K (16K x 18-Bit) Synchronous Dual-Port RAM
4845 drw 20
NOTES:
1. Industrial temperature range is available. For other speeds, packages and powers contact your sales office
2. Green parts available. For specific speeds, packages and powers contact your sales office.
LEAD FINISH (SnPb) parts are in EOL process. Product Discontinuation Notice - PDN# SP-17-02
Note
. that information regarding recently obsoleted parts is included in this datasheet for customer convenience.
15
6.42
709379/69L
High-Speed 32/16K x 18 Synchronous Pipelined Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
Datasheet Document History
9/30/99:
11/10/99:
12/22/99:
1/12/01:
Page 1
Page 4
Page 5
04/26/04:
Page 2
Page 4
Page 5
Page 7
Page 15
01/29/09:
07/26/10:
Page 1 & 16
Page 15
Page 1
Page 15
Page 7
Pages 8-11
07/16/15:
Page 1
Page 2
Page 2 & 15
Page 5
Page 6
Page 7
Page 16
Page 15
02/08/18:
04/24/19:
Initial Public Release
Replaced IDT log
Added nmissing diamond
Changed information in Truth Table II
Increased storage temperature parameter
Clarified TA parameter
DC Electrical parameters–changed wording from "open" to "disabled"
Changed ±200mV to 0mV in notes
Removed Preliminary status
Consolidated multiple devices into one datasheet
Removed I-temp footnote
Added date revision to pin configuration
Added Junction Temperature to Absolute Maximum Ratings Table
Added Ambient Temperature footnote
Added I-temp numbers for 9ns speed to the DC Electrical Characteristics Table
Added 6ns speed DC timing numbers to the DC Electrical Characteristics Table
Added I-temp for 9ns speed to AC Electrical CharacteristicsTable
Added 6ns speed AC timing numbers to the AC Electrical Characteristics Table
Added 6ns speed grade and 9ns I-temp to ordering information
Added IDT Clock Solution Table
Replaced old TM logo with new TM logo
Removed "IDT" from orderable part number
Added green parts availability to features
Added green indicator to ordering information
In order to correct the header notes of the AC Elect Chars Table and align them with the Industrial temp range
values located in the table, the commercial TA header note has been removed
In order to correct the footnotes of timing diagrams, CNTEN has been removed to reconcile the footnotes with
the CNTEN logic definition found in Truth Table II - Address Counter Control
Updated speed offerings by removing the 6.5ns commercial grade in Features
Removed IDT in reference to fabrication
The package code PN100-1 changed to PN100 to match standard package codes
Removed X6 speed grade from the DC Elec Chars table
Corrected typo in the Typical Output Derating drawing
Removed X6 speed grade from the AC Elec Chars table
Added Tape and Reel indicator to, removed X6 speed grade and updated the commercial offerings in
Ordering Information
Removed the IDT Clock Solution table
Product Discontinuation Notice - PDN# SP-17-02
Last time buy expires June 15, 2018
709369 is obsolete
709379 is still active
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16
6.42
for Tech Support:
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