70V06L25PFI

HIGH-SPEED 3.3V 16K x 8 DUAL-PORT STATIC RAM Features ◆ ◆ ◆ ◆ True Dual-Ported memory cells which allow simultaneous reads of the same memory location High-speed access – Commercial: 15ns (max.) – Industrial: 20ns (max.) Low-power operation – IDT70V06L Active: 380mW (typ.) Standby: 660µW (typ.) IDT70V06 easily expands data bus width to 16 bits or more using the Master/Slave select when cascading more than one device ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ 70V06L M/S = VIH for BUSY output flag on Master M/S = VIL for BUSY input on Slave Interrupt Flag On-chip port arbitration logic Full on-chip hardware support of semaphore signaling between ports Fully asynchronous operation from either port Battery backup operation—2V data retention TTL-compatible, single 3.3V (±0.3V) power supply Available in a 68-pin PLCC and a 64-pin TQFP Industrial temperature range (-40°C to +85°C) is available for selected speeds Green parts available, see ordering information Functional Block Diagram OEL OER CEL R/WL CER R/WR , I/O0L- I/O7L I/O Control I/O Control BUSYL I/O0R-I/O7R (1,2) A13L A0L (1,2) BUSYR Address Decoder MEMORY ARRAY 14 CEL OEL R/WL SEML (2) INTL Address Decoder A13R A0R 14 ARBITRATION INTERRUPT SEMAPHORE LOGIC M/S CER OER R/WR SEMR INTR(2) 2942 drw 01 NOTES: 1. (MASTER): BUSY is output; (SLAVE): BUSY is input. 2. BUSY outputs and INT outputs are non-tri-stated push-pull. 1 Feb.07.20 6.07 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Description This device provides two independent ports with separate control, address, and I/O pins that permit independent, asynchronous access for reads or writes to any location in memory. An automatic power down feature controlled by CE permits the on-chip circuitry of each port to enter a very low standby power mode. Fabricated using CMOS high-performance technology, these devices typically operate on only 400mW of power. The IDT70V06 is packaged in a 68-pin PLCC and a 64-pin thin quad flatpack (TQFP). The IDT70V06 is a high-speed 16K x 8 Dual-Port Static RAM. The IDT70V06 is designed to be used as a stand-alone 128K-bit Dual-Port Static RAM or as a combination MASTER/SLAVE Dual-Port Static RAM for 16-bit-or-more word systems. Using the IDT MASTER/SLAVE DualPort Static RAM approach in 16-bit or wider memory system applications results in full-speed, error-free operation without the need for additional discrete logic. I/O6R I/O5R I/O4R I/O3R VDD I/O2R I/O1R I/O0R VSS VDD I/O7L I/O6L VSS I/O5L I/O4L I/O3L I/O2L Pin Configurations(1,2,3) 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 27 28 8 29 7 30 31 6 32 4 33 3 2 1 67 66 65 40 64 41 63 42 62 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 A4R A3R A2R A1R A0R INTR BUSYR M/S VSS BUSYL INTL A0L A1L A2L A3L A4L A5L 39 A4R A1R A2R A3R A0R INTR VSS 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 49 32 50 31 51 30 52 29 53 28 54 27 55 26 56 70V06 25 A5L A6L A7L A8L A9L A10L A11L A12L VDD A13L PNG64(4) 57 58 59 CEL SEML R/WL OEL 64-Pin TQFP Top View 60 61 62 NOTES: I/O0L 1. All VDD pins must be connected to power supply. I/O1L 2. All VSS pins must be connected to ground supply. 3. PLG68 package body is approximately .95 in x .95 in x .17 in PNG64 package body is approximately 14mm x 14mm x 1.4mm. 4. This package code is used to reference the package diagram. 63 64 1 2 3 4 5 6 7 8 A5R A6R A7R A8R A9R A10R A11R A12R 24 23 VSS A13R 22 CER 21 20 19 18 17 9 10 11 12 13 14 15 16 SEMR R/WR OER I/O7R I/O6R I/O4R I/O5R I/O2R VDD I/O3R I/O0R I/O1R VSS I/O2L I/O3L I/O4L 2942 drw 03 2 Feb.07.20 M/S BUSYR A4L 2942 drw 02 BUSYL 68-Pin PLCC Top View A0L INTL 38 I/O6L I/O7L VDD 37 68 A1L 36 VSS 70V06 PLG68(4) I/O5L 35 I/O1L I/O0L N/C OEL R/WL SEML CEL N/C A13L VDD A12L A11L A10L A9L A8L A7L A6L A3L A2L 34 5 61 I/O7R N/C OER R/WR SEMR CER N/C A13R Vss A12R A11R A10R A9R A8R A7R A6R A5R 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Pin Configurations(1,2,3) (con't.) 11 51 A5L 50 A4L 48 A2L 46 44 42 A0L BUSYL M/S 40 38 INTR A1R 36 A3R 49 A3L 47 A1L 45 43 INTL VSS 41 39 37 BUSYR A0R A2R 35 A4R 34 A5R 32 A7R 33 A6R 30 A9R 31 A8R 10 53 A7L 52 A6L 09 55 A9L 54 A8L 08 57 56 A11L A10L 59 VDD 58 07 06 61 N/C 60 A13L 05 63 62 SEML CEL 04 65 64 OEL R/WL 22 23 SEMR CER 03 67 66 I/O0L N/C 20 OER A12L 68-Pin PGA Top View(5) 68 02 I/O1L 1 3 5 I/O2L I/O4L VSS 01 2 4 I/O3L I/O5L A B 28 29 A11R A10R 70V06 GU68(4) C 7 9 I/O7L VSS 11 13 I/O1R VDD E F G 27 A12R 24 N/C 25 A13R 21 R/WR 18 19 15 I/O4R I/O7R N/C 6 8 10 12 14 16 I/O6L VDD I/O0R I/O2R I/O3R I/O5R D 26 VSS H 17 I/O6R J K L INDEX 2942 drw 04 NOTES: 1. All VDD pins must be connected to power supply. 2. All VSS pins must be connected to ground supply. 3. Package body is approximately 1.18 in x 1.18 in x .16 in. 4. This package code is used to reference the package diagram. 5. This text does not indicate orientation of the actual part marking. Pin Names Left Port Right Port Names CEL CER Chip Enable R/WL R/WR Read/Write Enable OEL OER Output Enable A0L - A13L A0R - A13R Address I/O0L - I/O7L I/O0R - I/O7R Data Input/Output SEML SEMR Semaphore Enable INTL INTR Interrupt Flag BUSYL BUSYR Busy Flag M/S Master or Slave Select VDD Power (3.3V) VSS Ground (0V) 2942 tbl 01 6.42 3 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Truth Table I: Non-Contention Read/Write Control Inputs(1) Outputs CE R/W OE SEM I/O0-7 H X X H High-Z Deselected: Power-Down L L X H DATAIN Write to Memory L H L H DATAOUT X X H X High-Z Mode Read Memory Outputs Disabled 2942 tbl 02 NOTE: 1. A0L — A13L ≠ A0R — A13R Truth Table II: Semaphore Read/Write Control(1) Inputs Outputs CE R/W OE SEM I/O0-7 Mode H H L L DATAOUT Read Data in Semaphore Flag H ↑ X L DATAIN Write I/O0 into Semaphore Flag L X X L ____ Not Allowed 2942 tbl 03 NOTE: 1. There are eight semaphore flags written to via I/O0 and read from I/O0 - I/O7. These eight semaphores are addressed by A0 - A2. 4 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Absolute Maximum Ratings(1) Symbol Rating Commercial & Industrial Unit VTERM(2) Terminal Voltage with Respect to GND -0.5 to +4.6 V TBIAS Temperature Under Bias -55 to +125 o C TSTG Storage Temperature -65 to +150 o C IOUT DC Output Current Maximum Operating Temperature and Supply Voltage(1) Grade COUT Input Capacitance Output Capacitance 0V 3.3V + 0.3V -40OC to +85OC 0V 3.3V + 0.3V NOTE: 1. This is the parameter TA. This is the "instant on" case temperature. mA Recommended DC Operating Conditions Symbol Capacitance (TA = +25°C, f = 1.0MHz) CIN 0OC to +70OC 2942 tbl 05 2942 tbl 04 Parameter VDD Commercial NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed VDD + 0.3V. Symbol GND Industrial 50 (1) Ambient Temperature Conditions Max. Unit VIN = 3dV 9 pF VOUT = 3dV 10 pF Parameter VDD Supply Voltage VSS Ground VIH Input High Voltage VIL Min. Typ. Max. Unit 3.0 3.3 3.6 V 0 0 0 V 2.0 ____ VDD+0.3(2) V ____ 0.8 (1) Input Low Voltage -0.3 V 2942 tbl 06 NOTES: 1. VIL> -1.5V for pulse width less than 10ns. 2. VTERM must not exceed VDD +0.3V. 2942 tbl 07 NOTES: 1. This parameter is determined by device characterization but is not production tested. 2. 3dV references the interpolated capacitance when the input and output signals switch from 0V to 3V or from 3V to 0V. DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VDD = 3.3V ± 0.3V) 70V06S Symbol Parameter Test Conditions 70V06L Min. Max. Min. Max. Unit |ILI| Input Leakage Current(1) VDD = 3.6V, VIN = 0V to VDD ___ 10 ___ 5 µA |ILO| Output Leakage Current VOUT = 0V to VDD ___ 10 ___ 5 µA VOL Output Low Voltage IOL = +4mA ___ 0.4 ___ 0.4 V VOH Output High Voltage IOH = -4mA 2.4 ___ 2.4 ___ V 2942 tbl 08 NOTE: 1. At VDD < 2.0V input leakages are undefined. 6.42 5 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(1) (VDD = 3.3V ± 0.3V) 70V06X15 Com'l Only Symbol IDD ISB1 ISB2 ISB3 ISB4 Parameter Dynamic Operating Current (Both Ports Active) Standby Current (Both Ports - TTL Level Inputs) Standby Current (One Port - TTL Level Inputs) Full Standby Current (Both Ports CMOS Level Inputs) Full Standby Current (One Port CMOS Level Inputs) Test Condition Version 70V06X20 Com'l & Ind 70V06X25 Com'l & Ind Typ.(2) Max. Typ. (2) Max. Typ.(2) Max. Unit 140 130 200 175 130 125 190 165 mA mA COM'L S L 150 140 215 185 IND S L ____ ____ ____ ____ ____ ____ ____ ____ 130 195 125 180 COM'L S L 25 20 35 30 20 15 30 25 16 13 30 25 mA IND S L ____ ____ ____ ____ ____ ____ ____ ____ 15 40 13 40 mA COM'L S L 85 80 120 110 80 75 110 100 75 72 110 95 mA IND S L ____ ____ ____ ____ ____ ____ ____ ____ 75 115 72 110 mA Both Ports CEL and CER > VDD - 0.2V, VIN > VDD - 0.2V or VIN < 0.2V, f = 0(4) SEMR = SEML > VDD - 0.2V COM'L S L 1.0 0.2 5 2.5 1.0 0.2 5 2.5 1.0 0.2 5 2.5 mA IND S L ____ ____ ____ ____ ____ ____ ____ ____ 0.2 5 0.2 5 mA One Port CEL or CER > VDD - 0.2V SEMR = SEML > VDD - 0.2V VIN > VDD - 0.2V or V IN < 0.2V Active Port Outputs Disabled, f = fMAX(3) COM'L S L 85 80 125 105 80 75 115 100 75 70 105 90 mA IND S L ____ ____ ____ ____ ____ ____ ____ ____ 75 115 70 105 mA CE = VIL, Outputs Disabled SEM = VIH f = fMAX(3) CER = CEL = VIH SEMR = SEML = VIH f = fMAX(3) CEL or CER = VIH Active Port Outputs Disabled, f=fMAX(3) 2942 tbl 09a 70V06X35 Com'l Only Symbol IDD ISB1 ISB2 ISB3 ISB4 Parameter Dynamic Operating Current (Both Ports Active) Standby Current (Both Ports - TTL Level Inputs) Standby Current (One Port - TTL Level Inputs) Full Standby Current (Both Ports CMOS Level Inputs) Full Standby Current (One Port CMOS Level Inputs) Test Condition Version 70V06X55 Com'l Only Typ.(2) Max. Typ. (2) Max. Unit COM'L S L 120 115 180 155 120 115 180 155 mA IND S L ____ ____ ____ ____ ____ ____ ____ ____ mA COM'L S L 13 11 25 20 13 11 25 20 mA IND S L ____ ____ ____ ____ ____ ____ ____ ____ mA COM'L S L 70 65 100 90 70 65 100 90 mA IND S L ____ ____ ____ ____ ____ ____ ____ ____ mA Both Ports CEL and CER > VDD - 0.2V, VIN > VDD - 0.2V or VIN < 0.2V, f = 0(4) SEMR = SEML > VDD - 0.2V COM'L S L 1.0 0.2 5 2.5 1.0 0.2 5 2.5 mA IND S L ____ ____ ____ ____ ____ ____ ____ ____ mA One Port CEL or CER > VDD - 0.2V SEMR = SEML > VDD - 0.2V VIN > VDD - 0.2V or V IN < 0.2V Active Port Outputs Disabled, f = fMAX(3) COM'L S L 65 60 100 85 65 60 100 85 mA IND S L ____ ____ ____ ____ ____ ____ ____ ____ mA CE = VIL, Outputs Disabled SEM = VIH f = fMAX(3) CER = CEL = VIH SEMR = SEML = VIH f = fMAX(3) CEL or CER = VIH Active Port Outputs Disabled, f=fMAX(3) 2942 tbl 09b NOTES: 1. 'X' in part number indicates power rating (S or L) 2. VDD = 3.3, TA = +25°C, and are not production tested. IDD DC = 115mA (Typ.) 3. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/tRC, and using “AC Test Conditions” of input levels of GND to 3V. 4. f = 0 means no address or control lines change. 6 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges AC Test Conditions Input Pulse Levels 3.3V 3.3V GND to 3.0V Input Rise/Fall Times Input Timing Reference Levels 1.5V Output Reference Levels 1.5V Output Load 590Ω 590Ω 3ns Max. DATAOUT BUSY INT DATAOUT 435Ω 435Ω 30pF 5pF* Figures 1 and 2 2942 tbl 10 , 2942 drw 05 Figure 1. AC Output Test Load Figure 2. Output Test Load (For tLZ, tHZ, tWZ, tOW) *Including scope and jig. Timing of Power-Up Power-Down CE ICC tPU tPD ISB 2942 drw 06 6.42 7 Feb.07.20 , 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(4) 70V06X15 Com'l Only Symbol Parameter 70V06X20 Com'l & Ind 70V06X25 Com'l & Ind Min. Max. Min. Max. Min. Max. Unit READ CYCLE tRC Read Cycle Time 15 ____ 20 ____ 25 ____ ns tAA Address Access Time ____ 15 ____ 20 ____ 25 ns tACE Chip Enable Access Time (3) ____ 15 ____ 20 ____ 25 ns tAOE Output Enable Access Time (3) ____ 10 ____ 12 ____ 13 ns tOH Output Hold from Address Change 3 ____ 3 ____ 3 ____ ns tLZ Output Low-Z Time (1,2) 3 ____ 3 ____ 3 ____ ns tHZ Output High-Z Time (1,2) ____ 10 ____ 12 ____ 15 ns tPU Chip Enable to Power Up Time (1,2) 0 ____ 0 ____ 0 ____ ns tPD Chip Disable to Power Down Time (1,2) ____ 15 ____ 20 ____ 25 ns tSOP Semaphore Flag Update Pulse (OE or SEM) 10 ____ 10 ____ 10 ____ ns tSAA Semaphore Address Access (3) ____ 15 ____ 20 ____ 25 ns 2942 tbl 11a 70V06X35 Com'l Only Symbol Parameter 70V06X55 Com'l Only Min. Max. Min. Max. Unit READ CYCLE tRC Read Cycle Time 35 ____ 55 ____ ns tAA Address Access Time ____ 35 ____ 55 ns ____ 35 ____ 55 ns ____ 20 ____ 30 ns tACE Chip Enable Access Time (3) (3) tAOE Output Enable Access Time tOH Output Hold from Address Change 3 ____ 3 ____ ns tLZ Output Low-Z Time (1,2) 3 ____ 3 ____ ns tHZ Output High-Z Time (1,2) ____ 15 ____ 25 ns tPU Chip Enable to Power Up Time (1,2) 0 ____ 0 ____ ns tPD Chip Disable to Power Down Time (1,2) ____ 35 ____ 50 ns tSOP Semaphore Flag Update Pulse (OE or SEM) 15 ____ 15 ____ ns tSAA Semaphore Address Access (3) ____ 35 ____ 55 ns NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with Output Test Load (Figure 2). 2. This parameter is guaranteed but not tested. 3. To access SRAM, CE = VIL, SEM = VIH. 4. 'X' in part number indicates power rating (S or L). 8 Feb.07.20 2942 tbl 11b 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Waveform of Read Cycles(5) tRC ADDR (4) CE tAA (4) tACE tAOE (4) OE R/W tLZ tOH (1) (4) DATAOUT VALID DATA tHZ (2) BUSYOUT tBDD (3,4) 2942 drw 07 NOTES: 1. Timing depends on which signal is asserted last OE or CE. 2. Timing depends on which signal is de-asserted first CE or OE. 3. tBDD delay is required only in cases where the opposite port is completing a write operation to the same address location. For simultaneous read operations BUSY has no relation to valid output data. 4. Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA or tBDD. 5. SEM = VIH. 6.42 9 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature and Supply Voltage(5) 70V06X15 Com'l Only Symbol Parameter 70V06X20 Com'l & Ind 70V06X25 Com'l & Ind Min. Max. Min. Max. Min. Max. Unit 15 ____ 20 ____ 25 ____ ns tEW Chip Enable to End-of-Write (3) 12 ____ 15 ____ 20 ____ ns tAW Address Valid to End-of-Write 12 ____ 15 ____ 20 ____ ns tAS Address Set-up Time (3) 0 ____ 0 ____ 0 ____ ns tWP Write Pulse Width 12 ____ 15 ____ 20 ____ ns tWR Write Recovery Time 0 ____ 0 ____ 0 ____ ns tDW Data Valid to End-of-Write 10 ____ 15 ____ 15 ____ ns ____ 10 ____ 12 ____ 15 ns 0 ____ 0 ____ 0 ____ ns ____ WRITE CYCLE tWC Write Cycle Time Output High-Z Time tHZ Data Hold Time tDH (1,2) (4) (1,2) tWZ Write Enable to Output in High-Z 10 ____ 12 ____ 15 ns tOW Output Active from End-of-Write (1,2,4) 0 ____ 0 ____ 0 ____ ns tSWRD SEM Flag Write to Read Time 5 ____ 5 ____ 5 ____ ns tSPS SEM Flag Contention Window 5 ____ 5 ____ 5 ____ ns 2942 tbl 12a 70V06X35 Com'l Only Symbol Parameter 70V06X55 Com'l Only Min. Max. Min. Max. Unit 35 ____ 55 ____ ns tEW Chip Enable to End-of-Write (3) 30 ____ 45 ____ ns tAW Address Valid to End-of-Write 30 ____ 45 ____ ns 0 ____ 0 ____ ns ns WRITE CYCLE tWC Write Cycle Time (3) tAS Address Set-up Time tWP Write Pulse Width 25 ____ 40 ____ tWR Write Recovery Time 0 ____ 0 ____ ns tDW Data Valid to End-of-Write 15 ____ 30 ____ ns ____ 15 ____ 25 ns 0 ____ ns 25 ns ns tHZ tDH tWZ tOW tSWRD tSPS Output High-Z Time Data Hold Time (1,2) (4) 0 ____ (1,2) ____ 15 ____ (1,2,4) 0 ____ 0 ____ SEM Flag Write to Read Time 5 ____ 5 ____ ns SEM Flag Contention Window 5 ____ 5 ____ ns Write Enable to Output in High-Z Output Active from End-of-Write 2942 tbl 12b NOTES: 1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2). 2. This parameter is guaranteed but not tested. 3. To access SRAM, CE = VIL, SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. Either condition must be valid for the entire tEW time. 4. The specification for tDH must be met by the device supplying write data to the RAM under all operating conditions. Although tDH and tOW values will vary over voltage and temperature, the actual tDH will always be smaller than the actual tOW. 5. 'X' in part number indicates power rating (S or L). 10 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,3,5,8) tWC ADDRESS tHZ (7) OE tAW CE or SEM (9) tAS (6) tWP (2) tWR (3) R/W tWZ (7) tOW (4) DATAOUT (4) tDW tDH DATAIN 2942 drw 08 Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1,3,5,8) tWC ADDRESS tAW CE or SEM (9) (6) tAS tWR (3) tEW (2) R/W tDW tDH DATAIN 2942 drw 09 NOTES: 1. R/W or CE must be HIGH during all address transitions. 2. A write occurs during the overlap (tEW or tWP) of a LOW CE and a LOW R/W for memory array writing cycle. 3. tWR is measured from the earlier of CE or R/W (or SEM or R/W) going HIGH to the end of write cycle. 4. During this period, the I/O pins are in the output state and input signals must not be applied. 5. If the CE or SEM LOW transition occurs simultaneously with or after the R/W low transition, the outputs remain in the High-impedance state. 6. Timing depends on which enable signal is asserted last, CE, or R/W. 7. Timing depends on which enable signal is de-asserted first, CE, or R/W. 8. If OE is LOW during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be placed on the bus for the required tDW. If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified tWP. 9. To access SRAM, CE = VIL and SEM = VIH. To access Semaphore, CE = VIH and SEM = VIL. tEW must be met for either condition. 6.42 11 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Semaphore Read after Write Timing, Either Side(1) tSAA A0-A2 VALID ADDRESS tAW tOH VALID ADDRESS tWR tACE tEW SEM tDW DATA0 tSOP DATA OUT VALID(2) DATAIN VALID tAS tWP tDH R/W tSWRD OE tAOE tSOP Write Cycle Read Cycle 2942 drw 10 NOTES: 1. CE = VIH for the duration of the above timing (both write and read cycle). 2. “DATAOUT VALID” represents all I/O's (I/O0 - I/O7) equal to the semaphore value. Timing Waveform of Semaphore Write Contention(1,3,4) A0"A"-A2"A" (2) SIDE "A" MATCH R/W"A" SEM"A" tSPS A0"B"-A2"B" (2) SIDE "B" MATCH R/W"B" SEM"B" 2942 drw 11 NOTES: 1. DOR = DOL = VIL, CER = CEL = VIH, Semaphore Flag is released from both sides (reads as ones from both sides) at cycle start. 2. “A” may be either left or right port. “B” is the opposite port from “A”. 3. This parameter is measured from R/W“A” or SEM“A” going HIGH to R/W“B” or SEM“B” going HIGH. 4. If tSPS is not satisfied, the semaphore will fall positively to one side or the other, but there is no guarantee which side will obtain the flag. 12 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(6) 70V06X15 Com'l Ony Symbol Parameter 70V06X20 Com'l & Ind 70V06X25 Com'l & Ind Min. Max. Min. Max. Min. Max. Unit BUSY TIMING (M/S = VIH) tBAA BUSY Access Time from Address Match ____ 15 ____ 20 ____ 20 ns tBDA BUSY Disable Time from Address Not Matched ____ 15 ____ 20 ____ 20 ns BUSY Access Time from Chip Enable LOW ____ 15 ____ 20 ____ 20 ns ____ 15 ____ 17 ____ 17 ns 5 ____ 5 ____ 5 ____ ns tBAC tBDC BUSY Disable Time from Chip Enable HIGH tAPS Arbitration Priority Set-up Time (2) tBDD BUSY Disable to Valid Data(3) ____ 18 ____ 30 ____ 30 ns tWH Write Hold After BUSY(5) 12 ____ 15 ____ 17 ____ ns 0 ____ 0 ____ 0 ____ ns 12 ____ 15 ____ 17 ____ ns ____ 30 ____ 45 ____ 50 ns ____ 25 ____ 35 ____ 35 BUSY TIMING (M/S = VIL) BUSY Input to Write (4) tWB (5) tWH Write Hold After BUSY PORT-TO-PORT DELAY TIMING tWDD tDDD Write Pulse to Data Delay(1) Write Data Valid to Read Data Delay (1) ns 2942 tbl 13a 70V06X35 Com'l Only Symbol Parameter 70V06X55 Com'l Only Min. Max. Min. Max. Unit BUSY Access Time from Address Match ____ 20 ____ 45 ns BUSY Disable Time from Address Not Matched ____ 20 ____ 40 ns BUSY Access Time from Chip Enable LOW ____ 20 ____ 40 ns BUSY Disable Time from Chip Enable HIGH ____ 20 ____ 35 ns 5 ____ 5 ____ ns ____ 35 ____ 40 ns 25 ____ 25 ____ ns 0 ____ 0 ____ ns 25 ____ 25 ____ ns ____ 60 ____ 80 ns ____ 45 ____ 65 BUSY TIMING (M/S = VIH) tBAA tBDA tBAC tBDC tAPS tBDD tWH Arbitration Priority Set-up Time (2) (3) BUSY Disable to Valid Data (5) Write Hold After BUSY BUSY TIMING (M/S = VIL) tWB tWH BUSY Input to Write (4) (5) Write Hold After BUSY PORT-TO-PORT DELAY TIMING tWDD tDDD Write Pulse to Data Delay(1) Write Data Valid to Read Data Delay (1) ns 2942 tbl 13b NOTES: 1. Port-to-port delay through SRAM cells from writing port to reading port, refer to "Timing Waveform of Read With BUSY (M/S = VIH) or "Timing Waveform of Write With Port-To-Port Delay (M/S=VIL)". 2. To ensure that the earlier of the two ports wins. 3. tBDD is a calculated parameter and is the greater of 0, tWDD – tWP (actual) or tDDD – tDW (actual). 4. To ensure that the write cycle is inhibited during contention. 5. To ensure that a write cycle is completed after contention. 6. "X" is part numbers indicates power rating (S or L). 6.42 13 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Write with Port-To-Port Read and BUSY(2,4,5) (M/S = VIH) tWC MATCH ADDR"A" tWP R/W"A" tDW tDH VALID DATAIN "A" tAPS (1) MATCH ADDR"B" tBDA tBAA tBDD BUSY"B" tWDD DATAOUT "B" VALID tDDD (3) 2942 drw 12 NOTES: 1. To ensure that the earlier of the two ports wins. tAPS is ignored for M/S = VIL (SLAVE). 2. CEL = CER = VIL 3. OE = VIL for the reading port. 4. If M/S = VIL(slave) then BUSY is input. Then for this example BUSY“A” = VIH and BUSY“B” input is shown above. 5. All timing is the same for left and right port. Port "A" may be either left or right port. Port "B" is the port opposite from Port "A". 14 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Write with BUSY tWP R/W"A" tWB(3) BUSY"B" tWH (1) R/W"B" (2) , 2942 drw 13 NOTES: 1. tWH must be met for both BUSY input (slave) output master. 2. BUSY is asserted on Port “B” Blocking R/W“B”, until BUSY“B” goes HIGH. 3. tWB is only for the slave version. Waveform of BUSY Arbitration Controlled by CE Timing(1) (M/S = VIH) ADDR"A" and "B" ADDRESSES MATCH CE"A" tAPS (2) CE"B" tBAC tBDC BUSY"B" 2942 drw 14 Waveform of BUSY Arbitration Cycle Controlled by Address Match Timing(1) (M/S = VIH) ADDR"A" ADDRESS "N" tAPS (2) ADDR"B" MATCHING ADDRESS "N" tBAA tBDA BUSY"B" 2942 drw 15 NOTES: 1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from “A”. 2. If tAPS is not satisfied, the BUSY signal will be asserted on one side or another but there is no guarantee on which side BUSY will be asserted. 6.42 15 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(1) 70V06X15 Com'l Only Symbol Parameter 70V06X20 Com'l & Ind 70V06X25 Com'l & Ind Min. Max. Min. Max. Min. Max. Unit INTERRUPT TIMING tAS Address Set-up Time 0 ____ 0 ____ 0 ____ ns tWR Write Recovery Time 0 ____ 0 ____ 0 ____ ns tINS Interrupt Set Time ____ 15 ____ 20 ____ 20 ns tINR Interrupt Reset Time ____ 15 ____ 20 ____ 20 ns 2942 tbl 14a 70V06X35 Com'l Only Symbol Parameter 70V06X55 Com'l Only Min. Max. Min. Max. Unit INTERRUPT TIMING tAS Address Set-up Time 0 ____ 0 ____ ns tWR Write Recovery Time 0 ____ 0 ____ ns tINS Interrupt Set Time ____ 25 ____ 40 ns tINR Interrupt Reset Time ____ 25 ____ 40 ns 2942 tbl 14b NOTE: 1. 'X' in part number indicates power rating (S or L). Waveform of Interrupt Timing(1) tWC ADDR"A" INTERRUPT SET ADDRESS tAS (3) (2) tWR (4) CE"A" R/W"A" tINS (3) INT"B" 2942 drw 16 NOTES: 1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from “A”. 2. See Interrupt Truth Table III. 3. Timing depends on which enable signal (CE or R/W) is asserted last. 4. Timing depends on which enable signal (CE or R/W) is de-asserted first. 16 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Waveform of Interrupt Timing(1) (con't.) tRC ADDR"B" INTERRUPT CLEAR ADDRESS tAS (2) (3) CE"B" OE"B" tINR (3) INT"B" 2942 drw 17 NOTES: 1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from “A”. 2. See Interrupt Truth Table III. 3. Timing depends on which enable signal (CE or R/W) is asserted last. Truth Table III — Interrupt Flag(1) Left Port Right Port R/WL CEL OEL A13L-A0L INTL R/WR CER OER A13R-A0R L L X 3FFF X X X X X X X X X X L X X L X X 3FFE X L(2) (3) Function Set Right INTR Flag X L L 3FFF H Reset Right INTR Flag (3) L L X 3FFE X Set Left INTL Flag (2) X X X X X Reset Left INTL Flag L H 2942 tbl 15 NOTES: 1. Assumes BUSYL = BUSYR = VIH. 2. If BUSYL = VIL, then no change. 3. If BUSYR = VIL, then no change. 6.42 17 Feb.07.20 INTR 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Truth Table IV — Address BUSY Arbitration Inputs Outputs CEL CER A13L-A0L A13R-A0R BUSYL(1) BUSYR(1) Function X X NO MATCH H H Normal H X MATCH H H Normal X H MATCH H H Normal L L MATCH (2) (2) Write Inhibit(3) 2942 tbl 16 NOTES: 1. Pins BUSYL and BUSYR are both outputs when the part is configured as a master. Both are inputs when configured as a slave. BUSYX outputs on the IDT70V06 are push pull, not open drain outputs. On slaves the BUSYX input internally inhibits writes. 2. L if the inputs to the opposite port were stable prior to the address and enable inputs of this port. H if the inputs to the opposite port became stable after the address and enable inputs of this port. If tAPS is not met, either BUSYL or BUSYR = LOW will result. BUSYL and BUSYR outputs cannot be LOW simultaneously. 3. Writes to the left port are internally ignored when BUSYL outputs are driving LOW regardless of actual logic level on the pin. Writes to the right port are internally ignored when BUSYR outputs are driving LOW regardless of actual logic level on the pin. Truth Table V — Example of Semaphore Procurement Sequence(1,2,3) Functions D0 - D7 Left D0 - D7 Right Status No Action 1 1 Semaphore free Left Port Writes "0" to Semaphore 0 1 Left port has semaphore token Right Port Writes "0" to Semaphore 0 1 No change. Right side has no write access to semaphore Left Port Writes "1" to Semaphore 1 0 Right port obtains semaphore token Left Port Writes "0" to Semaphore 1 0 No change. Left port has no write access to semaphore Right Port Writes "1" to Semaphore 0 1 Left port obtains semaphore token Left Port Writes "1" to Semaphore 1 1 Semaphore free Right Port Writes "0" to Semaphore 1 0 Right port has semaphore token Right Port Writes "1" to Semaphore 1 1 Semaphore free Left Port Writes "0" to Semaphore 0 1 Left port has semaphore token Left Port Writes "1" to Semaphore 1 1 Semaphore free NOTES: 1. This table denotes a sequence of events for only one of the eight semaphores on the IDT70V06. 2. There are eight semaphore flags written to via I/O0 and read from all I/O's (I/O0 - I/O7). These eight semaphores are addressed by A0 -A2. 3. CE = VIH, SEM = VIL to access the semaphores. Refer to the Semaphore Read/Write Control Truth Table. Functional Description The IDT70V06 provides two ports with separate control, address and I/O pins that permit independent access for reads or writes to any location in memory. The IDT70V06 has an automatic power down feature controlled by CE. The CE controls on-chip power down circuitry that permits the respective port to go into a standby mode when not selected (CE = VIH). When a port is enabled, access to the entire memory array is permitted. Interrupts If the user chooses the interrupt function, a memory location (mail box or message center) is assigned to each port. The left port interrupt flag (INTL) is set when the right port writes to memory location 3FFE (HEX). The left port clears the interrupt by reading address location 3FFE. Likewise, the right port interrupt flag (INTR) is set when the left port writes to memory location 3FFF (HEX) and to clear the interrupt flag (INTR), the right port must read the memory location 3FFF. The message (8 bits) at 3FFE or 3FFF is user-defined. If the interrupt function is not used, address locations 3FFE and 3FFF are not used as mail boxes, but as part of the random access memory. Refer to Truth Table III for the interrupt operation. Busy Logic Busy Logic provides a hardware indication that both ports of the SRAM have accessed the same location at the same time. It also 18 Feb.07.20 2942 tbl 17 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM BUSY (L) CE MASTER Dual Port SRAM BUSY (L) BUSY (R) CE SLAVE Dual Port SRAM BUSY (L) BUSY (R) MASTER CE Dual Port SRAM BUSY (L) BUSY (R) SLAVE CE Dual Port SRAM BUSY (L) BUSY (R) DECODER Industrial and Commercial Temperature Ranges BUSY (R) 2942 drw 18 Figure 3. Busy and chip enable routing for both width and depth expansion with IDT70V06 SRAMs. allows one of the two accesses to proceed and signals the other side that the SRAM is “busy”. The BUSY pin can then be used to stall the access until the operation on the other side is completed. If a write operation has been attempted from the side that receives a BUSY indication, the write signal is gated internally to prevent the write from proceeding. The use of BUSY logic is not required or desirable for all applications. In some cases it may be useful to logically OR the BUSY outputs together and use any BUSY indication as an interrupt source to flag the event of an illegal or illogical operation. If the write inhibit function of BUSY logic is not desirable, the BUSY logic can be disabled by placing the part in slave mode with the M/S pin. Once in slave mode the BUSY pin operates solely as an input. Normal operation can be programmed by tying the BUSY pins HIGH. If desired, unintended write operations can be prevented to a port by tying the BUSY pin for that port LOW. The BUSY outputs on the IDT 70V06 RAM in master mode, are push-pull type outputs and do not require pull up resistors to operate. If these RAMs are being expanded in depth, then the busy indication for the resulting array requires the use of an external AND gate. Width Expansion with Busy Logic Master/Slave Arrays When expanding an IDT70V06 SRAM array in width while using BUSY logic, one master part is used to decide which side of the SRAM array will receive a BUSY indication, and to output that indication. Any number of slaves to be addressed in the same address range as the master use the BUSY signal as a write inhibit signal. Thus on the IDT70V06 RAM the BUSY pin is an output if the part is used as a master (M/S pin = VIH), and the BUSY pin is an input if the part used as a slave (M/S pin = VIL) as shown in Figure 3. If two or more master parts were used when expanding in width, a split decision could result with one master indicating BUSY on one side of the array and another master indicating BUSY on one other side of the array. This would inhibit the write operations from one port for part of a word and inhibit the write operations from the other port for part of the other word. The BUSY arbitration, on a master, is based on the chip enable and address signals only. It ignores whether an access is a read or write. In a master/slave array, both address and chip enable must be valid long enough for a BUSY flag to be output from the master before the actual write pulse can be initiated with the R/W signal. Failure to observe this timing can result in a glitched internal write inhibit signal and corrupted data in the slave. Semaphores The IDT70V06 is an extremely fast Dual-Port 16K x 8 CMOS Static RAM with an additional 8 address locations dedicated to binary semaphore flags. These flags allow either processor on the left or right side of the Dual-Port SRAM to claim a privilege over the other processor for functions defined by the system designer’s software. As an example, the semaphore can be used by one processor to inhibit the other from accessing a portion of the Dual-Port SRAM or any other shared resource. The Dual-Port SRAM features a fast access time, and both ports are completely independent of each other. This means that the activity on the left port in no way slows the access time of the right port. Both ports are identical in function to standard CMOS Static RAM and can be read from, or written to, at the same time with the only possible conflict arising from the simultaneous writing of, or a simultaneous READ/WRITE of, a non-semaphore location. Semaphores are protected against such ambiguous situations and may be used by the system program to avoid any conflicts in the non-semaphore portion of the Dual-Port SRAM. These devices have an automatic powerdown feature controlled by CE, the Dual-Port SRAM enable, and SEM, the semaphore enable. The CE and SEM pins control on-chip power down circuitry that permits the respective port to go into standby mode when not selected. This is the condition which is shown in Truth Table I where CE and SEM are both HIGH. Systems which can best use the IDT70V06 contain multiple processors or controllers and are typically very high-speed systems which are software controlled or software intensive. These systems can benefit from a performance increase offered by the IDT70V06's hardware semaphores without requiring complex programming. Software handshaking between processors offers the maximum in system flexibility by permitting shared resources to be allocated in varying configurations. The IDT70V06 does not use its semaphore flags to control any resources through hardware, thus allowing the system 6.42 19 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM designer total flexibility in system architecture. An advantage of using semaphores rather than the more common methods of hardware arbitration is that wait states are never incurred in either processor. This can prove to be a major advantage in very high-speed systems. How the Semaphore Flags Work The semaphore logic is a set of eight latches which are independent of the Dual-Port SRAM. These latches can be used to pass a flag, or token, from one port to the other to indicate that a shared resource is in use. The semaphores provide a hardware assist for a use assignment method called “Token Passing Allocation.” In this method, the state of a semaphore latch is used as a token indicating that a shared resource is in use. If the left processor wants to use this resource, it requests the token by setting the latch. This processor then verifies its success in setting the latch by reading it. If it was successful, it assumes control over the shared resource. If it was not successful in setting the latch, it determines that the right side processor has set the latch first, has the token and is using the shared resource. The left processor can then either repeatedly request that semaphore’s status or remove its request for that semaphore to perform another task and occasionally attempt again to gain control of the token via the set and test sequence. Once the right side has relinquished the token, the left side should succeed in gaining control. The semaphore flags are active LOW. A token is requested by writing a zero into a semaphore latch and is released when the same side writes a one to that latch. The eight semaphore flags reside within the IDT70V06 in a separate memory space from the Dual-Port SRAM. This address space is accessed by placing a LOW input on the SEM pin (which acts as a chip select for the semaphore flags) and using the other control pins (Address, OE, and R/W) as they would be used in accessing a standard Static RAM. Each of the flags has a unique address which can be accessed by either side through address pins A0 – A2. When accessing the semaphores, none of the other address pins has any effect. When writing to a semaphore, only data pin D0 is used. If a low is written into an unused semaphore location, that flag will be set to a zero on that side and a one on the other side (see Truth Table V). That semaphore can now only be modified by the side showing the zero. When a one is written into the same location from the same side, the flag will be set to a one for both sides (unless a semaphore request from the other side is pending) and then can be written to by both sides. The fact that the side which is able to write a zero into a semaphore subsequently locks out writes from the other side is what makes semaphore flags useful in interprocessor communications. (A thorough discussion on the use of this feature follows shortly.) A zero written into the same location from the other side will be stored in the semaphore request latch for that side until the semaphore is freed by the first side. When a semaphore flag is read, its value is spread into all data bits so that a flag that is a one reads as a one in all data bits and a flag containing a zero reads as all zeros. The read value is latched into one side’s output register when that side's semaphore select (SEM) and output enable (OE) signals go active. This serves to disallow the semaphore from changing state in the middle of a read cycle due to a write cycle from the other side. Industrial and Commercial Temperature Ranges Because of this latch, a repeated read of a semaphore in a test loop must cause either signal (SEM or OE) to go inactive or the output will never change. A sequence WRITE/READ must be used by the semaphore in order to guarantee that no system level contention will occur. A processor requests access to shared resources by attempting to write a zero into a semaphore location. If the semaphore is already in use, the semaphore request latch will contain a zero, yet the semaphore flag will appear as one, a fact which the processor will verify by the subsequent read (see Table V). As an example, assume a processor writes a zero to the left port at a free semaphore location. On a subsequent read, the processor will verify that it has written successfully to that location and will assume control over the resource in question. Meanwhile, if a processor on the right side attempts to write a zero to the same semaphore flag it will fail, as will be verified by the fact that a one will be read from that semaphore on the right side during subsequent read. Had a sequence of READ/WRITE been used instead, system contention problems could have occurred during the gap between the read and write cycles. It is important to note that a failed semaphore request must be followed by either repeated reads or by writing a one into the same location. The reason for this is easily understood by looking at the simple logic diagram of the semaphore flag in Figure 4. Two semaphore request latches feed into a semaphore flag. Whichever latch is first to present a zero to the semaphore flag will force its side of the semaphore flag LOW and the other side HIGH. This condition will continue until a one is written to the same semaphore request latch. Should the other side’s semaphore request latch have been written to a zero in the meantime, the semaphore flag will flip over to the other side as soon as a one is written into the first side’s request latch. The second side’s flag will now stay LOW until its semaphore request latch is written to a one. From this it is easy to understand that, if a semaphore is requested and the processor which requested it no longer needs the resource, the entire system can hang up until a one is written into that semaphore request latch. The critical case of semaphore timing is when both sides request a single token by attempting to write a zero into it at the same time. The semaphore logic is specially designed to resolve this problem. If simultaneous requests are made, the logic guarantees that only one side receives the token. If one side is earlier than the other in making the request, the first side to make the request will receive the token. If both requests arrive at the same time, the assignment will be arbitrarily made to one port or the other. One caution that should be noted when using semaphores is that semaphores alone do not guarantee that access to a resource is secure. As with any powerful programming technique, if semaphores are misused or misinterpreted, a software error can easily happen. Initialization of the semaphores is not automatic and must be handled via the initialization program at power-up. Since any semaphore request flag which contains a zero must be reset to a one, all semaphores on both sides should have a one written into them at initialization from both sides to assure that they will be free when needed. 20 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Using Semaphores-Some Examples Perhaps the simplest application of semaphores is their application as resource markers for the IDT70V06’s Dual-Port SRAM. Say the 16K x 8 SRAM was to be divided into two 8K x 8 blocks which were to be dedicated at any one time to servicing either the left or right port. Semaphore 0 could be used to indicate the side which would control the lower section of memory, and Semaphore 1 could be defined as the indicator for the upper section of memory. To take a resource, in this example the lower 8K of Dual-Port SRAM, the processor on the left port could write and then read a zero in to Semaphore 0. If this task were successfully completed (a zero was read back rather than a one), the left processor would assume control of the lower 8K. Meanwhile the right processor was attempting to gain control of the resource after the left processor, it would read back a one in response to the zero it had attempted to write into Semaphore 0. At this point, the software could choose to try and gain control of the second 8K section by writing, then reading a zero into Semaphore 1. If it succeeded in gaining control, it would lock out the left side. Once the left side was finished with its task, it would write a one to Semaphore 0 and may then try to gain access to Semaphore 1. If Semaphore 1 was still occupied by the right side, the left side could undo its semaphore request and perform other tasks until it was able to write, then read a zero into Semaphore 1. If the right processor performs a similar task with Semaphore 0, this protocol would allow the two processors to swap 8K blocks of Dual-Port SRAM with each other. The blocks do not have to be any particular size and can even be variable, depending upon the complexity of the software using the semaphore flags. All eight semaphores could be used to divide the DualPort SRAM or other shared resources into eight parts. Semaphores can even be assigned different meanings on different sides rather than being given a common meaning as was shown in the example above. Semaphores are a useful form of arbitration in systems like disk interfaces where the CPU must be locked out of a section of memory during a transfer and the I/O device cannot tolerate any wait states. With the use of semaphores, once the two devices has determined which memory area was “off-limits” to the CPU, both the CPU and the I/O devices could access their assigned portions of memory continuously without any wait states. Semaphores are also useful in applications where no memory “WAIT” state is available on one or both sides. Once a semaphore handshake has been performed, both processors can access their assigned SRAM segments at full speed. Another application is in the area of complex data structures. In this case, block arbitration is very important. For this application one processor may be responsible for building and updating a data structure. The other processor then reads and interprets that data structure. If the interpreting processor reads an incomplete data structure, a major error condition may exist. Therefore, some sort of arbitration must be used between the two different processors. The building processor arbitrates for the block, locks it and then is able to go in and update the data structure. When the update is completed, the data structure block is released. This allows the interpreting processor to come back and read the complete data structure, thereby guaranteeing a consistent data structure. L PORT R PORT SEMAPHORE REQUEST FLIP FLOP D0 D SEMAPHORE REQUEST FLIP FLOP Q Q WRITE D0 WRITE SEMAPHORE READ SEMAPHORE READ Figure 4. IDT70V06 Semaphore Logic 6.42 21 Feb.07.20 D 2942 drw 19 , 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Ordering Information A XXXXX A 999 A Device Type Power Speed Package A A Process/ Temperature Range Blank 8 Tray Tape and Reel Blank I(1) Commercial (0°C to +70°C) Industrial (-40°C to +85°C) G Green PF J 64-pin TQFP (PNG64) 68-pin PLCC (PLG68) 15 20 Commercial Only Industrial Only L Low Power Speed in Nanoseconds 70V06 128K (16K x 8) 3.3V Dual-Port RAM 2942 drw 20 NOTES: 1. Industrial temperature range is available. For specific speeds, packages and powers contact your sales office. LEAD FINISH (SnPb) parts are Obsolete. Product Discontinuation Notice - PDN# SP-17-02 Note that information regarding recently obsoleted parts are included in this datasheet for customer convenience. Orderable Part Information Speed (ns) 15 20 Pkg. Code Pkg. Type Temp. Grade 70V06L15JG PLG68 PLCC C 70V06L15JG8 PLG68 PLCC C 70V06L15PFG PNG64 TQFP C 70V06L15PFG8 PNG64 TQFP C 70V06L20JGI PLG68 PLCC I 70V06L20JGI8 PLG68 PLCC I 70V06L20PFGI PNG64 TQFP I 70V06L20PFGI8 PNG64 TQFP I Orderable Part ID 22 Feb.07.20 70V06L High-Speed 3.3V 16K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Datasheet Document History 03/10/99: 06/09/99: 11/10/99: 03/10/00: 05/30/00: 11/20/01: 10/23/08: 08/20/15: 06/08/18: 02/07/20: Initiated datasheet document history Converted to new format Cosmetic and typographical corrections Page 2 and 3 Added additional notes to pin configurations Changed drawing format Replaced IDT logo Added 15 & 20ns speed grades Upgraded DC parameters Added Industrial Temperature information Changed ±200mV to 0mV Page 5 Increased storage temperature parameter Clarified TA parameter Page 6 DC Electrical parameters–changed wording from "open" to "disabled" Page 1 Corrected standby power designation from mW to µW Page 2 & 3 Added date revision for pin configurations Page 2, 3, 5 & 6 Changed naming conventions from VCC to VDD and from GND to VSS Page 6 Removed Industrial temp for standard power for 20ns and 25ns speeds from DC Electrical Characteristics Removed Industrial temp for 35ns and 55ns speeds from DC Electrical Characteristics Pages 8,13 & 16 Removed Industrial temp for 35ns and 55ns speeds from AC Electrical Characteristics Page 8 Replaced table 11 with table 11a to show AC Electrical Characteristics for READ CYCLE for 15, 20 & 25ns Page 22 Removed Industrial temp from 35ns and 55ns in ordering information Page 22 Removed "IDT" from orderable part number Page 1 In Features: Added text: “Green parts available, see ordering information”. Page 2 In Description: Removed IDT in reference to fabrication Page 2 ,3 & 22 The package codes PN64-1, G68-1 & J68-1 changed to PN64, G68 & J68 respectively to match standard package codes Page 2 & 3 Removed date from all of the pin configurations 64-pin TQFP, 68-pin PGA & 68-pin PLCC configurations Page 19 & 20 Corrected miscellaneous typo's Page 22 Added Green and Tape & Reel indicators to the Ordering Information and updated footnotes Product Discontinuation Notice - PDN# SP-17-02 Last time buy expires June 15, 2018 Pages 1 - 24 Rebranded as Renesas datasheet Pages 1, 2 & 22 Deleted obsolete package code PGA GU68 Pages 1 & 22 Deleted obsolete Commercial speed grades 20/25/35/55ns and Industrial speed grade 25ns Pages 1 & 22 Removed standard power offering Page 2 Rotated PLG68 PLCC and PNG64 TQFP pin configurations to accurately reflect pin 1 orientation Page 2 Updated package codes Page 22 Added Orderable Part Information table 6.42 23 Feb.07.20 IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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