70V07S25PF

70V07S/L HIGH-SPEED 3.3V 32K x 8 DUAL-PORT STATIC RAM Features ◆ ◆ ◆ ◆ ◆ True Dual-Ported memory cells which allow simultaneous access of the same memory location High-speed access – Commercial: 25/35/55ns (max.) – Industrial: 35ns (max.) Low-power operation – IDT70V07S Active: 300mW (typ.) Standby: 3.3mW (typ.) – IDT70V07L Active: 300mW (typ.) Standby: 660μW (typ.) Interrupt Flag ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ IDT70V07 easily expands data bus width to 16 bits or more using the Master/Slave select when cascading more than one device M/S = VIH for BUSY output flag on Master M/S = VIL for BUSY input on Slave On-chip port arbitration logic Full on-chip hardware support of semaphore signaling between ports Fully asynchronous operation from either port TTL-compatible, single 3.3V (±0.3V) power supply Available in 68-pin PGA and a 80-pin TQFP Industrial temperature range (-40°C to +85°C) is available for selected speeds Green parts available, see ordering information Functional Block Diagram OEL OER CEL R/WL CER R/WR I/O0L- I/O7L I/O Control I/O0R-I/O7R I/O Control , (1,2) BUSYL A14L A0L (1,2) BUSYR Address Decoder MEMORY ARRAY 15 CEL OEL R/WL SEML (2) INTL Address Decoder A14R A0R 15 ARBITRATION INTERRUPT SEMAPHORE LOGIC M/S CER OER R/WR SEMR INTR(2) 2943 drw 01 NOTES: 1. (MASTER): BUSY is output; (SLAVE): BUSY is input. 2. BUSY and INT outputs are non-tri-stated push-pull. JULY 2019 1 DSC 2943/11 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Description address, and I/O pins that permit independent, asynchronous access for reads or writes to any location in memory. An automatic power down feature controlled by CE permits the on-chip circuitry of each port to enter a very low standby power mode. Fabricated using CMOS high-performance technology, these devices typically operate on only 300mW of power. The IDT70V07 is packaged in a ceramic 68-pin PGA and a 80-pin thin quad flatpack (TQFP). The IDT70V07 is a high-speed 32K x 8 Dual-Port Static RAM. The IDT70V07 is designed to be used as a stand-alone 256K-bit Dual-Port RAM or as a combination MASTER/SLAVE Dual-Port RAM for 16-bitor-more word systems. Using the IDT MASTER/SLAVE Dual-Port RAM approach in 16-bit or wider memory system applications results in fullspeed, error-free operation without the need for additional discrete logic. This device provides two independent ports with separate control, I/O1L I/O0L N/C OEL R/WL SEML CEL A14L A13L VCC A12L A11L A10L A9L A8L A7L A6L Pin Configurations(1,2,3) 10/25/01 INDEX 9 10 8 7 6 5 4 1 68 67 66 65 64 63 62 61 60 11 59 12 58 13 57 14 56 15 16 17 18 19 3 2 IDT70V07J J68-1(4) 55 54 53 68-Pin PLCC Top View(5) 52 51 20 50 21 49 22 48 23 47 24 46 25 45 44 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O7R N/C OER R/WR SEMR CER A14R A13R GND A12R A11R A10R A9R A8R A7R A6R A5R I/O2L I/O3L I/O4L I/O5L GND I/O6L I/O7L VCC GND I/O0R I/O1R I/O2R VCC I/O3R I/O4R I/O5R I/O6R NOTES: 1. All VCC pins must be connected to power supply. 2. All GND pins must be connected to ground. 3. J68-1 package body is approximately .95 in x .95 in x .17 in. 4. This package code is used to reference the package diagram. 5. This text does not indicate orientation of the actual part-marking. 2 A5L A4L A3L A2L A1L A0L INTL BUSYL GND M/S BUSYR INTR A0R A1R A2R A3R A4R 2943 drw 02 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges N/C A5L A4L A3L A2L A1L A0L INTL BUSYL GND M/S BUSYR INTR A0R A1R A2R A3R A4R N/C N/C Pin Configurations(1,2,3) (con't.) N/C N/C A6L A7L A8L A9L A10L A11L A12L VCC A13L A14L N/C CEL SEML R/WL OEL N/C I/O0L I/O1L 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 61 39 62 38 63 37 64 36 65 35 66 34 67 33 68 32 69 70V07 (4) 31 70 PNG80 30 71 29 72 80-PinTQFP 28 73 27 74 Top View 75 26 76 25 77 24 78 23 22 79 21 80 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 N/C N/C A5R A6R A7R A8R A9R A10R A11R A12R GND A13R A14R N/C CER SEMR R/WR OER N/C I/O7R N/C I/O2L I/O3L I/O4L I/O5L GND I/O6L I/O7L VCC N/C GND I/O0R I/O1R I/O2R VCC I/O3R I/O4R I/O5R I/O6R N/C 2943 drw 03 NOTES: 1. All VCC pins must be connected to power supply. 2. All GND pins must be connected to ground. 3. PN80-1 package body is approximately 14mm x 14mm x 1.4mm. 4. This package code is used to reference the package diagram. 3 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Pin Configurations(1,2,3) (con't.) 11 51 A5L 50 A4L 48 A2L 46 44 42 A0L BUSYL M/S 40 38 INTR A1R 36 A3R 49 A3L 47 A1L 45 43 41 39 37 INTL GND BUSYR A0R A2R 35 A4R 34 A5R 10 53 A7L 52 A6L 09 55 A9L 54 A8L 32 A7R 33 A6R 08 57 56 A11L A10L 30 A9R 31 A8R 07 59 58 VCC A12L 06 61 A14L 05 63 62 SEML CEL 04 65 64 OEL R/WL 22 23 SEMR CER 03 67 66 I/O0L N/C 20 OER 02 1 3 68 I/O1L I/O2L I/O4L 60 A13L A B 26 GND 68-Pin PGA Top View(5) C D E 10 12 14 16 I/O0R I/O2R I/O3R I/O5R F 27 A12R 24 25 A14R A13R 5 7 9 11 13 15 GND I/O7L GND I/O1R VCC I/O4R 2 4 6 8 I/O3L I/O5L I/O6L VCC 01 28 29 A11R A10R 70V07 GU68(4) G H 21 R/WR 18 19 I/O7R N/C , 17 I/O6R J K L INDEX 2943 drw 04 NOTES: 1. All VCC pins must be connected to power supply. 2. All GND pins must be connected to ground. 3. Package body is approximately 1.18 in x 1.18 in x .16 in. 4. This package code is used to reference the package diagram. 5. This text does not indicate orientation of the actual part-marking. Pin Names Left Port Right Port Names CEL CER Chip Enable R/WL R/WR Read/Write Enable OEL OER Output Enable A0L - A14L A0R - A14R Address I/O0L - I/O7L I/O0R - I/O7R Data Input/Output SEML SEMR Semaphore Enable INTL INTR Interrupt Flag BUSYL BUSYR Busy Flag M/S Master or Slave Select VCC Power (3.3V) GND Ground (0V) 2943 tbl 01 4 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Truth Table I: Non-Contention Read/Write Control Inputs(1) Outputs CE R/W OE SEM I/O0-7 Mode H X X H High-Z Deselected: Power-Down L L X H DATAIN Write to Memory L H L H DATAOUT X X H X High-Z Read Memory Outputs Disabled 2943 tbl 02 NOTE: 1. A0L — A14L ≠ A0R — A14R Truth Table II: Semaphore Read/Write Control Inputs(1) Outputs CE R/W OE SEM I/O0-7 Mode H H L L DATAOUT Read Data in Semaphore Flag H ↑ X L DATAIN Write I/O0 into Semaphore Flag L X X L ____ Not Allowed 2943 tbl 03 NOTE: 1. There are eight semaphore flags written to via I/O0 and read from all I/O's (I/O0-I/O7). These eight semaphores are addressed by A0-A2 Absolute Maximum Ratings(1) Symbol Rating Commercial & Industrial Unit Maximum Operating Temperature and Supply Voltage(1) Grade VTERM(2) Terminal Voltage with Respect to GND -0.5 to +4.6 V TBIAS(3) Temperature Under Bias -55 to +125 o C TSTG StorageTemperature -65 to +150 o C TJN Junction Temperature +150 o C IOUT DC Output Current 50 Commercial Industrial COUT(2) Output Capacitance 0V 3.3V + 0.3 -40OC to +85OC 0V 3.3V + 0.3 Recommended DC Operating Conditions(2) Symbol (TA = +25°C, f = 1.0MHz) TQFP Only Input Capacitance 0OC to +70OC mA Capacitance(1) CIN Vcc 2943 tbl 05 2943 tbl 04 Parameter GND NOTES: 1. This is the parameter TA. This is the "instant on" case temperature. NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed Vcc + 0.3V. 3. Ambient Temperature Under Bias. No AC Conditions. Chip Deselected. Symbol Ambient Temperature Conditions Max. Unit VIN = 0V 9 pF VOUT = 0V 10 Parameter Min. Typ. Max. Unit 3.0 3.3 3.6 V 0 0 0 V V VCC Supply Voltage GND Ground VIH Input High Voltage 2.0 ____ VCC+0.3(2) VIL Input Low Voltage -0.3(1) ____ 0.8 NOTES: 1. VIL > -1.5V for pulse width less than 10ns. 2. VTERM must not exceed Vcc + 0.3V. pF 2943 tbl 07 NOTES: 1. This parameter is determined by device characterization but is not production tested. 2. COUT also references CI/O. 5 V 2943 tbl 06 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range (VCC = 3.3V ± 0.3V) 70V07S Symbol Parameter Min. Max. Min. Max. Unit VCC = 3.6V, VIN = 0V to V CC ___ 10 ___ 5 µA Output Leakage Current CE = VIH, VOUT = 0V to V CC ___ 10 ___ 5 µA VOL Output Low Voltage IOL = +4mA ___ 0.4 ___ 0.4 V VOH Output High Voltage IOH = -4mA 2.4 ___ 2.4 ___ |ILI| (1) Input Leakage Current |ILO| Test Conditions 70V07L V 2943 tbl 08 NOTE: 1. At VCC < 2.0V, input leakages are undefined. DC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(1) (VCC = 3.3V ± 0.3V) 70V07X25 Com'l & Ind Symbol ICC ISB1 ISB2 ISB3 ISB4 Parameter Dynamic Operating Current (Both Ports Active) Standby Current (Both Ports - TTL Level Inputs) Standby Current (One Port - TTL Level Inputs) Full Standby Current (Both Ports CMOS Level Inputs) Full Standby Current (One Port CMOS Level Inputs) Test Condition Version 70V07X35 Com'l & Ind 70V07X55 Com'l Only Typ.(2) Max. Typ.(2) Max. Typ.(2) Max. Unit 170 140 90 90 140 120 90 90 140 120 mA COM'L S L 100 100 IND S L ____ ____ ____ ____ ____ ____ 100 185 90 155 ____ ____ COM'L S L 14 12 30 24 12 10 30 24 12 10 30 24 IND S L ____ ____ ____ ____ ____ ____ 12 50 10 50 ____ ____ COM'L S L 50 50 95 85 45 45 87 75 45 45 87 75 IND S L ____ ____ ____ ____ ____ ____ 50 105 45 95 ____ ____ Both Ports CEL and CER > VCC - 0.2V, VIN > VCC - 0.2V or VIN < 0.2V, f = 0(4) SEMR = SEML > VCC - 0.2V COM'L S L 1.0 0.2 6 3 1.0 0.2 6 3 1.0 0.2 6 3 IND S L ____ ____ ____ ____ ____ ____ 0.2 3 0.2 3 ____ ____ CE"A" < 0.2V and CE"B" > VCC - 0.2V(5) SEMR = SEML > VCC - 0.2V VIN > VCC - 0.2V or VIN < 0.2V Active Port Outputs Disabled, f = fMAX(3) COM'L S L 60 60 90 80 55 55 85 74 55 55 85 74 IND S L ____ ____ ____ ____ ____ ____ 60 90 55 85 ____ ____ CE = VIL, Outputs Disabled SEM = VIL f = fMAX(3) CER = CEL = VIH SEMR = SEML = VIH f = fMAX(3) CE"A" = VIL and CE"B" = VIH(5) Active Port Outputs Disabled, f=fMAX(3) SEMR = SEML = VIH mA mA mA mA 2943 tbl 09 NOTES: 1. 'X' in part number indicates power rating (S or L). 2. VCC = 3.3V, TA = +25°C, and are not production tested. ICCDC = 80mA (Typ.) 3. At f = fMAX, address and control lines (except Output Enable) are cycling at the maximum frequency read cycle of 1/ tRC, and using “AC Test Conditions" of input levels of GND to 3V. 4. f = 0 means no address or control lines change. 5. Port "A" may be either left or right port. Port "B" is the opposite from port "A". 6 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges AC Test Conditions 3.3V Input Pulse Levels 3.3V GND to 3.0V Input Rise/Fall Times 3ns Input Timing Reference Levels 1.5V Output Reference Levels 1.5V Output Load 590Ω 590Ω DATAOUT BUSY INT DATAOUT 30pF 435Ω Figures 1 and 2 5pF* 435Ω 2943 tbl 10 2943 drw 06 2943 drw 05 Figure 2. Output Test Load (for tLZ, tHZ, tWZ, tOW) * Including scope and jig. Figure 1. AC Output Test Load AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(4) 70V07X25 Com'l & Ind Symbol Parameter 70V07X35 Com'l & Ind 70V07X55 Com'l Only Min. Max. Min. Max. Min. Max. Unit READ CYCLE tRC Read Cycle Time 25 ____ 35 ____ 55 ____ ns tAA Address Access Time ____ 25 ____ 35 ____ 55 ns tACE Chip Enable Access Time (3) ____ 25 ____ 35 ____ 55 ns tAOE Output Enable Access Time ____ 15 ____ 20 ____ 30 ns tOH Output Hold from Address Change 3 ____ 3 ____ 3 ____ ns tLZ Output Low-Z Time (1,2) 3 ____ 3 ____ 3 ____ ns tHZ Output High-Z Time (1,2) ____ 15 ____ 20 ____ 25 ns 0 ____ 0 ____ 0 ____ ns ____ 25 ____ 35 ____ 50 ns 15 ____ 15 ____ ns ____ 45 ____ 65 tPU Chip Enable to Power Up Time (2) (2) tPD Chip Disable to Power Down Time tSOP Semaphore Flag Update Pulse (OE or SEM) 15 ____ tSAA Semaphore Address Access Time ____ 35 NOTES: 1. Transition is measured 0mV from Low- or High-impedance voltage with Output Test Load (Figure 2). 2. This parameter is guaranteed by device characterization, but is not production tested. 3. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. 4. 'X' in part number indicates power rating (S or L). Timing of Power-Up Power-Down CE ICC tPU tPD ISB 2943 drw 07 7 ns 2943 tbl 11 , 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Waveform of Read Cycles(5) tRC ADDR tAA(4) (4) tACE CE tAOE (4) OE R/W tLZ (1) tOH (4) DATAOUT VALID DATA tHZ (2) BUSYOUT (3,4) 2943 drw 08 tBDD NOTES: 1. Timing depends on which signal is asserted last, OE or CE. 2. Timing depends on which signal is de-asserted first, CE or OE. 3. tBDD delay is required only in cases where the opposite port is completing a write operation to the same address location. For simultaneous read operations BUSY has no relation to valid output data. 4. Start of valid data depends on which timing becomes effective last tAOE, tACE, tAA or tBDD. 5. SEM = VIH. AC Electrical Characteristics Over the Operating Temperature and Supply Voltage(5) 70V07X35 Com'l & Ind 70V07X25 Com'l & Ind 70V07X55 Com'l Only Min. Max. Min. Max. Min. Max. Unit 25 ____ 35 ____ 55 ____ ns tEW Chip Enable to End-of-Write (3) 20 ____ 30 ____ 45 ____ ns tAW Address Valid to End-of-Write 20 ____ 30 ____ 45 ____ ns 0 ____ 0 ____ 0 ____ ns ns Symbol Parameter WRITE CYCLE tWC Write Cycle Time (3) tAS Address Set-up Time tWP Write Pulse Width 20 ____ 25 ____ 40 ____ tWR Write Recovery Time 0 ____ 0 ____ 0 ____ ns tDW Data Valid to End-of-Write 15 ____ 20 ____ 30 ____ ns ____ 15 ____ 20 ____ 25 ns 0 ____ 0 ____ ns 20 ____ 25 ns ns ns tHZ tDH tWZ tOW tSWRD tSPS Output High-Z Time Data Hold Time (1,2) (4) 0 ____ (1,2) ____ 15 ____ (1,2,4) 0 ____ 0 ____ 0 ____ SEM Flag Write to Read Time 5 ____ 5 ____ 5 ____ SEM Flag Contention Window 5 ____ 5 ____ 5 ____ Write Enable to Output in High-Z Output Active from End-of-Write ns 2943 tbl 12 NOTES: 1. Transition is measured 0mV from Low or High impedance voltage with Output Test Load (Figure 2). 2. This parameter is guaranteed by device characterization, but is not production tested. 3. To access RAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. Either condition must be valid for the entire tEW time. 4. The specification for tDH must be met by the device supplying write data to the SRAM under all operating conditions. Although tDH and tOW values will vary over voltage and temperature, the actual tDH will always be smaller than the actual tOW. 5. 'X' in part number indicates power rating (S or L). 8 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8) tWC ADDRESS tHZ (7) OE tAW (9) tHZ (7) CE or SEM tAS (6) tWR (3) tWP (2) R/W tLZ DATAOUT tWZ (7) tOW (4) (4) tDW tDH DATAIN , 2943 drw 09 Timing Waveform of Write Cycle No. 2, CE Controlled Timing(1,5) tWC ADDRESS tAW (9) CE or SEM tAS (6) (3) tEW (2) tWR R/W tDW tDH DATAIN 2943 drw 10 NOTES: 1. R/W or CE must be HIGH during all address transitions. 2. A write occurs during the overlap (tEW or tWP) of a LOW CE and a LOW R/W for memory array writing cycle. 3. tWR is measured from the earlier of CE or R/W (or SEM or R/W) going HIGH to the end of write cycle. 4. During this period, the I/O pins are in the output state and input signals must not be applied. 5. If the CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition, the outputs remain in the High-impedance state. 6. Timing depends on which enable signal is asserted last, CE or R/W. 7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with the Output Test Load (Figure 2). 8. If OE is LOW during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be placed on the bus for the required tDW. If OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as the specified tWP. 9. To access SRAM, CE = VIL and SEM = VIH. To access semaphore, CE = VIH and SEM = VIL. tEW must be met for either condition. 9 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Semaphore Read after Write Timing, Either Side(1) tSAA A0-A2 VALID ADDRESS tAW tOH VALID ADDRESS tWR tACE tEW SEM tDW DATA0 tSOP DATAOUT VALID(2) DATAIN VALID tAS tWP tDH R/W tSWRD OE tAOE tSOP Write Cycle Read Cycle 2943 drw 11 NOTES: 1. CE = VIH for the duration of the above timing (both write and read cycle). 2. “DATAOUT VALID” represents all I/O's (I/O0-I/O7) equal to the semaphore value. Timing Waveform of Semaphore Write Contention(1,3,4) A0"A"-A2"A" (2) SIDE "A" MATCH R/W"A" SEM"A" tSPS A0"B"-A2"B" (2) SIDE "B" MATCH R/W"B" SEM"B" 2943 drw 12 NOTES: 1. DOR = DOL = VIL, CER = CEL = VIH. 2. All timing is the same for left and right ports. Port "A" may be either left or right port. "B" is the opposite from port "A". 3. This parameter is measured from R/W"A" or SEM"A" going HIGH to R/WB or SEM"B" going HIGH. 4. If tSPS is not satisfied, the semaphore will fall positively to one side or the other, but there is no guarantee which side will obtain the flag. 10 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(6) 70V07X25 Com'l & Ind Symbol Parameter 70V07X35 Com'l & Ind 70V07X55 Com'l Only Min. Max. Min. Max. Min. Max. Unit BUSY TIMING (M/S = VIH) tBAA BUSY Access Time from Address ____ 25 ____ 35 ____ 45 ns tBDA BUSY Disable Time from Address ____ 25 ____ 35 ____ 45 ns BUSY Access Time from Chip Enable ____ 25 ____ 35 ____ 45 ns BUSY Disable Time from Chip Enable ____ 25 ____ 35 ____ 45 ns 5 ____ 5 ____ 5 ____ ns ____ 35 ____ 40 ____ 50 ns 0 ____ 0 ____ 0 ____ ns 20 ____ 25 ____ 25 ____ ns tBAC tBDC tAPS tBDD Arbitration Priority Set-up Time BUSY Disable to Valid Data (2) (3) BUSY TIMING (M/S - VIL) tWB tWH BUSY Input to Write (4) Write Hold After BUSY (5) PORT-TO-PORT DELAY TIMING tWDD Write Pulse to Data Delay (1) ____ 55 ____ 65 ____ 85 ns tDDD Write Data Valid to Read Data Delay (1) ____ 50 ____ 60 ____ 80 ns 2943 tbl 13 NOTES: 1. Port-to-port delay through RAM cells from writing port to reading port, refer to "Timing Waveform of Write with Port-to-Port Read and BUSY". 2. To ensure that the earlier of the two ports wins. 3. tBDD is a calculated parameter and is the greater of 0, tWDD – tWP (actual) or tDDD – tDW (actual). 4. To ensure that the write cycle is inhibited on port "B" during contention on port "A". 5. To ensure that a write cycle is completed on port "B" after contention on port "A". 6. 'X' in part numbers indicates power rating (S or L). Timing Waveform of Write with Port-to-Port Read and BUSY(2,4,5) tWC ADDR"A" MATCH tWP R/W"A" tDW DATAIN "A" tDH VALID tAPS (1) ADDR"B" MATCH tBDA tBAA tBDD BUSY"B" tWDD DATAOUT "B" VALID (3) tDDD NOTES: 1. To ensure that the earlier of the two ports wins. tAPS is ignored for M/S = VIL (SLAVE). 2. CEL = CER = VIL 3. OE = VIL for the reading port. 4. If M/S = VIL (SLAVE), then BUSY is an input (BUSY"A" = VIH and BUSY"B" = "don't care", for this example). 5. All timing is the same for left and right ports. Port "A" may be either the left or right port. Port "B" is the port opposite from port "A". 11 2943 drw 13 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Timing Waveform of Write with BUSY tWP R/W"A" tWB BUSY"B" tWH R/W"B" (1) (2) NOTES: 1. tWH must be met for both BUSY input (SLAVE) and output (MASTER). 2. BUSY is asserted on Port "B" blocking R/W"B", until BUSY"B" goes HIGH. 2943 drw 14 Waveform of BUSY Arbitration Controlled by CE Timing(1) ADDR"A" and "B" ADDRESSES MATCH CE"A" tAPS (2) CE"B" tBAC tBDC BUSY"B" 2943 drw 15 Waveform of BUSY Arbitration Cycle Controlled by Address Match Timing(1) ADDR"A" ADDRESS "N" tAPS ADDR"B" (2) MATCHING ADDRESS "N" tBAA tBDA BUSY"B" 2943 drw 16 NOTES: 1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from Port “A”. 2. If tAPS is not satisfied, the BUSY signal will be asserted on one side or the other, but there is no guarantee on which side busy will be asserted. 12 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges AC Electrical Characteristics Over the Operating Temperature and Supply Voltage Range(1) 70V07X35 Com'l & Ind 70V07X25 Com'l & Ind Symbol Parameter 70V07X55 Com'l Only Min. Max. Min. Max. Min. Max. Unit INTERRUPT TIMING tAS Address Set-up Time 0 ____ 0 ____ 0 ____ ns tWR Write Recovery Time 0 ____ 0 ____ 0 ____ ns tINS Interrupt Set Time ____ 25 ____ 30 ____ 40 ns tINR Interrupt Reset Time ____ 30 ____ 35 ____ 45 ns 2043 tbl 14 NOTE: 1. 'X' in part number indicates power rating (S or L). Waveform of Interrupt Timing(1) tWC INTERRUPT SET ADDRESS ADDR"A" tAS (3) (2) tWR (4) CE"A" R/W"A" tINS (3) INT"B" 2943 drw 17 tRC ADDR"B" INTERRUPT CLEAR ADDRESS (2) tAS (3) CE"B" OE"B" tINR (3) INT"B" 2943 drw 18 NOTES: 1. All timing is the same for left and right ports. Port “A” may be either the left or right port. Port “B” is the port opposite from port “A”. 2. See Interrupt Truth Table III. 3. Timing depends on which enable signal (CE or R/W) is asserted last. 4. Timing depends on which enable signal (CE or R/W) is de-asserted first. 13 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Truth Table III — Interrupt Flag(1) Left Port Right Port R/WL CEL OEL A14L-A0L INTL R/WR CER OER A14R-A0R INTR L L X 7FFF X X X X X L X X X X X X L L 7FFF H Reset Right INTR Flag X X X X L L L X 7FFE X Set Left INTL Flag X L L 7FFE H X X X X X Reset Left INTL Flag (3) (2) (2) (3) Function Set Right INTR Flag 2943 tbl 15 NOTES: 1. Assumes BUSYL = BUSYR =VIH. 2. If BUSYL = VIL, then no change. 3. If BUSYR = VIL, then no change. Truth Table IV — Address BUSY Arbitration Inputs Outputs CEL CER A0L-A14L A0R-A14R BUSYL(1) BUSYR(1) Function X X NO MATCH H H Normal H X MATCH H H Normal X H MATCH H H Normal L L MATCH (2) (2) Write Inhibit(3) 2943 tbl 16 NOTES: 1. Pins BUSYL and BUSYR are both outputs when the part is configured as a master. Both are inputs when configured as a slave. BUSY outputs on the IDT70V07 are pushpull, not open drain outputs. On slaves the BUSY input internally inhibits writes. 2. "L" if the inputs to the opposite port were stable prior to the address and enable inputs of this port. "H" if the inputs to the opposite port became stable after the address and enable inputs of this port. If tAPS is not met, either BUSYL or BUSYR = LOW will result. BUSYL and BUSYR outputs can not be LOW simultaneously. 3. Writes to the left port are internally ignored when BUSYL outputs are driving LOW regardless of actual logic level on the pin. Writes to the right port are internally ignored when BUSYR outputs are driving LOW regardless of actual logic level on the pin. Truth Table V — Example of Semaphore Procurement Sequence(1,2,3) Functions D0 - D7 Left D0 - D7 Right Status No Action 1 1 Semaphore free Left Port Writes "0" to Semaphore 0 1 Left port has semaphore token Right Port Writes "0" to Semaphore 0 1 No change. Right side has no write access to semaphore Left Port Writes "1" to Semaphore 1 0 Right port obtains semaphore token Left Port Writes "0" to Semaphore 1 0 No change. Left port has no write access to semaphore Right Port Writes "1" to Semaphore 0 1 Left port obtains semaphore token Left Port Writes "1" to Semaphore 1 1 Semaphore free Right Port Writes "0" to Semaphore 1 0 Right port has semaphore token Right Port Writes "1" to Semaphore 1 1 Semaphore free Left Port Writes "0" to Semaphore 0 1 Left port has semaphore token Left Port Writes "1" to Semaphore 1 1 Semaphore free NOTES: 1. This table denotes a sequence of events for only one of the eight semaphores on the IDT70V07. 2. There are eight semaphore flags written to via I/O0 and read from all I/O's (I/O0 - I/O7). These eight semaphores are addressed by A0 -A2. 3. CE = VIH, SEM = VIL to access the semaphores. Refer to the Semaphore Read/Write Control Truth Table. 14 2943 tbl 17 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Functional Description programmed by tying the BUSY pins HIGH. If desired, unintended write operations can be prevented to a port by tying the BUSY pin for that port LOW. The BUSY outputs on the IDT 70V07 RAM in master mode, are push-pull type outputs and do not require pull up resistors to operate. If these RAMs are being expanded in depth, then the BUSY indication for the resulting array requires the use of an external AND gate. The IDT70V07 provides two ports with separate control, address and I/O pins that permit independent access for reads or writes to any location in memory. The IDT70V07 has an automatic power down feature controlled by CE. The CE controls on-chip power down circuitry that permits the respective port to go into a standby mode when not selected (CE HIGH). When a port is enabled, access to the entire memory array is permitted. Width Expansion with BUSY Logic Master/Slave Arrays Interrupts When expanding an IDT70V07 RAM array in width while using BUSY logic, one master part is used to decide which side of the RAM array will receive a BUSY indication, and to output that indication. Any number of slaves to be addressed in the same address range as the master, use the BUSY signal as a write inhibit signal. Thus on the IDT70V07 RAM the BUSY pin is an output if the part is used as a master (M/S pin = VIH), and the BUSY pin is an input if the part used as a slave (M/S pin = VIL) as shown in Figure 3. If two or more master parts were used when expanding in width, a split decision could result with one master indicating BUSY on one side of the array and another master indicating BUSY on one other side of the array. This would inhibit the write operations from one port for part of a word and inhibit the write operations from the other port for the other part of the word. The BUSY arbitration, on a master, is based on the chip enable and address signals only. It ignores whether an access is a read or write. In a master/slave array, both address and chip enable must be valid long enough for a BUSY flag to be output from the master before the actual write pulse can be initiated with the R/W signal. Failure to observe this timing can result in a glitched internal write inhibit signal and corrupted data in the slave. MASTER Dual Port RAM BUSYL BUSYL MASTER Dual Port RAM BUSYL CE BUSYR CE BUSYR SLAVE Dual Port RAM BUSYL SLAVE Dual Port RAM BUSYL CE BUSYR DECODER If the user chooses the interrupt function, a memory location (mail box or message center) is assigned to each port. The left port interrupt flag (INTL) is asserted when the right port writes to memory location 7FFE (HEX), where a write is defined as CER = R/WR = VIL per Truth Table III. The left port clears the interrupt through access of address location 7FFE when CEL = OEL = VIL, R/W is a "don't care". Likewise, the right port interrupt flag (INTR) is asserted when the left port writes to memory location 7FFF (HEX) and to clear the interrupt flag (INTR), the right port must read the memory 7FFF location 7FFF. The message (8 bits) at 7FFE or 7FFF is user-defined since it is an addressable SRAM location. If the interrupt function is not used, address locations 7FFE and 7FFF are not used as mail boxes, but as part of the random access memory. Refer to Truth Table III for the interrupt operation. CE BUSYR Semaphores BUSYR , 2943 drw 19 Figure 3. Busy and chip enable routing for both width and depth expansion with IDT70V07 RAMs. Busy Logic Busy Logic provides a hardware indication that both ports of the SRAM have accessed the same location at the same time. It also allows one of the two accesses to proceed and signals the other side that the SRAM is “busy”. The busy pin can then be used to stall the access until the operation on the other side is completed. If a write operation has been attempted from the side that receives a BUSY indication, the write signal is gated internally to prevent the write from proceeding. The use of BUSY logic is not required or desirable for all applications. In some cases it may be useful to logically OR the BUSY outputs together and use any BUSY indication as an interrupt source to flag the event of an illegal or illogical operation. If the write inhibit function of BUSY logic is not desirable, the BUSY logic can be disabled by placing the part in slave mode with the M/S pin. Once in slave mode the BUSY pin operates solely as a write inhibit input pin. Normal operation can be 15 The IDT70V07 is an extremely fast Dual-Port 32K x 8 CMOS Static RAM with an additional 8 address locations dedicated to binary semaphore flags. These flags allow either processor on the left or right side of the Dual-Port SRAM to claim a privilege over the other processor for functions defined by the system designer’s software. As an example, the semaphore can be used by one processor to inhibit the other from accessing a portion of the Dual-Port SRAM or any other shared resource. The Dual-Port SRAM features a fast access time, and both ports are completely independent of each other. This means that the activity on the left port in no way slows the access time of the right port. Both ports are identical in function to standard CMOS Static RAM and can be read from, or written to, at the same time with the only possible conflict arising from the simultaneous writing of, or a simultaneous READ/WRITE of, a non-semaphore location. Semaphores are protected against such ambiguous situations and may be used by the system program to avoid any conflicts in the non-semaphore portion of the Dual-Port SRAM. These devices have an automatic powerdown feature controlled by CE, the Dual-Port SRAM enable, and SEM, the semaphore enable. The CE and SEM pins control on-chip power down circuitry that permits the respective port to go into standby mode when not selected. This is the condition which is shown in Truth Table 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges I where CE and SEM are both HIGH. Systems which can best use the IDT70V07 contain multiple processors or controllers and are typically very high-speed systems which are software controlled or software intensive. These systems can benefit from a performance increase offered by the IDT70V07's hardware semaphores, which provide a lockout mechanism without requiring complex programming. Software handshaking between processors offers the maximum in system flexibility by permitting shared resources to be allocated in varying configurations. The IDT70V07 does not use its semaphore flags to control any resources through hardware, thus allowing the system designer total flexibility in system architecture. An advantage of using semaphores rather than the more common methods of hardware arbitration is that wait states are never incurred in either processor. This can prove to be a major advantage in very high-speed systems. semaphore flags useful in interprocessor communications. (A thorough discussion on the use of this feature follows shortly.) A zero written into the same location from the other side will be stored in the semaphore request L PORT R PORT SEMAPHORE REQUEST FLIP FLOP D0 D Q SEMAPHORE REQUEST FLIP FLOP Q WRITE D0 WRITE SEMAPHORE READ SEMAPHORE READ Figure 4. IDT70V07 Semaphore Logic How the Semaphore Flags Work D , 2943 drw 20 latch for that side until the semaphore is freed by the first side. When a semaphore flag is read, its value is spread into all data bits so that a flag that is a one reads as a one in all data bits and a flag containing a zero reads as all zeros. The read value is latched into one side’s output register when that side's semaphore select (SEM) and output enable (OE) signals go active. This serves to disallow the semaphore from changing state in the middle of a read cycle due to a write cycle from the other side. Because of this latch, a repeated read of a semaphore in a test loop must cause either signal (SEM or OE) to go inactive or the output will never change. A sequence WRITE/READ must be used by the semaphore in order to guarantee that no system level contention will occur. A processor requests access to shared resources by attempting to write a zero into a semaphore location. If the semaphore is already in use, the semaphore request latch will contain a zero, yet the semaphore flag will appear as one, a fact which the processor will verify by the subsequent read (see Truth Table V). As an example, assume a processor writes a zero to the left port at a free semaphore location. On a subsequent read, the processor will verify that it has written successfully to that location and will assume control over the resource in question. Meanwhile, if a processor on the right side attempts to write a zero to the same semaphore flag it will fail, as will be verified by the fact that a one will be read from that semaphore on the right side during subsequent read. Had a sequence of READ/WRITE been used instead, system contention problems could have occurred during the gap between the read and write cycles. It is important to note that a failed semaphore request must be followed by either repeated reads or by writing a one into the same location. The reason for this is easily understood by looking at the simple logic diagram of the semaphore flag in Figure 4. Two semaphore request latches feed into a semaphore flag. Whichever latch is first to present a zero to the semaphore flag will force its side of the semaphore flag LOW and the other side HIGH. This condition will continue until a one is written to the same semaphore request latch. Should the other side’s semaphore request latch have been written to a zero in the meantime, the semaphore flag will flip over to the other side as soon as a one is written into the first side’s request latch. The second side’s flag will now stay LOW until its semaphore request latch is written to a one. From this it is easy to understand that, if a semaphore The semaphore logic is a set of eight latches which are independent of the Dual-Port SRAM. These latches can be used to pass a flag, or token, from one port to the other to indicate that a shared resource is in use. The semaphores provide a hardware assist for a use assignment method called “Token Passing Allocation.” In this method, the state of a semaphore latch is used as a token indicating that shared resource is in use. If the left processor wants to use this resource, it requests the token by setting the latch. This processor then verifies its success in setting the latch by reading it. If it was successful, it proceeds to assume control over the shared resource. If it was not successful in setting the latch, it determines that the right side processor has set the latch first, has the token and is using the shared resource. The left processor can then either repeatedly request that semaphore’s status or remove its request for that semaphore to perform another task and occasionally attempt again to gain control of the token via the set and test sequence. Once the right side has relinquished the token, the left side should succeed in gaining control. The semaphore flags are active LOW. A token is requested by writing a zero into a semaphore latch and is released when the same side writes a one to that latch. The eight semaphore flags reside within the IDT70V07 in a separate memory space from the Dual-Port SRAM. This address space is accessed by placing a LOW input on the SEM pin (which acts as a chip select for the semaphore flags) and using the other control pins (Address, OE, and R/W) as they would be used in accessing a standard Static RAM. Each of the flags has a unique address which can be accessed by either side through address pins A0 – A2. When accessing the semaphores, none of the other address pins has any effect. When writing to a semaphore, only data pin D0 is used. If a LOW level is written into an unused semaphore location, that flag will be set to a zero on that side and a one on the other side (see Truth Table V). That semaphore can now only be modified by the side showing the zero. When a one is written into the same location from the same side, the flag will be set to a one for both sides (unless a semaphore request from the other side is pending) and then can be written to by both sides. The fact that the side which is able to write a zero into a semaphore subsequently locks out writes from the other side is what makes 16 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges is requested and the processor which requested it no longer needs the resource, the entire system can hang up until a one is written into that semaphore request latch. The critical case of semaphore timing is when both sides request a single token by attempting to write a zero into it at the same time. The semaphore logic is specially designed to resolve this problem. If simultaneous requests are made, the logic guarantees that only one side receives the token. If one side is earlier than the other in making the request, the first side to make the request will receive the token. If both requests arrive at the same time, the assignment will be arbitrarily made to one port or the other. One caution that should be noted when using semaphores is that semaphores alone do not guarantee that access to a resource is secure. As with any powerful programming technique, if semaphores are misused or misinterpreted, a software error can easily happen. Initialization of the semaphores is not automatic and must be handled via the initialization program at power-up. Since any semaphore request flag which contains a zero must be reset to a one, all semaphores on both sides should have a one written into them at initialization from both sides to assure that they will be free when needed. side. Once the left side was finished with its task, it would write a one to Semaphore 0 and may then try to gain access to Semaphore 1. If Semaphore 1 was still occupied by the right side, the left side could undo its semaphore request and perform other tasks until it was able to write, then read a zero into Semaphore 1. If the right processor performs a similar task with Semaphore 0, this protocol would allow the two processors to swap 16K blocks of Dual-Port SRAM with each other. The blocks do not have to be any particular size and can even be variable, depending upon the complexity of the software using the semaphore flags. All eight semaphores could be used to divide the Dual-Port SRAM or other shared resources into eight parts. Semaphores can even be assigned different meanings on different sides rather than being given a common meaning as was shown in the example above. Semaphores are a useful form of arbitration in systems like disk interfaces where the CPU must be locked out of a section of memory during a transfer and the I/O device cannot tolerate any wait states. With the use of semaphores, once the two devices has determined which memory area was “off-limits” to the CPU, both the CPU and the I/O devices could access their assigned portions of memory continuously without any wait states. Semaphores are also useful in applications where no memory “WAIT” state is available on one or both sides. Once a semaphore handshake has been performed, both processors can access their assigned SRAM segments at full speed. Another application is in the area of complex data structures. In this case, block arbitration is very important. For this application one processor may be responsible for building and updating a data structure. The other processor then reads and interprets that data structure. If the interpreting processor reads an incomplete data structure, a major error condition may exist. Therefore, some sort of arbitration must be used between the two different processors. The building processor arbitrates for the block, locks it and then is able to go in and update the data structure. When the update is completed, the data structure block is released. This allows the interpreting processor to come back and read the complete data structure, thereby guaranteeing a consistent data structure. Using Semaphores—Some Examples Perhaps the simplest application of semaphores is their application as resource markers for the IDT70V07’s Dual-Port SRAM. Say the 32K x 8 SRAM was to be divided into two 16K x 8 blocks which were to be dedicated at any one time to servicing either the left or right port. Semaphore 0 could be used to indicate the side which would control the lower section of memory, and Semaphore 1 could be defined as the indicator for the upper section of memory. To take a resource, in this example the lower 16K of Dual-Port SRAM, the processor on the left port could write and then read a zero in to Semaphore 0. If this task were successfully completed (a zero was read back rather than a one), the left processor would assume control of the lower 16K. Meanwhile the right processor was attempting to gain control of the resource after the left processor, it would read back a one in response to the zero it had attempted to write into Semaphore 0. At this point, the software could choose to try and gain control of the second 16K section by writing, then reading a zero into Semaphore 1. If it succeeded in gaining control, it would lock out the left 17 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Ordering Information XXXXX A 999 A Device Type Power Speed Package A A A Process/ Temperature Range Blank 8 Tray Tape and Reel Blank I(1) Commercial (0°C to +70°C) Industrial (-40°C to +85°C) G(2) Green PF G 80-pin TQFP (PNG80) 68-pin PGA (GU68) 25 35 55 Commercial Only Commercial & Industrial Commercial Only S L Standard Power Low Power 70V07 256K (32K x 8) 3.3V Dual-Port RAM Speed in nanoseconds 2943 drw 21 NOTES: 1. Contact your local sales office for Industrial temp range in other speeds, packages and powers. 2. Green parts available. For specific speeds, packages and powers contact your local sales office. LEAD FINISH (SnPb) parts are Obsolete excluding PGA. Product Discontinuation Notice - PDN# SP-17-02 Note that information regarding recently obsoleted parts are included in this datasheet for customer convenience. Orderable Part Information Speed (ns) 25 35 55 Pkg. Code Pkg. Type Temp. Grade Speed (ns) 70V07L25PFG PNG80 TQFP C 35 70V07L25PFG8 PNG80 TQFP C 55 GU68 PGA C Orderable Part ID 70V07L35G 70V07L35PFGI PNG80 TQFP I 70V07L35PFGI8 PNG80 TQFP I GU68 PGA C 70V07L55G 18 Pkg. Code Pkg. Type Temp. Grade 70V07S35G GU68 PGA C 70V07S55G GU68 PGA C Orderable Part ID 70V07S/L High-Speed 32K x 8 Dual-Port Static RAM Industrial and Commercial Temperature Ranges Datasheet Document History 03/24/99: 06/09/99: 10/14/04: 01/29/09: 01/30/09: 06/28/12: 01/28/13: 03/19/18: 07/09/19: Initiated datasheet document history Converted to new format Cosmetic and typographical corrections Page 2 and 3 Added additional notes to pin configurations Changed drawing format Removed Preliminary status Page 1 Added I-temp offering Page 4 Updated Capacitance table Increased Storage Temp parameter in Absolute Maximum Rating table Added Junction Temp to Absolute Maximum Rating table Page 4, 5, 6, 7 & 10 Removed I-temp footnote from tables Page 5 Added I-temp 25ns power numbers to the DC Electrical Characteristics table DC Electrical parameters–changed wording from "open" to "disabled" Page 5 & 6 Changed transition measurement from ±200mV to 0mV in footnotes Page 6, 7, 10, & 12 Added I-temp to all AC Electrical Characteristics table Page 8 Updated Timing Waveform of Write Cycle No. 1, R/W Controlled Timing Page 1 & 17 Replaced old IDTTM logo with new IDTTM logo Page 17 Added I-temp to 25ns speed grade in ordering information Page 18 Removed "IDT" from orderable part number Page 1 Added green availability to features Page 18 Added green indicator to ordering information Page 17 Added T&R indicator to ordering information Page 1 Added 35ns to Industrial offering in Features section Page 2 Removed reference to IDT's fabrication of CMOS high-performance technology in Description section Page 6 Added 35ns Industrial Chars values to the DC Elec Chars table Page 7,8,11,13, &15 Added Industrial to the 70V07X35 column heading Page 18 Added Industrial to the 35ns speed grade in the ordering information Product Discontinuation Notice - PDN# SP-17-02 Last time buy expires June 15, 2018 Page 1 & 18 Deleted obsolete Industrial speed grade 25ns in Features and Ordering Information Page 3 Rotated PNG80 TQFP pin configuration to accurately reflect pin 1 orientation Page 1 & 18 Removed PLG68 PLCC package information Page 18 Added Orderable Part Information CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com The IDT logo is a registered trademark of Integrated Device Technology, Inc. 19 for Tech Support: 408-284-2794 DualPortHelp@idt.com IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. 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