71024S25TYG

CMOS Static RAM 1 Meg (128K x 8-Bit) Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ Description 128K x 8 advanced high-speed CMOS static RAM Commercial (0°C to +70°C), Industrial (–40°C to +85°C) Equal access and cycle times — Commercial and Industrial: 12/15/20ns Two Chip Selects plus one Output Enable pin Bidirectional inputs and outputs directly TTL-compatible Low power consumption via chip deselect Available in 300 and 400 mil Plastic SOJ. Industrial temperature range (–40°C to +85°C) is available for selected speeds Green parts available, see ordering information The IDT71024 is a 1,048,576-bit high-speed static RAM organized as 128K x 8. It is fabricated using high-performance, high-reliability CMOS technology. This state-of-the-art technology, combined with innovative circuit design techniques, provides a cost-effective solution for high-speed memory needs. The IDT71024 has an output enable pin which operates as fast as 6ns, with address access times as fast as 12ns available. All bidirectional inputs and outputs of the IDT71024 are TTL-compatible, and operation is from a single 5V supply. Fully static asynchronous circuitry is used; no clocks or refreshes are required for operation. The IDT71024 is packaged in 32-pin 300 mil Plastic SOJ and 32pin 400 mil Plastic SOJ. Functional Block Diagram 1 Mar. 30.21 71024S 71024 CMOS Static RAM 1 Meg (128K x 8-Bit) Commercial and Industrial Temperature Ranges Pin Configuration(1) Absolute Maximum Ratings(1) 1 2 3 4 5 71024 6 PJG32 7 PBG32 8 9 10 11 12 13 14 15 16 NC A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 SOJ Top View Symbol VCC A15 CS2 WE A13 A8 A9 A11 OE A10 CS1 I/O7 I/O6 I/O5 I/O4 I/O3 Unit Terminal Voltage with Respect to GND –0.5 to +7.0 V TBIAS Temperature Under Bias –55 to +125 o C TSTG Storage Temperature –55 to +125 o C PT Power Dissipation 1.25 W IOUT DC Output Current 50 mA 2964 tbl 02 NOTES: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. VTERM must not exceed VCC + 0.5V. 2964 drw 02 Capacitance (TA = +25°C, f = 1.0MHz, SOJ package) Parameter(1) Symbol Truth Table(1,3) CIN Input Capacitance CI/O I/O Capacitance Conditions Max. Unit VIN = 3dV 7 pF VOUT = 3dV 8 pF 2964 tbl 03 NOTE: 1. This parameter is guaranteed by device characterization, but is not production tested. Inputs WE CS1 CS2 OE I/O X H X X High-Z Deselected – Standby (ISB) X VHC(2) X X High-Z Deselected – Standby (ISB1) X X L X High-Z Deselected – Standby (ISB) Function X X VLC X High-Z Deselected – Standby (ISB1) H L H H High-Z Outputs Disabled H L H L DATAOUT Read Data L L H X DATAIN Write Data Recommended DC Operating Conditions Symbol Parameter VCC Supply Voltage GND Ground VIH Input High Voltage VIL Input Low Voltage Min. Typ. Max. Unit 4.5 5.0 5.5 V 0 0 0 V 2.2 ____ VCC+0.5 V ____ 0.8 (1) –0.5 2964 tbl 01 NOTES: 1. H = VIH, L = VIL, X = Don't care. 2. VLC = 0.2V, VHC = VCC –0.2V. 3. Other inputs ≥VHC or ≤VLC. NOTE: 1. VIL (min.) = –1.5V for pulse width less than 10ns, once per cycle. Recommended Operating Temperature and Supply Voltage Grade Temperature GND VCC Commercial 0°C to +70°C 0V 5.0V ± 0.5V Industrial –40°C to +85°C 0V 5.0V ± 0.5V 2964 tbl 05 6.42 2 Mar.30.21 Value VTERM NOTE: 1. This text does not indicate orientation of actual part-marking. (2) Rating (2) V 2964 tbl 04 71024 CMOS Static RAM 1 Meg (128K x 8-Bit) Commercial and Industrial Temperature Ranges DC Electrical Characteristics (VCC = 5.0V ± 10%, Commercial and Industrial Temperature Ranges) IDT71024 Symbol Parameter Test Condition Min. Max. Unit |ILI| Input Leakage Current VCC = Max., VIN = GND to VCC ___ 5 µA |ILO| Output Leakage Current VCC = Max., CS1 = VIH, VOUT = GND to VCC ___ 5 µA VOL Output Low Voltage IOL = 8mA, VCC = Min. ___ 0.4 V VOH Output High Voltage IOH = –4mA, VCC = Min. 2.4 ___ V 2964 tbl 06 DC Electrical Characteristics(1) (VCC = 5.0V ± 10%, VLC = 0.2V, VHC = VCC – 0.2V) 71024S12 Symbol Parameters 71024S15 71024S20 Com'l. Ind. Com'l. Ind. Com'l. Ind. Unit ICC Dynamic Operating Current, CS2 ≥ VIH and CS1 ≤ VIL, Outputs Open, VCC = Max., f = fMAX(2) 160 160 155 155 140 140 mA ISB Standby Power Supply Current (TTL Level) CS1 ≥ VIH or CS2 ≤ VIL, Outputs Open, VCC = Max., f=fMAX(2) 40 40 40 40 40 40 mA ISB1 Full Standby Power Supply Current (CMOS Level), CS1 ≥ VHC or CS2 ≤ VLC, Outputs Open, VCC = Max., f = 0(2), VIN ≤ VLC or VIN ≥ VHC 10 10 10 10 10 10 mA 2964 tbl 07 NOTES: 1. All values are maximum guaranteed values. 2. fMAX = 1/tRC (all address inputs are cycling at fMAX); f = 0 means no address input lines are changing. AC Test Conditions Input Pulse Levels GND to 3.0V Input Rise/Fall Times 3ns Input Timing Reference Levels 1.5V Output Reference Levels 1.5V AC Test Load See Figures 1 and 2 5V 2964 tbl 08 480Ω 5V DATA OUT 480Ω 5pF* 255Ω DATA OUT 30pF 2964 drw 04 255Ω *Including jig and scope capacitance. Figure 2. AC Test Load 2964 drw 03 Figure 1. AC Test Load (for tCLZ, tOLZ, tCHZ, tOHZ, tOW, and tWHZ) 6.42 3 Mar.30.21 71024 CMOS Static RAM 1 Meg (128K x 8-Bit) Commercial and Industrial Temperature Ranges AC Electrical Characteristics (VCC = 5.0V ± 10%, Commercial and Industrial Temperature Ranges) 71024S12 Symbol Parameter 71024S15 71024S20 Min. Max. Min. Max. Min. Max. Unit Read Cycle tRC Read Cycle Time 12 — 15 — 20 — ns tAA Address Access Time — 12 — 15 — 20 ns tACS Chip Select Access Time — 12 — 15 — 20 ns tCLZ(1) Chip Select to Output in Low-Z 3 — 3 — 3 — ns tCHZ Chip Deselect to Output in High-Z 0 6 0 7 0 8 ns tOE Output Enable to Output Valid — 6 — 7 — 8 ns tOLZ(1) Output Enable to Output in Low-Z 0 — 0 — 0 — ns tOHZ(1) Output Disable to Output in High-Z 0 5 0 5 0 7 ns tOH Output Hold from Address Change 4 — 4 — 4 — ns tPU Chip Select to Power-Up Time 0 — 0 — 0 — ns tPD(1) Chip Deselect to Power-Down Time — 12 — 15 — 20 ns tWC Write Cycle Time 12 — 15 — 20 — ns tAW Address Valid to End-of-Write 10 — 12 — 15 — ns tCW Chip Select to End-of-Write 10 — 12 — 15 — ns tAS Address Set-Up Time 0 — 0 — 0 — ns tWP Write Pulse Width 8 — 12 — 15 — ns tWR Write Recovery Time 0 — 0 — 0 — ns tDW Data Valid to End-of-Write 7 — 8 — 9 — ns tDH Data Hold Time 0 — 0 — 0 — ns tOW(1) Output Active from End-of-Write 3 — 3 — 4 — ns tWHZ(1) Write Enable to Output in High-Z 0 5 0 5 0 8 (1) (1) Write Cycle NOTE: 1. This parameter guaranteed with the AC load (Figure 2) by device characterization, but is not production tested. 6.42 4 Mar.30.21 ns 2964 tbl 09 71024 CMOS Static RAM 1 Meg (128K x 8-Bit) Commercial and Industrial Temperature Ranges Timing Waveform of Read Cycle No. 1(1) Timing Waveform of Read Cycle No. 2(1,2,4) NOTES: 1. WE is HIGH for Read Cycle. 2. Device is continuously selected, CS1 is LOW, CS2 is HIGH. 3. Address must be valid prior to or coincident with the later of CS1 transition LOW and CS2 transition HIGH; otherwise tAA is the limiting parameter. 4. OE is LOW. 5. Transition is measured ±200mV from steady state. 6.42 5 Mar.30.21 71024 CMOS Static RAM 1 Meg (128K x 8-Bit) Commercial and Industrial Temperature Ranges Timing Waveform of Write Cycle No. 1 (WE Controlled Timing)(1,4,6) Timing Waveform of Write Cycle No. 2 (CS1 AND CS2 Controlled Timing)(1,4) NOTES: 1. A write occurs during the overlap of a LOW CS1, HIGH CS2, and a LOW WE. 2. tWR is measured from the earlier of either CS1 or WE going HIGH or CS2 going LOW to the end of the write cycle. 3. During this period, I/O pins are in the output state, and input signals must not be applied. 4. If the CS1 LOW transition or the CS2 HIGH transition occurs simultaneously with or after the WE LOW transition, the outputs remain in a high impedance state. CS1 and CS2 must both be active during the tCW write period. 5. Transition is measured ±200mV from steady state. 6. OE is continuously HIGH. During a WE controlled write cycle with OE LOW, tWP must be greater than or equal to tWHZ + tDW to allow the I/O drivers to turn off and data to be placed on the bus for the required tDW. If OE is HIGH during a WE controlled write cycle, this requirement does not apply and the minimum write pulse is the specified tWP. 6.42 6 Mar.30.21 71024 CMOS Static RAM 1 Meg (128K x 8-Bit) Commercial and Industrial Temperature Ranges Ordering Information 71024 S XX Device Type Power Speed X X X Package X Process/ Temperature Range NOTE: 1. Contact your local sales office for Industrial temp range for other speeds, packages and powers. Orderable Part Information Speed (ns) 12 15 20 Pkg. Code Pkg. Type Temp. Grade 71024S12TYG PJG32 SOJ C 71024S12TYG8 PJG32 SOJ C 71024S12TYGI PJG32 SOJ I 71024S12TYGI8 PJG32 SOJ I 71024S12YG PBG32 SOJ C 71024S12YG8 PBG32 SOJ C 71024S12YGI PBG32 SOJ I Orderable Part ID 71024S12YGI8 PBG32 SOJ I 71024S15TYG PJG32 SOJ C 71024S15TYG8 PJG32 SOJ C 71024S15TYGI PJG32 SOJ I 71024S15TYGI8 PJG32 SOJ I 71024S15YG PBG32 SOJ C 71024S15YG8 PBG32 SOJ C 71024S15YGI PBG32 SOJ I 71024S15YGI8 PBG32 SOJ I 71024S20TYG PJG32 SOJ C 71024S20TYG8 PJG32 SOJ C 71024S20TYGI PJG32 SOJ I 71024S20TYGI8 PJG32 SOJ I 71024S20YG PBG32 SOJ C 71024S20YG8 PBG32 SOJ C 71024S20YGI PBG32 SOJ I 71024S20YGI8 PBG32 SOJ I 6.42 7 Mar.30.21 Blank 8 Tube Tape and Reel Blank I(1) Commercial (0°C to +70°C) Industrial (–40°C to +85°C) G Green TY Y 300-mil SOJ (PJG32) 400-mil SOJ (PBG32) 12 15 20 Speed in nanoseconds 2964 drw 09 71024 CMOS Static RAM 1 Meg (128K x 8-Bit) Commercial and Industrial Temperature Ranges Datasheet Document History 9/30/99 Pg. 1, 3, 4, 7 Pg. 1–4, 7 1/6/2000 2/18/00 3/14/00 08/09/00 02/01/01 01/30/04 05/22/06 02/13/07 08/13/09 02/05/13 03/30/21 Pg. 3 Pg. 6 Pg. 8 Pg. 4 Pg. 3 Pg. 3 Pg. 7 Pg.3 Pg.7 Pg.2 Pg.1 Pg.7 Pg.1 & 7 Pg.2 & 7 Pg.7 Updated to new format Added 12ns industrial speed grade offering Removed military temperature offerings Removed 17ns and 25ns speed grades Revised ICC and ISB1 for 15ns and 20ns industrial speed grades Removed Note 1, reordered notes and footnotes Added Datasheet Document History Changed tWP(min) for 12ns speed grade from 10ns to 8ns. Revised Icc and ISB for Industrial Temperature offerings to meet commercial specifications Revised ISB to accommodate speed functionality Not recommended for new designs Removed "Not recommended for new designs" Added "Restricted hazardous substance device" to the ordering information. Added drawing Output Capacitive Derating drawing. Added M generation die step to data sheet ordering information. Corrected note reference. Removed /MS from datasheet header. Removed IDT's reference to fabrication. Updated ordering information by adding Tape and Reel, updated Restricted Hazardous Substance Device wording to Green and removed the Die Stepping Revision, the"M" designator. Updated Industrial temp and green availability Updated package codes Added Orderable Part Information table 6.42 8 Mar.30.21 IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. 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