72V811L20PF

3.3 VOLT DUAL CMOS SyncFIFO™ DUAL 256 X 9, DUAL 512 X 9, DUAL 1,024 X 9, DUAL 2,048 X 9, DUAL 4,096 X 9 , DUAL 8,192 X 9 LEAD FINISH (SnPb) ARE IN EOL PROCESS - LAST TIME BUY EXPIRES JUNE 15, 2018 FEATURES: • • • • • • • • • • • • • • • • IDT72V801 IDT72V811 IDT72V821 IDT72V831 IDT72V841 IDT72V851 Each of the two FIFOs (designated FIFO A and FIFO B) contained in the IDT72V801/72V811/72V821/72V831/72V841/72V851 has a 9-bit input data port (DA0 - DA8, DB0 - DB8) and a 9-bit output data port (QA0 - QA8, QB0 - QB8). Each input port is controlled by a free-running clock (WCLKA, WCLKB), and two Write Enable pins (WENA1, WENA2, WENB1, WENB2). Data is written into each of the two arrays on every rising clock edge of the Write Clock (WCLKA, WCLKB) when the appropriate Write Enable pins are asserted. The output port of each FIFO bank is controlled by its associated clock pin (RCLKA, RCLKB) and two Read Enable pins (RENA1, RENA2, RENB1, RENB2). The Read Clock can be tied to the Write Clock for single clock operation or the two clocks can run asynchronous of one another for dual clock operation. An Output Enable pin (OEA, OEB) is provided on the read port of each FIFO for three-state output control. Each of the two FIFOs has two fixed flags, Empty (EFA, EFB) and Full (FFA, FFB). Two programmable flags, Almost-Empty (PAEA, PAEB) and Almost-Full (PAFA, PAFB), are provided for each FIFO bank to improve memory utilization. If not programmed, the programmable flags default to Empty+7 for PAEA and PAEB, and Full-7 for PAFA and PAFB. The IDT72V801/72V811/72V821/72V831/72V841/72V851 architecture lends itself to many flexible configurations such as: • 2-level priority data buffering • Bidirectional operation • Width expansion • Depth expansion This FIFO is fabricated using IDT's high-performance submicron CMOS technology. The IDT72V801 is equivalent to two IDT72V201 256 x 9 FIFOs The IDT72V811 is equivalent to two IDT72V211 512 x 9 FIFOs The IDT72V821 is equivalent to two IDT72V221 1,024 x 9 FIFOs The IDT72V831 is equivalent to two IDT72V231 2,048 x 9 FIFOs The IDT72V841 is equivalent to two IDT72V241 4,096 x 9 FIFOs The IDT72V851 is equivalent to two IDT72V251 8,192 x 9 FIFOs Offers optimal combination of large capacity, high speed, design flexibility and small footprint Ideal for prioritization, bidirectional, and width expansion applications 10 ns read/write cycle time 5V input tolerant Separate control lines and data lines for each FIFO Separate Empty, Full, programmable Almost-Empty and Almost-Full flags for each FIFO Enable puts output data lines in high-impedance state Space-saving 64-pin plastic Thin Quad Flat Pack (TQFP/ STQFP) Industrial temperature range (–40°°C to +85°°C) is available Green parts available, see ordering information DESCRIPTION: The IDT72V801/72V811/72V821/72V831/72V841/72V851/72V851 are dual synchronous (clocked) FIFOs. The device is functionally equivalent to two IDT72V201/72V211/72V221/72V231/72V241/72V251 FIFOs in a single package with all associated control, data, and flag lines assigned to separate pins. FUNCTIONAL BLOCK DIAGRAM WCLKA WENA1 WENA2 INPUT REGISTER RAM ARRAY 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 DB0 - DB8 OFFSET REGISTER INPUT REGISTER FLAG LOGIC WRITE CONTROL LOGIC WRITE POINTER WCLKB EFA PAEA WENB1 PAFA LDA WENB2 FFA DA0 - DA8 WRITE POINTER RAM ARRAY 256 x 9, 512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 READ CONTROL LOGIC EFB PAEB PAFB FFB READ POINTER READ CONTROL LOGIC OUTPUT REGISTER OUTPUT REGISTER RESET LOGIC RSA OFFSET REGISTER FLAG LOGIC WRITE CONTROL LOGIC READ POINTER LDB RESET LOGIC OEA QA0 - QA8 RSB RCLKA RENA1 RENA2 OEB IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync FIFO is a trademark of Integrated Device Technology, Inc. COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES QB0 - QB8 RCLKB RENB1 RENB2 4093 drw 01 MARCH 2018 1 ©2018 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice. DSC-4093/6 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 QA0 FFA EFA OEA RENA2 RCLKA RENA1 GND QB8 QB7 QB6 QB5 QB4 QB3 QB2 QB1 PIN CONFIGURATION 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DA5 DA4 DA3 DA2 DA1 DA0 PAFA PAEA WENB2/LDB WCLKB WENB1 RSB DB8 DB7 DB6 DB5 QA1 QA2 QA3 QA4 QA5 QA6 QA7 QA8 VCC WENA2/LDA WCLKA WENA1 RSA DA8 DA7 DA6 TQFP (PN64, order code: PF) STQFP (PP64, order code: TF) TOP VIEW 2 QB0 FFB EFB OEB RENB2 RCLKB RENB1 GND Vcc PAEB PAFB DB0 DB1 DB2 DB3 DB4 4093 drw 02 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES PIN DESCRIPTIONS The IDT72V801/72V811/72V821/72V831/72V841/72V851's two FIFOs, referred to as FIFO A and FIFO B, are identical in every respect. The following Symbol DA0-DA8 Name I/O description defines the input and output signals for FIFO A. The corresponding signal names for FIFO B are provided in parentheses. Description A Data Inputs I 9-bit data inputs to RAM array A. DB0-DB8 B Data Inputs I 9-bit data inputs to RAM array B. RSA, RSB Reset I When RSA (RSB) is set LOW, the associated internal read and write pointers of array A (B) are set to the first location; FFA (FFB) and PAFA (PAFB) go HIGH, and PAEA (PAEB) and EFA (EFB) go LOW. After powerup, a reset of both FIFOs A and B is required before an initial WRITE. WCLKA WCLKB Write Clock I Data is written into the FIFO A (B) on a LOW-to-HIGH transition of WCLKA (WCLKB) when the write enable(s) are asserted. WENA1 WENB1 Write Enable 1 I If FIFO A (B) is configured to have programmable flags, WENA1 (WENB1) is the only write enable pin that can be used. When WENA1 (WENB1) is LOW, data A (B) is written into the FIFO on every LOW-to-HIGH transition WCLKA (WCLKB). If the FIFO is configured to have two write enables, WENA1 (WENB1) must be LOW and WENA2 (WENB2) must be HIGH to write data into the FIFO. Data will not be written into the FIFO if FFA (FFB) is LOW. WENA2/LDA WENB2/LDB Write Enable 2/ Load I FIFO A (B) is configured at reset to have either two write enables or programmable flags. If LDA (LDB) is HIGH at reset, this pin operates as a second Write Enable. If WENA2/LDA (WENB2/LDB) is LOW at reset this pin operates as a control to load and read the programmable flag offsets for its respective array. If the FIFO is configured to have two write enables, WENA1 (WENB1) must be LOW and WENA2 (WENB2) must be HIGH to write data into FIFO A (B). Data will not be written into FIFO A (B) if FFA (FFB) is LOW. If the FIFO is configured to have programmable flags, LDA (LDB) is held LOW to write or read the programmable flag offsets. QA0-QA8 A Data Outputs O 9-bit data outputs from RAM array A. QB0-QB8 B Data Outputs O 9-bit data outputs from RAM array B. RCLKA RCLKB Read Clock I Data is read from FIFO A (B) on a LOW-to-HIGH transition of RCLKA (RCLKB) when RENA1(RENB1) and RENA2 (RENB2) are asserted. RENA1 RENB1 Read Enable 1 I When RENA1 (RENB1) and RENA2 (RENB2) are LOW, data is read from FIFO A (B) on every LOW-to-HIGH transition of RCLKA (RCLKB). Data will not be read from Array A (B) if EFA (EFB) is LOW. RENA2 RENB2 Read Enable 2 I When RENA1 (RENB1) and RENA2 (RENB2) are LOW, data is read from the FIFO A (B) on every LOW-toHIGH transition of RCLKA (RCLKB). Data will not be read from array A (B) if the EFA (EFB) is LOW. OEA Output Enable I When OEA (OEB) is LOW, outputs DA0-DA8 (DB0-DB8) are active. If OEA (OEB) is HIGH, the OEB outputs DA0DA8 (DB0-DB8) will be in a high-impedance state. EFA EFB Empty Flag O When EFA (EFB) is LOW, FIFO A (B) is empty and further data reads from the output are inhibited. When EFA (EFB) is HIGH, FIFO A (B) is not empty. EFA (EFB) is synchronized to RCLKA (RCLKB). PAEA PAEB Programmable Almost-Empty Flag O When PAEA (PAEB) is LOW, FIFO A (B) is Almost-Empty based on the offset programmed into the appropriate offset register. The default offset at reset is Empty+7. PAEA (PAEB) is synchronized to RCLKA (RCLKB). PAFA PAFB Programmable Almost-Full Flag O When PAFA (PAFB) is LOW, FIFO A (B) is Almost-Full based on the offset programmed into the appropriate offset register. The default offset at reset is Full-7. PAFA (PAFB) is synchronized to WCLKA (WCLKB). FFA FFB Full Flag O When FFA (FFB) is LOW, FIFO A (B) is full and further data writes into the input are inhibited. When FFA (FFB) is HIGH, FIFO A (B) is not full. FFA (FFB) is synchronized to WCLKA (WCLKB). V CC Power +3.3V power supply pin. GND Ground 0V ground pin. 3 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 RECOMMENDED OPERATING CONDITIONS ABSOLUTE MAXIMUM RATINGS Symbol VTERM TSTG IOUT Rating Terminal Voltage with Respect to GND Storage Temperature DC Output Current Commercial –0.5 to +5 –55 to +125 –50 to +50 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES Unit V Symbol °C mA NOTE: 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Min Typ. Max Unit VCC Supply Voltage(Com’l & Ind’l) 3.0 3.3 3.6 V GND Supply Voltage(Com’l & Ind’l) 0 0 — V VIH Input High Voltage (Com’l & Ind’l) 2.0 — 5.0 V Input Low Voltage (Com’l & Ind’l) — — 0.8 V VIL Parameter TA Operating Temperature Commercial 0 — 70 °C TA Operating Temperature Industrial -40 ⎯ 85 °C DC ELECTRICAL CHARACTERISTICS (Commercial: VCC = 3.3V ± 0.3V, TA = 0°C to +70°C; Industrial :VCC = 3.3V ± 0.3V, TA = -40°C to +85°C) Min. IDT72V801 IDT72V811 IDT72V821 IDT72V831 IDT72V841 IDT72V851 Commercial and Industrial (1) tCLK = 10, 15, 20 ns Typ. Max. Unit Input Leakage Current (Any Input) –1 — –1 µA Output Leakage Current –10 — 10 µA VOH Output Logic “1” Voltage, IOH = –2 mA 2.4 — — V VOL Output Logic “0” Voltage, IOL = 8 mA — — 0.4 V Active Power Supply Current (both FIFOs) — — 40 mA Standby Current — — 10 mA Symbol ILI(2) ILO (3) ICC1(4,5,6) (3,7) ICC2 Parameter NOTES: 1. Industrial temperature range product for the 15ns speed grade is available as a standard device. 2. Measurements with 0.4 ≤ VIN ≤ VCC. 3. OEA, OEB ≥ VIH, 0.4 ≤ VOUT ≤ VCC. 4. Tested with outputs disabled (IOUT = 0). 5. RCLK and WCLK toggle at 20 MHz and data inputs switch at 10 MHz. 6. Typical ICC1 = 2[0.17 + 0.48*fS + 0.02*CL*fS] (in mA). These equations are valid under the following conditions: VCC = 3.3V, TA = 25°C, fS = WCLK frequency = RCLK frequency (in MHz, using TTL levels), data switching at fS/2, CL = capacitive load (in pF). 7. All Inputs = VCC - 0.2V or GND + 0.2V, except RCLK and WCLK, which toggle at 20 MHz. CAPACITANCE (TA = +25°C, f = 1.0MHz) Symbol CIN(2) COUT Parameter Input Capacitance (1,2) Output Capacitance Conditions Max. Unit VIN = 0V 10 pF VOUT = 0V 10 pF NOTE: 1. With output deselected (OEA, OEB ≥ VIH). 2. Characterized values, not currently tested. 4 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES AC ELECTRICAL CHARACTERISTICS(1) (Commercial: VCC = 3.3V ± 0.3V, TA = 0°C to +70°C; Industrial: VCC = 3.3V± 0.3V, TA = -40°C to +85°C) Symbol Parameter Commercial Com’l & Ind’l Commercial IDT72V801L10 IDT72V811L10 IDT72V821L10 IDT72V831L10 IDT72V841L10 IDT72V851L10 IDT72V801L15 IDT72V811L15 IDT72V821L15 IDT72V831L15 IDT72V841L15 IDT72V851L15 IDT72V801L20 IDT72V811L20 IDT72V821L20 IDT72V831L20 IDT72V841L20 IDT72V851L20 Min. Max. Min. Max. Min. — 100 — 66.7 — 50 MHz Max. Unit fS Clock Cycle Frequency tA Data Access Time 2 6.5 2 10 2 12 ns tCLK Clock Cycle Time 10 — 15(1) — 20 — ns tCLKH Clock High Time 4.5 — 6 — 8 — ns tCLKL Clock Low Time 4.5 — 6 — 8 — ns tDS Data Set-up Time 3 — 4 — 5 — ns tDH Data Hold Time 0.5 — 1 — 1 — ns tENS Enable Set-up Time 3 — 4 — 5 — ns tENH Enable Hold Time 0.5 — 1 — 1 — ns tRS Reset Pulse Width(2) 10 — 15 — 20 — ns tRSS Reset Set-up Time 8 — 10 — 12 — ns tRSR Reset Recovery Time 8 — 10 — 12 — ns tRSF Reset to Flag Time and Output Time — 10 — 15 — 20 ns tOLZ Output Enable to Output in Low-Z(3) 0 — 0 — 0 — ns tOE Output Enable to Output Valid 3 6 3 8 3 10 ns tOHZ Output Enable to Output in High-Z(3) 3 6 3 8 3 10 ns tWFF Write Clock to Full Flag — 6.5 — 10 — 12 ns tREF Read Clock to Empty Flag — 6.5 — 10 — 12 ns tPAF Write Clock to Programmable Almost-Full Flag — 6.5 — 10 — 12 ns tPAE Read Clock to Programmable Almost-Empty Flag — 6.5 — 10 — 12 ns tSKEW1 Skew Time Between Read Clock and Write Clock for Empty Flag and Full Flag 5 — 6 — 8 — ns tSKEW2 Skew Time Between Read Clock and Write Clock for Programmable Almost-Empty Flag and Programmable Almost-Full Flag 14 — 18 — 20 — ns NOTES: 1. Industrial temperature range product for the 15ns speed grade is available as a standard device. 2. Pulse widths less than minimum values are not allowed. 3. Values guaranteed by design, not currently tested. 3.3V 330Ω D.U.T. AC TEST CONDITIONS In Pulse Levels GND to 3.0V Input Rise/Fall Times 3ns Input Timing Reference Levels 1.5V Output Reference Levels Output Load 510Ω 30pF* 4093 drw 03 1.5V or equivalent circuit See Figure 1 Figure 1. Output Load *Includes jig and scope capacitances. 5 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 SIGNAL DESCRIPTIONS COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES When either of the two Read Enable, RENA1, RENA2 (RENB1, RENB2) associated with FIFO A (B) is HIGH, the output register holds the previous data and no new data is allowed to be loaded into the register. When all the data has been read from FIFO A (B), the Empty Flag, EFA (EFB) will go LOW, inhibiting further read operations. Once a valid write operation has been accomplished, EFA (EFB) will go HIGH after tREF and a valid read can begin. The Read Enables, RENA1, RENA2 (RENB1, RENB2) are ignored when FIFO A (B) is empty. FIFO A and FIFO B are identical in every respect. The following description explains the interaction of input and output signals for FIFO A. The corresponding signal names for FIFO B are provided in parentheses. INPUTS: Data In (DA0 – DA8, DB0 – DB8) — DA0 - DA8 are the nine data inputs for memory array A. DB0 - DB8 are the nine data inputs for memory array B. Output Enable (OEA, OEB) — When Output Enable, OEA (OEB) is enabled (LOW), the parallel output buffers of FIFO A (B) receive data from their respective output register. When Output Enable, OEA (OEB) is disabled (HIGH), the QA (QB) output data bus is in a high-impedance state. CONTROLS: Reset (RSA, RSB) — Reset of FIFO A (B) is accomplished whenever RSA (RSB) input is taken to a LOW state. During reset, the internal read and write pointers associated with the FIFO are set to the first location. A reset is required after power-up before a write operation can take place. The Full Flag, FFA (FFB) and Programmable Almost-Full Flag, PAFA (PAFB) will be reset to HIGH after tRSF. The Empty Flag, EFA (EFB) and Programmable Almost-Empty Flag, PAEA (PAEB) will be reset to LOW after tRSF. During reset, the output register is initialized to all zeros and the offset registers are initialized to their default values. Write Enable 2/Load (WENA2/LDA, WENB2/LDB) — This is a dualpurpose pin. FIFO A (B) is configured at Reset to have programmable flags or to have two write enables, which allows depth expansion. If WENA2/LDA (WENB2/LDB) is set HIGH at Reset, RSA= LOW (RSB = LOW), this pin operates as a second Write Enable pin. If FIFO A (B) is configured to have two write enables, when Write Enable 1, WENA1 (WENB1) is LOW and WENA2/LDA (WENB2/LDB) is HIGH, data can be loaded into the input register and RAM array on the LOW-to-HIGH transition of every Write Clock, WCLKA (WCLKB). Data is stored in the array sequentially and independently of any on-going read operation. In this configuration, when WENA1 (WENB1) is HIGH and/or WENA2/LDA (WENB2/LDB) is LOW, the input register of Array A holds the previous data and no new data is allowed to be loaded into the register. To prevent data overflow, the Full Flag, FFA (FFB) will go LOW, inhibiting further write operations. Upon the completion of a valid read cycle, FFA (FFB) will go HIGH after tWFF, allowing a valid write to begin. WENA1, (WENB1) and WENA2/LDA (WENB2/LDB) are ignored when the FIFO is full. FIFO A (B) is configured to have programmable flags when the WENA2/ LDA(WENB2/LDB) is set LOW at Reset, RSA = LOW (RSB = LOW). Each FIFO Write Clock (WCLKA, WCLKB) — A write cycle to Array A (B) is initiated on the LOW-to-HIGH transition of WCLKA (WCLKB). Data set-up and hold times must be met with respect to the LOW-to-HIGH transition of WCLKA (WCLKB). The Full Flag, FFA (FFB) and Programmable Almost-Full Flag, PAFA (PAFB) are synchronized with respect to the LOW-to-HIGH transition of the Write Clock, WCLKA (WCLKB). The Write and Read clock can be asynchronous or coincident. Write Enable 1 (WENA1, WENB1) — If FIFO A (B) is configured for programmable flags, WENA1 (WENB1) is the only enable control pin. In this configuration, when WENA1 (WENB1) is LOW, data can be loaded into the input register of RAM Array A (B) on the LOW-to-HIGH transition of every Write Clock, WCLKA (WCLKB). Data is stored in Array A (B) sequentially and independently of any on-going read operation. In this configuration, when WENA1 (WENB1) is HIGH, the input register holds the previous data and no new data is allowed to be loaded into the register. If the FIFO is configured to have two write enables, which allows for depth expansion. See Write Enable 2 paragraph below for operation in this configuration. To prevent data overflow, FFA (FFB) will go LOW, inhibiting further write operations. Upon the completion of a valid read cycle, the FFA (FFB) will go HIGH after tWFF, allowing a valid write to begin. WENA1 (WENB1) is ignored when FIFO A (B) is full. LDA WENA1 WCLKA OPERATION ON FIFO A LDB WENB1 WCLKB OPERATION ON FIFO B 0 0 Empty Offset (LSB) Empty Offset (MSB) Full Offset (LSB) Full Offset (MSB) Read Clock (RCLKA, RCLKB) — Data can be read from Array A (B) on the LOW-to-HIGH transition of RCLKA (RCLKB). The Empty Flag, EFA (EFB) and Programmable Almost-Empty Flag, PAEA (PAEB) are synchronized with respect to the LOW-to-HIGH transition of RCLKA (RCLKB). The Write and Read Clock can be asynchronous or coincident. 0 1 No Operation 1 0 Write Into FIFO 1 1 No Operation NOTE: 4093 tbl 08 1. For the purposes of this table, WENA2 and WENB2 = VIH. 2. The same selection sequence applies to reading from the registers. RENA1 and RENA2 (RENB1 and RENB2) are enabled and read is performed on the LOW-to-HIGH transition of RCLKA (RCLKB). Read Enables (RENA1, RENA2, RENB1, RENB2) — When both Read Enables, RENA1, RENA2 (RENB1, RENB2) are LOW, data is read from Array A (B) to the output register on the LOW-to-HIGH transition of the Read Clock, RCLKA (RCLKB). Figure 2. Writing to Offset Registers for FIFOs A and B 6 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 However, writing all offset registers does not have to occur at one time. One or two offset registers can be written and then by bringing LDA (LDB) HIGH, FIFO A (B) is returned to normal read/write operation. When LDA (LDB) is set LOW, and WENA1 (WENB1) is LOW, the next offset register in sequence is written. The contents of the offset registers can be read on the QA (QB) outputs when WENA2/LDA (WENB2/LDB) is set LOW and both Read Enables RENA1, RENA2 (RENB1, RENB2) are set LOW. Data can be read on the LOW-to-HIGH transition of the Read Clock RCLKA (RCLKB). A read and write should not be performed simultaneously to the offset registers. contains four 8-bit offset registers which can be loaded with data on the inputs, or read on the outputs. See Figure 3 for details of the size of the registers and the default values. If FIFO A (B) is configured to have programmable flags, when the WENA1 (WENB1) and WENA2/LDA (WENB2/LDB) are set LOW, data on the DA (DB) inputs are written into the Empty (Least Significant Bit) Offset register on the first LOW-to-HIGH transition of the WCLKA (WCLKB). Data are written into the Empty (Most Significant Bit) Offset register on the second LOW-to-HIGH transition of WCLKA (WCLKB), into the Full (Least Significant Bit) Offset register on the third transition, and into the Full (Most Significant Bit) Offset register on the fourth transition. The fifth transition of WCLKA (WCLKB) again writes to the Empty (Least Significant Bit) Offset register. 72V801 - 256 x 9 x 2 8 0 8 0 7 Empty Offset (LSB) Reg. Empty Offset (LSB) Default Value 007H Default Value 007H 0 7 0 8 8 8 8 (MSB) 0 00 8 7 8 0 Full Offset (LSB) Reg. Default Value 007H 1 0 0 8 (MSB) 0 00 72V851 - 8,192 x 9 x 2 0 7 8 0 7 Empty Offset (LSB) Reg. Empty Offset (LSB) Empty Offset (LSB) Default Value 007H Default Value 007H Default Value 007H 0 2 3 8 0 1 (MSB) 72V841 - 4,096 x 9 x 2 0 0 1 Default Value 007H 0 4 8 0 (MSB) (MSB) (MSB) 000 0000 00000 7 0 8 Full Offset (LSB) Reg. Default Value 007H 8 8 (MSB) 0 8 0 Default Value 007H 0 7 72V831 - 2,048 x 9 x 2 8 7 Full Offset (LSB) 0 7 8 Empty Offset (LSB) Reg. 1 Full Offset (LSB) Reg. Default Value 007H 8 72V821 - 1,024 x 9 x 2 72V811 - 512 x 9 x 2 7 8 8 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES 0 2 0 7 8 0 7 Full Offset (LSB) Full Offset (LSB) Default Value 007H Default Value 007H 3 8 0 8 4 0 (MSB) (MSB) (MSB) 000 0000 00000 4093 drw 05 Figure 3. Offset Register Formats and Default Values for the A and B FIFOs 7 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 OUTPUTS OUTPUTS:: COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES the IDT72V831's FIFO A (B), (4,096-m) writes to the IDT72V841's FIFO A (B), or (8,1912-m) writes to the IDT72V851's FIFO A (B). FFA (FFB) is synchronized with respect to the LOW-to-HIGH transition of the Write Clock WCLKA (WCLKB). The offset “m” is defined in the Full Offset Registers. If there is no Full offset specified, PAFA (PAFB) will go LOW at Full-7 words. PAFA (PAFB) is synchronized with respect to the LOW-to-HIGH transition of the Write Clock WCLKA (WCLKB). Full Flag (FFA, FFB) — FFA (FFB) will go LOW, inhibiting further write operations, when Array A (B) is full. If no reads are performed after reset, FFA (FFB) will go LOW after 256 writes to the IDT72V801's FIFO A (B), 512 writes to the IDT72V811's FIFO A (B), 1,024 writes to the IDT72V821's FIFO A (B), 2,048 writes to the IDT72V831's FIFO A (B), 4,096 writes to the IDT72V841's FIFO A (B), or 8,192 writes to the IDT72V851's FIFO A (B). FFA (FFB) is synchronized with respect to the LOW-to-HIGH transition of the Write Clock WCLKA (WCLKB). Programmable Almost–Empty Flag (PAEA, PAEB) — PAEA (PAEB) will go LOW when the read pointer is "n+1" locations less than the write pointer. The offset "n" is defined in the Empty Offset Registers. If no reads are performed after reset, PAEA (PAEB) will go HIGH after "n+1" writes to FIFO A (B). If there is no Empty offset specified, PAEA (PAEB) will go LOW at Empty+7 words. PAEA (PAEB) is synchronized with respect to the LOW-to-HIGH transition of the Read Clock RCLKA (RCLKB). Empty Flag (EFA, EFB) — EFA (EFB) will go LOW, inhibiting further read operations, when the read pointer is equal to the write pointer, indicating that Array A (B) is empty. EFA (EFB) is synchronized with respect to the LOW-to-HIGH transition of the Read Clock RCLKA (RCLKB). Programmable Almost–Full Flag (PAFA, PAFB) — PAFA (PAFB) will go LOW when the amount of data in Array A (B) reaches the Almost-Full condition. If no reads are performed after reset, PAFA (PAFB) will go LOW after (256-m) writes to the IDT72V801's FIFO A (B), (512-m) writes to the IDT72V811's FIFO A (B), (1,024-m) writes to the IDT72V821's FIFO A (B), (2,048-m) writes to Data Outputs (QA0 – QA8, QB0 – QB8 ) — QA0 - QA8 are the nine data outputs for memory array A, QB0 - QB8 are the nine data outputs for memory array B. TABLE 1: STATUS FLAGS FOR A AND B FIFOS NUMBER OF WORDS IN ARRAY A FFA PAFA PAEA EFA NUMBER OF WORDS IN ARRAY B FFB PAFB PAEB EFB L L IDT72V801 0 1 to n (1) (n+1) to (256-(m+1)) IDT72V811 IDT72V821 0 0 H H 1 to n(1) 1 to n(1) H H L H (n+1) to (512-(m+1)) (n+1) to (1,024-(m+1)) H H H H (1,024-m)(2) H L H H L L H H FFA PAFA PAEA EFA FFB PAFB PAEB EFB (2) (512-m)(2) 256 512 (256-m) to 255 to 511 to 1,023 1,024 NUMBER OF WORDS IN ARRAY A NUMBER OF WORDS IN ARRAY B IDT72V831 IDT72V841 IDT72V851 0 0 0 H H L L 1 to n(1) 1 to n(1) 1 to n(1) H H L H (n+1) to (2,048-(m+1)) (n+1) to (4,096-(m+1)) (n+1) to (8,192-(m+1)) H H H H (2,048-m)(2) to 2,047 (4,096-m)(2) to 4,095 (8,192-m)(2) to 8,191 H L H H 2,048 4,096 8,192 L L H H NOTES: 1. n = Empty Offset (n = 7 default value) 2. m = Full Offset (m = 7 default value) 8 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES tRS RSA (RSB) tRSS tRSR tRSS tRSR tRSS tRSR RENA1, RENA2 (RENB1, RENB2) WENA1 (WENB1) WENA2/LDA (1) (WENB2/LDB) tRSF EFA, PAEA (EFB, PAEB) tRSF FFA, PAFA (FFA, PAFA) tRSF (2) OEA (OEB) = 1 QA0 - QA8 (QB0 - QB8) OEA (OEB) = 0 4093 drw 06 NOTES: 1. Holding WENA2/LDA (WENB2/LDB) HIGH during reset will make the pin act as a second Write Enable pin. Holding WENA2/LDA (WENB2/LDB) LOW during reset will make the pin act as a load enable for the programmable flag offset registers. 2. After reset, QA0 - QA8 (QB0 - QB8) will be LOW if OEA (OEB) = 0 and tri-state if OEA (OEB) = 1. 3. The clocks RCLKA, WCLKA (RCLKB, WCLKB) can be free-running during reset. Figure 4. Reset Timing tCLK tCLKH tCLKL WCLKA (WCLKB) tDH tDS (DA0 - DA8 DB0 - DB8) DATA IN VALID tENS WENA1 (WENB1) tENH NO OPERATION tENS tENH WENA2 (WENB2) (If Applicable) NO OPERATION tWFF tWFF FFA (FFB) tSKEW1(1) RCLKA (RCLKB) RENA1, RENA2 (RENB1, RENB2) 4093 drw 07 NOTE: 1. tSKEW1 is the minimum time between a rising RCLKA (RCLKB) edge and a rising WCLKA (WCLKB) edge for FFA (FFB) to change during the current clock cycle. If the time between the rising edge of RCLKA (RCLKB) and the rising edge of WCLKA (WCLKB) is less than tSKEW1, then FFA (FFB) may not change state until the next WCLKA (WCLKB) edge. Figure 5. Write Cycle Timing 9 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES tCLK tCLKH tCLKL RCLKA (RCLKB) tENH tENS RENA1, RENA2 (RENB1, RENB2) NO OPERATION tREF tREF EFA (EFB) tA QA0 - QA8 (QB0 - QB8) VALID DATA tOLZ tOHZ tOE OEA (OEB) (1) tSKEW1 WCLKA, WCLKB WENA1 (WENB1) WENA2 (WENB2) 4093 drw 08 NOTE: 1. tSKEW1 is the minimum time between a rising WCLKA (WCLKB) edge and a rising RCLKA (RCLKB) edge for EFA (EFB) to change during the current clock cycle. If the time between the rising edge of RCLKA (RCLKB) and the rising edge of WCLKA (WCLKB) is less than tSKEW1, then EFA (EFB) may not change state until the next RCLKA (RCLKB) edge. Figure 6. Read Cycle Timing WCLKA (WCLKB) tDS DA0 - DA8 (DB0 - DB8) D1 tENS D2 D3 D0 (First Valid WENA1 (WENB1) tENS WENA2 (WENB2) (If Applicable) tSKEW1 tFRL(1) RCLKA (RCLKB) tREF EFA (EFB) tENS RENA1, RENA2 (RENB1, RENB2) tA QA0 - QA8 (QB0 - QB8) tA D0 D1 tOLZ tOE OEA (OEB) 4093 drw 09 NOTE: 1. When tSKEW1 ≥ minimum specification, tFRL = tCLK + tSKEW1 When tSKEW1 < minimum specification, tFRL = 2tCLK + tSKEW1 or tCLK + tSKEW1 The Latency Timings apply only at the Empty Boundary (EFA, EFB = LOW). Figure 7. First Data Word Latency Timing 10 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES NO WRITE WCLKA (WCLKB) NO WRITE tSKEW1 tDS NO WRITE tSKEW1 tDH DA0 - DA8 (DB0 - DB8) tWFF tWFF tWFF FFA (FFB) (1) tENS tENH tENS tENS tENH tENS WENA1 (WENB1) (1) WENA2 (WENB2) (If Applicable) RCLKA (RCLKB) tENS tENH tENS tENH RENA1 (RENB2) tA OEA LOW (OEB) QA0 - QA8 (QB0 - QB8) tA DATA READ DATA IN OUTPUT REGISTER NEXT DATA READ 4093 drw 10 NOTE: 1. Only one of the two Write Enable inputs, WEN1 or WEN2, needs to go inactive to inhibit writes to the FIFO. Figure 8. Full Flag Timing WCLKA (WCLKB) tDS tDS DA0 - DA8 (DB0 - DB8) DATA WRITE 1 tENS tENH tENS tENH DATA WRITE 2 tENS tENH WENA1, (WENB1) tENS tENH WENA2 (WENB2) (If Applicable) (1) (1) tSKEW1 tFRL tSKEW1 tFRL RCLKA (RLCKB) tREF tREF tREF EFA (EFB) RENA1, RENA2 (RENB1, RENB2) OEA (OEB) LOW tA QA0 - QA8 (QB0 - QB8) DATA READ DATA IN OUTPUT REGISTER NOTE: 1. When tSKEW1 ≥ minimum specification, tFRL maximum = tCLK + tSKEW1 When tSKEW1 < minimum specification, tFRL maximum = 2tCLK + tSKEW1 or tCLK + tSKEW1 The Latency Timings apply only at the Empty Boundary (EFA, EFB = LOW). Figure 9. Empty Flag Timing 11 4093 drw 11 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 tCLKH COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES tCLKL WCLKA (WCLKB) (4) tENS tENH tENS tENH WENA1 (WENB1 WENA2 (WENB2) (If Applicable) tPAF PAFA (PAFB) Full - (m+1) words in FIFO (1) Full - m words in FIFO (2) (3) tSKEW2 tPAF RCLKA (RCLKB) tENS tENH RENA1, RENA2 (RENB1, RENB2) 4093 drw 12 NOTES: 1. m = PAF offset. 2. (256-m) words for the IDT72V801, (512-m) words the IDT72V811, (1,024-m) words for the IDT72V821, (2,048-m) words for the IDT72V831, (4,096-m) words for the IDT72V841, or (8,192-m) words for the IDT72V851. 3. tSKEW2 is the minimum time between a rising RCLKA (RCLKB) edge and a rising WCLKA (WCLKB) edge for PAFA (PAFB) to change during that clock cycle. If the time between the rising edge of RCLKA (RCLKB) and the rising edge of WCLKA (WCLKB) is less than tSKEW2, then PAFA (PAFB) may not change state until the next WCLKA (WCLKB) rising edge. 4. If a write is performed on this rising edge of the Write Clock, there will be Full - (m-1) words in FIFO A (B) when PAFA (PAFB) goes LOW. Figure 10. Programmable Full Flag Timing tCLKH tCLKL WCLKA (WCLKB) tENS tENH tENS tENH WENA1 (WENB1) WENA2 (WENB2) (If Applicable) PAEA, PAEB n words in FIFO (1) tSKEW2 (2) n+1 words in FIFO tPAE tPAE (3) RCLKA (RCLKB) tENS RENA1, RENA2 (RENB1, RENB2) tENH 4093 drw 13 NOTES: 1. n = PAE offset. 2. tSKEW2 is the minimum time between a rising WCLKA (WCLKB) edge and a rising RCLKA (RCLKB) edge for PAEA (PAEB) to change during that clock cycle. If the time between the rising edge of WCLKA (WCLKB) and the rising edge of RCLKA (RCLKB) is less than tSKEW2, then PAEA (PAEB) may not change state until the next RCLKA (RCLKB) rising edge. 3. If a read is performed on this rising edge of the Read Clock, there will be Empty + (n-1) words in FIFO A (B) when PAEA (PAEB) goes LOW. Figure 11. Programmable Empty Flag Timing 12 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES tCLK tCLKH tCLKL WCLKA (WCLKB) tENH tENS LDA (LDB) tENS WENA1 (WENB1) tDS tDH DA0 - DA7 (DB0 - DB7) PAE OFFSET (LSB) PAE OFFSET (MSB) PAF OFFSET (LSB) PAF OFFSET (MSB) 4093 drw 14 Figure 12. Write Offset Register Timing tCLK tCLKH tCLKL RCLKA (RCLKB) tENS tENH LDA (LDB) tENS RENA1, RENA2 (RENB1, RENB2) tA QA0 - QA7 (QB0 - QB7) DATA IN OUTPUT REGISTER EMPTY OFFSET (LSB) EMPTY OFFSET (MSB) FULL OFFSET (LSB) FULL OFFSET (MSB) 4093 drw 15 Figure 13. Read Offset Register Timing 13 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 OPERATING CONFIGURATIONS COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES be grounded (see Figure 14). In this configuration, the Write Enable 2/Load WENA2/LDA (WENB2/LDB) pin is set LOW at Reset so that the pin operates as a control to load and read the programmable flag offsets. SINGLE DEVICE CONFIGURATION — When FIFO A (B) is in a Single Device Configuration, the Read Enable 2 RENA2 (RENB2) control input can RSA (RSB) WCLKA (WCLKB) RCLKA (RCLKB) IDT 72V801 72V811 72V821 72V831 72V841 72V851 FIFO A (B) WENA1 (WENB1) WENA2/LDA (WENB2/LDB) DA0 - DA8 (DB0 - DB8) FFA (FFB) PAFA (PAFB) RENA1 (RENB1) OEA (OEB) QA0 - QA8 (QB0 - QB8) EFA (EFB) PAEA (PAEB) RENA2 (RENB2) 4093 drw 16 Figure 14. Block Diagram of One of the IDT72V801/72V811/72V821/72V831/72V841/72V851's two FIFOs configured as a single device WIDTH EXPANSION CONFIGURATION — Word width may be increased simply by connecting the corresponding input control signals of FIFOs A and B. A composite flag should be created for each of the endpoint status flags EFAand EFB, also FFA and FFB). The partial status flags PAEA, PAFB, PAEA and PAFB can be detected from any one device. Figure 15 demonstrates an 18-bit word width using the two FIFOs contained in one IDT72V801/72V811/72V821/72V831/72V841/72V851. Any word width can be attained by adding additional IDT72V801/72V811/72V821/72V831/ 72V841/72V851s. When these devices are in a Width Expansion Configuration, the Read Enable 2 (RENA2 and RENB2) control inputs can be grounded (see Figure 15). In this configuration, the Write Enable 2/Load (WENA2/LDA, WENB2/LDB) pins are set LOW at Reset so that the pin operates as a control to load and read the programmable flag offsets. 9 RESET RSA DATA IN 18 9 DA0 - DA8 WRITE CLOCK WCLKA WRITE ENABLE WENA1 WRITE ENABLE/LOAD WENA2/LDA FULL FLAG FFA FFB DB0 - DB8 RAM ARRAY RCLKA WCLKB A 256x9 RENA1 WENB1 512x9 1,024x9 OEA1 2,048x9 2WENB2/LDB 4,096x9 8,192x9 RENA2 RSB RAM ARRAY B 256x9 512x9 1,024x9 2,048x9 4,096x9 8,192x9 EFA EFB EMPTY FLAG RCLKB READ CLOCK RENB1 READ ENABLE OEB QB0 - QB8 OUTPUT ENABLE 9 18 DATA OUT QA0 - QA8 RENB2 9 Figure 15. Block diagram of the two FIFOs contained in one IDT72V801/72V811/72V821/72V831/72V841/72V851 configured for an 18-bit width-expansion 14 4093 drw 17 IDT72V801/72V8211/72V821/72V831/72V841/72V851 3.3V DUAL CMOS SyncFIFOTM DUAL 256 x 9, DUAL 512 x 9, DUAL 1K x 9, DUAL 2K x 9, DUAL 4K x 9, DUAL 8K x 9 TWO PRIORITY DATA BUFFER CONFIGURATION the intermixed data according to type, sending one kind to FIFO A and the other kind to FIFO B. Then, at the outputs, each data type is transferred to its appropriate destination. Additional IDT72V801/72V811/72V821/72V831/ 72V841/72V851s permit more than two priority levels. Priority buffering is particularly useful in network applications. The two FIFOs contained in the IDT72V801/72V811/72V821/72V831/ 72V841/72V851 can be used to prioritize two different types of data shared on a system bus. When writing from the bus to the FIFO, control logic sorts Image Processing Card RAM ARRAY A RCLKA WCLKA OEA WENA1 RENA Clock Control Logic 9 DA0-DA8 Data 9 I/O Data Voice Processing Card RAM ARRAY B WCLKB RCLKB WENB1 RAM Clock OEB2 RENB1 9 Control Logic Control 9-bit bus Address Control Data IDT 72V801 72V811 72V821 72V831 72V841 72V851 Control Logic Processor Clock Address 9 QA0-QA8 WENA2 RENA2 VCC COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES DB0-DB8 QB0-QB8 WENB2 RENB2 9 9 Address Control I/O Data Data 4093 drw 18 VCC Figure 16. Block Diagram of Two Priority Configuration BIDIRECTIONAL CONFIGURATION The two FIFOs of the IDT72V801/72V811/72V821/72V831/72V841/ 72V851 can be used to buffer data flow in two directions. In the example that RAM ARRAY A WENA2 RENA2 VCC WCLKA WENA1 9 DMA Clock Control Logic 9-bit bus Data Peripheral Controller 9 9-bit bus Control OEA IDT 72V801 72V811 72V821 72V831 72V841 72V851 Control Logic Address RCLKA RENA1 DA0-DA8 QA0-QA8 9 Processor Clock follows, a processor can write data to a peripheral controller via FIFO A, and, in turn, the peripheral controller can write the processor via FIFO B. RAM ARRAY B RCLKB WENB1 RENB1 RAM 9 9 WCLKB OEB QB0-QB8 DB0-DB8 RENB2 WENB2 Address Control I/O Data Data 9 9 4093 drw 19 VCC Figure 17. Block Diagram of Bidirectional Configuration 15 DEPTH EXPANSION — These FIFOs can be adapted to applications that require greater than 256/512/1,024/2,048/4,096/8,192 words. The existence of double enable pins on the read and write ports allow depth expansion. The Write Enable 2/Load (WENA2, WENB2) pins are used as a second write enables in a depth expansion configuration, thus the Programmable flags are set to the default values. Depth expansion is possible by using one enable input for system control while the other enable input is controlled by expansion logic to direct the flow of data. A typical application would have the expansion logic alternate data access from one device to the next in a sequential manner. The IDT72V801/72V811/72V821/72V831/72V841/72V851 operates in the Depth Expansion configuration when the following conditions are met: 1. WENA2/LDA and WENB2/LDB pins are held HIGH during Reset so that these pins operate as second Write Enables. 2. External logic is used to control the flow of data. Please see the Application Note "DEPTH EXPANSION OF IDT'S SYNCHRONOUS FIFOs USING THE RING COUNTER APPROACH" for details of this configuration. ORDERING INFORMATION XXXXX Device Type X Power XX Speed X Package X X X Process / Temperature Range BLANK 8 Tube or Tray Tape and Reel BLANK I(1) Commercial (0°C to +70°C) Industrial (-40°C to +85°C) G(2) Green PF TF(3) Thin Quad Flatpack (TQFP, PN64) Slim Thin Plastic Quad Flatpack (STQFP, PP64) 10 15 20 Commercial Only Commercial And Industrial Commercial Only L Low Power 72V801 72V811 72V821 72V831 72V841 72V851 256 x 9 ⎯ 3.3 Volt DUAL SyncFIFO 512 x 9 ⎯ 3.3 Volt DUAL SyncFIFO 1,024 x 9 ⎯ 3.3 Volt DUAL SyncFIFO 2,048 x 9 ⎯ 3.3 Volt DUAL SyncFIFO 4,096 x 9 ⎯ 3.3 Volt DUAL SyncFIFO 8,192 x 9 ⎯ 3.3 Volt DUAL SyncFIFO Clock Cycle Time (tCLK), speed in Nanoseconds 4093 drw 20 NOTES: 1. Industrial temperature range product for the 15ns speed grade is available as a standard device. 2. Green parts available. For specific speeds and packages contact your local sales office. LEAD FINISH (SnPb) parts are in EOL process. Product Discontinuation Notice - PDN# SP-17-02 3. TF package is End of Life. Last time buy is July 28, 2015. DATASHEET DOCUMENT HISTORY 04/24/2001 02/02/2006 10/22/2008 11/06/2014 03/15/2018 pgs. 4, 5 and 16 pgs. 1 and 16. pg. 16. pgs. 1, 2 and 16. Product Discontinuation Notice - PDN# SP-17-02 Last time buy expires June 15, 2018. CORPORATE HEADQUARTERS 6024 Silver Creek Valley Road San Jose, CA 95138 for SALES: 800-345-7015 or 408-284-8200 fax: 408-284-2775 www.idt.com 16 for Tech Support: 408-360-1753 email: FIFOhelp@idt.com IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. 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