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83PN128AKILFT

83PN128AKILFT

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    VQFN-10

  • 描述:

    IC SYNTHESIZER LVPECL 10-VFQFPN

  • 数据手册
  • 价格&库存
83PN128AKILFT 数据手册
Programmable FemtoClock® NG ICS83PN128I Differential-to-3.3V, 2.5V LVPECL Synthesizer DATA SHEET General Description Features The ICS83PN128I is a programmable LVPECL synthesizer that can be used for frequency conversions. The device uses IDT’s fourth generation FemtoClock® NG technology for optimal high clock frequency and low phase noise performance, combined with a low power consumption and high power supply noise rejection. Oscillator-level performance is maintained with IDT’s Fourth Generation FemtoClock® NG PLL technology, which delivers low rms phase jitter. • • • • Fourth Generation FemtoClock® NG technology • • • • • • • Output frequency: 128.90MHz or 161.132813MHz The ICS83PN128I defaults to 161.132813MHz output using a 156.25MHz input with two select pins floating (pulled up with internal pullup resistors) but can also be set to four different frequency multiplier settings to support a wide variety of applications. The below table shows some of the more common application settings. Footprint compatible with 5mm x 7mm differential oscillators One differential LVPECL output pair CLK, nCLK input pair can accept the following levels: HCSL, LVDS, LVPECL, LVHSTL VCO range: 2.0GHz – 2.5GHz Cycle-to-cycle jitter: 18ps (typical) RMS phase jitter @ 128.90MHz, 12kHz – 20MHz: 0.53ps (typical) Full 3.3V or 2.5V operating supply -40°C to 85°C ambient operating temperature Lead-free (RoHS 6) packaging Frequency Select Table 156.25 128.90 01 156.25 128.90 10 156.25 128.90 11 (default) 156.25 161.132813 OE 1 Reserved 2 VEE 3 10 9 4 5 CLK 00 Pin Assignment nCLK Output Frequency (MHz) FSEL0 Input FSEL1 FSEL[1:0] 8 VCC 7 nQ 6 Q ICS83PN128I 10-Lead VFQFN 5mm x 7mm x 1mm package body K Package Top View Block Diagram Q CLK Pulldown nCLK Pullup/Pulldown ÷P FemtoClock® Phase Detector VCO NG ÷N nQ ÷M 2 FSEL[1:0] Pullup OE Pullup ICS83PN128AKI REVISION A MAY 9, 2013 1 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Pin Description and Pin Characteristic Tables Table 1. Pin Descriptions Number Name Type Description 1 OE 2 Reserved Reserved 3 VEE Power 4 nCLK Input Pullup/ Pulldown Inverting differential clock input. VCC/2 default when left floating 5 CLK Input Pulldown Non-inverting differential clock input. 6, 7 Q, nQ Output Differential output pair. LVPECL interface levels. 8 VCC Power Power supply pin. 9 FSEL0 Input Pullup Frequency select pin. LVCMOS/LVTTL interface levels. See Table 3, Frequency Select Table. 10 FSEL1 Input Pullup Frequency select pin. LVCMOS/LVTTL interface levels. See Table 3, Frequency Select Table. Pullup Output enable. External pullup required for normal operation. LVCMOS/LVTTL interface levels. Reserved pin. Negative supply pin. NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. Table 2. Pin Characteristics Symbol Parameter Test Conditions Minimum Typical Maximum Units CIN Input Capacitance 3.5 pF RPULLUP Input Pullup Resistor 51 k RPULLDOWN Input Pulldown Resistor 51 k Function Table Table 3. P, M, N Divider Function Table FSEL[1:0] P Divider M Divider N Divider Input Frequency (MHz) Output Frequency (MHz) 00 ÷2 26.39872 ÷16 156.25 128.90 01 ÷2 26.39872 ÷16 156.25 128.90 10 ÷2 26.39872 ÷16 156.25 128.90 1 1 (default) ÷2 33.00 ÷16 156.25 161.132813 ICS83PN128AKI REVISION A MAY 9, 2013 2 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Absolute Maximum Ratings NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Item Rating Supply Voltage, VCC 3.6V Inputs, VI -0.5V to VCC + 0.5V Outputs, IO Continuous Current Surge Current 50mA 100mA Package Thermal Impedance, JA 39.2C/W (0 mps) Storage Temperature, TSTG -65C to 150C DC Electrical Characteristics Table 4A. Power Supply DC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions VCC Power Supply Voltage IEE Power Supply Current Minimum Typical Maximum Units 3.135 3.3 3.465 V 189 mA Table 4B. Power Supply DC Characteristics, VCC = 2.5V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions VCC Power Supply Voltage IEE Power Supply Current Minimum Typical Maximum Units 2.375 2.5 2.625 V 182 mA Table 4C. LVCMOS/LVTTL DC Characteristics, VCC = 3.3V ± 5% or 2.5V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter VIH Input High Voltage VIL Input Low Voltage IIH Input High Current OE, FSEL[1:0] VCC = VIN = 3.465V or 2.625V IIL Input Low Current OE, FSEL[1:0] VCC = 3.465V or 2.625V, VIN = 0V ICS83PN128AKI REVISION A MAY 9, 2013 Test Conditions Minimum VCC = 3.465V Maximum Units 2 VCC + 0.3 V VCC = 2.625V 1.7 VCC + 0.3 V VCC = 3.465V -0.3 0.8 V VCC = 2.625V -0.3 0.7 V 5 µA 3 -150 Typical µA ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Table 4D. Differential DC Characteristics, VCC = 3.3V ± 5% or 2.5V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter IIH Input High Current CLK, nCLK IIL Test Conditions Minimum Typical VCC = VIN = 3.465V or 2.625V Maximum Units 150 µA CLK VIN = 0V, VCC = 3.465V or 2.625V -5 µA nCLK VIN = 0V, VCC = 3.465V or 2.625V -150 µA Input Low Current VPP Peak-to-Peak Voltage 0.15 1.3 V VCMR Common Mode Input Voltage; NOTE 1 VEE VCC – 0.85 V Maximum Units NOTE 1: Common mode input voltage is defined at the cross point. Table 4E. LVPECL DC Characteristics, VCC = 3.3V ± 5% or 2.5V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions Minimum Typical VOH Output High Voltage; NOTE 1 VCC – 1.4 VCC – 0.8 V VOL Output Low Voltage; NOTE 1 VCC – 2.0 VCC – 1.6 V VSWING Peak-to-Peak Output Voltage Swing 0.6 1.0 V NOTE 1: Outputs termination with 50 to VCC – 2V. ICS83PN128AKI REVISION A MAY 9, 2013 4 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER AC Electrical Characteristics Table 6A. AC Characteristics, VCC = 3.3V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter fMAX Output Frequency tjit(cc) Cycle-to-Cycle Jitter; NOTE 1 tjit(Ø) RMS Phase Jitter (Random); NOTE 2 tR / tF Output Rise/Fall Time odc Output Duty Cycle Test Conditions Minimum Typical Maximum Units FSEL[1:0] = 00 128.90 MHz FSEL[1:0] = 11 161.132813 MHz 18 30 ps 128.90MHz, Integration Range: 12kHz – 20MHz 0.53 ps 161.132813MHz, Integration Range: 12kHz – 20MHz 0.374 ps 20% to 80% 150 450 ps 49 51 % NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 1: This parameter is defined in accordance with JEDEC Standard 65. NOTE 2: Please refer to the Phase Noise plots. Measured using low noise input source. Table 6B. AC Characteristics, VCC = 2.5V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter fMAX Output Frequency tjit(cc) Cycle-to-Cycle Jitter; NOTE 1 tjit(Ø) RMS Phase Jitter (Random); NOTE 2 tR / tF Output Rise/Fall Time odc Output Duty Cycle Test Conditions Minimum Typical Maximum Units FSEL[1:0] = 00 128.90 MHz FSEL[1:0] = 11 161.132813 MHz 18 35 ps 128.90MHz, Integration Range: 12kHz – 20MHz 0.56 ps 161.132813MHz, Integration Range: 12kHz – 20MHz 0.374 ps 20% to 80% 100 500 ps 49 51 % NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 1: This parameter is defined in accordance with JEDEC Standard 65. NOTE 2: Please refer to the Phase Noise plots. Measured using low noise input source. ICS83PN128AKI REVISION A MAY 9, 2013 5 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Typical Phase Noise at 128.90MHz Noise Power dBc Hz 128.90MHz RMS Phase Jitter (Random) 12kHz to 20MHz = 0.53ps (typical) Offset Frequency (Hz) Typical Phase Noise at 161.132813MHz Noise Power dBc Hz 161.132813MHz RMS Phase Jitter (Random) 12kHz to 20MHz = 0.374ps (typical) Offset Frequency (Hz) ICS83PN128AKI REVISION A MAY 9, 2013 6 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Parameter Measurement Information 2V 2V Q VCC SCOPE VCC LVPECL Q SCOPE LVPECL nQ nQ VEE VEE -1.3V± 0.165V -0.5V± 0.125V 2.5V LVPECL Output Load AC Test Circuit 3.3V LVPECL Output Load AC Test Circuit VCC nQ Q nCLK t PW V t Cross Points PP CLK V odc = CMR PERIOD t PW x 100% t PERIOD VEE Output Duty Cycle/Pulse Width/Period Differential Input Level Noise Power Phase Noise Plot nQ Q tcycle n tcycle n+1 tjit(cc) = |tcycle n – tcycle n+1| 1000 Cycles Offset Frequency f1 f2 RMS Phase Jitter = 1 * Area Under Curve Defined by the Offset Frequency Markers 2* *ƒ RMS Phase Jitter Cycle-to-Cycle Jitter ICS83PN128AKI REVISION A MAY 9, 2013 7 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Parameter Measurement Information, continued nQ 80% 80% VSW I N G 20% 20% Q tR tF Output Rise/Fall Time ICS83PN128AKI REVISION A MAY 9, 2013 8 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Applications Information Recommendations for Unused Input Pins Inputs: LVCMOS Control Pins For the control pins that have internal pullup resistors; additional resistance is not required but can be added for additional protection. A 1k resistor can be used. Wiring the Differential Input to Accept Single-Ended Levels Figure 1 shows how a differential input can be wired to accept single ended levels. The reference voltage V1= VCC/2 is generated by the bias resistors R1 and R2. The bypass capacitor (C1) is used to help filter noise on the DC bias. This bias circuit should be located as close to the input pin as possible. The ratio of R1 and R2 might need to be adjusted to position the V1in the center of the input voltage swing. For example, if the input clock swing is 2.5V and VCC = 3.3V, R1 and R2 value should be adjusted to set V1 at 1.25V. The values below are for when both the single ended swing and VCC are at the same voltage. This configuration requires that the sum of the output impedance of the driver (Ro) and the series resistance (Rs) equals the transmission line impedance. In addition, matched termination at the input will attenuate the signal in half. This can be done in one of two ways. First, R3 and R4 in parallel should equal the transmission line impedance. For most 50 applications, R3 and R4 can be 100. The values of the resistors can be increased to reduce the loading for slower and weaker LVCMOS driver. When using single-ended signaling, the noise rejection benefits of differential signaling are reduced. Even though the differential input can handle full rail LVCMOS signaling, it is recommended that the amplitude be reduced. The datasheet specifies a lower differential amplitude, however this only applies to differential signals. For single-ended applications, the swing can be larger, however VIL cannot be less than -0.3V and VIH cannot be more than VCC + 0.3V. Though some of the recommended components might not be used, the pads should be placed in the layout. They can be utilized for debugging purposes. The datasheet specifications are characterized and guaranteed by using a differential signal. Figure 1. Recommended Schematic for Wiring a Differential Input to Accept Single-ended Levels ICS83PN128AKI REVISION A MAY 9, 2013 9 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER 3.3V Differential Clock Input Interface with the vendor of the driver component to confirm the driver termination requirements. For example, in Figure 2A, the input termination applies for IDT open emitter LVHSTL drivers. If you are using an LVHSTL driver from another vendor, use their termination recommendation. The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, HCSL and other differential signals. Both VSWING and VOH must meet the VPP and VCMR input requirements. Figures 2A to 2E show interface examples for the CLK/nCLK input driven by the most common driver types. The input interfaces suggested here are examples only. Please consult 3.3V 3.3V 3.3V 1.8V Zo = 50Ω CLK Zo = 50Ω CLK Zo = 50Ω nCLK Zo = 50Ω R1 50Ω R1 50Ω Differential Input LVHSTL IDT LVHSTL Driver Differential Input LVPECL nCLK R2 50Ω R2 50Ω R2 50Ω Figure 2B. CLK/nCLK Input Driven by a 3.3V LVPECL Driver Figure 2A. CLK/nCLK Input Driven by an IDT Open Emitter LVHSTL Driver 3.3V 3.3V 3.3V 3.3V 3.3V Zo = 50Ω CLK CLK R1 100Ω nCLK Zo = 50Ω Differential Input LVPECL LVDS Receiver Figure 2D. CLK/nCLK Input Driven by a 3.3V LVDS Driver Figure 2C. CLK/nCLK Input Driven by a 3.3V LVPECL Driver 3.3V nCLK 3.3V *R3 CLK nCLK HCSL *R4 Differential Input Figure 2E. CLK/nCLK Input Driven by a 3.3V HCSL Driver ICS83PN128AKI REVISION A MAY 9, 2013 10 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER 2.5V Differential Clock Input Interface with the vendor of the driver component to confirm the driver termination requirements. For example, in Figure 3A, the input termination applies for IDT open emitter LVHSTL drivers. If you are using an LVHSTL driver from another vendor, use their termination recommendation. The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, HCSL and other differential signals. Both VSWING and VOH must meet the VPP and VCMR input requirements. Figures 3A to 3E show interface examples for the CLK/nCLK input driven by the most common driver types. The input interfaces suggested here are examples only. Please consult 2.5V 2.5V 2.5V 1.8V Zo = 50 Zo = 50 CLK CLK Zo = 50 Zo = 50 nCLK nCLK Differential Input LVHSTL IDT Open Emitter LVHSTL Driver R1 50 Differential Input LVPECL R2 50 R1 50 R2 50 R3 18 Figure 3B. CLK/nCLK Input Driven by a 2.5V LVPECL Driver Figure 3A. CLK/nCLK Input Driven by an IDT Open Emitter LVHSTL Driver 2.5V 2.5V 2.5V R3 250 2.5V R4 250 2.5V Zo = 50 Zo = 50 CLK CLK R1 100 Zo = 50 nCLK Differential Input LVPECL R1 62.5 R2 62.5 Zo = 50 LVDS nCLK Differential Input Figure 3D. CLK/nCLK Input Driven by a 2.5V LVDS Driver Figure 3C. CLK/nCLK Input Driven by a 2.5V LVPECL Driver 2.5V 2.5V 2.5V R5 120Ω R7 120Ω Zo = 60Ω CLK Zo = 60Ω nCLK SSTL R6 120Ω R8 120Ω Differential Input Figure 3E. CLK/nCLK Input Driven by a 2.5V SSTL Driver ICS83PN128AKI REVISION A MAY 9, 2013 11 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER VFQFN EPAD Thermal Release Path In order to maximize both the removal of heat from the package and the electrical performance, a land pattern must be incorporated on the Printed Circuit Board (PCB) within the footprint of the package corresponding to the exposed metal pad or exposed heat slug on the package, as shown in Figure 4. The solderable area on the PCB, as defined by the solder mask, should be at least the same size/shape as the exposed pad/slug area on the package to maximize the thermal/electrical performance. Sufficient clearance should be designed on the PCB between the outer edges of the land pattern and the inner edges of pad pattern for the leads to avoid any shorts. and dependent upon the package power dissipation as well as electrical conductivity requirements. Thus, thermal and electrical analysis and/or testing are recommended to determine the minimum number needed. Maximum thermal and electrical performance is achieved when an array of vias is incorporated in the land pattern. It is recommended to use as many vias connected to ground as possible. It is also recommended that the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is desirable to avoid any solder wicking inside the via during the soldering process which may result in voids in solder between the exposed pad/slug and the thermal land. Precautions should be taken to eliminate any solder voids between the exposed heat slug and the land pattern. Note: These recommendations are to be used as a guideline only. For further information, please refer to the Application Note on the Surface Mount Assembly of Amkor’s Thermally/ Electrically Enhance Leadframe Base Package, Amkor Technology. While the land pattern on the PCB provides a means of heat transfer and electrical grounding from the package to the board through a solder joint, thermal vias are necessary to effectively conduct from the surface of the PCB to the ground plane(s). The land pattern must be connected to ground through these vias. The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are application specific PIN PIN PAD SOLDER EXPOSED HEAT SLUG GROUND PLANE THERMAL VIA SOLDER LAND PATTERN (GROUND PAD) PIN PIN PAD Figure 4. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale ICS83PN128AKI REVISION A MAY 9, 2013 12 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Termination for 3.3V LVPECL Outputs The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned are recommended only as guidelines. transmission lines. Matched impedance techniques should be used to maximize operating frequency and minimize signal distortion. Figures 5A and 5B show two different layouts which are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board designers simulate to guarantee compatibility across all printed circuit and clock component process variations. The differential outputs are low impedance follower outputs that generate ECL/LVPECL compatible signals. Therefore, terminating resistors (DC current path to ground) or current sources must be used for functionality. These outputs are designed to drive 50 R3 125 3.3V R4 125 3.3V 3.3V Zo = 50 + _ LVPECL Input Zo = 50 R1 84 Figure 5A. 3.3V LVPECL Output Termination ICS83PN128AKI REVISION A MAY 9, 2013 R2 84 Figure 5B. 3.3V LVPECL Output Termination 13 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Termination for 2.5V LVPECL Outputs level. The R3 in Figure 5B can be eliminated and the termination is shown in Figure 6C. Figure 6A and Figure 6B show examples of termination for 2.5V LVPECL driver. These terminations are equivalent to terminating 50 to VCC – 2V. For VCC = 2.5V, the VCC – 2V is very close to ground 2.5V VCC = 2.5V 2.5V 2.5V VCC = 2.5V R1 250Ω 50Ω R3 250Ω + 50Ω + 50Ω – 50Ω 2.5V LVPECL Driver – R1 50Ω 2.5V LVPECL Driver R2 62.5Ω R2 50Ω R4 62.5Ω R3 18Ω Figure 6A. 2.5V LVPECL Driver Termination Example Figure 6B. 2.5V LVPECL Driver Termination Example 2.5V VCC = 2.5V 50Ω + 50Ω – 2.5V LVPECL Driver R1 50Ω R2 50Ω Figure 6C. 2.5V LVPECL Driver Termination Example ICS83PN128AKI REVISION A MAY 9, 2013 14 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Schematic Application Figure 7 shows an example of ICS83PN128I application schematic. In this example, the device is operated at VCC = 3.3V. As with any high speed analog circuitry, the power supply pins are vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The ICS83PN128I provides separate power supplies to isolate any high switching noise from coupling into the internal PLL. Power supply filter recommendations are a general guideline to be used for reducing external noise from coupling into the devices. The filter performance is designed for a wide range of noise frequencies. This low-pass filter starts to attenuate noise at approximately 10kHz. If a specific frequency noise component is known, such as switching power supplies frequencies, it is recommended that component values be adjusted and if required, additional filtering be added. Additionally, good general design practices for power plane voltage stability suggests adding bulk capacitance in the local area of all devices. In order to achieve the best possible filtering, it is recommended that the placement of the filter components be on the device side of the PCB as close to the power pins as possible. If space is limited, the 0.1uF capacitor in each power pin filter should be placed on the device side. The other components can be on the opposite side of the PCB.   The schematic example focuses on functional connections and is not configuration specific. Refer to the pin description and functional tables in the datasheet to ensure that the logic control inputs are properly set. Logic Control Inp ut Ex amples S et Log ic Input to '1' VCC RU1 1K S et Log ic Input to '0' V CC 3. 3V RU2 N ot I ns tal l VCC F SE L1 FS EL0 C1 RD2 1K U1 0. 1uF 1 BLM18B B221SN 1 2 C2 Ferri te B ead C3 0.1uF 10uF 3. 3V F SE L1 F SEL0 RD1 N ot I ns t al l To Logic Input pins 10 9 To Logic Input pins R1 133 R2 133 Zo = 50 Ohm OE 1 2 3 OE R eserv ed VE E VC C nQ Q 8 7 6 Q + Zo = 50 Ohm - nC LK C LK nQ 4 5 R3 82.5 R4 82. 5 VCC=3.3V VC C R5 125 R6 125 Zo = 50 Ohm + Zo = 50 Ohm Z o = 50 C LK - nC LK R7 50 Z o = 50 R9 84 R8 50 R 10 84 LV PE C L D riv er Optional Y-Terminat ion R 11 50 Figure 7. ICS83PN128I Schematic Example ICS83PN128AKI REVISION A MAY 9, 2013 15 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Power Considerations This section provides information on power dissipation and junction temperature for the ICS83PN128I. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the ICS83PN128I is the sum of the core power plus the power dissipated due to loading. The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated due to loading. • Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 189mA = 654.885mW • Power (outputs)MAX = 32mW/Loaded Output pair Total Power_MAX (3.465V, with all outputs switching) = 654.885mW + 32mW = 686.885mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond wire and bond pad temperature remains below 125°C. The equation for Tj is as follows: Tj = JA * Pd_total + TA Tj = Junction Temperature JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 39.2°C/W per Table 7 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.687W * 39.2°C/W = 111.8°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board. Table 7. Thermal Resistance JA for 10 Lead VFQFN, Forced Convection JA vs. Air Flow Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards ICS83PN128AKI REVISION A MAY 9, 2013 0 39.2°C/W 16 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER 3. Calculations and Equations. The purpose of this section is to derive the power dissipated into the load. LVPECL output driver circuit and termination are shown in Figure 8. VCC Q1 VOUT RL 50Ω VCC - 2V Figure 8. LVPECL Driver Circuit and Termination To calculate power dissipation due to loading, use the following equations which assume a 50 load, and a termination voltage of VCC – 2V. • For logic high, VOUT = VOH_MAX = VCC_MAX – 0.8V (VCC_MAX – VOH_MAX) = 0.8V • For logic low, VOUT = VOL_MAX = VCC_MAX – 1.6V (VCC_MAX – VOL_MAX) = 1.6V Pd_H is power dissipation when the output drives high. Pd_L is the power dissipation when the output drives low. Pd_H = [(VOH_MAX – (VCC_MAX – 2V))/RL] * (VCC_MAX – VOH_MAX) = [(2V – (VCC_MAX – VOH_MAX))/RL] * (VCC_MAX – VOH_MAX) = [(2V – 0.8V)/50] * 0.8V = 19.2mW Pd_L = [(VOL_MAX – (VCC_MAX – 2V))/RL] * (VCC_MAX – VOL_MAX) = [(2V – (VCC_MAX – VOL_MAX))/RL] * (VCC_MAX – VOL_MAX) = [(2V – 1.6V)/50] * 1.6V = 12.8mW Total Power Dissipation per output pair = Pd_H + Pd_L = 32mW ICS83PN128AKI REVISION A MAY 9, 2013 17 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Reliability Information Table 8. JA vs. Air Flow Table for a 10 Lead VFQFN JA vs. Air Flow Meters per Second 0 Multi-Layer PCB, JEDEC Standard Test Boards 39.2°C/W Transistor Count The transistor count for ICS83PN128I is: 42,520 Package Dimensions Table 9. Package Dimensions for 10-Lead VFQFN Symbol N A A1 b1 b2 D D2 E E2 e1 e2 L1 L2 N ND NE aaa bbb ccc VNJR-1 All Dimensions in Millimeters Minimum Nominal 10 0.80 0.90 0 0.02 0.35 0.40 1.35 1.40 5.00 Basic 1.55 1.70 7.00 Basic 3.55 3.70 1.0 2.54 0.45 0.55 1.0 1.10 10 2 3 0.15 0.10 0.10 ICS83PN128AKI REVISION A MAY 9, 2013 Maximum 1.00 0.05 0.45 1.45 1.80 3.80 0.65 1.20 18 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Package Outline Package Outline - K Suffix for 10-Lead VFQFN D e1 A NX L2 B 0.1mm 0.1mm → bbb C A B → 4 INDEX AREA (D/2 xE/2) 7 NX b1 NX b2 7 C A B e2 aaa C 2x E2 E bbb 4 INDEX AREA (D/2 xE/2) PIN#1 ID TOP VIEW A1 D2 8 BOTTOM VIEW C A ccc C NX L1 9 aaa C 2x SEATING PLANE SIDE VIEW 0.08 C Bottom View w/Type A ID Bottom View w/Type C ID 2 1 2 1 CHAMFER 4 N N-1 RADIUS 4 N N-1 There are 2 methods of indicating pin 1 corner at the back of the VFQFN package: 1. Type A: Chamfer on the paddle (near pin 1) 2. Type C: Mouse bite on the paddle (near pin 1) NOTE: The following package mechanical drawing is a generic drawing that applies to any pin count VFQFN package. This drawing is not intended to convey the actual pin count or pin layout of this ICS83PN128AKI REVISION A MAY 9, 2013 device. The pin count and pin out are shown on the front page. The package dimensions are in Table 9. 19 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER Ordering Information Table 10. Ordering Information Part/Order Number Marking Package Shipping Packaging Temperature 83PN128AKILF ICS3PN128AIL “Lead-Free” 10 Lead VFQFN Tray -40C to 85C 83PN128AKILFT ICS3PN128AIL “Lead-Free” 10Lead VFQFN Tape & Reel -40C to 85C ICS83PN128AKI REVISION A MAY 9, 2013 20 ©2013 Integrated Device Technology, Inc. ICS83PN128I Data Sheet PROGRAMMABLE FEMTOCLOCK® NG DIFFERENTIAL-TO-3.3V, 2.5V LVPECL SYNTHESIZER We’ve Got Your Timing Solution 6024 Silver Creek Valley Road San Jose, California 95138 Sales 800-345-7015 (inside USA) +408-284-8200 (outside USA) Fax: 408-284-2775 www.IDT.com/go/contactIDT Technical Support netcom@idt.com +480-763-2056 DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. Copyright 2013. All rights reserved.
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