841402DKILFT

841402DKILFT

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    VFQFN32

  • 描述:

    IC CLOCK GENERATOR 32VFQFN

  • 数据手册
  • 价格&库存
841402DKILFT 数据手册
FemtoClock® Crystal-to-0.7V Differential HCSL Clock Generator ICS841402I DATA SHEET General Description Features The ICS841402I is an optimized PCIe and sRIO clock generator. The device uses a 25MHz parallel resonant crystal to generate 100MHz, 125MHz, 200MHz and 400MHz clock signals, replacing solutions requiring multiple oscillator and fanout buffer solutions. The device has excellent phase jitter suitable to clock components requiring precise and low jitter PCIe, sRIO or both clock signals. The device also supports a configurable spread-spectrum generation for PCIe applications. Designed for telecom, networking and industrial applications, the ICS841402I can also drive the high-speed sRIO and PCIe SerDes clock inputs of communications processors, DSPs, switches and bridges. • Two 0.7V differential HCSL outputs: configurable for PCIe (100MHz or 200MHz) and sRIO (125MHz) clock signals • • One LVCMOS/LVTTL reference clock output • Supports the following output frequencies: 100MHz, 125MHz, 200MHz or 400MHz • • • • VCO frequency range: 950MHz - 1.25GHz • PCI Express (2.5 Gb/S), Gen 2 (5 Gb/s) and Gen 3 (8 Gb/s) jitter compliant (REF_OUT disabled) • • • Full 3.3V operating supply Selectable crystal oscillator interface, 25MHz, 18pF parallel resonant crystal or LVCMOS/LVTTL single-ended reference clock input Configurable spread-spectrum generation for PCIe PLL bypass and output enable RMS phase jitter @ 200MHz, using a 25MHz crystal (12kHz – 20MHz): 1.21ps (typical) -40°C to 85°C ambient operating temperature Available in lead-free (RoHS 6) packages Block Diagram OE_REFOUT Pulldown 25MHz REF_OUT 25MHz Pulldown ÷ Q1 nQ1 Pin Assignment GND M= ÷40, ÷48 IREF SSM Pulldown BYPASS Pulldown FSEL[1:0] MR/nOE Pullup:Pulldown SSM REF_SEL Spread-Spectrum 1 IREF Pulldown nQ0 BYPASS REF_IN 0 Q0 VDD FemtoClock PLL XTAL_OUT N= ÷ ÷ ÷ VDDA 1 0 REF_SEL OSC REF_IN XTAL_IN 32 31 30 29 28 27 26 25 2 Pulldown XTAL_IN 1 24 VDD XTAL_OUT 2 23 FSEL1 MR/nOE 3 VDD 4 Q0 5 nQ0 6 Q1 7 nQ1 8 ICS841402I 32-Lead VFQFN 5mm x 5mm x 0.925mm package body K Package Top View 22 FSEL0 21 REF_OUT 20 OE_REFOUT 19 GND 18 nc 17 nc ICS841402DKI REVISION A NOVEMBER 7, 2012 1 nc nc VDD nc nc nc nc GND 9 10 11 12 13 14 15 16 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Table 1. Pin Descriptions Number Name 1, 2 XTAL_IN, XTAL_OUT Type Description Input 3 MR/nOE Input 4, 14, 24, 29 VDD Power Core supply pins. 5, 6 Q0, nQ0 Output Differential output pair. HCSL interface levels. 7, 8 Q1, nQ1 Output Differential output pair. HCSL interface levels. 9, 19, 32 GND Power Power supply ground. 10, 11, 12, 13, 15, 16, 17, 18 nc Unused 20 OE_REFOUT Input 21 REF_OUT Output 22 F_SEL0 Input Pulldown Output frequency select pin. LVCMOS/LVTTL interface levels. See Table 3B. 23 F_SEL1 Input Pullup Output frequency select pin. LVCMOS/LVTTL interface levels. See Table 3B. 25 SSM Input Pulldown Spread-spectrum selection. LVCMOS/LVTTL interface levels. See Table 3A. 26 IREF Output 27 BYPASS Input 28 VDDA Power 30 REF_SEL Input Pulldown Reference select. Selects the input reference source. LVCMOS/LVTTL interface levels. See Table 3E. 31 REF_IN Input Pulldown LVCMOS/LVTTL PLL reference clock input. Parallel resonant crystal interface. XTAL_OUT is the output, XTAL_IN is the input. (PLL reference.) Pulldown Master reset. LVCMOS/LVTTL interface levels. See Table 3D. No connect. Pulldown Output enable pin. LVCMOS/LVTTL interface levels. See Table 3F. Reference clock output. LVCMOS/LVTTL interface levels. In PCIe Gen 2 and Gen 3 applications, the REF_OUT output should be disabled. 0.7V current reference resistor output. A fixed precision resistor (475) from this pin to ground provides a reference current used for differential current-mode Qx, nQx clock outputs. Pulldown Selects PLL operation/PLL bypass operation. See Table 3C. LVCMOS/LVTTL interface levels. Analog supply pin. NOTE: Pulldown and Pullup refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. Table 2. Pin Characteristics Symbol Parameter Test Conditions CIN Input Capacitance 4 pF RPULLDOWN Input Pulldown Resistor 51 k RPULLUP Input Pullup Resistor 51 k ROUT Output Impedance 27  REF_OUT ICS841402DKI REVISION A NOVEMBER 7, 2012 2 Minimum Typical Maximum Units ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Function Tables Table 3A. Spread-Spectrum Modulation (SSM) Function Table (fREF = 25MHz) Input Outputs SSM Q[0:1], nQ[0:1] 0 SSM off (default) 1 SSM on (at 32kHz, -0.5%) Table 3B. FSEL Function Table (fREF = 25MHz) Inputs Outputs FSEL1 FSEL0 M Divider N Divider Q[0:1], nQ[0:1] 0 0 48 12 VCO/12 (100MHz) PCIe 0 1 40 8 VCO/8 (125MHz) sRIO 1 0 48 6 VCO/6 (200MHz) PCIe (default) 1 1 48 3 VCO/3 (400MHz) Table 3C. BYPASS Function Table Table 3E. REF_SEL Function Table Input BYPASS Input PLL Configuration REF_SEL Input Reference 0 PLL on (default) 0 XTAL (default) 1 PLL bypassed (Q[0:1], nQ[0:1] = fREF/N) 1 REF_IN Table 3D. MR/nOE Function Table Table 3F. OE_REFOUT Function Table Input MR/nOE Input NOTE1 Function OE_REFOUT Function 0 Outputs enabled (default) 0 REF_OUT disabled (High Impedance) (default) 1 Device reset, outputs disabled (High Impedance) 1 REF_OUT enabled NOTE 1: Asynchronous function. ICS841402DKI REVISION A NOVEMBER 7, 2012 3 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Absolute Maximum Ratings NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Item Rating Supply Voltage, VDD 4.6V Inputs, VI XTAL_IN Other Inputs 0V to VDD -0.5V to VDD + 0.5V Outputs, VO -0.5V to VDD + 0.5V Package Thermal Impedance, JA 37.0C/W (0 mps) Storage Temperature, TSTG -65C to 150C DC Electrical Characteristics Table 4A. Power Supply DC Characteristics, VDD = 3.3V ± 5%, TA = -40°C to 85°C Symbol Parameter VDD Test Conditions Minimum Typical Maximum Units Power Supply Voltage 3.135 3.3 3.465 V VDDA Analog Supply Voltage VDD – 0.16 3.3 VDD V IDD Power Supply Current Outputs unterminated 156 mA IDDA Analog Supply Current Outputs unterminated 16 mA Maximum Units Table 4B. LVCMOS/LVTTL DC Characteristics, VDD = 3.3V ± 5%, TA = -40°C to 85°C Symbol Parameter VIH Input High Voltage 2 VDD + 0.3 V VIL Input Low Voltage -0.3 0.5 V IIH IIL Input High Current Input Low Current Test Conditions Minimum Typical REF_IN, REF_SEL, BYPASS, SSM, F_SEL0, MR/nOE, OE_REFOUT VDD = VIN = 3.465V 150 µA F_SEL1 VDD = VIN = 3.465V 5 µA REF_IN, REF_SEL, BYPASS, SSM, F_SEL0, MR/nOE, OE_REFOUT VDD = 3.465V, VIN = 0V -5 µA F_SEL1 VDD = 3.465V, VIN = 0V -150 µA 2.6 V VOH Output High Voltage REF_OUT IOH = -12mA VOL Output Low Voltage REF_OUT IOL = 12mA ICS841402DKI REVISION A NOVEMBER 7, 2012 4 0.5 V ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Table 5. Crystal Characteristics Parameter Test Conditions Minimum Mode of Oscillation Typical Maximum Units Fundamental Frequency 25 MHz Equivalent Series Resistance (ESR) 50  Shunt Capacitance 7 pF NOTE: Characterized using an 18pF parallel resonant crystal. AC Electrical Characteristics Table 6A. PCI Express Jitter Specifications, VDD = 3.3V ± 5%, TA = -40°C to 85°C Typical Maximum PCIe Industry Specification Units ƒ = 100MHz, 25MHz crystal input Evaluation Band: 0Hz - Nyquist (clock frequency/2) 14.2 30.6 86 ps Phase Jitter RMS; NOTE 2, 4 ƒ = 100MHz, 25MHz Crystal Input High Band: 1.5MHz - Nyquist (clock frequency/2) 0.77 1.4 3.1 ps tREFCLK_LF_RMS (PCIe Gen 2) Phase Jitter RMS; NOTE 2, 4 ƒ = 100MHz, 25MHz Crystal Input Low Band: 10kHz - 1.5MHz 0.17 0.45 3.0 ps tREFCLK_LF_RMS (PCIe Gen 3) Phase Jitter RMS; NOTE 3, 4 ƒ = 100MHz, 25MHz crystal input Evaluation Band: 0Hz - Nyquist (clock frequency/2) 0.16 0.35 0.8 ps Symbol Parameter tj (PCIe Gen 1) Phase Jitter Peak to Peak Note 1, 4 tREFCLK_HF_RMS (PCIe Gen 2) Test Conditions Minimum NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. For additional information, refer to the PCI Express Application Note section in the datasheet. NOTE: PCIe jitter parameters were obtained with Spread Spectum Modulation disabled. NOTE: PCIe Gen 2 and Gen 3 jitter parameters were obtained with REF_OUT disabled. NOTE 1: Peak-to-Peak jitter after applying system transfer function for the Common Clock Architecture. Maximum limit for PCI Express Gen 1 is 86ps peak-to-peak for a sample size of 106 clock periods. NOTE 2: RMS jitter after applying the two evaluation bands to the two transfer functions defined in the Common Clock Architecture and reporting the worst case results for each evaluation band. Maximum limit for PCI Express Generation 2 is 3.1ps RMS for tREFCLK_HF_RMS (High Band) and 3.0ps RMS for tREFCLK_LF_RMS (Low Band). NOTE 3: RMS jitter after applying system transfer function for the common clock architecture. This specification is based on the PCI Express Base Specification Revision 0.7, October 2009 and is subject to change pending the final release version of the specification. NOTE 4: This parameter is guaranteed by characterization. Not tested in production. ICS841402DKI REVISION A NOVEMBER 7, 2012 5 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Table 6B. AC Characteristics, VDD = 3.3V ± 5%, TA = -40°C to 85°C Symbol fOUT Parameter Output Frequency Test Conditions Minimum Q[0:1], nQ[0:1] REF_OUT fIN Input Frequency tsk(o) Output Skew; NOTE 1, 2 tjit(cc) tjit(Ø) REF_IN Cycle-to-Cycle Jitter; NOTE 2 RMS Phase Jitter (Random); NOTE 3 400 MHz 25 MHz 25 MHz 70 ps 35 92 ps fOUT = 200MHz, N = 6, OE_REFOUT = 1, SSM = 0 20 72 ps fOUT = 400MHz, N = 3, OE_REFOUT = 1, SSM = 0 15 36 ps fOUT = 100MHz (12kHz – 20MHz) 1.21 1.6 ps fOUT = 125MHz (12kHz – 20MHz) 1.47 1.6 ps fOUT = 200MHz (12kHz – 20MHz) 1.23 1.6 ps fOUT = 400MHz (12kHz – 20MHz) 1.32 2 ps 85 ms 1150 mV -300 VRB Ringback Voltage; NOTE 7, 8 -100 tSTABLE Time before VRB is allowed; NOTE 7, 8 500 FM SSC Modulation Frequency; NOTE 9 29 FMF SSC Modulation Factor; NOTE 9 SSCRED Spectral Reduction; NOTE 9 VCROSS Absolute Crossing Voltage; NOTE 4, 10, 11 VCROSS Total Variation of VCROSS; NOTE 4, 10, 12 Output Duty Cycle MHz fOUT = 125MHz, N = 8, OE_REFOUT = 1, SSM = 0 Absolute Minimum Output Voltage; NOTE 4, 6 odc 200 ps VMIN Output Rise/Fall Time MHz 100 Absolute Maximum Output Voltage; NOTE 4, 5 tR / tF MHz 125 60 VMAX tSLEW- Units fOUT = 100MHz, N = 12, OE_REFOUT = 1, SSM = 0 PLL Lock Time Rising/Falling Edge Rate; NOTE 7, 13 Maximum 100 REF_SEL = 1, BYPASS = 0 tL tSLEW+ Typical 125 Measured between -150mV to +150mV REF_OUT mV 100 mV 33.33 kHz ps 32 -0.5 % 10 dB 560 mV 140 mV 0.6 4.7 V/ns 0.6 4.7 V/ns 690 1550 ps Q[0:1], nQ[0:1] N = 8, N = 12 45 55 % Q[0:1], nQ[0:1] N6 44 56 % Using REF_IN Input 48 52 % REF_OUT; NOTE 14 NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 1: Defined as skew between outputs at the same supply voltages and with equal load conditions. Measured at the output differential cross points. ICS841402DKI REVISION A NOVEMBER 7, 2012 6 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR NOTE 2: This parameter is defined in accordance with JEDEC Standard 65. NOTE 3: Refer to the Phase Noise Plots. NOTE 4: Measurement taken from single-ended waveform. NOTES continued on next page. NOTE 5: Defined as the maximum instantaneous voltage including overshoot. NOTE 6: Defined as the minimum instantaneous voltage including undershoot. See Parameter Measurement Information Section. NOTE 7: Measurement taken from a differential waveform. NOTE 8: TSTABLE is the time the differential clock must maintain a minimum ±150mV differential voltage after rising/falling edges before it is allowed to drop back into the VRB ±100 differential range. See Parameter Measurement Information Section. NOTE 9: Spread Spectrum clocking enabled. NOTE 10: Measured at crossing point where the instantaneous voltage value of the rising edge of Qx equals the falling edge of nQx. See Parameter Measurement Information Section. NOTE 11: Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all crossing points for this measurement. See Parameter Measurement Information Section. NOTE 12: Defined as the total variation of all crossing voltage of rising Qx and falling nQx. This is the maximum allowed variance in the VCROSS for any particular system. See Parameter Measurement Information Section. NOTE 13: Measured from -150mV to +150mV on the differential waveform (derived from Qx minus nQx). The signal must be monotonic through the measurement region for rise and fall time. The 300mV measurement window is centered on the differential zero crossing. See Parameter Measurement Information Section. NOTE 14: REF_OUT duty cycle characterized with REF_IN input duty cycle between 48% and 52%. ICS841402DKI REVISION A NOVEMBER 7, 2012 7 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Noise Power dBc Hz Typical Phase Noise at 100MHz Offset Frequency (Hz) Noise Power dBc Hz Typical Phase Noise at 125MHz Offset Frequency (Hz) ICS841402DKI REVISION A NOVEMBER 7, 2012 8 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Noise Power dBc Hz Typical Phase Noise at 200MHz Offset Frequency (Hz) Noise Power dBc Hz Typical Phase Noise at 400MHz Offset Frequency (Hz) ICS841402DKI REVISION A NOVEMBER 7, 2012 9 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Parameter Measurement Information 3.3V¬±5 3.3V¬±5 3.3V¬±5 3.3V¬±5 50 VDD VDDA VDDA 49.9Ω 2pF HCSL Measurement Point 50Ω 33Ω IREF 50 IREF GND GND 49.9Ω 475 2pF 475Ω 0V SCOPE Measurement Point 50Ω 33Ω VDD 0V 0V This load condition is used for VMAX, VMIN, VRB, VRB, tSTABLE, VCROSS, VCROSS and tSLEW± measurements. 0V This load condition is used for IDD, tjit(cc), tsk(o), odc and tjit(Ø) measurements. 3.3V HCSL Output Load AC Test Circuit 3.3V HCSL Output Load AC Test Circuit 1.65V¬±5 1.65V¬±5 nQx SCOPE VDD Qx VDDA Qx nQy Qy GND tsk(o) -1.65V¬±5 Output Skew 3.3V LVCMOS Output Load AC Test Circuit Noise Power Phase Noise Plot nQ0, nQ1 Q0, Q1 ➤ ➤ tcycle n+1 ➤ ➤ tjit(cc) = |tcycle n – tcycle n+1| 1000 Cycles Offset Frequency f2 f1 RMS Phase Jitter = 1 * Area Under Curve Defined by the Offset Frequency Markers 2* *ƒ Cycle-to-Cycle Jitter RMS Phase Jitter ICS841402DKI REVISION A NOVEMBER 7, 2012 tcycle n 10 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Parameter Measurement Information, continued V DD 2 REF_OUT t PW t 80% tR tF PERIOD REF_OUT odc = 80% t PW 20% 20% x 100% t PERIOD LVCMOS Rise/Fall Time LVCMOS Output Duty Cycle VMAX nQ nQ VCROSS_MAX VCROSS VCROSS_MIN Q Q VMIN Single-ended Measurement Points for Delta Cross Point Single-ended Measurement Points for Absolute Cross Point/Swing TSTABLE VRB Rise Edge Rate +150mV VRB = +100mV 0.0V VRB = -100mV -150mV Fall Edge Rate +150mV 0.0V -150mV Q - nQ Q - nQ VRB TSTABLE Differential Measurement Points for Rise/Fall Edge Rate Differential Measurement Points for Ringback ICS841402DKI REVISION A NOVEMBER 7, 2012 11 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Parameter Measurement Information, continued Clock Period (Differential) Positive Duty Cycle (Differential) Negative Duty Cycle (Differential) 0.0V Q - nQ Differential Measurement Points for Duty Cycle/Period ICS841402DKI REVISION A NOVEMBER 7, 2012 PLL Lock Time 12 ©2012 Integrated Device Technology, Inc. ICS841402I Data Sheet FEMTOCLOCK® CRYSTAL-TO-0.7V DIFFERENTIAL HCSL CLOCK GENERATOR Spread Spectrum Spread-spectrum clocking is a frequency modulation technique for EMI reduction. When spread-spectrum is enabled, a 32kHz triangle waveform is used with 0.5% down-spread (+0.0% / -0.5%) from the nominal output frequency. An example of a triangle frequency modulation profile is shown in Figure 1A below. The ramp profile can be expressed as: • Fnom = Nominal Clock Frequency in Spread Off mode (200MHz with 25MHz) • • Fm = Nominal Modulation Frequency (32kHz) An example of the amount of down spread relative to the nominal clock frequency can be seen in the frequency domain, as shown in Figure 1B. The ratio of this width to the fundamental frequency is typically 0.5%. The resulting spectral reduction is typically 10dB, as shown in Figure 2B. It is important to note the ICS841402I 10dB typical spectral reduction is the component-specific EMI reduction, and will not necessarily be the same as the system EMI reduction.  = Modulation Factor (0.5% down spread) (1 – ) Fnom + 2FM x  x Fnom x t when 0 < t < 1
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