84330CYILFT

84330CI 720MHz, Low Jitter, Crystal-to-LVPECL Frequency Synthesizer Data Sheet General Description Features The 84330CI is a general purpose, single output high frequency synthesizer. The VCO operates at a frequency range of 250MHz to 720MHz. The VCO and output frequency can be programmed using the serial or parallel interfaces to the configuration logic. The output can be configured to divide the VCO frequency by 1, 2, 4, and 8. Output frequency steps as small as 250kHz to 2MHz can be achieved using a 16MHz crystal depending on the output divider settings. • • • • • • Fully integrated PLL, no external loop filter requirements • • • • • RMS period jitter: 6ps (maximum) One differential 3.3V LVPECL output Crystal oscillator interface: 10MHz to 25MHz Output frequency range: 31.25MHz to 720MHz VCO range: 250MHz to 720MHz Parallel or serial interface for programming M and N dividers during power-up Cycle-to-cycle jitter: 40ps (maximum) 3.3V supply voltage -40°C to 85°C ambient operating temperature Available in lead-free (RoHS 6) packages VEE TEST VEE VCC FOUT VCC nFOUT Pin Assignments 25 24 23 22 21 20 19 S_CLOCK 26 18 N1 S_DATA 27 17 N0 4 Pullup VCC ÷ 16 M7 M6 M5 M4 M2 M3 VEE XTAL_SEL 0 M8 10 11 TEST Pulldown 9 VCC FREF_EXT 8 M1 1 XTAL2 7 VEE OSC XTAL2 XTAL1 6 M0 12 5 VCC XTAL1 Pullup FOUT OE XTAL_SEL OE FREF_EXT Block Diagram nP_LOAD VCCA ICS84330CI 16 28 Lead PLCC V Package 15 1 11.6mm x 11.4mm x 4.1mm 14 2 package body Top View 13 3 28 nFOUT S_LOAD 32 31 30 29 28 27 26 25 M0:M8 N0:N1 TEST Pullup Pullup ©2016 Integrated Device Technology, Inc 1 4 VCCA 5 FREF_EXT 6 XTAL_SEL 7 XTAL1 8 9 10 11 12 13 14 15 16 24 nc 23 N1 22 N0 21 M8 20 M7 19 M6 18 M5 17 M4 nc CONFIGURATION INTERFACE LOGIC VCCA ICS84330CI 32 Lead LQFP Y Package 7mm x 7mm x 1.4mm package body Top View M2 Pulldown Pulldown Pulldown Pullup 0 3 M3 S_LOAD S_DATA S_CLOCK nP_LOAD ÷2 S_LOAD M0 ÷M S_DATA M1 VCO FOUT nFOUT 2 nP_LOAD 1 ÷2 ÷4 ÷8 ÷1 1 OE PHASE DETECTOR S_CLOCK XTAL2 PLL Revision A January 13, 2016 84330CI Data Sheet Functional Description LOW-to-HIGH transition of the nP_LOAD input, the data is latched and the M divider remains loaded until the next LOW transition on nP_LOAD or until a serial event occurs. The TEST output is Mode 000 (shift register out) when operating in the parallel input mode. The relationship between the VCO frequency, the crystal frequency and the M divider is defined as follows: fVCO = fXTAL x 2M 16 NOTE: The functional description that follows describes operation using a 16MHz crystal. Valid PLL loop divider values for different crystal or input frequencies are defined in the Input Frequency Characteristics, Table 6, NOTE 1. The 84330CI features a fully integrated PLL and therefore requires no external components for setting the loop bandwidth. A quartz crystal is used as the input to the on-chip oscillator. The output of the oscillator is divided by 16 prior to the phase detector. With a 16MHz crystal, this provides a 1MHz reference frequency. The VCO of the PLL operates over a range of 250MHz to 720MHz. The output of the M divider is also applied to the phase detector. The M value and the required values of M0 through M8 are shown in Table 3B, Programmable VCO Frequency Function Table. Valid M values for which the PLL will achieve lock are defined as 125  M  360. The frequency out is defined as follows: fout = fVCO = fXTAL x 2M N 16 N The phase detector and the M divider force the VCO output frequency to be 2M times the reference frequency by adjusting the VCO control voltage. Note that for some values of M (either too high or too low), the PLL will not achieve lock. The output of the VCO is scaled by a divider prior to being sent to each of the LVPECL output buffers. The divider provides a 50% output duty cycle. Serial operation occurs when nP_LOAD is HIGH and S_LOAD is LOW. The shift register is loaded by sampling the S_DATA bits with the rising edge of S_CLOCK. The contents of the shift register are loaded into the M divider when S_LOAD transitions from LOW-to-HIGH. The M divide and N output divide values are latched on the HIGH-to-LOW transition of S_LOAD. If S_LOAD is held HIGH, data at the S_DATA input is passed directly to the M divider on each rising edge of S_CLOCK. The serial mode can be used to program the M and N bits and test bits T2:T0. The internal registers T2:T0 determine the state of the TEST output as follows in the table below: The programmable features of the 84330CI support two input modes to program the M divider and N output divider. The two input operational modes are parallel and serial. Figure 1 shows the timing diagram for each mode. In parallel mode the nP_LOAD input is LOW. The data on inputs M0 through M8 and N0 through N1 is passed directly to the M divider and N output divider. On the T2 0 0 0 0 1 1 1 1 T1 0 0 1 1 0 0 1 1 T0 0 1 0 1 0 1 0 1 TEST Output Shift Register Out HIGH PLL Reference XTAL ÷16 (VCO ÷ M)/2 (non 50% Duty Cycle M Divider) fOUT, LVCMOS Output Frequency < 200MHz LOW (S_CLOCK ÷ M)/2 (non 50% Duty Cycle M Divider) fOUT ÷ 4 fOUT fOUT fOUT fOUT fOUT fOUT fOUT S_CLOCK ÷ N Divider fOUT SERIAL LOADING S_CLOCK T2 S_DATA t S_LOAD S t T1 T0 N1 N0 M8 M7 M6 M5 M4 M3 M2 M1 M0 H t nP_LOAD S PARALLEL LOADING M0:M8, N0:N1 M, N nP_LOAD t S t H nP_LOAD Time Figure 1. Parallel & Serial Load Operations ©2016 Integrated Device Technology, Inc 2 Revision A January 13, 2016 84330CI Data Sheet Table 1. Pin Descriptions Name Type Description Power VCCA Analog supply pin. XTAL1, XTAL2 Crystal oscillator interface. XTAL1 is an oscillator input, XTAL2 is an oscillator output. XTAL_SEL Input Pullup Selects between the crystal oscillator or FREF_EXT inputs as the PLL reference source. Selects XTAL inputs when HIGH. Selects FREF_EXT when LOW. LVCMOS / LVTTL interface levels. OE Input Pullup Output enable. LVCMOS / LVTTL interface levels. nP_LOAD Input Pullup Parallel load input. Determines when data present at M8:M0 is loaded into M divider, and when data present at N1:N0 sets the N output divide value. LVCMOS / LVTTL interface levels. M0, M1, M2 M3, M4, M5 M6, M7, M8 Input Pullup M divider inputs. Data latched on LOW-to-HIGH transition of nP_LOAD input. LVCMOS / LVTTL interface levels. N0, N1 Input Pullup Determines N output divider value as defined in Table 3C Function Table. LVCMOS / LVTTL interface levels. VEE Power Negative supply pins. TEST Output Test output which is used in the serial mode of operation. Single-ended LVPECL interface levels. VCC Power Core supply pins. nFOUT, FOUT Output Differential output for the synthesizer. 3.3V LVPECL interface levels. nc Unused No connect. FREF_EXT Input Pulldown PLL reference input. LVCMOS / LVTTL interface levels. S_CLOCK Input Pulldown Clocks the serial data present at S_DATA input into the shift register on the rising edge of S_CLOCK. LVCMOS / LVTTL interface levels. S_DATA Input Pulldown Shift register serial input. Data sampled on the rising edge of S_CLOCK. LVCMOS / LVTTL interface levels. S_LOAD Input Pulldown Controls transition of data from shift register into the M divider. LVCMOS / LVTTL interface levels. NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. Table 2. Pin Characteristics Symbol Parameter CIN Input Capacitance RPULLUP Input Pullup Resistor 51 k RPULLDOWN Input Pulldown Resistor 51 k ©2016 Integrated Device Technology, Inc Test Conditions Minimum Typical 4 3 Maximum Units pF Revision A January 13, 2016 84330CI Data Sheet Function Tables Table 3A. Parallel and Serial Mode Function Table Inputs nP_LOAD M N S_LOAD S_CLOCK S_DATA Conditions X X X X X X Reset. M and N bits are all set HIGH. L Data Data X X X Data on M and N inputs passed directly to the M divider and N output divider. TEST mode 000.  Data Data L X X Data is latched into input registers and remains loaded until next LOW transition or until a serial event occurs. H X X L  Data Serial input mode. Shift register is loaded with data on S_DATA on each rising edge of S_CLOCK. H X X  L Data Contents of the shift register are passed to the M divider and N output divider. H X X  L Data M divider and N output divider values are latched. Parallel or serial input do not affect shift registers. H X X L X X H X X H  Data S_DATA passed directly to M divider as it is clocked. NOTE: L = LOW H = HIGH X = Don’t care  = Rising edge transition  = Falling edge transition Table 3B. Programmable VCO Frequency Function Table 256 128 64 32 16 8 4 2 1 M Divide M8 M7 M6 M5 M4 M3 M2 M1 M0 125 0 0 1 1 1 1 1 0 1 252 126 0 0 1 1 1 1 1 1 0 254 127 0 0 1 1 1 1 1 0 1 256 128 0 1 0 0 0 0 0 1 0 • • • • • • • • • • • VCO Frequency (MHz) 250 • • • • • • • • • • • 718 359 1 0 1 1 0 0 1 1 1 720 360 1 0 1 1 0 1 0 0 0 NOTE 1: These M divide values and the resulting frequencies correspond to a crystal frequency of 16MHz. Table 3C. Programmable Output DividerFunction Table Inputs Output Frequency (MHz) N1 N0 N Divider Value Minimum Maximum 0 0 2 125 360 0 1 4 62.5 180 1 0 8 31.25 90 1 1 1 250 720 ©2016 Integrated Device Technology, Inc 4 Revision A January 13, 2016 84330CI Data Sheet Absolute Maximum Ratings NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Item Rating Supply Voltage, VCC 4.6V Inputs, VI -0.5V to VCC + 0.5V Outputs, IO Continuous Current Surge Current 50mA 100mA Package Thermal Impedance, JA 28 Lead PLCC 32 Lead LQFP 37.8C/W (0 lfpm) 47.9C/W (0 lfpm) Storage Temperature, TSTG -65C to 150C DC Electrical Characteristics Table 4A. Power Supply DC Characteristics, VCC = 3.3V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions Minimum Typical Maximum Units VCC Core Supply Voltage 3.135 3.3 3.465 V VCCA Analog Supply Voltage 3.135 3.3 3.465 V ICC Power Supply Current 160 mA ICCA Analog Supply Current 17 mA Table 4B. LVCMOS/LVTTL DC Characteristics, VCC = 3.3V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions Minimum Typical Maximum Units VIH Input High Voltage 2 VCC + 0.3 V VIL Input Low Voltage -0.3 0.8 V IIH Input High Current IIL Input Low Current M0-M8, N0, N1, OE, nP_LOAD, XTAL_SEL VCC = VIN = 3.465V 5 µA S_LOAD, S_CLOCK FREF_EXT, S_DATA VCC = VIN = 3.465V 150 µA M0-M8, N0, n1, OE, nP_LOAD, XTAL_SEL VCC = 3.465V, VIN = 0V -150 µA S_LOAD, S_CLOCK FREF_EXT, S_DATA VCC = 3.465V, VIN = 0V -5 µA Table 4C. LVPECL DC Characteristics, VCC = 3.3V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions Minimum Typical Maximum Units VOH Output High Voltage; NOTE 1 VCC - 1.4 VCC - 0.9 V VOL Output Low Voltage; NOTE 1 VCC - 2.0 VCC - 1.7 V VSWING Peak-to-Peak Output Voltage Swing 0.6 1.0 V NOTE 1: Outputs terminated with 50 to VCC -2V. ©2016 Integrated Device Technology, Inc 5 Revision A January 13, 2016 84330CI Data Sheet Table 5. Crystal Characteristics Parameter Test Conditions Minimum Mode of Oscillation Typical Maximum Units 25 MHz Fundamental Frequency 10 Equivalent Series Resistance (ESR) 50  Shunt Capacitance 7 pF Table 6. Input Frequency Characteristics, VCC = 3V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions fIN Input Frequency XTAL; NOTE 1 Minimum Typical 10 S_CLOCK FREF_EXT; NOTE 2 Maximum Units 25 MHz 50 MHz 10 MHz NOTE 1: For the crystal frequency range, the M value must be set to achieve the minimum or maximum VCO frequency range of 250MHz to 720MHz. Using the minimum input frequency of 10MHz, valid values of M are 200  M  511. Using the maximum input frequency of 25MHz, valid values of M are 80  M  230. NOTE 2: Maximum frequency on FREF_EXT is dependent on the internal M counter limitations. See Application Information Section for recommendations on optimizing the performance using the FREF_EXT input. AC Electrical Characteristics Table 7. AC Characteristics, VCC = 3.3V±5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions fOUT Output Frequency tjit(per) Period Jitter, RMS; NOTE 1. 2 tjit(cc) Cycle-to-Cycle Jitter; NOTE 1, 2 tR / tF Output Rise/Fall Time tS Setup Time Maximum Units 720 MHz 6 ps fOUT  43.75MHz 40 ps fOUT < 43.75MHz 50 ps 600 ps 20% to 80% Minimum 200 Typical S_DATA to S_CLOCK 20 ns S_CLOCK to S_LOAD 20 ns M, N to nP_LOAD 20 ns S_DATA to S_CLOCK 20 ns M, N to nP_LOAD 20 ns tH Hold Time tL PLL Lock Time odc Output Duty Cycle 45 10 ms 55 % NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. See Parameter Measurement Information section. NOTE: Characterized using 16MHz XTAL. NOTE 1: This parameter is defined in accordance with JEDEC Standard 65. NOTE 2: See Applications section. ©2016 Integrated Device Technology, Inc 6 Revision A January 13, 2016 84330CI Data Sheet Parameter Measurement Information 2V VOH VREF VCC, VCCA Qx SCOPE VOL 1σ contains 68.26% of all measurements 2σ contains 95.4% of all measurements 3σ contains 99.73% of all measurements 4σ contains 99.99366% of all measurements 6σ contains (100-1.973x10-7)% of all measurements nQx Reference Point (Trigger Edge) VEE Histogram Mean Period (First edge after trigger) -1.3V±0.165V 3.3/3.3V LVPECL Output Load AC Test Circuit Period Jitter nFOUT nFOUT FOUT FOUT tcycle n tcycle n+1 tjit(cc) = |tcycle n – tcycle n+1| 1000 Cycles Output Duty Cycle/Pulse Width/Period Cycle-to-Cycle Jitter nFOUT FOUT Output Rise/Fall Time ©2016 Integrated Device Technology, Inc 7 Revision A January 13, 2016 84330CI Data Sheet Applications Information Power Supply Filtering Technique As in any high speed analog circuitry, the power supply pins are vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The 84330CI provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. VCC and VCCA should be individually connected to the power supply plane through vias, and 0.01µF bypass capacitors should be used for each pin. Figure 2 illustrates this for a generic VCC pin and also shows that VCCA requires that an additional 10 resistor along with a 10F bypass capacitor be connected to the VCCA pin. Figure 2. Power Supply Filtering Recommendations for Unused Input and Output Pins Inputs: Outputs: LVCMOS Control Pins TEST Output All control pins have internal pullups or pulldowns; additional resistance is not required but can be added for additional protection. A 1k resistor can be used. The unused TEST output can be left floating. There should be no trace attached. LVPECL Outputs The unused LVPECL output pair can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated. Cycle-to-Cycle Jitter (ps) 50 40 30 Spec Limit N=1 20 10 0 200 300 400 500 600 700 Output Frequency (MHz) Figure 3. Cycle-to-Cycle Jitter vs. fOUT (using a 16MHz crystal) ©2016 Integrated Device Technology, Inc 8 Revision A January 13, 2016 84330CI Data Sheet Overdriving the XTAL Interface The XTAL_IN input can accept a single-ended LVCMOS signal through an AC coupling capacitor. A general interface diagram is shown in Figure 4A. The XTAL_OUT pin can be left floating. The maximum amplitude of the input signal should not exceed 2V and the input edge rate can be as slow as 10ns. This configuration requires that the output impedance of the driver (Ro) plus the series resistance (Rs) equals the transmission line impedance. In addition, VCC matched termination at the crystal input will attenuate the signal in half. This can be done in one of two ways. First, R1 and R2 in parallel should equal the transmission line impedance. For most 50 applications, R1 and R2 can be 100. This can also be accomplished by removing R1 and making R2 50. By overdriving the crystal oscillator, the device will be functional, but note, the device performance is guaranteed by using a quartz crystal. XTAL_OUT R1 100 Ro Rs C1 Zo = 50 ohms XTAL_IN R2 100 Zo = Ro + Rs .1uf LVCMOS Driver Figure 4A. General Diagram for LVCMOS Driver to XTAL Input Interface XTAL_OUT C2 Zo = 50 ohms XTAL_IN .1uf Zo = 50 ohms LVPECL Driver R1 50 R2 50 R3 50 Figure 4B. General Diagram for LVPECL Driver to XTAL Input Interface ©2016 Integrated Device Technology, Inc 9 Revision A January 13, 2016 84330CI Data Sheet Termination for 3.3V LVPECL Outputs The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned are recommended only as guidelines. transmission lines. Matched impedance techniques should be used to maximize operating frequency and minimize signal distortion. Figures 5A and 5B show two different layouts which are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board designers simulate to guarantee compatibility across all printed circuit and clock component process variations. The differential outputs are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources must be used for functionality. These outputs are designed to drive 50 R3 125 3.3V R4 125 3.3V 3.3V Zo = 50 + _ Input Zo = 50 R1 84 Figure 5A. 3.3V LVPECL Output Termination ©2016 Integrated Device Technology, Inc R2 84 Figure 5B. 3.3V LVPECL Output Termination 10 Revision A January 13, 2016 84330CI Data Sheet Layout Guideline The schematic of the 84330CI layout example used in this layout guideline is shown in Figure 6A. The 84330CI recommended PCB board layout for this example is shown in Figure 6B. This layout example is used as a general guideline. The layout in the actual system will depend on the selected component types, the density of the components, the density of the traces, and the stack up of the P.C. board. SP C1 X1 C2 16MHz, 18pF M3 M2 M1 M0 nPLOAD OE SP SP = Space (i.e. not intstalled) M [8:0]= 110010000 (400) N[1:0] =00 (Divide by 2) 12 13 14 15 16 17 18 X_IN XTAL_SEL FREF_EXT VCCA S_LOAD S_DATA S_CLOCK M4 M5 M6 M7 M8 N0 N1 4 3 2 1 28 27 26 VEE TEST VCC VEE nFOUT FOUT VCC M4 M5 M6 M7 M8 N2 N1 VCC=3.3V M3 M2 M1 M0 nP_LOAD OE X_OUT 11 10 9 8 7 6 5 VCC 19 20 21 22 23 24 25 U1 ICS84330 R7 10 VCCA C11 0.01u C16 10u C3 VCC VCC 0.1uF Zo = 50 Ohm RD0 1K RD1 1K RD7 SP RD8 SP RU10 1K RD9 1K RU11 SP nPLoad RD10 SP RU12 1K Fout = 200 M Hz C4 0.1u + Zo = 50 Ohm OE N0 RU9 SP N1 RU8 1K M8 RU7 1K M7 RU1 SP M1 M0 RU0 SP RD6 1K - R2 50 RD12 SP R1 50 R3 50 Figure 6A. 84330CI Schematic of Recommended Layout ©2016 Integrated Device Technology, Inc 11 Revision A January 13, 2016 84330CI Data Sheet • The differential 50 output traces should have the same length. The following component footprints are used in this layout example: All the resistors and capacitors are size 0603. • Avoid sharp angles on the clock trace. Sharp angle turns cause the characteristic impedance to change on the transmission lines. Power and Grounding Place the decoupling capacitors C3 and C4, as close as possible to the power pins. If space allows, placement of the decoupling capacitor on the component side is preferred. This can reduce unwanted inductance between the decoupling capacitor and the power pin caused by the via. • Keep the clock traces on the same layer. Whenever possible, avoid placing vias on the clock traces. Placement of vias on the traces can affect the trace characteristic impedance and hence degrade signal integrity. Maximize the power and ground pad sizes and number of vias capacitors. This can reduce the inductance between the power and ground planes and the component power and ground pins. • To prevent cross talk, avoid routing other signal traces in parallel with the clock traces. If running parallel traces is unavoidable, allow a separation of at least three trace widths between the differential clock trace and the other signal trace. The RC filter consisting of R7, C11, and C16 should be placed as close to the VCCA pin as possible. • Make sure no other signal traces are routed between the clock trace pair. Clock Traces and Termination Poor signal integrity can degrade the system performance or cause system failure. In synchronous high-speed digital systems, the clock signal is less tolerant to poor signal integrity than other signals. Any ringing on the rising or falling edge or excessive ring back can cause system failure. The shape of the trace and the trace delay might be restricted by the available space on the board and the component location. While routing the traces, the clock signal traces should be routed first and should be locked prior to routing other signal traces. • The matching termination resistors should be located as close to the receiver input pins as possible. Crystal The crystal X1 should be located as close as possible to the pins 4 (XTAL1) and 5 (XTAL2). The trace length between the X1 and U1 should be kept to a minimum to avoid unwanted parasitic inductance and capacitance. Other signal traces should not be routed near the crystal traces. X1 C1 C2 U1 GND VCC PIN 2 C11 PIN 1 C16 VCCA VCCA R7 VIA Signals Traces C3 C4 50 Ohm Traces Figure 6B. 84330CI PCB Board Layout for 84330CI ©2016 Integrated Device Technology, Inc 12 Revision A January 13, 2016 84330CI Data Sheet Power Considerations This section provides information on power dissipation and junction temperature for the 84330CI. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the 84330CI is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load. • Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 17mA = 58.9mW • Power (outputs)MAX = 30mW/Loaded Output Pair Total Power_MAX (3.465V, with all outputs switching) = 58.9mW + 30mW = 88.9mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond wire and bond pad temperature remains below 125°C. The equation for Tj is as follows: Tj = JA * Pd_total + TA Tj = Junction Temperature JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 31.1°C/W per Table 8A below. Therefore, Tj for an ambient temperature of 70°C with all outputs switching is: 85°C + 0.89W * 31.1°C/W = 112.7°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (multi-layer). Table 8A. Thermal Resistance JA for 28 Lead PLCC, Forced Convection JA by Velocity Linear Feet per Minute 0 200 500 37.8°C/W 31.1°C/W 28.3°C/W 0 200 500 Single-Layer PCB, JEDEC Standard Test Boards 67.8°C/W 55.9°C/W 50.1°C/W Multi-Layer PCB, JEDEC Standard Test Boards 47.9°C/W 42.1°C/W 39.4°C/W Multi-Layer PCB, JEDEC Standard Test Boards Table 8B. Thermal Resistance JA for 32 Lead LQFP, Forced Convection JA by Velocity Linear Feet per Minute NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs. ©2016 Integrated Device Technology, Inc 13 Revision A January 13, 2016 84330CI Data Sheet 3. Calculations and Equations. The purpose of this section is to calculate the power dissipation for the LVPECL output pair. LVPECL output driver circuit and termination are shown in Figure 7. VCC Q1 VOUT RL 50Ω VCC - 2V Figure 7. LVPECL Driver Circuit and Termination To calculate worst case power dissipation into the load, use the following equations which assume a 50 load, and a termination voltage of VCC - 2V. • For logic high, VOUT = VOH_MAX = VCC_MAX - 0.9V (VCC_MAX - VOH_MAX) = 0.9V • For logic low, VOUT = VOL_MAX = VCC_MAX - 1.7V (VCC_MAX - VOL_MAX) = 1.7V Pd_H is power dissipation when the output drives high. Pd_L is the power dissipation when the output drives low. Pd_H = [(VOH_MAX - (VCC_MAX -2V))/RL] * (VCC_MAX - VOH_MAX) = [(2V - (VCC_MAX - VOH_MAX))/RL] * (VCC_MAX - VOH_MAX) = [(2V - 0.9V)/50] * 0.9V = 19.8mW Pd_L = [(VOL_MAX - (VCC_MAX -2V))/RL] * (VCC_MAX - VOL_MAX) = [(2V - (VCC_MAX - VOL_MAX))/RL] * (VCC_MAX - VOL_MAX) = [(2V - 1.7V)/50] * 1.7V = 10.2mW Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW ©2016 Integrated Device Technology, Inc 14 Revision A January 13, 2016 84330CI Data Sheet Reliability Information Table 9A. JA vs. Air Flow Table for a 28 Lead PLCC JA vs. Air Flow Linear Feet per Minute 0 200 500 37.8°C/W 31.1°C/W 28.3°C/W 0 200 500 Single-Layer PCB, JEDEC Standard Test Boards 67.8°C/W 55.9°C/W 50.1°C/W Multi-Layer PCB, JEDEC Standard Test Boards 47.9°C/W 42.1°C/W 39.4°C/W Multi-Layer PCB, JEDEC Standard Test Boards Table 9B. JA vs. Air Flow Table for a 32 Lead LQFP JA vs. Air Flow Linear Feet per Minute NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs. Transistor Count The transistor count for 84330CI is: 4498 ©2016 Integrated Device Technology, Inc 15 Revision A January 13, 2016 84330CI Data Sheet Package Outline and Package Dimensions Package Outline - V Suffix for 28 Lead PLCC Table 10A. Package Dimensions for 28 Lead PLCC JEDEC Variation All Dimensions in Millimeters Symbol Minimum Maximum N 28 A 4.19 4.57 A1 2.29 3.05 A2 1.57 2.11 b 0.33 0.53 c 0.19 0.32 D/E 12.32 12.57 D1/E1 11.43 11.58 D2/E2 5.21 5.46 Reference Document: JEDEC Publication 95, MS-018 ©2016 Integrated Device Technology, Inc 16 Revision A January 13, 2016 84330CI Data Sheet Package Outline - Y Suffix for 32 Lead LQFP Table 10B. Package Dimensions for 32 Lead LQFP JEDEC Variation: BBA All Dimensions in Millimeters Symbol Minimum Nominal Maximum N 32 A 1.60 A1 0.05 0.15 A2 1.35 1.40 1.45 b 0.30 0.37 0.45 c 0.09 0.20 D&E 9.00 Basic D1 & E1 7.00 Basic D2 & E2 5.60 Ref. e 0.80 Basic L 0.45 0.60 0.75  0° 7° ccc 0.10 Reference Document: JEDEC Publication 95, MS-026 ©2016 Integrated Device Technology, Inc 17 Revision A January 13, 2016 84330CI Data Sheet Ordering Information Table 11. Ordering Information Part/Order Number 84330CVILF 84330CVILFT 84330CYILF 84330CYILFT Marking ICS84330CVILF ICS84330CVILF ICS84330CYIL ICS84330CYIL ©2016 Integrated Device Technology, Inc Package Lead-Free, 28 Lead PLCC Lead-Free, 28 Lead PLCC Lead-Free, 32 Lead LQFP Lead-Free, 32 Lead LQFP 18 Shipping Packaging Tube Tape & Reel Tube Tape & Reel Temperature -40°C to 85°C -40°C to 85°C -40°C to 85°C -40°C to 85°C Revision A January 13, 2016 84330CI Data Sheet Revision History Sheet Rev Table A A A A Description of Change Date 1 Features Section - corrected Output Frequency Range from 25MHz to 31.25MHz. 12/7/04 T10A 8 17 Added Recommendations for Unused Input and Output Pins. Package Dimension Table - D2/E2 changed the min. from 4.85 to 5.21 and the max. from 5.56 to 5.46. Converted datasheet format. 2/2/09 T11 18 Ordering Information - Added “Lead-Free” marking for the PLCC and LQFP packages. 2/19/09 T7 6 AC Characteristics Table - due to datasheet format conversion, corrected cycle-to-cycle test conditions back to original conditions. Updated Overdriving the XTAL Interface. Updated new Header/Footer format. 1/7/11 A A Page 9 T11 18 Removed leaded orderables from Ordering Information table 11/29/12 T11 1 18 Features section - removed leaded part reference. Ordering Information - Removed quantities in Tape and Reel and removed the Lead Free note below the table. Removed ICS from part numbers. Updated data sheet header and footer. 1/13/16 ©2016 Integrated Device Technology, Inc 19 Revision A January 13, 2016 84330CI Data Sheet Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 USA www.IDT.com 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales www.idt.com/go/support DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. 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