8732-01
Low Voltage, Low Skew
3.3V LVPECL Clock Generator
Data Sheet
GENERAL DESCRIPTION
Features
The 8732-01 is a low voltage, low skew, 3.3V LVPECL Clock
Generator. The 8732-01 has two selectable clock inputs. The
CLK0, nCLK0 pair can accept most standard differential input
levels. The single ended clock input accepts LVCMOS or LVTTL
input levels. The 8732-01 has a fully integrated PLL along with
frequency configurable outputs. An external feedbackinput and
outputs regenerate clocks with “zero delay”.
• Ten differential 3.3V LVPECL outputs
The 8732-01 has multiple divide select pins for each bank of
outputs along with 3 independent feedback divide select pins
allowing the 8732-01 to function both as a frequency multiplier
and divider. The PLL_SEL input can be usedto bypass the
PLL for test and system debug purposes.In bypass mode,
the input clock is routed around the PLLand into the internal
output dividers.
• Maximum output frequency: 350MHz
• Selectable differential CLK0, nCLK0 or
LVCMOS/LVTTL CLK1 inputs
• CLK0, nCLK0 supports the following input types:
LVPECL, LVDS, LVHSTL, SSTL, HCSL
• CLK1 accepts the following input levels:
LVCMOS or LVTTL
• VCO range: 250MHz to 700MHz
• External feedback for “zero delay” clock regeneration
with configurable frequencies
• Cycle-to-cycle jitter: CLK0, nCLK0, 50ps (maximum)
CLK1, 80ps (maximum)
• Output skew: 150ps (maximum)
• Static phase offset: -150ps to 150ps
• Lead-Free package fully RoHS compliant
VCCO
QFB1
nQFB1
QFB0
nQFB0
VEE
VCC
FB_IN
nFB_IN
FBDIV_SEL0
FBDIV_SEL1
FBDIV_SEL2
PIN ASSIGNMENT
VEE
BLOCK DIAGRAM
VCCO
1
52 51 50 49 48 47 46 45 44 43 42 41 40
39
VCCO
QA0
2
38
nQB3
nQA1
5
35
QB2
VEE
6
34
VEE
PLL_SEL
7
33
MR
ICS8732-01
VCCO
VCCO
31
nQA2
10
30
QA3
11
29
nQB0
nQA3
12
28
QB0
VEE
DIV_SELB0
VCC
nc
DIV_SELB1
VCCA
CLK_SEL
CLK0
nCLK0
CLK1
VEE
VCC
DIV_SELA0
13
27
14 15 16 17 18 19 20 21 22 23 24 25 26
DIV_SELA1
VEE
QB1
52-Lead LQFP
10mm x 10mm x 1.4mm package body
Y package
Top View
©2016 Integrated Device Technology, Inc
1
Revision E January 22, 2016
8732-01 Data Sheet
TABLE 1. PIN DESCRIPTIONS
Number
1, 8, 32,
39, 40
2, 3,
4, 5
6,
13, 17,
27, 34,
45, 52
Name
Type
Description
VCCO
Power
Output supply pins.
QA0, nQA0,
QA1, nQA1
Output
Differential output pair. LVPECL interface levels.
VEE
Power
Negative supply pins.
7
PLL_SEL
Input
9, 10, 11,
12
QA2, nQA2,
QA3, nQA3
Output
14
DIV_SELA1
Input
15
DIV_SELA0
Input
16, 26, 46
VCC
Power
18
CLK1
Input
19
nCLK0
Input
20
CLK0
Input
Pulldown Non-inverting differential clock input.
21
CLK_SEL
Input
Pulldown
22
VCCA
Power
23
nc
Unused
24
DIV_SELB1
Input
25
DIV_SELB0
Input
28, 29,
30, 31
QB0, nQB0,
QB1, nQB1
Output
33
MR
Input
35, 36,
37, 38
41, 42,
43, 44
QB2, nQB2,
QB3, nQB3
QFB1, nQFB1,
QFB0, nQFB0
47
FB_IN
Input
48
nFB_IN
Input
49
FBDIV_SEL0
Input
50
FBDIV_SEL1
Input
51
FBDIV_SEL2
Input
Pullup
Selects between the PLL and reference clock as the input to the dividers.
When LOW, selects reference clock. When HIGH, selects PLL.
LVCMOS / LVTTL interface levels.
Differential output pairs. LVPECL interface levels.
Determines output divider valued in Table 3.
LVCMOS / LVTTL interface levels.
Determines output divider valued in Table 3.
Pulldown
LVCMOS / LVTTL interface levels.
Pulldown
Core supply pins.
Pulldown LVCMOS / LVTTL reference clock input.
Pullup
Inverting differential clock input.
Clock select input. When LOW, selects CLK0, nCLK0.
When HIGH, selects CLK1. LVCMOS / LVTTL interface levels.
Analog supply pin.
No connect.
Determines output divider valued in Table 3.
LVCMOS / LVTTL interface levels.
Determines output divider valued in Table 3.
Pulldown
LVCMOS / LVTTL interface levels.
Pulldown
Differential output pairs. LVPECL interface levels.
Active High Master Reset. When logic HIGH, the internal dividers
are reset causing the true outputs Qx to go low and the inverted outputs
Pulldown
nQx to go high. When LOW, the internal dividers and the outputs are enabled. LVCMOS / LVTTL interface levels.
Output
Differential output pairs. LVPECL interface levels.
Output
Differential feedback output pairs. LVPECL interface levels.
Feedback input to phase detector for regenerating clocks
with “zero delay”.
Feedback input to phase detector for regenerating clocks
Pullup
with “zero delay”.
Selects divide value for differential feedback output pairs.
Pulldown
LVCMOS / LVTTL interface levels.
Selects divide value for differential feedback output pairs.
Pulldown
LVCMOS / LVTTL interface levels.
Selects divide value for differential feedback output pairs.
Pulldown
LVCMOS / LVTTL interface levels.
Pulldown
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
©2016 Integrated Device Technology, Inc
2
Revision E January 22, 2016
8732-01 Data Sheet
TABLE 2. PIN CHARACTERISTICS
Symbol
Parameter
Test Conditions
CIN
Input Capacitance
RPULLUP
RPULLDOWN
Minimum
Typical
Maximum
Units
4
pF
Input Pullup Resistor
51
kΩ
Input Pulldown Resistor
51
kΩ
TABLE 3A. CONTROL INPUT FUNCTION TABLE FOR QA0:QA3 OUTPUTS
Inputs
Outputs
MR
PLL_SEL
DIV_SELA1
DIV_SELA0
QA0:QA3, nQA0:nQA3
1
X
X
X
Low
0
1
0
0
fVCO/2
0
1
0
1
fVCO/4
0
1
1
0
fVCO/6
0
1
1
1
fVCO/8
0
0
0
0
fREF_CLK/2
0
0
0
1
fREF_CLK/4
0
0
1
0
fREF_CLK/6
0
0
1
1
fREF_CLK/8
TABLE 3B. CONTROL INPUT FUNCTION TABLE FOR QB0:QB3 OUTPUTS
Inputs
Outputs
MR
PLL_SEL
DIV_SELB1
DIV_SELB0
1
X
X
X
Low
0
1
0
0
fVCO/2
0
1
0
1
fVCO/4
0
1
1
0
fVCO/8
0
1
1
1
fVCO/12
0
0
0
0
fREF_CLK/2
0
0
0
1
fREF_CLK/4
0
0
1
0
fREF_CLK/8
0
0
1
1
fREF_CLK/12
©2016 Integrated Device Technology, Inc
QB0:QB3, nQB0:nQB3
3
Revision E January 22, 2016
8732-01 Data Sheet
TABLE 3C. CONTROL INPUT FUNCTION TABLE FOR QFB0, QFB1
Inputs
Outputs
MR
PLL_SEL
FBDIV_SEL2
FBDIV_SEL1
FBDIV_SEL0
QFB0, QFB1
nQFB0, nQFB1
1
X
X
X
X
Low
0
1
0
0
0
fVCO/4
0
1
0
0
1
fVCO/6
0
1
0
1
0
fVCO/8
0
1
0
1
1
fVCO/10
0
1
1
0
0
fVCO/8
0
1
1
0
1
fVCO/12
0
1
1
1
0
fVCO/16
0
1
1
1
1
fVCO/20
0
0
0
0
0
fREF_CLK/4
0
0
0
0
1
fREF_CLK/6
0
0
0
1
0
fREF_CLK/8
0
0
0
1
1
fREF_CLK/10
0
0
1
0
0
fREF_CLK/8
0
0
1
0
1
fREF_CLK/12
0
0
1
1
0
fREF_CLK/16
0
0
1
1
1
fREF_CLK/20
TABLE 4A. QX OUTPUT FREQUENCY W/FB_IN = QFB0 OR QFB1
Inputs
fVCO
FB_IN
FBDIV_SEL2
FBDIV_SEL1
FBDIV_SEL0
Output Divider Mode
QFB
0
0
0
QFB
0
0
1
QFB
0
1
QFB
0
1
QFB
1
0
QFB
1
0
QFB
1
QFB
1
CLK1 (MHz)
(NOTE 1)
Minimum
Maximum
÷4
62.5
175
(NOTE 2)
fREF_CLK x 4
÷6
41.67
116.67
fREF_CLK x 6
0
÷8
31.25
87.5
fREF_CLK x 8
1
÷10
25
70
fREF_CLK x 10
0
÷8
31.25
87.5
fREF_CLK x 8
1
÷12
20.83
58.33
fREF_CLK x 12
1
0
÷16
15.62
43.75
fREF_CLK x 16
1
1
÷20
12.5
35
fREF_CLK x 20
NOTE 1: VCO frequency range is 250MHz to 700MHz.
NOTE 2: The maximum input frequency that the phase detector can accept is 175MHz.
©2016 Integrated Device Technology, Inc
4
Revision E January 22, 2016
8732-01 Data Sheet
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, VCC
4.6V
Inputs, VI
-0.5V to VCC + 0.5 V
Outputs, IO
Continuous Current
Surge Current
50mA
100mA
Package Thermal Impedance, θJA
42.3°C/W (0 lfpm)
Storage Temperature, TSTG
-65°C to 150°C
NOTE: Stresses beyond those listed under Absolute
Maximum Ratings may cause permanent damage to the
device. These ratings are stress specifications only. Functional
operation of product at these conditions or any conditions
beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect product reliability.
TABLE 5A. POWER SUPPLY DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
VCC
Test Conditions
Minimum
Typical
Maximum
Units
Core Supply Voltage
3.135
3.3
3.465
V
VCCA
Analog Supply Voltage
3.135
3.3
3.465
V
VCCO
Output Supply Voltage
3.135
3.3
3.465
V
ICC
Power Supply Current
165
mA
ICCA
Analog Supply Current
15
mA
TABLE 5B. LVCMOS/LVTTL DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
VIH
Parameter
Input High Voltage
Maximum
Units
CLK1
Test Conditions
2
VCC+ 0.3
V
CLK_SEL, PLL_SEL,
DIV_SELAx, DIV_SELBx,
FBDIV_SELx, MR
2
VCC+ 0.3
V
-0.3
1.3
V
-0.3
0.8
V
VCC = VIN = 3.465V
150
µA
VCC = VIN = 3.465V
5
µA
CLK1
VIL
Input Low Voltage
IIH
Input High Current
CLK_SEL, PLL_SEL,
DIV_SELAx, DIV_SELBx,
FBDIV_SELx, MR
CLK_SEL, MR, CLK1
DIV_SELAx, DIV_SELBx,
FBDIV_SELx
PLL_SEL
IIL
Input Low Current
Minimum
Typical
CLK_SEL, MR, CLK1
DIV_SELAx, DIV_SELBx,
FBDIV_SELx
VCC = 3.465V,
VIN = 0V
-5
µA
PLL_SEL
VCC = 3.465V,
VIN = 0V
-150
µA
©2016 Integrated Device Technology, Inc
5
Revision E January 22, 2016
8732-01 Data Sheet
TABLE 5C. DIFFERENTIAL DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
IIH
Parameter
Input High Current
Test Conditions
CLK0, FB_IN
nCLK0, nFB_IN
Minimum
Typical
VCC = VIN = 3.465V
VCC = VIN = 3.465V
Maximum
Units
150
µA
5
µA
CLK0, FB_IN
VCC = 3.465V, VIN = 0V
-5
µA
nCLK0, nFB_IN
VCC = 3.465V, VIN = 0V
-150
µA
IIL
Input Low Current
VPP
Peak-to-Peak Input Voltage
VCMR
Common Mode Input Voltage; NOTE 1, 2
0.15
1.3
V
VEE + 0.5
VCC - 0.85
V
Maximum
Units
V
NOTE 1: For single ended applications, the maximum input voltage for FB_IN, nFB_IN is VCC + 0.3V.
NOTE 2: Common mode voltage is defined as VIH.
TABLE 5D. LVPECL DC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
Test Conditions
Minimum
Typical
VOH
Output High Voltage; NOTE 1
VCCO - 1.4
VCCO - 0.9
VOL
Output Low Voltage; NOTE 1
VCCO - 2.0
VCCO - 1.7
V
VSWING
Peak-to-Peak Output Voltage Swing
0.6
1.0
V
Maximum
Units
200
MHz
Maximum
350
Units
MHz
150
ps
NOTE 1: Outputs terminated with 50Ω to VCCO - 2V.
TABLE 6. PLL INPUT REFERENCE CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
Parameter
fREF
Input Reference Frequency
Test Conditions
Minimum
Typical
TABLE 7. AC CHARACTERISTICS, VCC = VCCA = VCCO = 3.3V±5%, TA = 0°C TO 70°C
Symbol
fMAX
Parameter
Output Frequency
t(Ø)
Static Phase Offset; NOTE 1
tsk(o)
Output Skew; NOTE 2, 3, 4
tjit(cc)
Cycle-to-Cycle Jitter;
NOTE 3
Test Conditions
Minimum
PLL_SEL = 3.3V,
fREF = 100MHz, fVCO = 400MHz
-150
Typical
150
ps
CLK0,
nCLK
50
ps
CLK1
80
PLL Lock Time
10
tL
tR / tF
Output Rise/Fall Time
20% to 80%
200
700
odc
Output Duty Cycle
48
52
fOUT ≤ 175MHz
All parameters measured at fMAX unless noted otherwise.
NOTE 1: Defined as the time difference between the input reference clock and the averaged feedback input signal
when the PLL is locked and the input reference frequency is stable.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions.
Measured at the output differential cross points.
NOTE 3: This parameter is defined in accordance with JEDEC Standard 65.
NOTE 4: All outputs in divide by 4 configuration.
©2016 Integrated Device Technology, Inc
6
ps
ms
ps
%
Revision E January 22, 2016
8732-01 Data Sheet
PARAMETER MEASUREMENT INFORMATION
3.3V OUTPUT LOAD AC TEST CIRCUIT
DIFFERENTIAL INPUT LEVEL
OUTPUT SKEW
CYCLE-TO-CYCLE JITTER
STATIC PHASE OFFSET
OUTPUT RISE/FALL TIME
OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD
©2016 Integrated Device Technology, Inc
7
Revision E January 22, 2016
8732-01 Data Sheet
APPLICATION INFORMATION
WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS
Figure 1 shows how the differential input can be wired to accept
single ended levels. The reference voltage V_REF = VCC/2 is
generated by the bias resistors R1, R2 and C1. This bias circuit
should be located as close as possible to the input pin. The ratio
of R1 and R2 might need to be adjusted to position the V_REF
in the center of the input voltage swing. For example, if the input
clock swing is only 2.5V and VCC = 3.3V, V_REF should be 1.25V
and R2/R1 = 0.609.
VCC
R1
1K
Single Ended Clock Input
CLK
V_REF
nCLK
C1
0.1u
R2
1K
FIGURE 1. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT
TERMINATION FOR LVPECL OUTPUTS
The clock layout topology shown below is a typical termination
for LVPECL outputs. The two different layouts mentioned are
recommended only as guidelines.
drive 50Ω transmission lines. Matched impedance techniques
should be used to maximize operating frequency and minimize
signal distortion. Figures 2A and 2B show two different layouts
which are recommended only as guidelines. Other suitable clock
layouts may exist and it would be recommended that the board
designers simulate to guarantee compatibility across all printed
circuit and clock component process variations.
FOUT and nFOUT are low impedance follower outputs that
generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources
must be used for functionality. These outputs are designed to
FIGURE 2A. LVPECL OUTPUT TERMINATION
©2016 Integrated Device Technology, Inc
FIGURE 2B. LVPECL OUTPUT TERMINATION
8
Revision E January 22, 2016
8732-01 Data Sheet
POWER SUPPLY FILTERING TECHNIQUES
As in any high speed analog circuitry, the power supply
pins are vulnerable to random noise. The 8732-01 provides
separate power supplies to isolate any high switching
noise from the outputs to the internal PLL. VCC, VCCA and VCCO
should be individually connected to the power supply plane
through vias, and bypass capacitors should be used for each pin.
To achieve optimum jitter performance, power supply isolation
is required. Figure 3 illustrates how a 10Ω resistor along with
a 10μF and a .01μF bypass capacitor should be connected to
each VCCA pin.
3.3V
VCC
.01μF
10Ω
VCCA
.01μF
10μF
FIGURE 3. POWER SUPPLY FILTERING
DIFFERENTIAL CLOCK INPUT INTERFACE
The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL
and other differential signals. Both VSWING and VOH must meet
the VPP and VCMR input requirements. Figures 4A to 4D show
interface examples for the CLK/nCLK input driven by the most
common driver types. The input interfaces suggested here are
examples only. Please consult with the vendor of the driver
component to confirm the driver termination requirements. For
example in Figure 4A, the input termination applies for LVHSTL drivers. If you are using an LVHSTL driver from another
vendor, use their termination recommendation.
3.3V
3.3V
3.3V
1.8V
Zo = 50 Ohm
CLK
Zo = 50 Ohm
CLK
Zo = 50 Ohm
nCLK
Zo = 50 Ohm
LVPECL
nCLK
HiPerClockS
Input
LVHSTL
ICS
HiPerClockS
LVHSTL Driver
R1
50
R1
50
HiPerClockS
Input
R2
50
R2
50
R3
50
FIGURE 4A. CLK/NCLK INPUT DRIVEN BY
LVHSTL DRIVER
FIGURE 4B. CLK/NCLK INPUT DRIVEN BY
3.3V LVPECL DRIVER
3.3V
3.3V
3.3V
3.3V
R3
125
3.3V
R4
125
Zo = 50 Ohm
Zo = 50 Ohm
LVDS_Driv er
CLK
CLK
R1
100
Zo = 50 Ohm
nCLK
LVPECL
R1
84
HiPerClockS
Input
Receiv er
R2
84
FIGURE 4C. CLK/NCLK INPUT DRIVEN BY
3.3V LVPECL DRIVER
©2016 Integrated Device Technology, Inc
nCLK
Zo = 50 Ohm
FIGURE 4D. CLK/NCLK INPUT DRIVEN BY
3.3V LVDS DRIVER
9
Revision E January 22, 2016
8732-01 Data Sheet
LAYOUT GUIDELINE
Figure 5 shows a schematic example of the 8732-01. In this
example, the CLK0/nCLK0 input is selected. The decoupling
capacitors should be physically located near the power pin. For
8732-01, the unused outputs can be left floating.
Zo = 50
+
VCC
R14
1K
Zo = 50
-
VCC
VCC
R4
50
10
C16
10uF
C11
0.1uF
DIV_SELA1
DIV_SELA0
VCC
Zo = 50
Zo = 50
R1
50
R2
50
DIV_SELA1
DIV_SELA0
VCC
VEE
CLK1
nCLK0
CLK0
CLK_SEL
VCCA
nc
DIV_SELB1
DIV_SELB0
VCC
52
51
50
49
48
47
46
45
44
43
42
41
40
VEE
FBDIV_SEL2
FBDIV_SEL1
FBDIV_SEL0
nFB_IN
FB_IN
VCC
VEE
nQFB0
QFB0
nQFB1
QFB1
VCCO
FBDIV_SEL2
FBDIV_SEL1
FBDIV_SEL0
R10
50
R13
1K
R11
50
R12
50
27
28
29
30
31
32
33
34
35
36
37
38
39
R3
50
DIV_SELB1
DIV_SELB0
R6
50
VEE
QB0
nQB0
QB1
nQB1
VCCO
MR
VEE
QB2
nQB2
QB3
nQB3
VCCO
LVPECL
14
15
16
17
18
19
20
21
22
23
24
25
26
R5
50
U1
ICS8732-01
VEE
nQA3
QA3
nQA2
QA2
VCCO
PLL_SEL
VEE
nQA1
QA1
nQA0
QA0
VCCO
R7
13
12
11
10
9
8
7
6
5
4
3
2
1
VCCA
Zo = 50
Logic Input Pin Examples
VCC
Set Logic
Input to
'1'
RU1
1K
VCC
+
Set Logic
Input to
'0'
RU2
SP
Zo = 50
SP = Spare (i.e. not intstalled)
(U1-1)
To Logic
Input
pins
RD1
SP
To Logic
Input
pins
RD2
1K
-
VCC=3.3V
VCC
C1
0.1uF
(U1-8)
C2
0.1uF
(U1-16)
R8
50
(U1-26)
C3
0.1uF
C4
0.1uF
(U1-32)
(U1-39)
C5
0.1uF
(U1-40)
C6
0.1uF
C7
0.1uF
R7
50
(U1-46)
C8
0.1uF
R9
50
Bypass capacitors located near the power pins
FIGURE 5. 8732-01 LVPECL BUFFER SCHEMATIC EXAMPLE
©2016 Integrated Device Technology, Inc
10
Revision E January 22, 2016
8732-01 Data Sheet
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the 8732-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 8732-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
•
•
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 165mA = 572mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 10 * 30mW = 300mW
Total Power_MAX (3.465V, with all outputs switching) = 572mW + 300mW = 872mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of
the device. The maximum recommended junction temperature for the devices is 125°C.
The equation for Tj is as follows: Tj = θJA * Pd_total + TA
Tj = Junction Temperature
θJA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θJA must be used. Assuming
a moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 36.4°C/W per Table 8 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.872W * 36.4°C/W = 101.7°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
TABLE 8. THERMAL RESISTANCE θJA FOR 52-PIN LQFP, FORCED CONVECTION
θJA by Velocity (Linear Feet per Minute)
0
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
58.0°C/W
42.3°C/W
200
500
47.1°C/W
36.4°C/W
42.0°C/W
34.0°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
©2016 Integrated Device Technology, Inc
11
Revision E January 22, 2016
8732-01 Data Sheet
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in Figure 6.
FIGURE 6. LVPECL DRIVER CIRCUIT AND TERMINATION
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a
termination
voltage of VCCO- 2V.
•
For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.9V
(VCCO_MAX - VOH_MAX) = 0.9V
•
For logic low, VOUT = VOL_MAX = VCCO_MAX – 1.7V
(VCCO_MAX - VOL_MAX) = 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(VOH_MAX – (VCCO_MAX - 2V))/RL] * (VCCO_MAX - VOH_MAX) = [(2V - (VCCO_MAX - VOH_MAX))/RL] * (VCCO_MAX - VOH_MAX) =
[(2V - 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(VOL_MAX – (VCCO_MAX - 2V))/RL] * (VCCO_MAX - VOL_MAX) = [(2V - (VCCO_MAX - VOL_MAX))/RL] * (VCCO_MAX - VOL_MAX) =
[(2V - 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
©2016 Integrated Device Technology, Inc
12
Revision E January 22, 2016
8732-01 Data Sheet
RELIABILITY INFORMATION
TABLE 9. θJAVS. AIR FLOW TABLE FOR 52 LEAD LQFP
θJA by Velocity (Linear Feet per Minute)
0
Single-Layer PCB, JEDEC Standard Test Boards
Multi-Layer PCB, JEDEC Standard Test Boards
58.0°C/W
42.3°C/W
200
500
47.1°C/W
36.4°C/W
42.0°C/W
34.0°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TRANSISTOR COUNT
The transistor count for 8732-01 is: 4916
©2016 Integrated Device Technology, Inc
13
Revision E January 22, 2016
8732-01 Data Sheet
PACKAGE OUTLINE - Y SUFFIX FOR 52 LEAD LQFP
TABLE 10. PACKAGE DIMENSIONS
JEDEC VARIATION
ALL DIMENSIONS IN MILLIMETERS
SYMBOL
BCC
MINIMUM
NOMINAL
N
MAXIMUM
52
A
--
A1
0.05
--
0.15
A2
1.35
1.40
1.45
b
0.22
0.32
0.38
c
0.09
--
0.20
--
D
12.00 BASIC
D1
10.00 BASIC
E
12.00 BASIC
E1
10.00 BASIC
e
1.60
0.65 BASIC
L
0.45
--
θ
0°
--
7°
ccc
--
--
0.08
0.75
Reference Document: JEDEC Publication 95, MS-026
©2016 Integrated Device Technology, Inc
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Revision E January 22, 2016
8732-01 Data Sheet
TABLE 11. ORDERING INFORMATION
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
8732AY-01LF
ICS8732AY-01LF
52 lead “Lead Free” LQFP
Tube
0°C to +70°C
8732AY-01LFT
ICS8732AY-01LF
52 lead “Lead Free” LQFP
Tape and Reel
0°C to +70°C
©2016 Integrated Device Technology, Inc
15
Revision E January 22, 2016
8732-01 Data Sheet
REVISION HISTORY SHEET
Rev
Table
Page
Description of Change
T2
T4A
1
3
4
Features Section - changed VCO min. from 200MHz to 250MHz.
Pin Characteristics Table - changed CIN from max. 4pF to typical 4pF.
Qx Output Frequency Table - changed the CLK1 min. column to correlate with
the VCO change.
Absolute Maximum Ratings - changed VO to IO and included Continuous Current
and Surge Current
Added Differential Clock Input Interface in the Application Information section.
B
5
8
C
T5A
5
8
10
1
C
C
Date
Power Supply DC Characteristics Table - changed IEE from 240mA max. to
165mA max., and ICCA from 14mA max. to 15mA max.
Power Considerations - recalculated Power Dissipation and Junction Temperatures to correspond with Table 5A.
Updated LVPECL Output Termination diagrams.
Added Schematic Layout.
5/20/03
6/23/03
9/24/03
Block Diagram - changed REF_SEL to CLK_SEL.
3/3/04
C
T11
15
Ordering Information Table - corrected Tape & Reel Count to read 500 from 1000.
4/29/04
C
T4A
4
Qx Output Frequency Table - changed NOTE 2 from “200MHz” to “175MHz”.
10/19/04
T11
T5A
1
15
5
Features Section - added Lead Free bullet.
Ordering Information Table - added Lead Free part number and note.
5/23/05
Power Supply DC Characteristics Table - corrected IEE to read ICC.
5/31/05
T5D
6
LVPECL DC Characteristics Table -corrected VOH max. from VCCO - 1.0V to VCCO 0.9V.
Power Considerations - corrected power dissipation to reflect VOH max in Table
5D.
4/13/07
C
C
D
11 - 12
E
T11
E
T5D
E
T11
15
17
9
15
Updated datasheet’s header/footer with IDT from ICS.
Removed ICS prefix from Part/Order Number column.
Added Contact Page.
VOH Maximum = VCCO - 0.9
7/31/10
5/2/13
Removed ICS in the part number where needed.
Ordering Information - removed quantity from tape and reel. Deleted LF note
below the table.
Update header and footer.
©2016 Integrated Device Technology, Inc
16
1/22/16
Revision E January 22, 2016
8732-01 Data Sheet
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