0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
8761CYLFT

8761CYLFT

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    LQFP64

  • 描述:

    IC CLK GEN PCI/PCI-X 64-LQFP

  • 数据手册
  • 价格&库存
8761CYLFT 数据手册
8761 Low Voltage, Low Skew, PCI / PCI-X Clock Generator DATASHEET GENERAL DESCRIPTION FEATURES The 8761 is a low voltage, low skew PCI / PCI-X Clock Generator. The 8761 has a selectable REF_ CLK or crystal input. The REF_CLK input accepts LVCMOS or LVTTL input levels. The 8761 has a fully intgrated PLL along with frequency configurable clock and feedback outputs for multiplying and regenerating clocks with “zero delay”. Using a 20MHz or 25MHz crystal or a 33.333MHz or 66.666MHz reference frequency, the 8761 will generate output frequencies of 33.333MHz, 66.666MHz, 100MHz and 133.333MHz simultaneously. • Fully integrated PLL • Seventeen LVCMOS/LVTTL outputs, 15Ω typical output impedance • Selectable crystal oscillator interface or LVCMOS/LVTTL REF_CLK • Maximum output frequency: 166.67MHz • Maximum crystal input frequency: 38MHz • Maximum REF_CLK input frequency: 83.33MHz • Individual banks with selectable output dividers for generating 33.333MHz, 66.66MHz, 100MHz and 133.333MHz simultaneously • Separate feedback control for generating PCI / PCI-X frequencies from a 20MHz or 25MHz crystal or 33.333MHz or 66.666MHz reference frequency • Cycle-to-cycle jitter: 70ps (maximum) • Period jitter, RMS: 17ps (maximum) • Output skew: 230ps (maximum) • Bank skew: 40ps (maximum) • Static phase offset: 0 ± 150ps (maximum) • Full 3.3V or 3.3V core, 2.5V multiple output supply modes • 0°C to 85°C ambient operating temperature The low impedance LVCMOS/LVTTL outputs of the 8761 are designed to drive 50Ω series or parallel terminated transmission lines. BLOCK DIAGRAM • Available in lead-free RoHS-compliant package QD3 VDDOD QD2 GND QD1 VDDOD QD0 GND QC3 VDDOC QC2 GND QC1 VDDOC QC0 GND PIN ASSIGNMENT REF_CLK 1 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 GND 2 47 FB_OUT XTAL1 3 46 VDDOFB 4 45 FB_IN VDD 5 44 VDD XTAL_SEL 6 43 FBDIV_SEL0 PLL_SEL 7 42 FBDIV_SEL1 VDDA 8 41 MR VDD 9 40 VDD XTAL2 8761 GND D_SELC0 10 39 D_SELD0 D_SELC1 11 38 D_SELD1 OEC 12 37 OED OEA 13 36 OEB D_SELA0 14 35 D_SELB0 D_SELA1 15 34 D_SELB1 GND QB3 VDDOB QB2 GND QB1 VDDOB QB0 GND QA3 VDDOA QA2 GND QA1 VDDOA QA0 16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 GND GND 64-Lead LQFP 10mm x 10mm x 1.4mm package body Y package Top View 8761 REVISION E 2/18/15 1 ©2015 Integrated Device Technology, Inc. 8761 DATA SHEET TABLE 1. PIN DESCRIPTIONS Number Name 1 REF_CLK Input 2, 16, 17, 21, 25, 29, 33, 48, 52, 56, 60, 64 GND Power Power supply ground. 3, 4 XTAL1, XTAL2 Input Crystal oscillator interface. XTAL1 is the input. XTAL2 is the output. 5, 9, 40, 44 VDD Power Core supply pins. 6 XTAL_SEL Input Pullup 7 PLL_SEL Input Pullup 8 VDDA Power 10, 11 D_SELC0, D_SELC1 Input 12 OEC Input 13 OEA Input 14, 15 18, 20, 22, 24 D_SELA0, D_SELA1 QA0, QA1, QA2, QA3 Type Input Output Description Pulldown Reference clock input. LVCMOS / LVTTL interface levels. Selects between crystal oscillator or reference clock as the PLL reference source. Selects XTAL inputs when HIGH. Selects REF_CLK when LOW. LVCMOS / LVTTL interface levels. Selects between PLL and bypass mode. When HIGH, selects PLL. When LOW, selects reference clock. LVCMOS / LVTTL interface levels. Analog supply pin. See Applications Note for filtering. Selects divide value for Bank C outputs as described in Table 3. LVCMOS / LVTTL interface levels. Determines state of Bank C outputs. When HIGH, outputs are enabled. Pullup When LOW, outputs are disabled. LVCMOS / LVTTL interface levels. Determines state of Bank A outputs. When HIGH, outputs are enabled. Pullup When LOW, outputs are disabled. LVCMOS / LVTTL interface levels. Selects divider value for Bank A outputs as described in Table 3. Pulldown LVCMOS / LVTTL interface levels. Bank A clock outputs. 15Ω typical output impedance. LVCMOS / LVTTL interface levels. Pulldown 19, 23 VDDOA Power Output supply pins for Bank A outputs. 26, 28, 30, 32 QB0, QB1, QB2, QB3 Output Bank B clock outputs. 15Ω typical output impedance. LVCMOS / LVTTL interface levels. 27, 31 VDDOB Power Output supply pins for Bank B outputs. 34, 35 D_SELB1, D_SELB0 Input Pulldown 36 OEB Input Pullup 37 OED Input Pullup 38, 39 D_SELD1, D_SELD0 Input Pulldown 41 MR Input Pulldown 42 FBDIV_SEL1 Input Pulldown 43 FBDIV_SEL0 Input Pullup 45 FB_IN Input Pulldown LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR Selects divider value for Bank B outputs as described in Table 3. LVCMOS / LVTTL interface levels. Determines state of Bank B outputs. When HIGH, outputs are enabled. When LOW, outputs are disabled. LVCMOS / LVTTL interface levels. Determines state of Bank D outputs. When HIGH, outputs are enabled. When LOW, outputs are disabled. LVCMOS / LVTTL interface levels. Selects divider value for Bank D outputs as described in Table 3. LVCMOS / LVTTL interface levels. Active HIGH Master reset. When logic HIGH, the internal dividers are reset causing the outputs to go low. When logic LOW, the internal dividers and the outputs are enabled. LVCMOS / LVTTL interface levels. Selects divider value for bank feedback output as described in Table 3. LVCMOS / LVTTL interface levels. Selects divider value for bank feedback output as described in Table 3. LVCMOS / LVTTL interface levels. Feedback input to phase detector for generating clocks with “zero delay”. LVCMOS / LVTTL interface levels. 2 REVISION E 2/18/15 8761 DATA SHEET Number Name 46 VDDOFB Power Type 47 FB_OUT Output 49, 51, 53, 55 50, 54 57, 59, 61, 63 QD3, QD2, QD1, QD0 VDDOD QC3, QC2, QC1, QC0 58, 62 VDDOC Description Output supply pin for FB_Out output. Feedback output. Connect to FB_IN. 15Ω typical output impedance. LVCMOS / LVTTL interface levels. Bank D clock outputs. 15Ω typical output impedance. LVCMOS / LVTTL interface levels. Output supply pins for Bank D outputs. Bank C clock outputs. 15Ω typical output impedance. LVCMOS / LVTTL interface levels. Output Power Output Power Output supply pins for Bank C outputs. NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. TABLE 2. PIN CHARACTERISTICS Symbol Parameter Test Conditions Minimum Typical Maximum Units CIN Input Capacitance RPULLUP Input Pullup Resistor 51 kΩ RPULLDOWN Input Pulldown Resistor 51 kΩ CPD Power Dissipation Capacitance (per output); NOTE 1 ROUT Output Impedance 4 pF VDD, VDDA = 3.465V; VDDOx = 3.465V 9 pF VDD, VDDA = 3.465V; VDDOx = 2.625V 11 pF Ω 15 NOTE 1: VDDOx denotes VDDOA, VDDOB, VDDOC, VDDOD, VDDOFB. TABLE 3A. OUTPUT CONTROL PIN FUNCTION TABLE Inputs Outputs MR OEA OEB OEC OED QA0:QA3 1 1 1 1 1 LOW LOW LOW LOW 0 1 1 1 1 Active Active Active Active X 0 0 0 0 HiZ HiZ HiZ HiZ PLL_SEL QC0:QC3 TABLE 3C. PLL INPUT FUNCTION TABLE TABLE 3B. OPERATING MODE FUNCTION TABLE Inputs QB0:QB3 Inputs Operating Mode XTAL_SEL PLL Input 0 Bypass 0 REF_CLK 1 PLL 1 XTAL Oscillator REVISION E 2/18/15 3 LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR QD0:QD3 8761 DATA SHEET TABLE 3D. CONTROL FUNCTION TABLE Outputs Inputs PLL_SEL =1 Frequency Reference Frequency Range (MHz) QX0:QX3 QX0:QX3 (MHz) FB_OUT (MHz) 0 41.6 - 83.33 x2 83.33 - 166.67 41.6 - 83.33 0 1 20.83 - 41.67 x4 83.33 - 166.67 20.83 - 41.67 0 1 0 15.62 - 31.25 x 5.33 83.33 - 166.67 15.62 - 31.25 0 1 1 12.5 - 25 x 6.67 83.33 - 166.67 12.5 - 25 0 1 0 0 41.6 - 83.33 x 1.5 62.4 - 125 41.6 - 83.33 0 1 0 1 20.83 - 41.67 x3 62.4 - 125 20.83 - 41.67 0 1 1 0 15.62 - 31.25 x4 62.4 - 125 15.62 - 31.25 0 1 1 1 12.5 - 25 x5 62.4 - 125 12.5 - 25 1 0 0 0 41.6 - 83.33 x1 41.6 - 83.33 41.6 - 83.33 1 0 0 1 20.83 - 41.67 x2 41.6 - 83.33 20.83 - 41.67 1 0 1 0 15.62 - 31.25 x 2.67 41.6 - 83.33 15.62 - 31.25 1 0 1 1 12.5 - 25 x 3.33 41.6 - 83.33 12.5 - 25 1 1 0 0 41.6 - 83.33 ÷2 20.8 - 41.67 41.6 - 83.33 1 1 0 1 20.83 - 41.67 ÷1 20.8 - 41.67 20.83 - 41.67 1 1 1 0 15.62 - 31.25 x 1.33 20.8 - 41.67 15.62 - 31.25 1 1 1 1 12.5 - 25 x 1.67 20.8 - 41.67 12.5 - 25 D_SELx1 D_SELx0 FBDIV_SEL1 FBDIV_SEL0 0 0 0 0 0 0 0 NOTE: D_SELX1 denotes D_SELA1, D_SELB1, D_SELC1, and D_SELD1. D_SELX0 denotes D_SELA0, D_SELB0, D_ SELC0, and D_SELD0. QX0:QX3 denotes QA0:QA3, QB0:QB3, QC0:QC3, and QD0:QD3. TABLE 3E. CONTROL FUNCTION TABLE (PCI CONFIGURATION) Outputs Inputs PLL_SEL = 1 Frequency D_SELx1 D_SELx0 FBDIV_SEL1 FBDIV_SEL0 0 0 0 0 Reference Frequency (MHz) 66.67 x2 QX0:QX3 (MHz) 133 0 0 0 1 33.33 x4 133 33.33 0 0 1 0 25 x 5.33 133 25 0 0 1 1 20 x 6.67 133 20 0 1 0 0 66.67 x 1.5 100 66.67 0 1 0 1 33.33 x3 100 33.33 0 1 1 0 25 x4 100 25 0 1 1 1 20 x5 100 20 1 0 0 0 66.67 x1 66.67 66.67 1 0 0 1 33.33 x2 66.67 33.33 1 0 1 0 25 x 2.67 66.67 25 1 0 1 1 20 x 3.33 66.67 20 1 1 0 0 66.67 ÷2 33.33 66.67 1 1 0 1 33.33 ÷1 33.33 33.33 1 1 1 0 25 x 1.33 33.33 25 QX0:QX3 FB_OUT (MHz) 66.67 1 1 1 1 20 x 1.67 33.33 20 NOTE: D_SELx1 denotes D_SELA1, D_SELB1, D_SELC1, and D_SELD1. D_SELx0 denotes D_SELA0, D_SELB0, D_ SELC0, and D_SELD0. QX0:QX3 denotes QA0:QA3, QB0:QB3, QC0:QC3, and QD0:QD3. LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 4 REVISION E 2/18/15 8761 DATA SHEET ABSOLUTE MAXIMUM RATINGS Supply Voltage, VDD 4.6V Inputs, VI -0.5V to VDD + 0.5 V Outputs, VO -0.5V to VDDOx + 0.5V Package Thermal Impedance, θJA 41.1°C/W (0 lfpm) Storage Temperature, TSTG -65°C to 150°C NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDA = VDDOX = 3.3V±5%, TA = 0°C TO 85°C Symbol Parameter VDD Core Supply Voltage Test Conditions Minimum Typical Maximum Units 3.135 3.3 3.465 V VDDA Analog Supply Voltage 3.135 3.3 3.465 V VDDOx Output Supply Voltage; NOTE 1 3.135 3.3 3.465 V IDD Power Supply Current 175 mA IDDA Analog Supply Current 55 mA IDDOx Output Supply Current; NOTE 2 25 mA NOTE 1: VDDOx denotes VDDOA, VDDOB, VDDOC, VDDOD, and VDDOFB. NOTE 2: IDDOx denotes IDDOA, IDDOB, IDDOC, IDDOD, and IDDOFB. TABLE 4B. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDA = 3.3V±5%, VDDO = 2.5V±5%, TA = 0°C TO 85°C X Symbol Parameter VDD VDDA Test Conditions Minimum Typical Maximum Units Core Supply Voltage 3.135 3.3 3.465 V Analog Supply Voltage 3.135 3.3 3.465 V VDDOx Output Supply Voltage; NOTE 1 2.375 2.5 2.625 V IDD Power Supply Current 160 mA IDDA Analog Supply Current 50 mA IDDOx Output Supply Current; NOTE 2 210 mA NOTE 1: VDDOx denotes VDDOA, VDDOB, VDDOC, VDDOD, and VDDOFB. NOTE 2: IDDOx denotes IDDOA, IDDOB, IDDOC, IDDOD, and IDDOFB. REVISION E 2/18/15 5 LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 8761 DATA SHEET TABLE 4C. LVCMOS/LVTTL DC CHARACTERISTICS, VDD = VDDA = VDDOX = 3.3V±5% OR 2.5V±5%, TA = 0°C TO 85°C Symbol VIH VIL IIH IIL VOH Parameter Input High Voltage Input Low Voltage Input High Current Input Low Current Test Conditions Maximum Units 2 VDD + 0.3 V 2 VDD + 0.3 V OEA:OED, XTAL_SEL, MR, D_SELA0:D_SELD0, FB_IN, D_SELA1, D_SELD1, PLL_SEL -0.3 0.8 V REF_CLK -0.3 1.3 V VDD = VIN = 3.465V 150 µA VDD = VIN = 3.465V 5 µA OEA:OED, XTAL_SEL, MR, D_SELA0:D_SELD0, FB_IN, D_SELA1:D_SELD1, PLL_SEL, FBDIV_SEL0, FBDIV_SEL1 REF_CLK D_SELA0:D_SELD0, FB_IN, MR, D_SELA1:D_SELD1, REF_CLK, FBDIV_SEL1 XTAL_SEL, PLL_SEL, FBDIV_ SEL0, OEA:OED D_SELA0:D_SELD0, FB_IN, MR, D_SELA1:D_SELD1, REF_CLK, FBDIV_SEL1 XTAL_SEL, PLL_SEL, FBDIV_ SEL0, OEA:OED Output High Voltage; NOTE 1 VOL Output Low Voltage; NOTE 1 IOZL Output Tristate Current Low IOZH Output Tristate Current High Minimum Typical VDD = 3.465V, VIN = 0V -5 µA VDD = 3.465V, VIN = 0V -150 µA VDDOx = 3.465V 2.6 V VDDOx = 2.625V 1.8 V VDDOx = 3.465V or 2.625V 0.5 V -5 µA 5 µA NOTE 1: Outputs terminated with 50W to VDDOx/2. See Parameter Measurement Information section, “Output Load Test Circuit” Diagrams. TABLE 5. CRYSTAL CHARACTERISTICS Parameter Test Conditions Minimum Mode of Oscillation Typical Maximum Units Fundamental Frequency 10 Equivalent Series Resistance (ESR) Shunt Capacitance 38 MHz 70 Ω 1 mW 7 pF Drive Level TABLE 6. PLL INPUT REFERENCE CHARACTERISTICS, VDD = VDDA = VDDO = 3.3V±5%, TA = 0°C TO 85°C X Symbol Parameter fREF Reference Frequency LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR Test Conditions Minimum 10 6 Typical Maximum Units 83.33 MHz REVISION E 2/18/15 8761 DATA SHEET TABLE 7A. AC CHARACTERISTICS, VDD = VDDA = VDDOX = 3.3V±5%, TA = 0°C TO 85°C Symbol Parameter fMAX Output Frequency t(Ø) Static Phase Offset; NOTE 1, 7 tsk(b) Bank Skew; NOTE 2, 6 tsk(o) Output Skew; NOTE 3, 6 Test Conditions f = 50MHz Minimum Typical Maximum Units 166.67 MHz -150 150 ps 40 ps 230 ps f = 50MHz; NOTE 4, 7 70 ps f = 25MHz XTAL, 133.3MHz out 190 ps tjit(cc) Cycle-to-Cycle Jitter; 6 tjit(per) Period Jitter, RMS; NOTE 4, 6, 7, 8 17 ps tL PLL Lock Time 1 ms tR Output Rise Time 20% to 80% 300 800 ps tF Output Fall Time 20% to 80% 300 800 ps odc Output Duty Cycle; NOTE 5, 7 45 55 NOTE 1: Defined as the time difference between the input reference clock and the average feedback input signal when the PLL is locked and the input reference frequency is stable. Measured from VDD/2 of the input to VDDOx/2 of the output. NOTE 2: Defined as skew within a bank of outputs at the same voltages and with equal load conditions. NOTE 3: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDOx/2. NOTE 4: Jitter performance using LVCMOS inputs. NOTE 5: Measured using REF_CLK. For XTAL input, refer to Application Note. NOTE 6: This parameter is defined in accordance with JEDEC Standard 65. NOTE 7: Tested with D_SELXX =10 (divide by 6); FBDIV_SEL = 00 (divide by 6). NOTE 8: This parameter is defined as an RMS value. % TABLE 7B. AC CHARACTERISTICS, VDD = VDDA = 3.3V±5%, VDDO = 2.5V±5%, TA = 0°C TO 85°C X Symbol Parameter fMAX Output Frequency t(Ø) Static Phase Offset; NOTE 1, 7 tsk(b) Bank Skew; NOTE 2, 6 tsk(o) Output Skew; NOTE 3, 6 Test Conditions f = 50MHz Minimum Typical Maximum Units 166.67 MHz -350 20 ps 40 ps 230 ps f = 50MHz; NOTE 4, 7 70 ps f = 25MHz XTAL, 133.3MHz out 190 ps tjit(cc) Cycle-to-Cycle Jitter; NOTE 6 tjit(per) Period Jitter, RMS; NOTE 4, 6, 7, 8 17 ps tL PLL Lock Time 1 ms tR Output Rise Time 20% to 80% 300 800 ps tF Output Fall Time 20% to 80% 300 800 ps odc Output Duty Cycle; NOTE 5, 7 45 55 % See notes in Table 7A above. REVISION E 2/18/15 7 LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 8761 DATA SHEET PARAMETER MEASUREMENT INFORMATION 3.3V OUTPUT LOAD AC TEST CIRCUIT 3.3V/2.5V OUTPUT LOAD AC TEST CIRCUIT OUTPUT SKEW BANK SKEW (Where X denotes outputs in the same Bank) t jit(cc) = tcycle n –tcycle n+1 1000 Cycles CYCLE-TO-CYCLE JITTER STATIC PHASE OFFSET OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD OUTPUT RISE/FALL TIME LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 8 REVISION E 2/18/15 8761 DATA SHEET APPLICATION INFORMATION POWER SUPPLY FILTERING TECHNIQUES As in any high speed analog circuitry, the power supply pins are vulnerable to random noise. The 8761 provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. VDD, VDDA, and VDDOx should be individually connected to the power supply plane through vias, and bypass capacitors should be used for each pin. To achieve optimum jitter performance, power supply isolation is required. Figure 1 illustrates how a ferrite bead along with a 10µF and a .01μF bypass capacitor should be connected to each VDDA. FIGURE 1. POWER SUPPLY FILTERING CRYSTAL INPUT INTERFACE The 8761 crystal interface is shown in Figure 2. While layout the PC Board, it is recommended to provide C1 and C2 spare footprints for frequency fine tuning. For an 18pF parallel res- onant crystal, the C1 and C2 are expected to be ~10pF and ~5pF respectively. XTAL2 C1 SPARE X1 18pF Parallel Cry stal XTAL1 C2 SPARE FIGURE 2. CRYSTAL INPUT INTERFACE REVISION E 2/18/15 9 LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 8761 DATA SHEET RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS INPUTS: OUTPUTS: CRYSTAL INPUT: For applications not requiring the use of the crystal oscillator input, both XTAL_IN and XTAL_OUT can be left floating. Though not required, but for additional protection, a 1kΩ resistor can be tied from XTAL_IN to ground. LVCMOS OUTPUT: All unused LVCMOS output can be left floating. We recommend that there is no trace attached. REF_CLK INPUT: For applications not requiring the use of the reference clock, it can be left floating. Though not required, but for additional protection, a 1kΩ resistor can be tied from the REF_CLK to ground. LVCMOS CONTROL PINS: All control pins have internal pull-ups or pull-downs; additional resistance is not required but can be added for additional protection. A 1kΩ resistor can be used. LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 10 REVISION E 2/18/15 8761 DATA SHEET SCHEMATIC EXAMPLE Figure 3 shows a schematic example of the 8761. In this example, the input is driven by an ICS LVHSTL driver. The decoupling capacitors should be physically located near the power pin. For 8761, the unused clock outputs can be left floating. The optional C1 and C2 are spare footprints for frequency fine tuning. Zo = 50 R1 36 VDDO Receiv er VDD 1K X1 25MHz,18pF 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 FB C2 SP VDD C17 C16 10u 36 Receiv er GND FB_OUT VDDOFB FB_IN VDD FBDIV_SEL0 FBDIV_SEL1 MR VDD D_SELD0 D_SELD1 OED OEB D_SELB0 D_SELB1 GND REF_CLK GND XTAL1 XTAL2 VDD XTAL_SEL PLL_SEL VDDA VDD D_SELC0 D_SELC1 OEC OEA D_SELA0 D_SELA1 GND 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 VDDO VDD SP = Spare, Not Install ICS8761 Zo = 50 R3 GND QA0 VDDOA QA1 GND QA2 VDDOA QA3 GND QB0 VDDOB QB1 GND QB2 VDDOB QB3 0.1u 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 1K Zo = 50 R2 U1 GND QC0 VDDOC QC1 GND QC2 VDDOC QC3 GND QD0 VDDOD QD1 GND QD2 VDDOD QD3 VDD R6 36 Receiv er 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 C1 SP R5 VDDO Zo = 50 R4 Logic Input Pin Examples VDD Set Logic Input to '1' VDD Set Logic Input to '0' RU2 SP RU1 1K To Logic Input pins To Logic Input pins RD1 SP RD2 1K (U1,5) (U1,9) VDD (U1,40) 36 (U1,44) C6 C5 C4 C3 0.1u 0.1u 0.1u 0.1u (U1,23) (U1,19) VDDO Receiv er VDD=3.3V VDDO=3.3V (U1,27) (U1,31) (U1,50) (U1,54) (U1,58) (U1,46) C7 C8 C9 C10 C11 C12 C13 C14 C15 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u 0.1u FIGURE 3. 8761 CLOCK GENERATOR SCHEMATIC EXAMPLE REVISION E 2/18/15 (U1,62) 11 LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 8761 DATA SHEET RELIABILITY INFORMATION TABLE 8. θJAVS. AIR FLOW TABLE FOR 64 LEAD TSSOP θJA by Velocity (Linear Feet per Minute) Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 0 200 500 58.8°C/W 41.1°C/W 48.5°C/W 35.8°C/W 43.2°C/W 33.6°C/W NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs. TRANSISTOR COUNT The transistor count for 8761 is: 6040 LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 12 REVISION E 2/18/15 8761 DATA SHEET PACKAGE OUTLINE - Y SUFFIX FOR 64 LEAD TSSOP TABLE 9. PACKAGE DIMENSIONS JEDEC VARIATION ALL DIMENSIONS IN MILLIMETERS SYMBOL BCD MINIMUM NOMINAL N MAXIMUM 64 A -- A1 0.05 -- 0.15 A2 1.35 1.40 1.45 b 0.17 -- 0.27 c 0.09 -- 0.20 -- D 12.00 BASIC D1 10.00 BASIC D2 7.50 Ref. E 12.00 BASIC E1 10.00 BASIC E2 7.50 Ref. e 1.60 0.50 BASIC L 0.45 -- 0.75 θ 0° -- 7° ccc -- -- 0.08 Reference Document: JEDEC Publication 95, MS-026 REVISION E 2/18/15 13 LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 8761 DATA SHEET TABLE 10. ORDERING INFORMATION Part/Order Number Marking Package Shipping Packaging Temperature 8761CYLF ICS8761CYLF 64 Lead “Lead-Free” LQFP tray 0°C to 85°C 8761CYLFT ICS8761CYLF 64 Lead “Lead-Free” LQFP tape & reel 0°C to 85°C NOTE: Parts that are ordered with an “LF” suffix to the part number are the Pb-Free configuration and are RoHS compliant. LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR 14 REVISION E 2/18/15 8761 DATA SHEET Rev A Table T1 T1 Page 2 2 A T4B, T4D 6, 8 1 T3D 4 T5A, T5B 7, 9 B T1 2 T5A, T5B 7, 9 T1 T4A, T4C 10 11 2 5, 7 B B 10 10 1 T3D 4 T4A 5 T5A & T5B 6&8 C 1 10 14 C C T2 T5 14 3 6 9 LVCMOS DC Characteristics table -in the IIH and IIL rows, FBDIV_SEL0 was deleted from the “pulldown” row and was added to the “pullup” row. Features section, changed max. output frequency from 200MHz to 183.3MHz, and max. REF_CLK input frequency from 100MHz to 91.6MHz. Control Function Table - revised Reference Frequency Range column and Frequency columns to reflect the output frequency change. AC Characteristics tables - changed Output Frequency from 200MHz max. to 183.3MHz max. Pin Description Table, revised crystal description. AC Characteristics tables - changed Period Jitter measurement to Period Jitter, RMS and added NOTE 8. Added Crystal information. Added Schematic Example in the Application Information Section. Pin Description Table - revised MR description. Power Supply Tables - changed VDD parameter to read “Core Supply Voltage” from “Positive Supply Voltage”. Deleted Crystal Input Interface section. Updated Schematic Example diagram. Date 8/15/02 11/05/02 11/06/02 1/20/03 3/25/03 Updated Features to reflect T5A, 3.3V AC Characteristics (see below). Adjusted Ref. Frequency Range and Frequency columns. Changed IDD max. from 150mA to 175mA, IDDA max. from 50mA to 55mA, and IDDO max. from 330mA to 25mA. Changed fMAX from 183.3MHz max. to 166.67MHz max. Changed RMS tjit(per) from 20ps max. to 17ps max. Features Section - added Lead-Free bullet. Added Crystal Section. Ordering Information Table - added Lead-Free/Annealed Part Number. 10 11 14 Ordering Information Table - added Lead-Free Part Number. Pin Characteristics Table - changed CIN from 4pF max. to 4pF typical. Crystal Characteristics Table - added Drive Level. Power Supply Filtering Techniques - corrected last sentence in the paragraph to read “”Figure 1 illustrates how a ferrite bead along...”” from “”Figure 1 illustrates how a 10W resistor along...””. Corrected Power Supply Filtering diagram. Added Recommendations for Unused Input and Output Pins. Corrected Schematic Example diagram. Ordering Information Table - added Lead-Free note. D T10 REVISION HISTORY SHEET Description of Change Pin Description Table, revised Master Reset description. Pin Description Table, pin 43 should be labeled at a PULLUP instead of a PULLDOWN. 4/10/03 8/2/04 8/7/04 1/13/06 E T10 14 16 Updated datasheet’s header/footer with IDT from ICS. Removed ICS prefix from Part/Order Number column. Added Contact Page. 7/26/10 E T10 14 Ordering Information - removed leaded devices PDN CQ-13-02 2/18/15 REVISION E 2/18/15 15 LOW VOLTAGE, LOW SKEW, PCI / PCI-X CLOCK GENERATOR Corporate Headquarters 6024 Silver Creek Valley Road San Jose, California 95138 Sales 800-345-7015 or +408-284-8200 Fax: 408-284-2775 www.IDT.com Technical Support email: clocks@idt.com DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. Copyright 2015. All rights reserved. IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.
8761CYLFT 价格&库存

很抱歉,暂时无法提供与“8761CYLFT”相匹配的价格&库存,您可以联系我们找货

免费人工找货