87946I
1-to-10 Low Skew, 1, 2 LVCMOS/LVTTL
3.3V Fanout Buffer
Datasheet
PRODUCT DISCONTINUATION NOTICE - LAST TIME BUY EXPIRES MAY 6, 2017
General Description
Features
The 87946I is a low skew, ÷1, ÷2 LVCMOS Fanout Buffer. The
87946I has two selectable single ended clock inputs. The 87946I
has two selectable single ended clock inputs. The single ended clock
inputs accept LVCMOS or LVTTL input levels. The low impedance
LVCMOS outputs are designed to drive 50 series or parallel
terminated transmission lines. The effective fanout can be increased
from 10 to 20 by utilizing the ability of the outputs to drive two series
terminated lines.
•
•
•
Ten single-ended LVCMOS outputs, 7 typical output impedance
•
•
•
•
•
•
Maximum input/output frequency: 150MHz
The divide select inputs, DIV_SELx, control the output frequency of
each bank. The outputs can be utilized in the ÷1, ÷2 or a combination
of ÷1 and ÷2 modes. The master reset input, MR/nOE, resets the
internal frequency dividers and also controls the active and high
impedance states of all outputs.
Selectable CLK0 and CLK1 LVCMOS clock inputs
CLK0 and CLK1 can accept the following input levels:
LVCMOS and LVTTL
Output skew: 350ps (maximum)
3.3V input, 3.3V outputs
-40°C to 85°C ambient operating temperature
Available in lead-free (RoHS 6) package
For drop-in replacement use 87946i-147
The 87946I is characterized at 3.3V core/3.3V output. Guaranteed
output and part-to-part skew characteristics make the 87946I ideal
for those clock distribution applications demanding well defined
performance and repeatability.
Pin Assignment
Block Diagram
32 31 30 29 28 27 26 25
DIV_SELA Pulldown
3
QB[0:2]
1
DIV_SELB Pulldown
GND
VDD
2
23
QB0
CLK0
3
22
VDDB
CLK1
4
21
QB1
DIV_SELA
5
20
GND
DIV_SELB
6
19
QB2
DIV_SELC
7
18
VDDB
GND
8
17
VDDC
9
10 11 12 13 14 15 16
QC3
GND
QC2
QC[0:3]
1
QC1
4
VDDC
0
24
GND
0
1
QC0
1
CLK_SEL
VDDC
÷2
QA2
1
VDDA
3
QA[0:2]
CLK1 Pullup
QA1
0
GND
÷1
QA0
0
VDDA
CLK0 Pullup
GND
MR/nOE
CLK_SEL Pulldown
87946I
DIV_SELC Pulldown
32-Lead LQFP
7mm x 7mm x 1.4mm package body
Y Package
Top View
MR/nOE Pulldown
©2016 Integrated Device Technology, Inc
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87946I Datasheet
Table 1. Pin Descriptions
Number
Name
Type
Description
1
CLK_SEL
Input
2
VDD
Power
3, 4
CLK0, CLK1
Input
Pullup
5
DIV_SELA
Input
Pulldown
Controls frequency division for Bank A outputs.
LVCMOS/LVTTL interface levels.
6
DIV_SELB
Input
Pulldown
Controls frequency division for Bank B outputs.
LVCMOS/LVTTL interface levels.
7
DIV_SELC
Input
Pulldown
Controls frequency division for Bank C outputs.
LVCMOS/LVTTL interface levels.
8, 11, 15, 20,
24, 27, 31
GND
Power
9, 13, 17
VDDC
Power
Positive supply pins for Bank C outputs.
10, 12,
14, 16
QC0, QC1,
QC2, QC3
Output
Bank C clock outputs. LVCMOS/LVTTL interface levels.
7 typical output impedance.
18, 22
VDDB
Power
Positive supply pins for Bank B outputs.
19, 21, 23
QB2, QB1, QB0
Output
Bank B clock outputs. LVCMOS/LVTTL interface levels.
7 typical output impedance.
25, 29
VDDA
Power
Positive supply pins for Bank A outputs.
26, 28, 30
QA2, QA1, QA0
Output
Bank A clock outputs. LVCMOS/LVTTL interface levels.
7 typical output impedance.
32
MR/nOE
Input
Pulldown
Clock select input. When HIGH, selects CLK1. When LOW, selects CLK0.
LVCMOS / LVTTL interface levels.
Positive supply pin.
LVCMOS/LVTTL clock inputs.
Power supply ground.
Pulldown
Master reset and output enable. When LOW, output drivers are enabled.
When HIGH, output drivers are in High-Impedance and dividers are reset.
LVCMOS / LVTTL interface levels.
NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values.
Table 2. Pin Characteristics
Symbol
Parameter
CIN
Input Capacitance
RPULLUP
Input Pullup Resistor
Test Conditions
RPULLDOWN Input Pulldown Resistor
CPD
Power Dissipation Capacitance
(per output); NOTE 1
ROUT
Output Impedance
VDD, VDDX = 3.6V
Minimum
Typical
Maximum
Units
4
pF
51
k
51
k
25
pF
7
NOTE 1: VDDx denotes VDDA, VDDB, VDDC.
© 2016 Integrated Device Technology, Inc
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87946I Datasheet
Table 3. Function Table
Inputs
Outputs
MR/nOE
DIV_SELA
DIV_SELB
DIV_SELC
QA0:QA2
QB0:QB2
QC0:QC3
1
X
X
X
High-Impedance
High-Impedance
High-Impedance
0
0
X
X
fIN/1
Active
Active
0
1
X
X
fIN/2
Active
Active
0
X
0
X
Active
fIN/1
Active
0
X
1
X
Active
fIN/2
Active
0
X
X
0
Active
Active
fIN/1
0
X
X
1
Active
Active
fIN/2
Absolute Maximum Ratings
NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond
those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect product reliability.
Item
Rating
Supply Voltage, VDD
4.6V
Inputs, VDD
-0.5V to VDD + 0.5V
Outputs, VDD
-0.5V to VDDX+ 0.5V
Package Thermal Impedance, JA
47.9C/W (0 lfpm)
Storage Temperature, TSTG
-65C to 150C
DC Electrical Characteristics
Table 4A. Power Supply DC Characteristics, VDD = VDDX = 3.3V ± 0.3V, TA = -40°C to 85°C
Symbol
Parameter
VDD
Test Conditions
Minimum
Typical
Maximum
Units
Positive Supply Voltage
3.0
3.3
3.6
V
VDDX
Output Supply Voltage; NOTE 1
3.0
3.3
3.6
V
IDD
Power Supply Current
85
mA
NOTE 1: VDDX denotes VDDA, VDDB, VDDC.
©2016 Integrated Device Technology, Inc
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87946I Datasheet
Table 4B. LVCMOS/LVTTL DC Characteristics, VDD = VDDX = 3.3V ± 0.3V, TA = -40°C to 85°C
Symbol
VIH
VIL
IIH
IIL
Parameter
Input High Voltage
Input Low Voltage
Input High Current
Input Low Current
Test Conditions
Minimum
Typical
Maximum
Units
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL,
MR/nOE
2
VDD + 0.3
V
CLK0, CLK1
2
VDD + 0.3
V
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL,
MR/nOE
-0.3
0.8
V
CLK0, CLK1
-0.3
1.3
V
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL,
MR/nOE
VDD = VIN = 3.6V
120
µA
CLK0, CLK1
VDD = VIN = 3.6V
5
µA
DIV_SELA, DIV_SELB,
DIV_SELC, CLK_SEL,
MR/nOE
VDD = 3.6V, VIN = 0V
-5
µA
CLK0, CLK1
VDD = 3.6V, VIN = 0V
-120
µA
2.5
V
VOH
Output High Voltage
IOH = -20mA
VOL
Output Low Voltage
IOH = 20mA
© 2016 Integrated Device Technology, Inc
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Revision C, September 20, 2016
87946I Datasheet
AC Electrical Characteristics
Table 5. AC Characteristics, VDD = VDDX = 3.3V ± 0.3V, TA = -40°C to 85°C
Symbol
Parameter
fIN
Input Frequency
tpLH
Propagation Delay
Low to High; NOTE 1
tpHL
Propagation Delay
High to Low; NOTE 1
tsk(o)
Output Skew; NOTE 2, 6
Test Conditions
Minimum
Typical
Maximum
Units
150
MHz
2
12
ns
2.0
11.5
ns
350
ps
fMAX < 100MHz
350
ps
fMAX > 100MHz
450
ps
4.5
ns
1.0
ns
tsk(w)
Multiple Frequency Skew;
NOTE 3, 6
tsk(pp)
Part-to-Part Skew;
NOTE 4, 6
tR / tF
Output Rise/Fall Time;
NOTE 5
tEN
Output Enable Time;
NOTE 5
11
ns
tDIS
Output Disable Time;
NOTE 5
11
ns
0.8V to 2.0V
0.1
NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device
is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal
equilibrium has been reached under these conditions.
NOTE: VDDX denotes VDDA, VDDB, VDDC.
NOTE 1: Measured from VDD/2 of the input to VDDX/2 of the output.
NOTE 2: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at VDDX/2.
NOTE 3: Defined as skew across banks of outputs operating at different frequencies with the same supply voltage and equal load conditions.
NOTE 4: Defined as skew between outputs on different devices operating at the same supply voltage, same frequency and with equal load
conditions. Using the same type of inputs on each device, the outputs are measured at VDDX/2.
NOTE 5: These parameters are guaranteed by characterization. Not tested in production.
NOTE 6: This parameter is defined in accordance with JEDEC Standard 65.
©2016 Integrated Device Technology, Inc
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Revision C, September 20, 2016
87946I Datasheet
Parameter Measurement Information
1.65V ± 0.15V
V
SCOPE
VDD,
VDDA,
VDDB,
VDDC
DDx
Qx
2
Qx
V
DDx
Qy
2
tsk(o)
GND
-1.65V ± 0.15V
3.3V Output Load AC Test Circuit
Output Skew
Par t 1
V
QBx, QCx
DDx
Qx
2
Par t 2
V
DDx
QAx
Qy
tsk(ω)
Multiple Frequency Skew
2
tsk(pp)
Part-to-Part Skew
VDDx
2
CLK0, CLK1
2V
QAx,
QBx, QCx
VDDx
2
QAx,
QBx, QCx
t
2V
0.8V
0.8V
tR
tF
PD
Propagation Delay
© 2016 Integrated Device Technology, Inc
Output Rise/Fall Time
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Revision C, September 20, 2016
87946I Datasheet
Application Information
Recommendations for Unused Input and Output Pins
Inputs:
Outputs:
CLK Inputs
LVCMOS Outputs
For applications not requiring the use of a clock input, it can be left
floating. Though not required, but for additional protection, a 1k
resistor can be tied from the CLK input to ground.
All unused LVCMOS output can be left floating. There should be no
trace attached.
LVCMOS Control Inputs
All control pins have internal pullups or pulldowns; additional
resistance is not required but can be added for additional protection.
A 1k resistor can be used.
Reliability Information
Table 6. JA vs. Air Flow Table
JA vs. Air Flow (Linear Feet per Minute)
Linear Feet per Minute
0
200
500
Single-Layer PCB, JEDEC Standard Test Boards
67.8°C/W
55.9°C/W
50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards
47.9°C/W
42.1°C/W
39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
Transistor Count
The transistor count for 87946I is: 1204
©2016 Integrated Device Technology, Inc
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Revision C, September 20, 2016
87946I Datasheet
Package Outline and Package Dimensions
Package Outline - Y Suffix for 32 Lead LQFP
Table 7. Package Dimensions for 32 Lead LQFP
JEDEC Variation:
All Dimensions in Millimeters
Symbol
Minimum
Nominal
Maximum
N
32
A
1.60
A1
0.05
0.15
A2
1.35
1.40
1.45
b
0.30
0.37
0.45
c
0.09
0.20
D&E
9.00 Basic
D1 & E1
7.00 Basic
D2 & E2
5.60 Ref.
e
0.80 Basic
L
0.45
0.60
0.75
0°
7°
ccc
0.10
Reference Document: JEDEC Publication 95, MS-026
© 2016 Integrated Device Technology, Inc
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Revision C, September 20, 2016
87946I Datasheet
Ordering Information
Table 8. Ordering Information
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
87946AYILF
ICS87946AYIL
“Lead-Free” 32 Lead LQFP
Tray
-40C to 85C
87946AYILFT
ICS87946AYIL
“Lead-Free” 32 Lead LQFP
Tape & Reel
-40C to 85C
©2016 Integrated Device Technology, Inc
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Revision C, September 20, 2016
87946I Datasheet
Revision History Sheet
Rev
Table
Page
A
T1
1
2
6
Features section added Max Input/Output frequency bullet.
Revised MR/nOE description.
Revised Output Rise & Fall time diagram
8/14/02
B
T5
4
AC Characteristics Table changed:
(CLK0, CLK1) TPLH from 6.0ns max. to 12.0ns max, deleted typical value
(CLK0, CLK1) TPHL from 6.0ns max. to 11.5ns max, deleted typical value
10/22/02
T5
5
3/17/10
T8
6
7
8
9
AC Characteristics Table - changed symbol fOUT to fIN. Moved 150MHz min. to
max. column. Added Thermal Note. Corrected NOTE 2.
Updated parameter Measurement Information section.
Added Recommendations for Unused Input and Output Pins section.
Updated Package Outline drawing.
Ordering Information Table - deleted ICS prefix from Part/Order Number
column. Added lead-free marking.
1
Deleted HiperClocks logo from General Description.
Update Header / Footer of the datasheet.
6/22/12
T8
9
Ordering Information - removed leaded devices, PDN CQ-13-02.
Updated data sheet format.
2/18/15
T8
9
Ordering Information - Deleted LF note below table.
Product Discontinuation Notice - Last time buy expires May 6, 2017.
PDN CQ-16-01
Updated header and footer.
6/28/16
Corrected datasheet title.
Corrected General Description, first sentence from Clock Generator to Fanout
Buffer.
9/20/16
B
B
B
B
1
C
Description of Change
© 2016 Integrated Device Technology, Inc
Date
10
Revision C, September 20, 2016
87946I Datasheet
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