8N0QV01EH-0110CDI

8N0QV01EH-0110CDI

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    CLCC10

  • 描述:

    IC OSC VCXO QD FREQ 10CLCC

  • 数据手册
  • 价格&库存
8N0QV01EH-0110CDI 数据手册
Quad-Frequency Programmable VCXO IDT8N0QV01 Rev H DATASHEET General Description Features The 8N0QV01 is a Quad-Frequency Programmable VCXO with very flexible frequency and pull-range programming capabilities. The device uses IDT’s Fourth Generation FemtoClock® NG technology for an optimum of high clock frequency and low phase noise performance. The device accepts 2.5V or 3.3V supply and is packaged in a small, lead-free (RoHS 6) 10-lead ceramic 5mm x 7mm x 1.55mm package. • • Fourth generation FemtoClock® NG technology • Four power-up default frequencies (see part number order codes), re-programmable by I2C • I2C programming interface for the output clock frequency, APR and internal PLL control registers • • Frequency programming resolution is 435.9Hz ÷N • • • • One 2.5V, 3.3V LVCMOS clock output Besides the four default power-up frequencies set by the FSEL0 and FSEL1 pins, the 8N0QV01 can be programmed via the I2C interface to any output clock frequency between 15.476MHz to 260MHz to a very high degree of precision with a frequency step size of 435.9Hz ÷N (N: PLL post divider). Since the FSEL0 and FSEL1 pins are mapped to four independent PLL, P, M and N divider registers (P, MINT, MFRAC and N), reprogramming those registers to other frequencies under control of FSEL0 and FSEL1 is supported. The extended temperature range supports wireless infrastructure, telecommunication and networking end equipment requirements. Programmable clock output frequency from 15.476MHz to 260MHz Absolute pull-range (APR) programmable from ±2.5 to ±727.5ppm Two control inputs for the power-up default frequency LVCMOS/LVTTL compatible control inputs RMS phase jitter @ 156.25MHz (12kHz - 20MHz): 0.635ps (typical) • RMS phase jitter @ 156.25MHz (1kHz - 40MHz): 0.850ps (typical) • • • 2.5V or 3.3V supply voltage modes -40°C to 85°C ambient operating temperature Lead-free (RoHS 6) packaging ÷P OSC FemtoClock® NG VCO 1950-2600MHz PFD & LPF ÷N Q VC 10 1 SDATA Pin Assignment SCLK Block Diagram 9 8 VDD 6 Q 114.285 MHz FSEL1 FSEL0 SCLK SDATA OE Pulldown Pulldown 7 7 25 Configuration Register (ROM) (Frequency, APR, Polarity) Pullup Pullup I2C Control 4 5 FSEL1 2 A/D VC 3 FSEL0 GND ÷MINT, MFRAC IDT8N0QV01 Rev H 10-lead ceramic 5mm x 7mm x 1.55mm package body CD Package Top View Pullup IDT8N0QV01HCD REVISION A MARCH 13, 2014 1 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Block Diagram with Programming Registers ÷P OSC Output Divider N FemtoClock® NG VCO 1950-2600MHz PFD & LPF ÷N 114.285MHz 2 Feedback Divider M (25 Bit) MINT (7 bits) 7 MFRAC (18 bits) A/D VC 7 18 7 34 Programming Registers I2C Control 7 ADC_GAIN ADC_POL I2C: 6 bits 1 bit Def: 6 bits 1 bit P0 30 30 SCLK SDATA Pullup Pullup 30 30 FSEL[1:0] OE MINT0 MFRAC0 41 7 N0 I2C: 2 bits 7 bits 18 bits 7 bits Def: 2 bits 7 bits 18 bits 7 bits P1 MINT1 MFRAC1 N1 I2C: 2 bits 7 bits 18 bits 7 bits Def: 2 bits 7 bits 18 bits 7 bits P2 MINT2 MFRAC2 N2 I2C: 2 bits 7 bits 18 bits 7 bits Def: 2 bits 7 bits 18 bits 7 bits P3 MINT3 MFRAC3 N3 I2C: 2 bits 7 bits 18 bits 7 bits Def: 2 bits 7 bits 18 bits 7 bits 00 34 01 34 34 10 34 11 34 Pulldown, Pulldown Pullup Def: Power-up default register setting for I2C registers ADC_GAINn, ADC_POL, Pn, MINTn, MFRACn and Nn IDT8N0QV01HCD REVISION A MARCH 13, 2014 2 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Pin Description and Characteristics Table 1. Pin Descriptions Number Name Type Description 1 VC Input 2 OE Input 3 GND Power 5, 4 FSEL1, FSEL0 Input 6 Q Output 7 DNU 8 VDD Power 9 SDATA Input Pullup I2C Data Input. LVCMOS/LVTTL interface levels. 10 SCLK Input Pullup I2C Clock Input. LVCMOS/LVTTL interface levels. VCXO Control Voltage. The control voltage versus frequency characteristics are set by the ADC_GAIN[5:0] register bits. Output enable pin. See Table 3B for function. LVCMOS/LVTTL interface levels. Pullup Power supply ground. Pulldown Default frequency select pins. LVCMOS/LVTTL interface levels. Refer to the FemtoClock NG Ceramic-Package XO and VCXO Ordering Product Information document for default frequency order codes. Clock output. LVCMOS/LVTTL interface levels. Do not use. Do not connect. Positive power supply. NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. Table 2. Pin Characteristics Symbol Parameter CIN Input Capacitance CPD Power Dissipation Capacitance RPULLUP Test Conditions Minimum Typical Maximum Units FSEL[1:0], SDATA, SCLK, OE 3.5 pF VC 10 pF VDD = 3.465V or 2.625V 8 pF Input Pullup Resistor 50 k RPULLDOWN Input Pulldown Resistor 50 k  Output Impedance VDD = 3.3V 15 ROUT VDD = 2.5V 19  Q IDT8N0QV01HCD REVISION A MARCH 13, 2014 3 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Function Tables Table 3A. Default Frequency Selection Input FSEL1 FSEL0 Operation 0 (default) 0 (default) Default frequency 0. 0 1 Default frequency 1. 1 0 Default frequency 2. 1 1 Default frequency 3. NOTE: The default frequency is the output frequency after power-up. One of four default frequencies is selected by FSEL[1:0]. See programming section for details. Table 3B. OE Configuration Input OE 0 1 (default) Output Enable Output Q are in high-impedance state. Outputs are enabled. NOTE: OE is an asynchronous control. IDT8N0QV01HCD REVISION A MARCH 13, 2014 4 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Principles of Operation The four configuration registers for the P, M (MINT & MFRAC) and N dividers which are named Pn, MINTn, MFRACn and Nn with n = 0 to 3. “n” denominates one of the four possible configurations. The block diagram consists of the internal 3rd overtone crystal and oscillator which provide the reference clock fXTAL of 114.285MHz. The PLL includes the FemtoClock NG VCO along with the pre-divider (P), the feedback divider (M) and the post divider (N). The P, M, and N dividers determine the output frequency based on the fXTAL reference and must be configured correctly for proper operation. The feedback divider is fractional supporting a huge number of output frequencies. The configuration of the feedback divider to integer-only values results in an improved output phase noise characteristics at the expense of the range of output frequencies. In addition, internal registers are used to hold up to four different factory pre-set P, M, and N configuration settings. These default pre-sets are stored in the I2C registers at power-up. Each configuration is selected via the FSEL[1:0] pins and can be read back using the SCLK and SDATA pins. As identified previously, the configurations of P, M (MINT & MFRAC) and N divider settings are stored the I2C register, and the configuration loaded at power-up is determined by the FSEL[1:0] pins. Table 4. Frequency Selection Input The user may choose to operate the device at an output frequency different than that set by the factory. After power-up, the user may write new P, N and M settings into one or more of the four configuration registers and then use the FSEL[1:0] pins to select the newly programmed configuration. Note that the I2C registers are volatile and a power supply cycle will reload the pre-set factory default conditions. FSEL1 FSEL0 Selects Register 0 (def.) 0 (def.) Frequency 0 P0, MINT0, MFRAC0, N0 0 1 Frequency 1 P1, MINT1, MFRAC1, N1 1 0 Frequency 2 P2, MINT2, MFRAC2, N2 1 1 Frequency 3 P3, MINT3, MFRAC3, N3 Frequency Configuration An order code is assigned to each frequency and VCXO pull range configuration programmed by the factory (default frequencies). For available order codes, see the FemtoClock NG Ceramic-Package XO and VCXO Ordering Product Information document. If the user does choose to write a different P, M, and N configuration, it is recommended to write to a configuration which is not currently selected by FSEL[1:0] and then change to that configuration after the I2C transaction has completed. Changing the FSEL[1:0] controls results in an immediate change of the output frequency to the selected register values. The P, M, and N frequency configurations support an output frequency range 15.476MHz to 260MHz. For more information and guidelines on programming of the device for custom frequency configurations, programming for a specific VCXO pull range, the available APR (absolute pull range), the register description and the serial interface description, see the FemtoClock NG Ceramic 5x7 Module Programming Guide. The devices use the fractional feedback divider with a delta-sigma modulator for noise shaping and robust frequency synthesis capability. The relatively high reference frequency minimizes phase noise generated by frequency multiplication and allows more efficient shaping of noise by the delta-sigma modulator. The output frequency is determined by the 2-bit pre-divider (P), the feedback divider (M) and the 7-bit post divider (N). The feedback divider (M) consists of both a 7-bit integer portion (MINT) and an 18-bit fractional portion (MFRAC) and provides the means for high-resolution frequency generation. The output frequency fOUT is calculated by: 1 MFRAC + 0.5 f OUT = f XTAL  -------------  MINT + ------------------------------------PN 18 2 IDT8N0QV01HCD REVISION A MARCH 13, 2014 (1) 5 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Absolute Maximum Ratings NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of the product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Item Rating Supply Voltage, VDD 3.6V Inputs, VI -0.5V to VDD + 0.5V Outputs, IO (LVCMOS) -0.5V to VDD + 0.5V Outputs, IO (SDATA) 10mA Package Thermal Impedance, JA 49.4°C/W (mps) Storage Temperature, TSTG -65°C to 150°C DC Electrical Characteristics Table 5A. Power Supply DC Characteristics, VDD = 3.3V ± 5%, TA = -40°C to 85°C Symbol Parameter VDD Supply Voltage IDD Power Supply Current Test Conditions Minimum Typical Maximum Units 3.135 3.3 3.465 V 135 150 mA Minimum Typical Maximum Units 2.375 2.5 2.625 V 130 145 mA No Load, OE = Low Table 5B. Power Supply DC Characteristics, VDD = 2.5V ± 5%, TA = -40°C to 85°C Symbol Parameter VDD Supply Voltage IDD Power Supply Current IDT8N0QV01HCD REVISION A MARCH 13, 2014 Test Conditions No Load, OE = Low 6 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Table 5C. LVCMOS/LVTTL DC Characteristic, VDD = 3.3V ± 5% or 2.5V ± 5%, TA = -40°C to 85°C Symbol Parameter VIH Input High Voltage VIL Input Low Voltage IIH Input High Current IIL Input Low Current Test Conditions Minimum OE, SCLK, SDATA, FSEL[1:0] VDD = 3.3V OE, SCLK, SDATA, FSEL[1:0] Typical Maximum Units 2 VDD+ 0.3 V VDD = 2.5V 1.7 VDD + 0.3 V VDD = 3.465V -0.3 0.8 V VDD = 2.5V -0.3 0.7 V OE, VDD = VIN = 3.465V or 2.625V 10 µA SDATA, SCLK VDD = VIN = 3.465V or 2.625V 5 µA FSEL0, FSEL1 VDD = VIN = 3.465V or 2.625V 150 µA OE VDD = 3.465V or 2.625V, VIN = 0V -500 µA SDATA, SCLK VDD = 3.465V or 2.625V, VIN = 0V -150 µA FSEL0, FSEL1 VDD = 3.465V or 2.625V, VIN = 0V -5 µA VDD = 3.465V 2.4 V VDD = 2.625 1.7 V VOH Output High Voltage Q VOL Output Low Voltage Q IDT8N0QV01HCD REVISION A MARCH 13, 2014 VDD = 3.6V or 2.625 7 0.4 V ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO AC Electrical Characteristics Table 6A. AC Characteristics, VDD = 3.3V ± 5% or 2.5V ± 5%, TA = -40°C to 85°C Symbol Parameter fOUT Output Frequency Q, nQ fI Initial Accuracy fS fA fT Temperature Stability Aging Total Stability Test Conditions Minimum P = 1, N = 10...126 15.476 Typical Cycle-to-Cycle Jitter; NOTE 1 tjit(per) Period Jitter; NOTE 1 tjit(Ø) RMS Phase Jitter (Random) Units 260 MHz Measured at 25°C at Final Test ±10 ppm Option code = A or B ±100 ppm Option code = E or F ±50 ppm Option code = K or L ±20 ppm Frequency drift over 10 year life ±3 ppm Frequency drift over 15 year life ±5 ppm Option code A or B (10 year life) ±113 ppm Option code E or F (10 year life) ±63 ppm Option code K or L (10 year life) tjit(cc) Maximum ±33 ppm VDD = 3.3V 15 32 ps VDD = 2.5V 18 40 ps VDD = 3.3V 2.6 5 ps VDD = 2.5V 4 7 ps 17MHz  fout  260MHz, Integration Range: 12kHz - 20MHz, NOTE 3 0.70 1.20 ps 156.25MHz, Integration Range: 12kHz - 20MHz; NOTE 2 0.64 0.92 ps 156.25MHz, Integration Range: 1kHz - 40MHz 0.85 1.00 ps N(100) Single-side band phase noise, 100Hz from Carrier 156.25MHz -75 dBc/Hz N(1k) Single-side band phase noise, 1kHz from Carrier 156.25MHz -98 dBc/Hz N(10k) Single-side band phase noise, 10kHz from Carrier 156.25MHz -118 dBc/Hz N(100k) Single-side band phase noise, 100kHz from Carrier 156.25MHz -127 dBc/Hz N(1M) Single-side band phase noise, 1MHz from Carrier 156.25MHz -139 dBc/Hz N(10M) Single-side band phase noise, 10MHz from Carrier 156.25MHz -143 dBc/Hz tR / tF Output Rise/Fall Time odc Output Duty Cycle tOSC tSET VDD = 3.3V, 20% to 80% 150 425 700 ps VDD = 2.5V, 20% to 80% 150 500 800 ps 45 50 55 % Oscillator Start-Up Time 20 ms Output frequency settling time after FSEL0 and FSEL1 values are changed 1 ms NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE: All AC parameters are characterized with P = 1. NOTES continued on next page. IDT8N0QV01HCD REVISION A MARCH 13, 2014 8 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO NOTE: Please see the FemtoClock Ceramic 5x7 Modules Programming Guide for more information on PLL feedback modes and the optimum configuration for phase noise. NOTE 1: This parameter is defined in accordance with JEDEC standard 65. NOTE 2: Please refer to the phase noise plots. NOTE 3: Applies to output frequencies: 17MHz, 19.44MHz, 25MHz, 33.33MHz, 75MHz, 77.76MHz, 100MHz, 106.25MHz, 122.88MHz, 125MHz, 150MHz, 155.52MHz, 156.25MHz, 161.132MHz, 175MHz, 187.5MHz, 200MHz, 212.5MHz, 250MHz and 260MHz. Table 6B. VCXO Control Voltage Input (VC) Characterisitics, Symbol Parameter Test Conditions Minimum VDD = 3.3V Maximum Units KV Oscillator Gain, NOTE 1, 2, 3 7.57 477.27 ppm/V VDD = 2.5V 10 630 ppm/V LVC Control Voltage Linearity; NOTE 4 BW Modulation Bandwidth BSL Variation -5 100 kHz ZVC VC Input Impedance 500 k VCNOM Nominal Control Voltage VDD/2 V VC Control Voltage Tuning Range; NOTE 4 VDD = 3.3V ± 5% or 2.5V ± 5%, TA = -40°C to 85°C 0 Typical ±0.4 +5 VDD % V NOTE 1: VC = 0V to VDD. Oscillator gain is programmed by IDT. Gain = (25 · n) ÷ VCC and is in the range of n=1 to n = 63. NOTE 2: Nominal oscillator gain: Please refer to the FemtoClock NG Ceramic 5x7 Module Programming Guide document. NOTE 3: For best phase noise performance, use the lowest KV that meets the requirements of the application. NOTE 4: BSL = Best Straight Line Fit: Variation of the output frequency vs. control voltage VC, in percent. VC ranges from 10% to 90% VDD. IDT8N0QV01HCD REVISION A MARCH 13, 2014 9 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Noise Power (dBc/Hz) Typical Phase Noise at 156.25MHz (12kHz - 20MHz) Offset Frequency (Hz) IDT8N0QV01HCD REVISION A MARCH 13, 2014 10 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Parameter Measurement Information 1.65V±5% 1.25V±5% SCOPE VDD LVCMOS SCOPE VDD Q Q LVCMOS GND GND -1.25V±5% -1.65V±5% 3.3V LVCMOS Output Load Test Circuit 2.5V LVCMOS Output Load Test Circuit 80% 80% 20% 20% Q RMS Phase Jitter tR tF Output Rise/Fall Time Q Q ➤ tcycle n ➤ tcycle n+1 ➤ ➤ tjit(cc) = tcycle n tcycle n+1 1000 Cycles Output Duty Cycle/Pulse Width/Period IDT8N0QV01HCD REVISION A MARCH 13, 2014 Cycle-to-Cycle Jitter 11 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Parameter Measurement Information, continued VOH VREF VOL 1σ contains 68.26% of all measurements 2σ contains 95.4% of all measurements 3σ contains 99.73% of all measurements 4σ contains 99.99366% of all measurements 6σ contains (100-1.973x10-7)% of all measurements Reference Point (Trigger Edge) Histogram Mean Period (First edge after trigger) Period Jitter Applications Information Recommendations for Unused Input Pins Inputs: LVCMOS Select Pins All control pins have internal pullups or pulldowns; additional resistance is not required but can be added for additional protection. A 1k resistor can be used. IDT8N0QV01HCD REVISION A MARCH 13, 2014 12 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Schematic Example achieve the best possible filtering, it is recommended that the placement of the filter components be on the device side of the PCB as close to the power pins as possible. If space is limited, the 0.1µF capacitor on the VDD pin must be placed on the device side with direct return to the ground plane though vias. The remaining filter components can be on the opposite side of the PCB. Figure 1 shows an example 8N0QV01application schematic in which the device is operated at VDD = +3.3V. The schematic example focuses on functional connections and is intended as an example only and may not represent the exact user configuration. Refer to the pin description and functional tables in the datasheet to ensure the logic control inputs are properly set. For example OE and FSEL[1:0] can be configured from an FPGA instead of set with pull up and pull down resistors as shown. Power supply filter component recommendations are a general guideline to be used for reducing external noise from coupling into the devices. The filter performance is designed for a wide range of noise frequencies. This low-pass filter starts to attenuate noise at approximately 10kHz. If a specific frequency noise component is known, such as switching power supplies frequencies, it is recommended that component values be adjusted and if required, additional filtering be added. Additionally, good general design practices for power plane voltage stability suggests adding bulk capacitance in the local area of all devices. The 8N0QV01 is not a self contained part; it requires pairing with a PLL. The two connections necessary to be made to the PLL are VC, the analog control voltage that sets the center frequency of the VCXO, and Q, which is the oscillator output. VC is the analog output of the PLL low pass loop filter that serves to remove noise from the phase detector error output. As with any high speed analog circuitry, the power supply pins are vulnerable to random noise, so to achieve optimum jitter performance isolation of the VDD pin from the power supply is required. In order to Figure 1. IDT8N0QV01 Schematic Example IDT8N0QV01HCD REVISION A MARCH 13, 2014 13 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Power Considerations This section provides information on power dissipation and junction temperature for the IDT8N0QV01. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the IDT8N0QV01 is the sum of the core power plus the power dissipation in the load(s). The following is the power dissipation for VDD = 3.3V +5% = 3.465V, which gives worst case results. • Power (core)MAX = VDD_MAX * IDD = 3.465V * 150mA = 519.8mW Total Static Power: = Power (core)MAX = 519.8mW Dynamic Power Dissipation at FOUT (max) Total Power (FOUT_MAX) = [(CPD * N) * Frequency * (VDD)2] = [(8pF *1) * 260MHz * (3.465V)2] = 24.97mW Total Power = Static Power + Dynamic Power Dissipation = 519.8mW + 24.97mW = 544.77mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad, and directly affects the reliability of the device. The maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond wire and bond pad temperature remains below 125°C. The equation for Tj is as follows: Tj = JA * Pd_total + TA Tj = Junction Temperature JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming no air flow and a multi-layer board, the appropriate value is 49.4°C/W per Table 7 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.545W *49.4°C/W = 112°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (multi-layer). Table 7. Thermal Resistance JA for a 10-lead Ceramic 5mm x 7mm Package, Forced Convection JA by Velocity Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards IDT8N0QV01HCD REVISION A MARCH 13, 2014 0 1 2.5 49.4°C/W 44.2°C/W 41.0°C/W 14 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Reliability Information Table 8. JA vs. Air Flow Table for a 10-lead Ceramic 5mm x 7mm Package JA vs. Air Flow Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards 0 1 2.5 49.4°C/W 44.2°C/W 41.0°C/W Transistor Count The transistor count for IDT8N0QV01 is: 47,302 IDT8N0QV01HCD REVISION A MARCH 13, 2014 15 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Package Outline and Package Dimensions IDT8N0QV01HCD REVISION A MARCH 13, 2014 16 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Table 9. Device Marking Industrial Temperature Range (TA = -40°C to 85°C) Marking IDT8N0QV01yHddddCDI Commercial Temperature Range (TA = 0°C to 70°C) IDT8N0QV01yHddddCD y = Option Code, dddd=Default-Frequency and VCXO Pull Range NOTE: For available order codes, see the FemtoClock NG Ceramic-Package XO and VCXO Ordering Product Information document. For more information and guidelines on programming of the device for custom frequency configurations, programming for a specific VCXO pull range, the available APR (absolute pull range), the register description and the serial interface description, see the FemtoClock NG Ceramic 5x7 Module Programming Guide. IDT8N0QV01HCD REVISION A MARCH 13, 2014 17 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO Revision History Sheet Rev A Table Page T1 3 6A 6B 8 9 14 Description of Change Date first row: deleted '(see Table 3C).' forth row: replaced description. Deleted NOTE 2 from RMS Phase Jitter. Added 'NOTE 2' to 156.25MHz. Note 2: Added 'Please refer to the FemtoClock NG Ceramic 5x7 Module Programming Guide document.' Power Considerations. Changed Dynamic Power Dissipation from 2.5mW to 24.97mW IDT8N0QV01HCD REVISION A MARCH 13, 2014 18 3/14/2014 ©2013 Integrated Device Technology, Inc. IDT8N0QV01 Rev H Data Sheet QUAD-FREQUENCY PROGRAMMABLE-VCXO We’ve Got Your Timing Solution 6024 Silver Creek Valley Road San Jose, California 95138 Sales 800-345-7015 (inside USA) +408-284-8200 (outside USA) Fax: 408-284-2775 www.IDT.com/go/contactIDT Technical Support Sales netcom@idt.com +480-763-2056 DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. 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