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8V19N408ZNLGI

8V19N408ZNLGI

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    VFQFN-72

  • 描述:

    IC ATTENUATOR/CLK SYNTH 72VFQFPN

  • 数据手册
  • 价格&库存
8V19N408ZNLGI 数据手册
FemtoClock® NG Jitter Attenuator and Clock Synthesizer 8V19N407 DATA SHEET General Description Features 8V19N407 is a fully integrated FemtoClock® NG Jitter Attenuator and Clock Synthesizer. The device is a high-performance clock solution for conditioning and frequency/phase management of wireless base station radio equipment boards and is optimized to deliver excellent phase noise performance. The device supports JESD204B subclass 0 and 1 clock implementations. The device is very flexible in programming of the output frequency and phase. A two-stage PLL architecture supports both jitter attenuation and frequency multiplication. The first stage PLL is the jitter attenuator and uses an external VCXO for best possible phase noise characteristics.The second stage PLL lock on the VCXO-PLL output signal and synthesizes the target frequency. The second-stage PLL use an internal VCO. • • • • • • • • • • The device supports the clock generation of high-frequency clocks from the VCO and low-frequency system reference signals (SYSREF). The system reference signals are internally synchronized to the clock signals. Delay functions exist for achieving alignment and controlled phase delay between system reference and clock signals and to align/delay individual output signals. The input is monitored for activity. The “hold-over” is provided to handle clock input failure scenarios. Auto-lock, individually programmable output frequency dividers and phase adjustment capabilities are added for flexibility. The device is configured through a 4-wire SP serial interface and reports lock and signal loss status in internal registers and optionally via an lock detect (nINT) output. The device is packaged in a lead-free (RoHS 6) 72-lead VFQFN package. The extended temperature range supports wireless infrastructure, telecommunication and networking end equipment requirements. The device is a member of the high-performance clock family from IDT. • • • • • • • • • • • • • • • • • • • • • • REVISION 2 10/1/15 1 Core timing unit for JESD204B wireless infrastructure clocks Fourth generation FemtoClock® NG technology First stage PLL uses an external VCXO for jitter attenuation Second PLL stage facilitates an integrated VCO for frequency synthesis 8V19N407-19: fVCO = 1900 - 2000MHz 8V19N407-24: fVCO = 2400 - 2500MHz Five differential configurable LVPECL, LVDS clock outputs with a variable output amplitude Four differential LVDS system reference (SYSREF) signal outputs Synchronization between clock and system reference signals Wide input frequency range supported by 8-bit pre- and 15-bit VCXO-PLL feedback divider Output clock frequencies: fVCO ÷ N Three independent output clock frequency dividers N (range of ÷1 to ÷96) Phase delay capabilities for alignment/delay for clock and SYSREF signals Individual output phase adjustment (Clock): one-period of the selected VCO frequency in 64 steps Individual output phase adjustment (SYSREF): approximately half-period of the selected VCO frequency in 8 steps Internal, SPI controlled SYSREF pulse generation SYSREF frequencies: fVCO ÷ NS SYSREF frequency dividers NS: ÷64 to ÷2048 (10 dividers) Clock input compatible with LVPECL, LVDS and LVCMOS signals Dedicated power-down features for reducing power consumption Input clock monitoring Holdover for temporary loss of input signal scenarios Support of output power-down and output disable Typical clock output phase noise at 614.4MHz: 1kHz offset: -122.3 dBc/Hz 10kHz offset: -123.6 dBc/Hz 100kHz offset: -128.3 dBc/Hz 1MHz offset: -149.4 dBc/Hz 10MHz offset: -155.6 dBc/Hz RMS phase noise of 614.4 MHz clock (12kHz - 20MHz):  500MHz 50 to VDDx - 2.5V ÷5 384 491.52 500 ÷6 320 ÷8 240 307.2 ÷10 192 245.76 ÷12 160 ÷16 120 153.6 156.25 ÷20 96 122.88 125 ÷24 80 NOTE 1. Individual setting for each output QCLKA[1:0], QCLKB[1:0] and QCLKC. ÷32 60 76.8 78.125 ÷40 48 61.44 62.5 Each QCLK output can be individually disabled to the logic low state by clearing the corresponding OUTEN bit. See Table 2H for details. ÷48 40 51.2 LVDS (EF  0) 0 0 0 Power off 100 across 312.5 0 0 1 400mV 100 across 250 0 1 0 700mV 100 across 1 1000mV,  fOUT > 500MHz 100 across 0 ÷64 30 38.4 ÷80 24 30.72 ÷96 20 25.6 1 Table 2H. QCLK Output Enable1 OUTEN 31.25 NOTE 1. 1920MHz: 8V19N407-19 NOTE 2. 2457.6MHz: 8V19N407-24 NOTE 3. 2500MHz: 8V19N407-24 0 QCLK is disabled in logic low state 1 QCLK is enabled NOTE 1. Individual setting for each output QCLKA[1:0], QCLKB[1:0] and QCLKC. Clock channel power: Setting the corresponding nPOWER bit will power-down the N divider and delay stage of an clock output channel to save operating currents in situations of an output channel not used for frequency generation. Output Format All differential device clock outputs (QCLK) can be individually configured in format (LVPECL, LVDS), output amplitude, state (enable, disable) and power state (power on, power off). Outputs in LVPECL format are terminated to a termination voltage VT according to the configured output amplitude. Outputs in LVDS format are terminated 100across the terminals. The outputs of the 8V19N407 was designed for flexibility in amplitude control. The output offset voltage changes with amplitude. For strict LVDS compliance, it is recommended to AC-couple the LVDS outputs and re-bias to VBIAS = 1.25V. The lowest output amplitude settings correspond with the least amount of power consumed. Unused clock outputs may not be terminated externally to save current consumption. The QCLK outputs LVPECL, LVDS format configuration is shown in Table 2G. For LVPECL format, set EF = 1 and terminate the LVPECL output pair 50 to the specified recommended termination voltage shown in Table 2G. For LVDS format, set EF = 0 and terminate the output pair 100 across the QCLK, nQCLK terminals. Independent on the state of the EF bit, the A[1:0] bits control the output amplitude of QCLK outputs. FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER Output Operation Table 2I. Clock Channel Power Operation1 nPOWER Clock Channel 0 Divider N and delay stage  powered up 1 Divider N and delay stage  powered down NOTE 1. Individual setting for each clock channel A, B and C (dividers NA, NB, NC and clock delay stages A, B, C). See Table 3E for register configuration. SYSREF Outputs (QREF) Each QREF output can be individually configured as SYSREF output or as clock output by setting the corresponding MUX bit. For JESD204B-operation, configure QREF outputs as SYSREF outputs. See Table 2J for details. 9 REVISION 2 10/1/15 8V19N407 DATA SHEET Table 2J. QREF Output Configuration1 QREF MUX See Table 2P and Section, “SYSREF Generation” on page 12. Each individual QREF output can also be disabled into logic low state by clearing the OUTEN bit. For SYSREF operation, the QREF outputs should be configured as shown in Table 2L: Operation Clock Mode • Frequency divided by N • Output amplitude: use any setting in Table 2K • Set nPOWER = 1 to power down the corresponding (unused) SYSREF delay stage A0-B1 • Set OUTEN = 1 (output enable) 0 Table 2L. QREF Output Control1 (SYSREF, MUX = 1) Clock mode (MUX = 0): QREF outputs operate as additional clock outputs, increasing the available clock signal fanout. In this mode, the output amplitude can be configured to one of three different values. In clock mode, the output frequency of is controlled by the N divider of the corresponding device clock output. For instance, the divider NA controls the output frequency of both QCLKA0, A1 and QREFA0, A1. The QREF output delay setting is controlled by the delay circuit  of the associated clock output QCLK. See Table 2K for details. A[0] Output Operation X 0 0 QREF output buffer powered down 0 0 1 0 1 0 0 1 1 1 0 1 VO, PP = 400mV 1 1 0 VO, PP = 700mV 1 1 1 VO, PP = 1000mV,  fOUT > 500MHz 100 across 0 1 VO, PP = 400mV 100 across QCLK Outputs The 8V19N407 has output dividers which generate the supported clock frequencies at outputs QCLK synchronously. After the SPI controlled synchronization of output dividers, all output clocks QCLK will be in alignment with each other. Outputs which selected different output dividers are aligned on the incident rising edge. QCLK Delay Circuits QREF disabled in logic low state The clock outputs QCLK have an individual delay element () to advance/delay its clock output phase of an clock output bank if an offset is desired on a particular output. The delay circuit operates by inserting a delay into the clock signal coming out of the individual QCLK bank outputs by a discrete number of one clock period of the FemtoClock NG VCO. The user may select a number of steps to insert via the appropriate register. Each of the two output banks supports 64 steps of phase delay (the delay unit is a function of the internal VCO frequency. See Table 2O). For fine delay, the SYSREF outputs have individual phase delay circuits, each delay circuit supports eight steps. See Table 2P. JESD204B (SYSREF) Operation (MUX = 1): The QREF outputs support the generation of SYSREF pulses in JESD204B applications. The delay stages can be used to establish repeatable phase relationships of QCLK outputs to each other and to the SYREF signals QREF: the QCLK delay stages support 64 steps of delay and the QREF outputs support additional 8 steps of fine-delay. REVISION 2 10/1/15 Output Termination Power off Synchronization and Phase Alignment Table 2K. QREF Output Control (MUX = 0) A[1] Output Operation 0 SYSREF power down features: Setting the corresponding nPOWER bit will power-down the  delay circuit. A QREF output buffer can be powered-down by setting A[1:0] = 00. The QREF outputs automatically power-down when SRO = 0 (counted pulse mode) and no SYSREF pulses are generated. QREF outputs will power up automatically for SYSREF pulse generation, controlled by the SYSREF generation sequence (see Section, “QREF Phase Delay and SYSREF Synchronization Sequence, (Sequence S2)” on page 14). Applications not using a QREF output should power the delay circuit down (nPOWER = 1) and also power off the output buffer (set MUX = 0, A[1:0] = 00). Powered-down output buffers save operating current even with presence of external terminations. See Table 2M and Table 2K for details. NOTE 1. Individual setting for each output QREF output QREFA[1:0], QREFB[1:0]. OUTEN A[0] 0 NOTE 1. Individual setting for each output QREF output QREFA[1:0], QREFB[1:0]. SYSREF Mode (JESD204B) • Set nPOWER = 0 to power up the corresponding SYSREF delay stage A0-B1 • Set the QREF output amplitude to 400mV (A[1:0] = 01) • Set OUTEN = 1 (output enable) 1 A[1] The delay capabilities of the clock and SYSREF outputs can be used to establish a specific, repeatable phase relationship between any QCLK and QREF outputs. QREF outputs that are configured with the same delay value are aligned to each other. 10 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Table 2M. A,B, C QCLK Phase Delay1 Phase Delay (in ns Phase Delay (in ns for a VCO Frequency of: Delay Unit 1 ----------f VCO 1920MHz2 2457.6MHz3 2500MHz4 0 0 0 0 0 1 1 · 1/fVCO 0.520 0.406 0.400 2 2 · 1/fVCO 1.041 0.8138 0.800 ... ... ... ... ...   · 1/fVCO  · 0.520  · 0.406  · 0.400 ... ... ... ... ... 63 63 · 1/fVCO 32.812 25.634 25.200 NOTE 1. Individual setting for each clock output Bank A, B and C. NOTE 2. 1920MHz: 8V19N407-19. NOTE 3. 2457.6MHz: 8V19N407-24. NOTE 4. 2500MHz: 8V19N407-24. Table 2N. A0, A1, B0, B1 SYSREF Phase Delay1 2 Phase Delay (in ns for a VCO Frequency (fVCO) of: Delay Unit Delay 1920MHz 2500MHz 2949.12MHz 0 000 0 0.000 0.000 0.000 1 001 tDelay 0.165 0.165 0.165 2 010 1/fVCO 0.521 0.339 0.407 3 011 tDelay + 1/fVCO 0.686 0.504 0.572 4 100 2/fVCO 1.042 0.678 0.814 5 101 tDelay + 2/fVCO 1.207 0.843 0.979 6 110 3/fVCO 1.563 1.017 1.221 7 111 tDelay + 3/fVCO 1.728 1.182 1.386 NOTE 1. tDelay is implemented by inserting a buffer delay of 165ps (±20% tolerance). NOTE 2. Individual setting for each SYSREF delay stages. See Table 3G for register configurations. QREF (SYSREF) to QCLK Phase Alignment QCLK (N =2,  = 8) The QREF outputs have a deterministic phase relation to the QCLK outputs. The delay circuits in both QCLK and QREF paths add phase offset to configure the phase relationship of each QCLK and QREF pair. There are 64 delay steps for each QCLK output bank and additional 8 delay steps on each QREF output. The QCLK delay unit is equal to one VCO period, the QREF delay unit is equal to approximately one half VCO period (fine delay). Each QCLK output bank and each QREF output can be individually advanced, aligned or delayed with respect to an incident QCLK rising edge. See Figure 1: For phase alignment between the incident edge of QCLK outputs and QREF, set the phase delay to = 9 (QCLK) and = 0 (QREF). As a pre-condition for alignment of SYSREF pulses to the incident clock edge, set the SYSREF synchronizer divider to the least common multiple value of clock dividers NA and NB (see Table 3K). FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 1÷fVCO QCLK (N = 4,  = 9) QCLK (N = 2,  = 9) QREFm ( = 0 to 7) incident edge Figure 1. QREF to QCLK Phase Relationship 11 REVISION 2 10/1/15 8V19N407 DATA SHEET SYSREF Generation The QREF outputs generate SYSREF signal pulses that support JESD204B synchronization functions. Following SYSREF pulse generation modes are available and configurable by SPI: The generation of SYSREF pulses is configured by SPI commands and is available after the initial setup of output clock divider and QREF phase delay stages. • Counted pulse mode: 1 to 255 pulses are generated by the device. SYSREF activity stops automatically after the transmission of the selected number of pulses and the QREF output powers down. An essential part of the SYSREF generation is the sequence of SPI commands to apply to synchronize the SYSREF pulses to the clock divider and delay state machines. • Continuous mode. The SYSREF signal is a clock signal. . Table 2O. SYSREF Generation1 2 NS SRO 3 2 SYSREF Operation (fSYSREF) for fVCO (MHz) 1 0 NS 1920 2457.6 2500 Counted Pulse Mode (Use the SRPC register to configure the number of generated SYSREF pulses) 0 0 0 0 0 0 0 0 1 0 0 1 0 0 0 1 1 0 1 0 0 1 0 1 0 ÷64 30 38.4 39.0625 ÷96 20 25.6 26.04166 ÷128 15 19.2 19.53125 ÷192 10 12.8 13.02083 0 ÷256 7.5 9.6 9.76562 0 1 ÷384 5 6.4 6.51041 1 0 ÷512 3.75 4.8 4.88281 1 1 1 ÷768 2.5 3.2 3.25520 1 0 0 0 ÷1024 1.875 2.4 2.44140 1 0 0 1 ÷2048 0.9375 1.2 1.22070 Continues Pulse Mode 1 0 0 0 0 ÷64 30 38.4 39.0625 0 0 0 1 ÷96 20 25.6 26.04166 0 0 1 0 ÷128 15 19.2 19.53125 0 0 1 1 ÷192 10 12.8 13.02083 0 1 0 0 ÷256 7.5 9.6 9.76562 0 1 0 1 ÷384 5 6.4 6.51041 0 1 1 0 ÷512 3.75 4.8 4.88281 0 1 1 1 ÷768 2.5 3.2 3.25520 1 0 0 0 ÷1024 1.875 2.4 2.44140 1 0 0 1 ÷2048 0.9375 1.2 1.22070 NOTE 1. SRO and SRPC are global settings. See Table 2P for the setting sequence to apply. NOTE 2. SYSREF setting should only be used with 400mV and 700mV amplitude setting. REVISION 2 10/1/15 12 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET QCLK Phase Delay and SYSREF Synchronization Sequence (S2) Precondition: Delay circuits are set to powered-up (nPOWER = 0). Set MUX = 1 to assign the SYSREF function to the QREF outputs, NS to the SYSREF pulse rate and configure the SYSREF synchronizer divider value to the least common multiple value of NA and NB. Table 2P. SYSREF Generation Sequence SRO SYSREF Pulse Mode Operation Pre-condition: • MUX = 1, nPOWER = 0, A[1:0] = 01 • Write SR_REQ0 = 1 (register 5). QREF outputs will power up. • OUTEN = 1 • Write SR_REQ1 = 1 (register 25): NS dividers are reset and • SPRC[7:0] contains the number of pulses to generate (1...255) synchronize. • NS[3:0] contains the SYSREF divider • Write SR_RESET = 1 (register 29): Continuous clocks or a number • SYNC[3:0] is set to the least common of specified pulses will be generated at QREF outputs. multiple value of NA and NB. See Table 2P for detailed description of the sequences. 0 Counted Start operation: apply sequence S2 • QREF output will power-up for SYSREF pulse generation. • The programmed number of SYSREF pulses is generated • QREF output will power down automatically • The three SR_REQ0, 1 and SR_RESET bits clear automatically Repeated use: apply sequence (S2) at any time Pre-condition: • A[1:0] = 01 • MUX = 1, nPOWER = 0 • OUTEN=1 • NS[3:0] contains the SYSREF divider 1 Continues • SYNC[3:0] is set to the least common multiple value of NA and NB. Start operation: apply sequence S2 Stop operation: Set SRO = 0 Restart function: Set SRO = 1 and apply sequence S2 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 13 REVISION 2 10/1/15 8V19N407 DATA SHEET Device Start-up, Reset and Synchronization The QREF phase delay and SYSREF synchronization sequence is also used to trigger the synchronized generation of SYSREF pulses. The last steps, it is recommended to clear all interrupts in preparation to start monitoring the devices status bits. After the 8V19N407 first powers-up, an internal reset signal is auto-generated. The registers are initialized with the default values listed in the table for each register. Status Conditions & Interrupts During startup, it is not required to apply an input clock to the CLK input: the VCXO-PLL will “free-run” with the frequency of the external VCXO. The control voltage to the external VCXO (LFV pin) will be held at VDD/2 to support fast PLL lock and the VCXO-PLL will begin operation with their charge pumps in the middle of their operating range. The 8V19N407 has an interrupt output to signal changes in status conditions. Settings for status conditions may be accessed in the Status and Interrupt Enable registers. The 8V19N407 has several conditions that can indicate faults and status changes in the operation of the device. These are shown in Table 2Q and can be monitored directly in the status registers. A changed bit on any or all of these can be programmed to generate an interrupt signal (nINT) via settings in the Interrupt Enable registers. As a second step, the user should write the desired PLL dividers. Configure other operation settings such the output divider, SYSREF divider and output phase delay settings into the registers and apply software-controlled divider reset and QREF phase delay stage synchronization sequences. This is done by two separate SPI-controlled reset procedures which should be applied in the order below. First, apply the output divider reset sequence: Table 2Q. Status Bit Functions Status if Bit is: Bit Name Clock Output Divider Reset Sequence, (Sequence S1) • • • 1 0 STAT2 VCO calibration Completed Not completed step 2: write logic 1 to the NR_REQ1 register bit STAT1 VCXO-PLL Locked Unlocked step 3: write logic 1 to the NR_RESET bit STAT0 CLK state Active LOS step 1: write logic 1 to the NR_REQ0 register bit This completes the reset of the output divider stages. Each subsequent change of any N output divider value requires to re-apply above divider reset sequence. For the reference monitor circuit, if there has been no activity on the reference input for three consecutive clock edges (of the feedback 1st-stage VCXO signal) then the appropriate status bit will transition to a 0. It will not return to 1 until activity has resumed for three clock edges. Then, configure the delay stages and when completed, apply the second sequence to synchronize the QREF output delay stages: QREF Phase Delay and SYSREF Synchronization Sequence, (Sequence S2) • • • Function The lock detect circuit operate by monitoring the loop filter voltage on the first PLL (VCXO-PLL). If the monitored voltage exceeds a range, this indicates an out-of-lock condition. step 1: write logic 1 to the SR_REQ0 register bit step 2: write logic 1 to the SR_REQ1 register bit It is normal when attempting to achieve lock for there to be multiple times when an out-of-lock condition as described above would occur before a full, stable lock is achieved. To prevent a bouncing status, the lock detect bit will not become asserted until the lock is stable. Once a stable lock has been achieved, this de-bounce circuit is deactivated so the lock-detect bit will de-assert immediately if a subsequent out-of-lock condition occurs. step 3: write logic 1 to the SR_RESET bit This completes the synchronization of the delay stages. The clock divider reset sequence and the QREF phase delay & SYSREF synchronization sequence must be done in two separate SPI write cycles (do not combine both sequences in a single SPI write). If sequences S1 and S2 are programmed in any order other than that which is recommended, this could result in an unknown state of the SYSREF generation. In order to reactivate the SYSREF Synchronization Sequence, power down QREF outputs by programming nPOWER bits to “1”. The device is now ready for a new SYSREF Synchronization Sequence. The Interrupt and Interrupt Enable registers are used to control the behavior of the nINT output based on changes in the status indicators. If any of the status indicators STAT[1:0] change, that will set the corresponding INT[1:0] bit of the Interrupt registers. If any of the INT[1:0] bits are set and their corresponding interrupt enable bit INTEN[1:0] is asserted, it will generate an interrupt (low level on nINT). Any change of the output divider values or delay stage configuration requires to re-apply initialization/ synchronization through the respective SPI sequence individually. Interrupts are cleared by writing a 1 to the appropriate INT[1:0] bit(s) in the Interrupt register after the underlying fault condition has been resolved. When all valid interrupt sources have been cleared in this manner, this will release the nINT output until the next unmasked fault. When synchronizing the output delay stages through the synchronization sequence, care must be taken prevent writing a logic 1 to the NR_REQ0, NR_REQ1, NR_RESET register bits in the same base register write cycle (write a logic 0 to these bits, which will not affect them). REVISION 2 10/1/15 14 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET SPI Mode Operation with MISO Output in High Impedance SPI mode slave operation requires that some function external to the 8V19N407 has performed any necessary serial bus arbitration and/or address decoding at the level of the board or system. By default, the MISO data output is in high-impedance state. The 8V19N407 begins a cycle by detecting an asserted (low) state on the nLE input at a rising edge of SPICLK. This is also coincident with the first bit of data being shifted into the device. In SPI mode, the first bit is the Most Significant Bit (MSB) of the data word being written. Data must be written in 32-bit words, with nLE remaining asserted and one data bit being shifted in to the 8V19N407 on every rising edge of SPICLK. If nLE is deasserted (high) at any time except following the 32nd falling edge of SPICLK, then this is treated as an error and the shift register contents are discarded. No data is written to any internal registers. If nLE is deasserted (high) as expected after the 32nd falling edge of SPICLK, then this will result in the shift register contents being acted on according to the instructions (address + R/W) in it. During write operation, the MISO output remains in high-impedance state. The word format of the 32-bit quantity in the shift register is shown in Figure 2. The register fields in the 8V19N407 have been organized so that the 4 LSBs in each 32-bit register row are not used for data transfer. Three of these bits will represent the base address for the eight 32-bit base registers and the 4th bit indicates whether a read or write operation is requested. If a read operation is requested, 32-bits of read data will be provided in the immediately subsequent access. The nLE must be deasserted (high) and then reasserted (low). On the first SPICLK rising edge, once nLE is re-asserted to low state, the MISO output will turn to active state and one data bit will be placed on the MISO output at each rising edge of SPICLK as long as nLE remains asserted (low). If nLE is deasserted (high) before 32-bits of read data have been shifted out, the read cycle will be considered to be completed. If nLE remains asserted (low) longer than 32-bit times, then the data during those extra clock periods will be undefined. The MSB of the data will be presented first. When nLE is de-asserted (high), the MISO output will go into high impedance state and the SPI bus is available for transactions with other devices. 2 tSU tH1 tLO tHI tH2 tPW nLE 1 Start Write Command (D3=0) 2 Complete Write Command SPICLK 1 MOSI D31 D30 D29 D28 MISO D1 D0 High Impedance Figure 2. SPI Write Cycle Timing Diagram, MISO High Impedance tPW  tH2  nLE 3 Start Read Data Out 4 Complete Read Data Out SPICLK 4 3 MOSI D1 D0 tPZLH MISO High Impedance tP D31 tPLHZ D30 … D0 High Imp. Figure 3. SPI Read Cycle Timing Diagram, MISO High Impedance FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 15 REVISION 2 10/1/15 8V19N407 DATA SHEET Table 2R. SPI Read / Write Cycle Timing Parameters Symbol Parameter Test Condition Minimum Maximum Unit fCLK SPICLK frequency - 20 MHz tSU tH1 nLE, MOSI setup time to SPICLK 15 - ns SPICLK to nLE, MOSI hold time 10 - ns tH2 SPICLK falling edge to nLE rising edge, hold time 10 - ns tLO SPICLK low period 25 - ns tHI SPICLK high period 25 - ns tPW nLE deasserted pulse width 50 - ns tPZLH Propagation Delay, MISO Output High Impedance to Active High or Low External pullup = 5k 16 ns tPLHZ Propagation Delay, MISO Output Active High or Low to High Impedance External pullup = 5k 2 ns tP Propagation Delay, SPICLK to MISO External pullup = 5k 20 ns Table 2S. SPI Interface I/O Voltage Select SELSV SPI Interface I/O Voltage (SPICLK, MOSI, MISO, nLE, nINT) 0 1.8V 1 (default) 3.3V REVISION 2 10/1/15 16 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Register Descriptions The Serial Control port of the 8V19N407 supports SPI mode operation. Below indicates how registers may be accessed. 0 Register Base Address Table 3A. . Register Map Register Name 3 D7 D6 D5 D4 D3 D2 D1 D0 QCLKC Control Table 3E 0000 XXXX QC DLY[5] QC DLY[4] QC DLY[3] QC DLY[2] R/Wn 0 0 0 1 MV Feedback Divider Control Table 3C 1111 1111 MV[7] MV[6] MV[5] MV[4] MV[3] MV[2] MV[1] MV[0] 2 MF Feedback Divider Table 3C 0001 0000 MF[7] MF[6] MF[5] MF[4] MF[3] MF[2] MF[1] MF[0] 3 SYSREF Control Table 3K 1000 0001 Reserved Reserved Reserved Reserved Reserved Reserved Reserved SRO 4 QCLKC Control QCLKB Control Table 3E 0000 XXXX QC DLY[1] QC DLY[0] QB DLY[1] QB DLY[0] R/Wn 0 0 1 5 Reset Control MV Feedback Divider Control Table 3S Table 3C X000 0000 SR_REQ0 MV[14] MV[13] MV[12] MV[11] MV[10] MV[9] MV[8] 6 QREFA1, A0 Control Table 3G 1000 1000 QREFA1 A[1] QREFA1 A[0] QREFA1 EF QREFA1 MUX QREFA0 A[1] QREFA0 A[0] QREFA0 EF QREFA0 MUX 7 Reset Control SYSREF Control Table 3S Table 3K X000 1000 NR_REQ0 Reserved SYNC nPOWER Reserved SYNC N[3] SYNC N[2] SYNC N[1] SYNC N[0] 8 QCLKB Control Table 3E 0000 XXXX QB DLY[5] QB DLY[4] QB DLY[3] QB DLY[2] R/Wn 0 1 0 9 PV Pre-Divider Table 3C 1111 1111 PV[7] PV[6] PV[5] PV[4] PV[3] PV[2] PV[1] PV[0] Reserved STAT2 STAT1 STAT0 Reserved Reserved INT1 INT0 NS[3] NS[2] NS[1] NS[0] QREFB1 OE QREFB0 OE QREFA1 OE QREFA0 OE Table 3E 0000 XXXX QA DLY[5] QA DLY[4] QA DLY[3] QA DLY[2] R/Wn 0 1 1 Table 3I POLV HOLD CPV[5] CPV[4] CPV[3] CPV[2] CPV[1] CPV[0] 10 Status Control Table 3O XXXX X0XX SYSREF Control 11 QREF B1, B0 Control Table 3K Table 3G 12 QCLKA Control 13 VCXO-PLL Control 0100 1111 0010 0000 14 Reserved — 0001 1000 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 15 Reserved — 1000 0000 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved QA DLY[1] QA DLY[0] Reserved BYPASS R/Wn 1 0 0 16 QCLKA Control Table 3E 0000 XXXX VCXO-PLL Control Table 3I 17 QREFA1 Control QREFA0 Control Table 3G 0001 0001 QREFA1 DLY[2] QREFA1 DLY[1] QREFA1 DLY[0] QREFA1 nPOWER QREFA0 DLY[2] QREFA0 DLY[1] QREFA0 DLY[0] QREFA0 nPOWER 18 QCLKA Control Table 3E 0000 0100 QCLKA N[4] QCLKA N[3] QCLKA N[2] QCLKA N[1] QCLKA N[0] QA OE Ch A nPOWER Reserved QCLKB Control QCLKC Control Table 3E 0000 0100 QCLKB N[4] QCLKB N[3] QCLKB N[2] QCLKB N[1] QCLKB N[0] QB OE Ch B nPOWER QCLKC N[0] Table 3E 0000 XXXX QCLKC N[4] QCLKC N[3] QCLKC N[2] QCLKC N[1] R/Wn 1 0 1 4 19 20 QCLKC Control 5 Default Setting 0 1 2 See 21 QREFB1 Control QREFB0 Control Table 3G 0001 0001 QREFB1 DLY[2] QREFB1 DLY[1] QREFB1 DLY[0] QREFB1 nPOWER QREFB0 DLY[2] QREFB0 DLY[1] QREFB0 DLY[0] QREFB0 nPOWER 22 QREFB1 Control QREFB0 Control Table 3G 1000 1000 QREFB1 A[1] QREFB1 A[0] QREFB1 EF QREFB1 MUX QREFB0 A[1] QREFB0 A[0] QREFB0 EF QREFB0 MUX 23 SYSREF Control Table 3K 0000 0000 SRPC[7] SRPC[6] SRPC[5] SRPC[4] SRPC[3] SRPC[2] SRPC[1] SRPC[0] FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 17 REVISION 2 10/1/15 8V19N407 DATA SHEET 6 Register Base Address Table 3A. . Register Map (Continued) Register Name D7 D6 D5 D4 D3 D2 D1 D0 24 QCLKC Control Table 3ETable 3M 1000 XXXX QC OE Ch C nPOWER Reserved SPI_REL R/Wn 1 1 0 Reset Control 25 QCLKB1, B0 Control Table 3S Table 3E X010 0100 SR_REQ1 Reserved QCLKB1 A[1] QCLKB1 A[0] QCLKB1 EF QCLKB0 A[1] QCLKB0 A[0] QCLKB0 EF 26 QCLKA1, A0 Control Table 3E 0010 0100 Reserved Reserved QCLKA1 A[1] QCLKA1 A[0] QCLKA1 EF QCLKA0 A[1] QCLKA0 A[0] QCLKA0 EF 27 Reset Control QVCXO Control Table 3S Table 3E X100 0001 NR_REQ1 QVCXO A[1] QVCXO A[0] QVCXO EF Reserved Reserved Reserved Reserved QCLKC A[1] QCLKC A[0] QCLKC EF Reserved R/Wn 1 1 1 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved VCO_SEL Reserved INTEN1 INTEN0 NR_RESET Reserved Reserved Reserved Reserved Reserved Reserved Reserved 28 QCLKC Control 7 Default Setting See Table 3E 1000 XXXX 29 Reset Control VCO Control Table 3S Table 3M X000 1010 30 VCO Control Interrupt Enable Table 3M Table 3Q 0011 0000 Table 3S X011 1110 31 Reset Control SR_RESET Reserved Reserved PLL Divider Control Registers The divider control registers contains the frequency divider settings for the VCXO-PLL and FemtoClock NG PLL. Table 3B. PLL Divider Control Register Bit Allocations Register Bit Register D7 D6 D5 D4 D3 D2 D1 D0 1 MV[7] MV[6] MV[5] MV[4] MV[3] MV[2] MV[1] MV[0] 2 MF[7] MF[6] MF[5] MF[4] MF[3] MF[2] MF[1] MF[0] 5 SR_REQ0 MV[14] MV[13] MV[12] MV[11] MV[10] MV[9] MV[8] 9 PV[7] PV[6] PV[5] PV[4] PV[3] PV[2] PV[1] PV[0] Table 3C. PLL Divider Control Register Function Descriptions Factory Default Bits Name MV[14:0] VCXO-PLL Feedback Divider 000 0000 VCXO-PLL Feedback Divider. Range: MV = ÷4 to ÷32767. Binary encoding. 1111 1111 Default divider: MV = ÷255 PV[7:0] VCXO-PLL Pre-Divider 1111 1111 VCXO-PLL Pre Divider. Range: PV = ÷1 to ÷255. Binary encoding. Default divider: PV = ÷255 MF[7:0] FemtoClock NG PLL  Feedback Divider 0001 0000 FemtoClock NG PLL Feedback Divider. Range: MF = ÷8 to ÷255.  Binary encoding. Default divider: MF = ÷16 REVISION 2 10/1/15 Function 18 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET QCLK, QVCXO Control Registers The QCLK, QVCXO Device Clock Output Control Registers contain the settings for the clock frequency divider, phase delay, power state, enable state, signal format and signal amplitude. Table 3D. QCLKn, QVCXO Control Register Bit Allocations Register Bit Register D7 D6 D5 D4 D3 D2 D1 D0 0 QC DLY[5] QC DLY[4] QC DLY[3] QC DLY[2] R/W 0 0 0 4 QC DLY[1] QC DLY[0] QB DLY[1] QB DLY[0] R/W 0 0 1 8 QB DLY[5] QB DLY[4] QB DLY[3] QB DLY[2] R/W 0 1 0 12 QA DLY[5] QA DLY[4] QA DLY[3] QA DLY[2] R/W 0 1 1 16 QA DLY[1] QA DLY[0] Reserved BYPASS R/W 1 0 0 18 QCLKA N[4] QCLKA N[3] QCLKA N[2] QCLKA N[1] QCLKA N[0] QA OE Ch A nPOWER Reserved 19 QCLKB N[4] QCLKB N[3] QCLKB N[2] QCLKB N[1] QCLKB N[0] QB OE Ch B nPOWER QCLKC N[0] 20 QCLKC N[4] QCLKC N[3] QCLKC N[2] QCLKC N[1] R/Wn 1 0 1 24 QC OE Ch C nPOWER Reserved SPI_REL R/Wn 1 1 0 25 SR_REQ1 Reserved QCLKB1 A[1] QCLKB1 A[0] QCLKB1 EF QCLKB0 A[1] QCLKB0 A[0] QCLKB0 EF 26 Reserved Reserved QCLKA1 A[1] QCLKA1 A[0] QCLKA1 EF QCLKA0 A[1] QCLKA0 A[0] QCLKA0 EF 27 NR_REQ1 QVCXO A[1] QVCXO A[0] QVCXO EF Reserved Reserved Reserved Reserved 28 QCLKC A[1] QCLKC A[0] QCLKC EF Reserved 0 1 1 1 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 19 REVISION 2 10/1/15 8V19N407 DATA SHEET Table 3E. QCLK, QVCXO Control Register Function Descriptions Bits Name OE QCLK Output Enable Factory Default Function 1 = QCLKx output(s) are enabled 1 0 = QCLKx output(s) are disabled in the active low state x denominate(s) the clock output(s) (e.g. x = B denominates QCLKB0 and CLKB1). 1 = Output channel X is powered down nPOWER Clock Output Channel Power 0 0 = Output channel X is powered up x denominates the output channel A, B or C. A channel consists of the output divider and delay stage, e.g. A and NA for channel A. These bits control the value of the clock frequency divider and output frequency NA[4:0], NB[4:0], NC[4:0] Clock Divider Setting 00000 N[4:0] Clock Divider N[4:0] Clock Divider 00000 ÷2 01000 ÷16 00001 ÷3 01001 ÷20 00010 ÷4 01010 ÷24 00011 ÷5 01011 ÷32 00100 ÷6 01100 ÷40 00101 ÷8 01101 ÷48 00110 ÷10 01110 ÷80 00111 ÷12 01111 ÷96 10000 ÷1 11011 ÷64 These bits control the selection of phase delay  of the clock outputs. One unit of  corresponds to the delay of 1/fVCO. For fine delay adjustments, use the delay circuits of the QREF outputs.  DLY[5:0] EF Clock Phase Delay QCLK, QVCXO Output Format 000000 0 Delay 000000 0 000001 1/fVCO 000010 2· (1/fVCO) ... ...   · (1/fVCO) Sets the output format: 0 = LVDS (Requires LVDS 100 output termination across a differential pair. 1 = LVPECL (Requires LVPECL 50 termination to the specified recommended termination voltage). QCLK, QVCXO amplitude control A[1:0] QCLK,QVCXO Output Amplitude REVISION 2 10/1/15 10 Output Termination A[1] A[0] Amplitude 0 0 Output is powered- down 0 1 400mV 50 to VDDx - 1.5V 1 0 700mV 50 to VDDx - 2V 1 1 1000mV, fOUT > 500MHz 20 LVPECL (EF = 1) LVDS (EF = 0) Should not have any  termination 100across differential pair 50 to VDDx - 2.5V FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET QREF Output Control Registers The QREF Control Registers contain the settings for the SYSREF output enable, power state, signal source and phase delay. Since the registers have an identical format and bit meaning, they are described only once. Table 3F. QREF Output Control Register Bit Allocations Register Bit Register D7 D6 D5 D4 D3 D2 D1 D0 6 QREFA1 A[1] QREFA1 A[0] QREFA1 EF QREFA1 MUX QREFA0 A[1] QREFA0 A[0] QREFA0 EF QREFA0 MUX 11 NS[3] NS[2] NS[1] NS[0] QREFB1 OE QREFB0 OE QREFA1 OE QREFA0 OE 17 QREFA1 DLY[2] QREFA1 DLY[1] QREFA1 DLY[0] QREFA1 nPOWER QREFA0 DLY[2] QREFA0 DLY[1] QREFA0 DLY[0] QREFA0 nPOWER 21 QREFB1 DLY[2] QREFB1 DLY[1] QREFB1 DLY[0] QREFB0 nPOWER QREFB0 DLY[2] QREFB0 DLY[1] QREFB0 DLY[0] QREFB0 nPOWER 22 QREFB1 A[1] QREFB1 A[0] QREFB1 EF QREFB1 MUX QREFB0 A[1] QREFB0 A[0] QREFB0 EF QREFB0 MUX Table 3G. QREF Output Control Register Function Descriptions1 Factory Default Bits Name MUX QREF Signal Source 0 nPOWER Output Power 1 DLY[2:0] SYSREF Phase Delay  EF QREF Output Format 000 0 Function 1 = QREFn signal source is the QREFn delay circuit (SYSREF mode) 0 = QREFn signal source is the respective N clock divider (Clock mode) 1 = QREFn and delay block is powered down 0 = QREFn and delay block is powered up These bits control the selection of phase-delay of the QREF outputs. Sets the QREF output format: 0 = QREFn is LVDS (Requires LVDS 100 output termination across a differential pair). Use this format for SYSREF or clock signals. 1 = QREFn is LVPECL (Requires LVPECL 50 output termination to the specified recommended termination voltage). Use this format for clock signals. QREFn Amplitude Control A[1:0] OE QREF Output Amplitude QREF Enable 10 1 Output Termination A[1] A[0] QREF Amplitude 0 0 Powered-down 0 1 400mV 50 to VDDx - 1.5V 1 0 700mV 50 to VDDx - 2V 1 1 1000mV, fOUT > 500MHz LVPECL (EF = 1) Should not have any termination LVDS (EF = 0) 100across differential pair 50 to VDDx - 2.5V 1 = QREFn output is enabled 0 = QREFn output is disabled in the active low state NOTE 1. Subscript “n” represents the output number. FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 21 REVISION 2 10/1/15 8V19N407 DATA SHEET VCXO-PLL Control Registers The device control register contains settings for the VCXO-PLL charge pump and VCXO control voltage polarity and VCXO-bypass. Table 3H. VCXO-PLL Control Register Bit Allocations Register Bit Register D7 D6 D5 D4 D3 D2 D1 D0 13 POLV HOLD CPV[5] CPV[4] CPV[3] CPV[2] CPV[1] CPV[0] 16 QA DLY[1] QA DLY[0] Reserved BYPASS R/Wn 1 0 0 Table 3I. VCXO-PLL Control Register Function Descriptions Bits Name CPV[5:0] VCXO-PLL Charge-Pump Current POLV VCXO Polarity Factory Default Function 10 0000 Controls the charge pump current of the VCXO-PLL. Charge pump current is the binary value of this register multiplied by 20µA. ICP = 20µA · CPV[5:0]. Default setting is 640µA (32 · 20µA) 0 0 = Positive polarity. Use for an external VCXO with a positive f(VC) characteristics. 1 = Negative polarity. Use for an external VCXO with a negative f(VC) characteristics. 0 = Normal operation HOLD Holdover Control 0 BYPASS VCXO-PLL Bypass 0 1 = VCXO-PLL is set to holdover. The control voltage of the external VCXO is set to VDD/2. 0 = VCXO-PLL is enabled 1 = VCXO-PLL is bypassed SYSREF Control Registers The SYSREF pulse count register (SRPC) contains the binary setting for the number of SYSREF pulses generated by the device. Table 3J. SYSREF Control Register Bit Allocations Register Bit Register D7 D6 D5 D4 D3 D2 D1 D0 3 VCO_DIV nPOWER VCO N[3] VCO N[2] VCO N[1] VCO N[0] VCO nPOWER Reserved SRO 7 NR_REQ0 Reserved SYNC nPOWER Reserved SYNC N[3] SYNC N[2] SYNC N[1] SYNC N[0] 11 NS[3] NS[2] NS[1] NS[0] QREFB1 OE QREFB0 OE QREFA1 OE QREFA0 OE 23 SRPC[7] SRPC[6] SRPC[5] SRPC[4] SRPC[3] SRPC[2] SRPC[1] SRPC[0] REVISION 2 10/1/15 22 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Table 3K. SYSREF Control Register Function Descriptions Bits SRPC[7:0] Name SYSREF Pulse Count Factory Default 0000 0000 Function Binary value of the SYSREF pulses generated by the 8V19N407 and output at all enabled QREF outputs. Allows to generate 1 to 255 pulses after each write access. Requires SRO = 0. The programmed number of SYSREF pulses is generated after the SYSREF synchronization procedure completes. See Section, “SYSREF Generation” on page 12. SYSREF Divider Value NS[3:0] SYNC nPOWER SYSREF Frequency Divider Synchronizer Power Control 0100 0 NS3 NS2 NS1 NS0 Value 0 0 0 0 ÷64 0 0 0 1 ÷96 0 0 1 0 ÷128 0 0 1 1 ÷192 0 1 0 0 ÷256 0 1 0 1 ÷384 0 1 1 0 ÷512 0 1 1 1 ÷768 1 0 0 0 ÷1024 1 0 0 1 ÷2048 1 0 X X 1010-1111 are undefined. 0 = SYSREF synchronizer power up 1 = SYSREF synchronizer power down Power down the SYSREF synchronizer if all QREFn outputs are used as clock outputs. FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 23 REVISION 2 10/1/15 8V19N407 DATA SHEET Table 3K. SYSREF Control Register Function Descriptions (Continued) Bits Factory Default Name Function SYSREF Synchronizer divider value. This divider controls the release of SYSREF pulses at coincident QCLKAn and QCLKBn clock edges. For SYSREF operation, set this divider value to the least common multiple of the clock divider values NA and NB. For instance, if NA = ÷2 and NB = ÷3, set the SYNC divider to ÷6 (SYNC[3:0] = 0100). SYNC N[3:0] SRO SYSREF Synchronizer Divider SYNC3 SYNC2 SYNC1 SYNC0 0 0 0 0 ÷2 0 0 0 1 ÷3 0 0 1 0 ÷4 0 0 1 1 ÷5 0 1 0 0 ÷6 0 1 0 1 ÷8 0 1 1 0 ÷10 0 1 1 1 ÷12 1 0 0 0 ÷16 1 0 0 1 ÷20 1 0 1 0 ÷24 1 0 1 1 ÷32 1 1 0 0 ÷40 1 1 0 1 ÷48 1 1 1 0 ÷80 1 1 1 1 ÷96 1000 SYSREF Operation 1 Value 0 = Single SYSREF pulse generation mode. Number of pulses is controlled by SRPC[7:0]. 1 = Continuous SYSREF pulse generation FemtoClock NG PLL Control Registers The FemtoClock NG registers contain the setting for the divider, selection and power state. Table 3L. FemtoClockNG PLL Control Register Bit Allocations Register Bit Register D7 D6 D5 D4 D3 D2 D1 D0 24 QC OE Ch C nPOWER Reserved SPI_REL R/Wn 1 1 0 30 Reserved Reserved Reserved Reserved VCO_SEL Reserved INTEN1 INTEN0 Table 3M. FemtoClockNG PLL Control Register Function Descriptions Bits Name VCO_SEL VCO Frequency Select SPI_REL FemtoClock NG PLL Relock REVISION 2 10/1/15 Factory Default Function 0 This bit must be set ‘0’ 0 0 = no effect 1 = Creates a pulse that forces a re-lock on the FemtoClock NG PLL. Bit auto-clears. (Any changes of VCO-PLL parameters, such as Feedback Divider MF requires re-locking using SPI_REL bit.) 24 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Status Registers This register contains the clock status bits STAT[2:0] and latched copies of these bits (INT[1:0]). Table 3N. Status Register Bit Allocations Register Bit Register D7 10 D6 D5 D4 STAT2 STAT1 STAT0 D3 D2 D1 D0 Reserved INT1 INT0 Table 3O. Status Register Function Descriptions Bits Name STAT2 VCO Calibration Factory Default Function VCO calibration status: 1 = Completed - 0 = Not completed VCXO-PLL (1st stage) lock status: STAT1 VCXO-PLL Lock Status - 1 = VCXO-PLL is locked 0 = VCXO-PLL is unlocked CLK Input clock status: STAT0 Clock Input CLK Status - 1 = CLK input clock is present 0 = CLK input clock not detected INT[1:0] Individual Interrupt Status & Clear Bits These bits contain a latched version of the STAT[1:0] bits: The INT[1:0] bits indicate a fault condition (0) since the last interrupt clear command. Writing a 1 to a INT[1:0] bit position will clear that interrupt latch, provided the corresponding fault condition has also been cleared. Clearing the latch with the corresponding STAT[1:0] bit still indicating a fault (0) will result in an immediate re-trigger of the latch. - Interrupt Enable Register This register controls the interrupt functions of the 8V19N407. Table 3P. Interrupt Enable Register Bit Allocations Register Bit Register D7 D6 D5 D4 D3 D2 D1 D0 30 Reserved Reserved Reserved Reserved SEL Reserved INTEN1 INTEN0 Table 3Q. Interrupt Enable Register Function Descriptions Bits INTEN[1:0] Name Interrupt Enable Bits Factory Default 00 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER Function A setting of 0 in any of these bit positions will mask the corresponding INT[1:0] latch bit from affecting the interrupt output signal (nINT). A setting of 1 in any bit position will enable that INT[1:0] latch bit to drive the interrupt signal nINT. Setting all INTEN[1:0] to 0 has the effect of disabling interrupts from the device. 25 REVISION 2 10/1/15 8V19N407 DATA SHEET Reset Control Registers The Reset Control Registers contain the settings for the register controlled-reset and restart capabilities of the device. Output divider reset (NR_REQ0, NR_REQ1, NR_RESET): the divider reset sequence is required after device startup and after any N divider value change. See Section, “Clock Output Divider Reset Sequence, (Sequence S1)” on page 14. The QREF phase delay and SYSREF synchronization sequence is required for the synchronization of the delay stages after each delay stage configuration, and is also applicable for the generation of SYSREF pulses. Sequence: write a logic 1 to SR_REQ0, SR_REQ1 and SR_RESET in this order to generate a programmable number of SYSREF pulses at all enabled QREF outputs. See Section, “QREF Phase Delay and SYSREF Synchronization Sequence, (Sequence S2)” on page 14. Table 3R. Reset Control Register Bit Allocations Register Bit Register D7 D6 D5 D4 D3 D2 D1 D0 5 SR_REQ0 MV[14] MV[13] MV[12] MV[11] MV[10] MV[9] MV[8] 7 NR_REQ0 Reserved SYNC nPOWER Reserved SYNC N[3] SYNC N[2] SYNC N[1] SYNC N[0] 25 SR_REQ1 Reserved QCLKB1 A[1] QCLKB1 A[0] QCLKB1 EF QCLKB0 A[1] QCLKB0 A[0] QCLKB0 EF 27 NR_REQ1 QVCXO A[1] QVCXO A[0] QVCXO EF Reserved Reserved Reserved Reserved 29 SR_RESET Reserved Reserved Reserved Reserved Reserved Reserved Reserved 31 NR_RESET Reserved Reserved Reserved Reserved Reserved Reserved VCO_FSEL REVISION 2 10/1/15 26 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Table 3S. Reset Control Register Function Descriptions Bits Name NR_REQ0 NA, NB, NC Output Divider Reset Request 01, Auto-clear NR_REQ1 NA, NB, NC Output Divider Reset Request 1, Auto-clear Factory Default X X Function Writing a 1 to the bit position D7 in register 7 is the first step of the reset/re-synchronization sequence for the frequency dividers NA-C. All QCLK outputs are set to the logic low stage. This bit auto-clears after the reset sequence. Writing a 0 to this bit position has no effect. Writing a 1 to the bit position D7 in register 29 is the second step of the reset/re-synchronization sequence for the frequency dividers NA-C. After this bit is set to logic 1, the dividers NA-C can be reset synchronously by writing a logic 1 to the NR_RESET bit (register 31, bit position D7) Independent on the selected output dividers NA-C, the QCLK outputs will then restart with a rising edge simultaneously. This bit clears itself after the completion of the reset sequence and QCLK[A-C] outputs are reset. Writing a 0 to this bit position has no effect. NR_RESET NA, NB, NC Output Divider Divider Reset Auto-clear SR_REQ0 SYSREF Synchronization Request 02, Auto-clear SR_REQ1 SYSREF Synchronization Request 1, Auto-clear X Writing a 1 to the bit position D7 in register 31 is the third and final step of the reset/re-synchronization sequence for the frequency dividers NA-C. The dividers re-start synchronously up to 10 clock periods after this reset bit is written. This bit clears itself after the completion of the reset sequence and QCLK[A-C] outputs are reset. Writing a 0 to this bit position has no effect. X Writing a 1 to the bit position D7 in register 5 is the first step of the synchronization sequence for the SYSREF outputs (QREF). This bit auto-clears after the reset sequence. Writing a 0 to this bit position has no effect. Requires SRO = 0, otherwise no function. X Writing a 1 to the bit position D7 in register 27 is the second step of the synchronization sequence for the SYSREF outputs (QREF). The NS divider is reset. The SYSREF outputs (QREF) are active and set to logic low level in preparation to the last step (SR_RESET). Requires SRO = 0, otherwise no function. This bit clears itself after the completion of the reset sequence and QREF outputs are reset. Writing a 0 to this bit position has no effect. Writing a 1 to the bit position D7 in register 29 is the third and final step of the synchronization sequence for the SYSREF outputs (QREF). SR_RESET SYSREF Synchronization Reset Auto-clear X After writing a 1 to SR_RESET, the number of SYSREF pulses programmed in SRPC[7:0] are synchronously output at all enabled QREF outputs. This bit clears itself after the completion of the synchronization sequence. Writing a 0 to this bit position has no effect. Requires SRO = 0, otherwise no function. NOTE 1. See Section, “Clock Output Divider Reset Sequence, (Sequence S1)” on page 14. NOTE 2. See Section, “QREF Phase Delay and SYSREF Synchronization Sequence, (Sequence S2)” on page 14. FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 27 REVISION 2 10/1/15 8V19N407 DATA SHEET Absolute Maximum Ratings NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.  These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond  those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for  extended periods may affect product reliability. Table 4A. Absolute Maximum Ratings Item Rating Supply Voltage, VDDx 4.6V Inputs -0.5V to VDDx + 0.5V Outputs, VO (LVCMOS) -0.5V to VDDx + 0.5V Outputs, IO (LVPECL) Continuous Current Surge Current  50mA 100mA Outputs, IO (LVDS) Continuous Current Surge Current 10mA 15mA Junction Temperature, TJ 125C Storage Temperature, TSTG -65C to 150C Table 4B. Pin Characteristics Symbol Parameter CIN Input nLE, MOSI, Capacitance SPICLK 4 pF RPULLUP Input Pullup Resistor 51 k RPULLDOWN Input Pulldown Resistor 51 k ROUT Output Impedance SELSV = 1 (3.3V) 30  SELSV = 0 (1.8V) 40  REVISION 2 10/1/15 Test Conditions MISO, INT 28 Minimum Typical Maximum Units FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET DC Electrical Characteristics Table 5A. Power Supply DC Characteristics, VDDx = VDDQx = 3.3V ± 5%, TA = -40°C to +85°C1, 2, 3, 4 Symbol Parameter VDDx Power Supply Voltage VDDQx Output Supply Voltage IDDx Test Conditions IDDQx Output Supply Current, LVDS5, 7 Typical Maximum Units 3.135 3.3 3.465 V 3.135 Power Supply Current5 Output Supply Current, LVPECL5, 6 Minimum 3.3 3.465 V LVPECL Output Setting 325 350 mA LVDS Output Setting 355 370 mA 400mV Amplitude Setting 300 400 mA 700mV Amplitude Setting 315 420 mA 1000mV Amplitude Setting, fOUT > 500MHz 354 460 mA 400mV Amplitude Setting 452 550 mA 700mV Amplitude Setting 522 620 mA 1000mV Amplitude Setting, fOUT > 500MHz 617 670 mA NOTE 1. VDDx denotes VDD1, VDD2, VDD3, VDD4, VDD5, VDD6, VDD7. NOTE 2. VDDQx denotes VDDQA, VDDQB, VDDQC. NOTE 3. IDDx denotes IDD1, IDD2, IDD3, IDD4, IDD5, IDD6, IDD7. NOTE 4. IDDQx denotes IDDQA, IDDQB, IDDQC. NOTE 5. Both VCXO-PLL and FemtoClock NG PLL are locked and all output clocks are running (QREFn are in QCLK mode). SYSREF delay stages and synchronizer control are disabled. NOTE 6. Outputs not terminated. NOTE 7. Outputs not terminated with 100 across the differential pair. Table 5B. LVCMOS/LVTTL DC Characteristics, VDDx = VDDQx = 3.3V ± 5%, TA = -40°C to +85°C1, 2 Symbol Parameter VIH Input High Voltage VIL Input Low Voltage IIH Input High Current SPICLK, nLE, MOSI IIL Input Low Current VOH Output  High Voltage VOL Output  Low Voltage Maximum Units 1.3 1.8 V SELSV = 1 2.3 VDDX V SELSV = 0 -0.3 0.35 V SELSV = 1 -0.3 0.6 V VDD5 = 3.3V, VIN = 3.3V 150 µA SELSV VDD5 = 3.3V, VIN = 3.3V 5 µA SPICLK, nLE, MOSI VDD5 = 3.465V, VIN = 0V -5 µA SELSV VDD5 = 3.465V, VIN = 0V -150 µA VDDQx = 3.465V, SELSV = 0 IOH = -2mA 1.65 V VDDQx = 3.465V, SELSV = 1 IOH = -4mA 2.0 V nINT, MISO nINT, MISO Test Conditions Minimum SELSV = 0 Typical VDDQx = 3.465V, SELSV = 0 IOL = 2mA 0.15 V VDDQx = 3.465V, SELSV = 1 IOL = 4mA 0.5 V NOTE 1. VDDx denotes: VDD1, VDD2, VDD3, VDD4, VDD5, VDD6 and VDD7. NOTE 2. VDDQx denotes VDDQA, VDDQB, VDDQC. FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 29 REVISION 2 10/1/15 8V19N407 DATA SHEET Table 5C. Differential Input DC Characteristics, VDD5 = 3.3V ± 5%, TA = -40°C to +85°C Symbol Parameter Test Conditions Minimum Typical IIH Input High Current CLK, nCLK, VCXO, nVCXO IIL Input Low Current CLK, VCXO VDD5 = 3.465V, VIN = 0V -5 µA nCLK, nVCXO VDD5 = 3.465V, VIN = 0V -150 µA VDD5 = VIN = 3.465V Maximum Units 150 µA Table 5D. LVPECL DC Characteristics (QCLKn, EF = 1), VDDQx = 3.3V ± 5%, GND = 0V, TA = -40°C to +85°C1 Symbol Parameter Test Conditions Minimum Typical Maximum Units VDDQX – 1.41 VDDQX – 0.9 VDDQX – 0.55 V 400mV Amplitude Setting VDDQX – 1.66 VDDQX – 1.3 VDDQX – 1.11 V 700mV Amplitude Setting VDDQX – 1.965 VDDQX – 1.6 VDDQX – 1.35 V 1000mV Amplitude Setting, fOUT >500MHz VDDQX – 2.22 VDDQX – 2.0 VDDQX – 1.5 V 400mV Amplitude Setting VOH VOL Output High Voltage2 700mV Amplitude Setting 1000mV Amplitude Setting, fOUT >500MHz Output Low Voltage2 NOTE 1. VDDQx denotes: VDDQA, VDDQB, VDDQC. NOTE 2. Outputs terminated with 50 to VDDQx – 1.5V (400mV amplitude setting), VDDQx – 2.0V (700mV amplitude setting),  VDDQx – 2.5V (1000mV amplitude setting). Table 5E. LVDS DC Characteristics (QCLKn, EF = 0), VDDQx = 3.3V ± 5%, GND = 0V, TA = -40°C to +85°C1 Symbol VOS VOS Parameter Offset Voltage2 Test Conditions Minimum Typical Maximum Units 400mV Amplitude Setting 2.3 V 700mV Amplitude Setting 2.1 V 1000mV Amplitude Setting, fOUT >500MHz 1.9 V 20 mV VOS Magnitude Change NOTE 1. VDDQx denotes VDDQA, VDDQB, VDDQC. NOTE 2. VOS changes with VDD. Table 5F. LVDS DC Characteristics (QREFn), VDDQx = 3.3V ± 5%, GND = 0V, TA = -40°C to +85°C 1 Symbol VOS VOS Parameter Offset Voltage2 Test Conditions Minimum Typical Maximum Units 400mV Amplitude Setting 2.3 V 700mV Amplitude Setting 2.1 V 1000mV Amplitude Setting, fOUT >500MHz 1.9 V 20 mV VOS Magnitude Change NOTE 1. VDDQx denotes VDDQA, VDDQB, VDDQC. NOTE 2. VOS changes with VDD. REVISION 2 10/1/15 30 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET AC Electrical Characteristics Table 6A. AC Characteristics, VDDx = VDDQx = 3.3V ± 5%, GND = 0V, TA = -40°C to +85°C 1 Symbol Parameter fVCO VCO Frequency Range QCLKx fOUT Output Frequency2 QREFx VPP Peak-to-peak Input Voltage3 VCMR Common Mode Input Voltage4 Test Conditions Minimum 8V19N407-19 8V19N407-24 400mV Amplitude Setting fVCO ÷ 96 700mV Amplitude Setting fVCO ÷ 96 LVPECL Differential Output Voltage Swing, Peak-to-peak VOD VOD tsk(o) LVDS Differential Output Voltage6 2000 MHz 2400 2500 MHz fVCO MHz fVCO MHz 0.2 1.4 V 1.1 VDD – 0.3 V 570 mV 500 700mV Amplitude Setting fVCO ÷ 96 1000mV Amplitude Setting 500 310 425 700mV Amplitude Setting 500 730 1020 mV 1000mV Amplitude Setting 870 1080 1200 mV 400mV Amplitude Setting 620 850 1140 mV 700mV Amplitude Setting 1000 1460 2040 mV 1000mV Amplitude Setting 1740 2160 2400 mV 400mV Amplitude Setting 600 800 1000 mV 700mV Amplitude Setting 950 1400 1850 mV 1000mV Amplitude Setting 1450 2140 2600 mV LVDS VOD Magnitude Change 50 mV QCLKx Same N divider, Delay = 0 65 110 ps QCLKx Any N Divider, Incident Rising Edge, Delay = 0 75 140 ps Output Skew7, 8 QREFx Delay = 0 20 50 ps Any Equal Delay Settings 20 50 ps QREFx to QCLKx Any Divider, Incident Rising QCLK Edge, Delay = 0 110 200 ps QCLK (LVPECL) 20% to 80% 700mV Amplitude setting 150 300 ps QCLK (LVDS) 20% to 80% 700mV Amplitude setting 150 300 ps 20%-80% - SELSV = 0 1000 2650 ps 20%-80% - SELSV = 1 600 1000 ps QREFx t R / tF 1900 fVCO ÷ 96 400mV Amplitude Setting VO(PP)5 Units 400mV Amplitude Setting CLK, nCLK LVPECL Output Voltage Swing, Peak-to-peak Maximum 1000mV Amplitude Setting Typical Output Rise/Fall Time, Differential Output Rise/Fall Time9 Output Isolation nINT, MISO (LVCMOS) fOUT = 1228.8MHz 52 58 77 dB fOUT = 614.4MHz 55 59 80 dB fOUT = 307.2MHz 58 69 79 dB FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 31 REVISION 2 10/1/15 8V19N407 DATA SHEET Table 6A. AC Characteristics, VDDx = VDDQx = 3.3V ± 5%, GND = 0V, TA = -40°C to +85°C 1 (Continued) Symbol Parameter odc Output Duty Cycle QCLK[8:0], QREF[6:0] Test Conditions Minimum Typical Maximum Units Divide by1 42 48 54 % Other Dividers 45 50 55 % 210 1000 ms VCXO-PLL Bandwidth = 30Hz, tLOCK PLL Lock Time Device fully powered, measured from the first presence of a valid PLL reference clock to the complete lock of all PLLs NOTE 1. Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. VDDQx denotes VDDQA, VDDQB, VDDQC. VDDx denotes VDD1, VDD2, VDD3, VDD4, VDD5, VDD6, VDD7. NOTE 2. Used as clock output. NOTE 3. VIL should not be less than -0.3V. NOTE 4. Common mode input voltage is defined as the signal crosspoint. NOTE 5. LVPECL outputs terminated with 50 to VDDQx – 1.5V (400mV amplitude setting), VDDQx – 2.0V (700mV amplitude setting), VDDQx – 2.5V (1000mV amplitude setting). NOTE 6. LVDS outputs terminated 100 across terminals. NOTE 7. This parameter is defined in accordance with JEDEC standard 65. NOTE 8. Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the differential cross points. NOTE 9. Single-ended output nINT terminated according to Figure 12. REVISION 2 10/1/15 32 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Table 6B. 8V19N407-19 QCLK Phase Noise and Jitter Characteristics, VDDx = VDDQx = 3.3V ± 5%, GND = 0V, TA = -40°C to +85°C 1, 2, 3, 4, 5, 6 Symbol Parameter Test Conditions Minimum Typical Maximum Units Integration Range: 1kHz - 76.8MHz 104.7 160.6 fs Integration Range: 12kHz - 20MHz 91.4 129.8 fs N(10) 10Hz offset from Carrier -50.5 N(100) 100Hz offset from Carrier -85.6 1kHz offset from Carrier -116.2 -93.0 dBc/Hz 10kHz offset from Carrier -118.2 -114.3 dBc/Hz 100kHz offset from Carrier -122.8 -119.3 dBc/Hz 800kHz offset from Carrier -142.6 -139.8 dBc/Hz 1MHz offset from Carrier -144.7 -141.7 dBc/Hz Noise Floor -154 300Hz - 100kHz -87 -64 dBc f = 983.04MHz tjit(Ø) RMS Phase Jitter (Random) N(1k) N(10k) N(100k) Single-side Band Phase Noise N(800k) N(1M) N() Spurious Attenuation dBc/Hz dBc/Hz dBc/Hz >100kHz -85 -63 dBc Phase Detector Spurious -69 -61 dBc Integration Range: 1kHz - 76.8MHz 108.1 172.0 fs 145.0 f = 491.52MHz tjit(Ø) RMS Phase Jitter (Random) Integration Range: 12kHz - 20MHz 92.4 N(10) 10Hz offset from Carrier -57.1 dBc/Hz N(100) 100Hz offset from Carrier -92.7 dBc/Hz 1kHz offset from Carrier -123.4 -107.2 dBc/Hz N(1k) N(10k) N(100k) Single-side Band Phase Noise N(800k) N(1M) fs 10kHz offset from Carrier -124.5 -120.7 dBc/Hz 100kHz offset from Carrier -128.9 -125.3 dBc/Hz 800kHz offset from Carrier -148.2 -145.1 dBc/Hz 1MHz offset from Carrier -150.0 -146.8 dBc/Hz N() Noise Floor -157 300Hz - 100kHz -93 -70 dBc >100kHz -85 -66 dBc Phase Detector Spurious -76 -63 dBc Integration Range: 1kHz - 40MHz 124.1 175.4 fs Integration Range: 12kHz - 20MHz 98.5 142.0 fs N(10) 10Hz offset from Carrier -63.0 N(100) 100Hz offset from Carrier -98.2 1kHz offset from Carrier -129.2 -112.0 dBc/Hz 10kHz offset from Carrier -130.5 -125.6 dBc/Hz 100kHz offset from Carrier -134.9 -131.1 dBc/Hz 800kHz offset from Carrier -153.4 -150.7 dBc/Hz 1MHz offset from Carrier -154.8 -152.0 dBc/Hz Noise Floor -160 dBc/Hz 300Hz - 100kHz -95 dBc >100kHz -97 Phase Detector Spurious -87 Spurious Attenuation dBc/Hz f = 245.76MHz tjit(Ø) RMS Phase Jitter (Random) N(1k) N(10k) N(100k) Single-side Band Phase Noise N(800k) N(1M) N() Spurious Attenuation FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 33 dBc/Hz dBc/Hz -78 dBc dBc REVISION 2 10/1/15 8V19N407 DATA SHEET NOTE 1. Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 2. VDDQx denotes VDDQA, VDDQB, VDDQC. VDDx denotes VDD1, VDD2, VDD3, VDD4, VDD5, VDD6, VDD7. NOTE 3. Phase noise and spurious specifications apply for device operation with QREFn outputs inactive (no SYSREF pulses generated). NOTE 4. A VCXO has been used with Phase Noise and Spurious Attenuation measurements with typical offset values of 1kHz -131dBc/Hz, 10kHz -155dBc/Hz, 100kHz -160dBc/Hz and 1MHz -162dBc/Hz. NOTE 5. Voltage regulator to supply VDDX was used with a typical power supply rejection ratio of 80dB at 1kHz and ultra low noise generation with a typical value of 3nV/Hz at 10kHz and 7nV/Hz at 1kHz. NOTE 6. Outputs configured as LVDS 700mV. REVISION 2 10/1/15 34 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Table 6C. 8V19N407-24 QCLK Phase Noise and Jitter Characteristics, VDDx = VDDQx = 3.3V ± 5%, GND = 0V, TA = -40°C to +85°C 1, 2, 3, 4, 5, 6 Symbol Parameter Test Conditions Minimum Typical Maximum Units Integration Range: 1kHz - 76.8MHz 82.5 114.1 fs Integration Range: 12kHz - 20MHz 73.7 103.5 fs N(10) 10Hz offset from Carrier -52.5 N(100) 100Hz offset from Carrier -86.8 1kHz offset from Carrier -116.9 -111.7 dBc/Hz 10kHz offset from Carrier -118.1 -114.1 dBc/Hz 100kHz offset from Carrier -122.7 -119.4 dBc/Hz 800kHz offset from Carrier -142.7 -139.8 dBc/Hz 1MHz offset from Carrier -144.7 -141.7 dBc/Hz Noise Floor -154 300Hz - 100kHz -92 -75 dBc f = 1228.8MHz tjit(Ø) RMS Phase Jitter (Random) N(1k) N(10k) N(100k) Single-side Band Phase Noise N(800k) N(1M) N() Spurious Attenuation dBc/Hz dBc/Hz dBc/Hz >100kHz -85 -74 dBc Phase Detector Spurious -68 -60 dBc Integration Range: 1kHz - 76.8MHz 99.8 132.0 fs 110.9 f = 614.4MHz tjit(Ø) RMS Phase Jitter (Random) Integration Range: 12kHz - 20MHz 80.9 N(10) 10Hz offset from Carrier -58.4 dBc/Hz N(100) 100Hz offset from Carrier -93.0 dBc/Hz 1kHz offset from Carrier -122.3 -118.2 dBc/Hz N(1k) N(10k) N(100k) Single-side Band Phase Noise N(800k) N(1M) fs 10kHz offset from Carrier -123.6 -119.6 dBc/Hz 100kHz offset from Carrier -128.3 -125.2 dBc/Hz 800kHz offset from Carrier -147.7 -144.8 dBc/Hz 1MHz offset from Carrier -149.4 -146.4 dBc/Hz N() Noise Floor -154 300Hz - 100kHz -95 -81 dBc >100kHz -85 -69 dBc Phase Detector Spurious -79 -68 dBc Integration Range: 1kHz - 76.8MHz 101.9 136.4 fs Integration Range: 12kHz - 20MHz 81.3 111.6 fs N(10) 10Hz offset from Carrier -64.0 N(100) 100Hz offset from Carrier -98.7 1kHz offset from Carrier -128.9 -124.9 dBc/Hz 10kHz offset from Carrier -130.1 -122.0 dBc/Hz 100kHz offset from Carrier -134.6 -131.3 dBc/Hz 800kHz offset from Carrier -153.2 -150.2 dBc/Hz 1MHz offset from Carrier -154.6 -151.5 dBc/Hz Noise Floor -160 Spurious Attenuation dBc/Hz f = 307.2MHz tjit(Ø) RMS Phase Jitter (Random) N(1k) N(10k) N(100k) N(800k) N(1M) Single-side Band Phase Noise N() FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 35 dBc/Hz dBc/Hz dBc/Hz REVISION 2 10/1/15 8V19N407 DATA SHEET Table 6C. 8V19N407-24 QCLK Phase Noise and Jitter Characteristics, VDDx = VDDQx = 3.3V ± 5%, GND = 0V, TA = -40°C to +85°C 1, 2, 3, 4, 5, 6 Symbol Parameter Spurious Attenuation Test Conditions Minimum Typical Maximum Units 300Hz - 100kHz -98 -81 dBc >100kHz -96 -79 dBc Phase Detector Spurious -80 Integration Range: 1kHz - 40MHz 103.3 139.2 fs Integration Range: 12kHz - 20MHz 83.7 114.7 fs dBc f = 156.25MHz tjit(Ø) RMS Phase Jitter (Random) N(10) 10Hz offset from Carrier -69.1 dBc/Hz N(100) 100Hz offset from Carrier -103.3 dBc/Hz 1kHz offset from Carrier -133.5 -124.9 dBc/Hz 10kHz offset from Carrier -137.2 -132.7 dBc/Hz 100kHz offset from Carrier -142.4 -137.9 dBc/Hz 1MHz offset from Carrier -158.4 -155.6 dBc/Hz Noise Floor -161.8 N(1k) N(10k) Single-side Band Phase Noise N(100k) N(1M) N() dBc/Hz f = 125MHz Integration Range: 1kHz - 40MHz 146.8 185.2 fs Integration Range: 12kHz - 20MHz 109.8 142.4 fs N(10) 10Hz offset from Carrier -70.4 dBc/Hz N(100) 100Hz offset from Carrier -104.9 dBc/Hz tjit(Ø) RMS Phase Jitter (Random) N(1k) N(10k) Single-side Band Phase Noise N(100k) N(1M) N() 1kHz offset from Carrier -135.8 -125.9 dBc/Hz 10kHz offset from Carrier -139.0 -134.1 dBc/Hz 100kHz offset from Carrier -143.8 -138.4 dBc/Hz 1MHz offset from Carrier -157.3 -155.0 dBc/Hz Noise Floor -158.9 dBc/Hz NOTE 1. Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 2. VDDQx denotes VDDQA, VDDQB, VDDQC. VDDx denotes VDD1, VDD2, VDD3, VDD4, VDD5, VDD6, VDD7. NOTE 3. Phase noise and spurious specifications apply for device operation with QREFn outputs inactive (no SYSREF pulses generated). NOTE 4. A VCXO has been used with Phase Noise and Spurious Attenuation measurements with typical values of 1kHz -131dBc/Hz,  10kHz -155dBc/Hz, 100kHz -160dBc/Hz and 1MHz -162dBc/Hz. NOTE 5. Voltage regulator to supply VDDX was used with a typical power supply rejection ratio of 80dB at 1kHz and ultra low noise generation with a typical value of 3nV/Hz at 10kHz and 7nV/Hz at 1kHz. NOTE 6. Outputs configured as LVDS 700mV. REVISION 2 10/1/15 36 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Table 6D. 8V19N407-19 QREF Phase Noise and Spurious Characteristics, VDDx = VDDQx = 3.3V ± 5%, GND = 0V, TA = -40°C to +85°C1, 2, 3, 4, 5, 6 Symbol Parameter N(1k) N(10k) N(100k) Single-side Band Phase Noise (SYSREF = 15MHz) N(1M) Test Conditions Minimum Typical Maximum Units 1kz offset from Carrier -130 dBc/Hz 10kHz offset from Carrier -150 dBc/Hz 100kHz offset from Carrier -155 dBc/Hz 1MHz offset from Carrier -156 dBc/Hz 300Hz - 100kHz -90 dBc >100kHz -85 dBc Phase Detector Spurious -85 dBc Spurious Attenuation NOTE 1. Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 2. VDDQx denotes VDDQA, VDDQB, VDDQC. VDDx denotes VDD1, VDD2, VDD3, VDD4, VDD5, VDD6, VDD7. NOTE 3. Phase noise specifications are applicable for all outputs. NOTE 4. A VCXO has been used with Phase Noise and Spurious Attenuation measurements with typical values of 1kHz -131dBc/Hz,  10kHz -155dBc/Hz, 100kHz -160dBc/Hz and 1MHz -162dBc/Hz. NOTE 5. Voltage regulator to supply VDDX was used with a typical power supply rejection ratio of 80dB at 1kHz and ultra low noise generation with a typical value of 3nV/Hz at 10kHz and 7nV/Hz at 1kHz. NOTE 6. Outputs configured as LVDS 700mV. Table 6E. 8V19N407-24 QREF Phase Noise and Spurious Characteristics, VDDx = VDDQx = 3.3V ± 5%, GND = 0V,  TA = -40°C to +85°C1, 2, 3, 4, 5, 6 Symbol Parameter Test Conditions Minimum Typical Maximum Units N(1k) 1kz offset from Carrier -132 dBc/Hz N(10k) 10kHz offset from Carrier -147 dBc/Hz 100kHz offset from Carrier -155 dBc/Hz 1MHz offset from Carrier -156 dBc/Hz 300Hz - 100kHz -88 dBc >100kHz -85 dBc Phase Detector Spurious -85 dBc N(100k) Single-side Band Phase Noise (SYSREF = 19.2MHz) N(1M) Spurious Attenuation NOTE 1. Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 2. VDDQx denotes VDDQA, VDDQB, VDDQC. VDDx denotes VDD1, VDD2, VDD3, VDD4, VDD5, VDD6, VDD7. NOTE 3. Phase noise specifications are applicable for all outputs active, Nx not equal. NOTE 4. A VCXO has been used with Phase Noise and Spurious Attenuation measurements with typical values of 1kHz -131dBc/Hz,  10kHz -155dBc/Hz, 100kHz -160dBc/Hz and 1MHz -162dBc/Hz. NOTE 5. Voltage regulator to supply VDDX was used with a typical power supply rejection ratio of 80dB at 1kHz and ultra low noise generation with a typical value of 3nV/Hz at 10kHz and 7nV/Hz at 1kHz. NOTE 6. Outputs configured as LVDS 700mV. FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 37 REVISION 2 10/1/15 8V19N407 DATA SHEET Noise Power dBc Hz Typical Phase Noise at 1228.8MHz Offset Frequency (Hz) Noise Power dBc Hz Typical Phase Noise at 307.2MHz Offset Frequency (Hz) REVISION 2 10/1/15 38 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Noise Power dBc Hz Typical Phase Noise at 156.25MHz Offset Frequency (Hz) Noise Power dBc Hz Typical Phase Noise at 125MHz Offset Frequency (Hz) FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 39 REVISION 2 10/1/15 8V19N407 DATA SHEET Noise Power dBc Hz Typical Phase Noise at 983.04MHz Offset Frequency (Hz) Noise Power dBc Hz Typical Phase Noise at 491.52MHz Offset Frequency (Hz) REVISION 2 10/1/15 40 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Noise Power dBc Hz Typical Phase Noise at 245.76MHz Offset Frequency (Hz) FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 41 REVISION 2 10/1/15 8V19N407 DATA SHEET Parameter Measurement Information nQCLKA[1:0], nQCLKB[1:0], nQCLKC, nQREFA[1:0], nQREFB[1:0] nQx Qx nQy QCLKA[1:0], QCLKB[1:0], QCLKC, QREFA[1:0], QREFB[1:0] Qy 80% 80% VOD 20% 20% tR tF LVDS Output Rise/Fall Time Differential Output Skew nQCLKA[1:0], nQCLKB[1:0], nQCLKC, nQREFA[1:0], nQREFB[1:0] VDD QCLKA[1:0], QCLKB[1:0], QCLKC, QREFA[1:0], QREFB[1:0] nCLK V Cross Points PP CLK V CMR GND Differential Input Level nQCLKA[1:0], nQCLKB[1:0], nQCLKC, nQREFA[1:0], nQREFB[1:0] QCLKA[1:0], QCLKB[1:0], QCLKC, QREFA[1:0], QREFB[1:0] 80% Differential Output Duty Cycle/Pulse Width/Period 80% 80% 80% VO(PP) 20% 20% tR MISO, nINT tR tF tF LVCMOS Output Rise/Fall Time LVPECL Output Rise/Fall Time REVISION 2 10/1/15 20% 20% 42 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Applications Information Recommendations for Unused Input and Output Pins Inputs: Outputs: LVCMOS Control Pins LVPECL Outputs All control pins have internal pullups or pulldowns; additional resistance is not required but can be added for additional protection. A 1k resistor can be used. Any unused LVPECL output pair can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated. LVDS Outputs All unused LVDS output pairs can be either left floating or terminated with 100 across. If they are left floating, there should be no trace attached. FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 43 REVISION 2 10/1/15 8V19N407 DATA SHEET Wiring the Differential Input to Accept Single-Ended Levels Figure 4 shows how a differential input can be wired to accept single ended levels. The reference voltage V1= VDD/2 is generated by the bias resistors R1 and R2. The bypass capacitor (C1) is used to help filter noise on the DC bias. This bias circuit should be located as close to the input pin as possible. The ratio of R1 and R2 might need to be adjusted to position the V1in the center of the input voltage swing. For example, if the input clock is driven from a single-ended 2.5V LVCMOS driver and the DC offset (or swing center) of this signal is 1.25V, the R1 and R2 values should be adjusted to set the V1 at 1.25V. The values below are for when both the single ended swing and VDD are at the same voltage. This configuration requires that the sum of the output impedance of the driver (Ro) and the series resistance (Rs) equals the transmission line impedance. In addition, matched termination at the input will attenuate the signal in half. This can be done in one of two ways. First, R3 and R4 in parallel should equal the transmission line impedance. For most 50 applications, R3 and R4 can be 100. The values of the resistors can be increased to reduce the loading for slower and weaker LVCMOS driver. When using single-ended signaling, the noise rejection benefits of differential signaling are reduced. Even though the differential input can handle full rail LVCMOS signaling, it is recommended that the amplitude be reduced while maintaining an edge rate faster than  1V/ns. The datasheet specifies a lower differential amplitude, however this only applies to differential signals. For single-ended applications, the swing can be larger, however VIL cannot be less than -0.3V and VIH cannot be more than VDD + 0.3V. Though some of the recommended components might not be used, the pads should be placed in the layout. They can be utilized for debugging purposes. The datasheet specifications are characterized and guaranteed by using a differential signal. Figure 4. Recommended Schematic for Wiring a Differential Input to Accept Single-ended Levels REVISION 2 10/1/15 44 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET 3.3V Differential Clock Input Interface The CLK /nCLK accepts LVDS, LVPECL and other differential signals. Both differential inputs must meet the VPP and VCMR input requirements. Figure 5A to Figure 5C show interface examples for the CLK /nCLK input with built-in 50 terminations driven by the most common driver types. The input interfaces suggested here are examples only. If the driver is from another vendor, use their termination recommendation. Please consult with the vendor of the driver component to confirm the driver termination requirements. Figure 5A. CLK/nCLK Input Driven by a  3.3V LVPECL Driver Figure 5C. CLK/nCLK Input Driven by a  3.3V LVPECL Driver Figure 5B. CLK/nCLK Input Driven by a  3.3V LVDS Driver FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 45 REVISION 2 10/1/15 8V19N407 DATA SHEET VFQFN EPAD Thermal Release Path In order to maximize both the removal of heat from the package and the electrical performance, a land pattern must be incorporated on the Printed Circuit Board (PCB) within the footprint of the package corresponding to the exposed metal pad or exposed heat slug on the package, as shown in Figure 6. The solderable area on the PCB, as defined by the solder mask, should be at least the same size/shape as the exposed pad/slug area on the package to maximize the thermal/electrical performance. Sufficient clearance should be designed on the PCB between the outer edges of the land pattern and the inner edges of pad pattern for the leads to avoid any shorts. and dependent upon the package power dissipation as well as electrical conductivity requirements. Thus, thermal and electrical analysis and/or testing are recommended to determine the minimum number needed. Maximum thermal and electrical performance is achieved when an array of vias is incorporated in the land pattern. It is recommended to use as many vias connected to ground as possible. It is also recommended that the via diameter should be 12 to 13mils (0.30 to 0.33mm) with 1oz copper via barrel plating. This is desirable to avoid any solder wicking inside the via during the soldering process which may result in voids in solder between the exposed pad/slug and the thermal land. Precautions should be taken to eliminate any solder voids between the exposed heat slug and the land pattern. Note: These recommendations are to be used as a guideline only. For further information, please refer to the Application Note on the Surface Mount Assembly of Amkor’s Thermally/ Electrically Enhance Lead frame Base Package, Amkor Technology. While the land pattern on the PCB provides a means of heat transfer and electrical grounding from the package to the board through a solder joint, thermal vias are necessary to effectively conduct from the surface of the PCB to the ground plane(s). The land pattern must be connected to ground through these vias. The vias act as “heat pipes”. The number of vias (i.e. “heat pipes”) are application specific PIN PIN PAD SOLDER EXPOSED HEAT SLUG GROUND PLANE THERMAL VIA SOLDER LAND PATTERN (GROUND PAD) PIN PIN PAD Figure 6. P.C. Assembly for Exposed Pad Thermal Release Path – Side View (drawing not to scale) REVISION 2 10/1/15 46 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Termination Information Termination for QCLK LVPECL Outputs (EF = 1) . Figure 7 shows an example of the termination for a QCLK LVPECL driver. In this example, the transmission line characteristic impedance is 50. The R1 and R2 50 resistors are matched load terminations and are terminated to the voltage VT. VT should be set to a voltage according to the output amplitude in Table 2G. The termination resistors must be placed close to the receiver (line end) VDDQx VT = VDDx - 1.5V (400 mV Amplitude) VT = VDDx - 2.0V (700 mV Amplitude) VT = VDDx - 2.5V (1000 mV Amplitude) VT R1 = 50 R2 = 50 T = 50 QCLK LVPECL (EF = 1) Figure 7. QCLK LVPECL (EF = 1) Output Termination Termination for QCLK LVDS Outputs (EF = 0) Figure 8 and Figure 9 show examples of the termination for a QCLK and QREF LVDS drivers. In these examples, the transmission line characteristic impedance is 50. The 100 resistor R is matched to the line impedance. The output amplitude is configurable, see Table 2G. The termination resistor must be placed close to the receiver (line end) or is internal to the receiver. VDDQx (400mV Amplitude) (700mV Amplitude) (1000mV Amplitude) T = 50 R = 100 QCLK LVDS (EF = 0) Figure 8. QCLK LVDS (EF = 0) Output Termination VDDQx T = 50 QREF LVDS R = 100 Figure 9. DC Termination for QREF LVDS Outputs FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 47 REVISION 2 10/1/15 8V19N407 DATA SHEET AC Termination for QREF LVDS Outputs Figure 10 shows an example of the AC termination for the QREF LVDS driver. In this example, the transmission line characteristic impedance is 50. A 100 AC-line termination must be placed close to the receiver (line end) or is internal to the receiver. The receiver input should be re-biased according to its common mode range specifications. VDDQx 0.1µF T = 50 0.1µF R = 100 QREF LVDS Figure 10. AC Termination for QREF LVDS Outputs Figure 11 shows an example of the termination for the QREF LVDS driver. In this example, the transmission line characteristic impedance is 50. The 100 resistor R is matched to the line impedance. The output amplitude is configurable, see Table 2G. The termination resistor must be placed close to the receiver (line end). A The receiver input should be re-biased according to its common mode range specifications. VDDQx VBIAS 0.1µF T=50 0.1µF R = 100 QREF LVDS Figure 11. AC Termination for QREF LVDS Outputs Termination for Single-ended Outputs (nINT) . Figure 12 shows an example of the series termination for the nINT LVCMOS driver. In this example, the transmission line characteristic impedance is 50 VDDQx R = 10 T = 50 LVCMOS Figure 12. Termination for single-ended Outputs REVISION 2 10/1/15 48 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Schematic Example Figure 13 and Figure 14 (next page) show an example 8V19N407 application schematic in which the device is operated at VDD = 3.3V. To achieve optimum jitter performance, power supply isolation is required to minimize device generated noise. The 8V19N407 provides separate power supplies to isolate any high switching noise from coupling into the internal PLL as shown in Figure 14. This example focuses on functional connections and is not configuration specific. Refer to the pin description and functional tables in the datasheet to ensure that the logic control inputs are properly set for the application. In order to achieve the best possible filtering, it is recommended that the placement of the filter components be on the device side of the PCB as close to the power pins as possible. If space is limited the 0.1uf capacitor in each power pin filter should be placed on the device side. The other components can be on the opposite side of the PCB. Pull up and pull down resistors to set configuration pins can all be placed on the PCB side opposite the device side to free up device side area if necessary. The required generic VCXO shown requires a separate power filter and a termination for the VCXO output type. Since the type is not specified, neither is a specific termination. The loop filter for the external VCXO is three poles for best out of band rejection. The corresponding loop filter for the internal VCO is specified as three poles even though only two poles are populated. This leaves the option of increasing the filter order based on system level test. Power supply filter recommendations are a general guideline to be used for reducing external noise from coupling into the devices. The filter performance is designed for a wide range of noise frequencies. This low-pass filter starts to attenuate noise at approximately 10kHz. If a specific frequency noise component is known, such as switching power supplies frequencies, it is recommended that component values be adjusted and if required, additional filtering be added. Additionally, good general design practices for power plane voltage stability suggests adding bulk capacitance in the local area of all devices. The output terminations and clock receivers shown in Figure 13 are representative examples. AC coupled LVDS terminations are also permissible as shown in the Section, “Termination Information”. As with any high speed analog circuitry, the power supply pins are vulnerable to board supply or device generated noise. This device requires an external voltage regulator for the VDDx pins for isolation of board supply noise. This regulator is indicated in the schematic by the two different power supplies, VREG_3.3V and 3.3V. Consult the voltage regulator specification for details of the required performance. FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER For additional layout recommendations and guidelines, contact clocks@idt.com. 49 REVISION 2 10/1/15 8V19N407 DATA SHEET U2A R1 15 56 57 58 59 60 SPICLK MOSI MISO nLE nI NT LF SPICLK MOSI MISO nLE nINT 0 R4 180 C1 C4 1.2nF C2 DEPOP 56nF 3.3V VCOR VCO R2 1k 3 20 C3 4. 7uF 21 62 Z o = 50 Ohm 23 24 Z o = 50 Ohm SELSV C QVCXO nQVCXO + R3 100 65 66 Z o = 50 Ohm - CR QCLKA0 nQCLKA0 7 8 CLK_IN QCLKA0 nQCLKA0 Z o = 50 Ohm LVDS Rec eiv er R6 50 + R5 Z o = 50 Ohm 100 61 QCLKA1 nQCLKA1 9 10 Z o = 50 Ohm LVDS Driver QREFA0 nQREFA0 4 5 C5 30k C6 R8 50 QREFA0 nQREFA0 R9 71 - R7 50 nCLK_IN +3.3V LVPECL Receiv er Z o = 50 Ohm LFV R11 20k QREFA1 nQREFA1 1nF + R10 100 12 13 Z o = 50 Ohm - 8nF C7 QCLKB0 nQCLKB0 10uF 3. 3V 1 48 47 QCLKB0 nQCLKB0 LVDS Rec eiv er FB1 2 Z o = 50 Ohm BLM18BB221SN1 C8 0.1uF C9 10uF QCLKB1 nQCLKB1 + R12 100 46 45 Z o = 50 Ohm - C10 QREFB0 nQREFB0 VCC U7 QREFB0 nQREFB0 43 42 QREFB1 nQREFB1 LVDS Rec eiv er 6 0.1uF 51 50 1 GND VC 4 68 OUT_P VCXO 5 OUT_N 69 QREFB1 nQREFB1 Zo = 50 Ohm nVCXO 3 + VCXO QCLKC nQCLKC 54 53 R13 100 Zo = 50 Ohm R14 R15 150 150 +3.3V LVPECL Rec eiv er Figure 13. Signal I/O, External VCXO and Loop Filters REVISION 2 10/1/15 50 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET VREG_3.3V F B2 1 2 VDD7 U2B 70 VDD7 C13 BLM18BB221SN1 C11 C12 0.1uF 10uF 3.3V 0.1uF VDDQA VDDQA VREG_3.3V 6 11 1 2 C15 10uF 0.1uF VDD6 1 BLM18BB221SN1 C14 0.1uF 67 BLM18BB221SN1 C18 0.1uF 2 VDDQA C16 F B4 FB3 C17 0.1uF C20 C19 10uF 0.1uF 3.3V VREG_3.3V FB5 F B6 1 2 63 VDD5 VDD5 VDDQB VDDQB 44 49 VREG_3.3V 2 C27 C25 10uF 0.1uF 1 C21 BLM18BB221SN1 0.1uF C23 10uF C22 BLM18BB221SN1 C24 0.1uF VDDQB C26 0.1uF 0.1uF FB7 1 2 BLM18BB221SN1 C28 0.1uF 27 26 19 VDD 4 C30 C29 10uF VDD4 VDD4 VDD4 FB8 52 VDDQC C31 0.1uF C33 VDDQC C32 0.1uF 0.1uF 2 3.3V 1 BLM18BB221SN1 C34 10uF C35 0.1uF 0.1uF VREG_3.3V NC NC NC NC NC NC NC NC NC NC NC NC F B9 1 2 BLM18BB221SN1 C36 0.1uF 37 18 VDD3 C38 C37 10uF VDD3 VDD3 C39 0.1uF 0.1uF VREG_3.3V 1 F B10 2 BLM18BB221SN1 C40 0.1uF 39 16 VDD2 C42 C41 10uF VDD2 VDD2 22 25 28 29 30 31 32 34 33 35 36 40 C43 0.1uF 0.1uF VREG_3.3V F B11 2 BLM18BB221SN1 C45 10uF VDD1 73 C46 0.1uF ePAD 2 14 17 38 41 55 64 72 C44 0.1uF 1 VDD1 GND GND GND GND GND GND GND GND 1 Figure 14. Power Filters FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 51 REVISION 2 10/1/15 8V19N407 DATA SHEET Power Considerations The 8V19N407 device was designed and characterized to operate within the ambient extended temperature range of -40°C to 85°C.The ambient temperature represents the temperature around the device, not the junction temperature. Extreme care must be taken to avoid exceeding the 125°C junction temperature, potentially damaging the device. Equations and example calculations are also provided below. 1. Power Dissipation. The power dissipation for the 8V19N407 is the product of supply voltage and total IDD.  The following is the power dissipation for VDD = 3.3V + 5% = 3.465V at ambient temperature of 85°C. Maximum current at 85°C, IDD_TOTAL_MAX = IDD_MAX + IDDQ_MAX (All QCLKx and QVCXO are running with 700mV amplitude in LVDS mode and Continuous SYSREFs are running with 400mV amplitude in LVDS mode) • Total Power Dissipation: PD = VDD_MAX * IDD_MAX = 3.465V * (370mA + 620mA) = 3.430W 2. Junction Temperature. Junction temperature, Tj, signifies the hottest point on the device and exceeding the specified limit could cause device reliability issues.  The maximum recommended junction temperature is 125°C. For devices like this and in systems where most heat escapes from the bottom exposed pad of the package, JB is the primary thermal resistance of interest. The equation to calculate Tj using JB is: Tj = JB * PD + TB Tj = Junction Temperature JB = Junction-to-Board Thermal Resistance PD = Device Power Dissipation (example calculation is in section 1 above) TB = Board Temperature In order to calculate junction temperature, the appropriate junction-to-board thermal resistance JB must be used. Assuming a 2-ground plane board, the appropriate value of JB is 0.713°C/W per Table 7 below. Therefore, Tj for a PCB maintained at 115°C with all outputs switching is: 115°C + 3.430W * 0.713°C/W = 117.4°C which is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, heat transfer method, the type of board (multi-layer) and the actual maintained board temperature. The below table is for two ground planes. The thermal resistance will change as the number of layers in the board changes or if the board size change and other changes in other factors impacts heat dissipation in the system. Table 7. Thermal Resistances for 72-Lead VFQFN Package Air Flow (m/s) 0 1 2 JB 0.713°C/W 0.713°C/W 0.713°C/W JA 19.16°C/W 15.49°C/W 14.14°C/W NOTE: Applicable to PCBs with two ground planes. NOTE: ePAD size is 8.4mm x 8.4mm and connected to ground plane in PCB through 8 x 8 Thermal Via Array. NOTE: In devices where most of the heat exits through the bottom ePAD, JB is commonly used for thermal calculations. Transistor Count The transistor count for 8V19N407 is: 46,972 REVISION 2 10/1/15 52 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET 72 VFQFN Package Information FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 53 REVISION 2 10/1/15 8V19N407 DATA SHEET 72 VFQFN Package Information, Continued REVISION 2 10/1/15 54 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 8V19N407 DATA SHEET Ordering Information Table 8. Ordering Information with MISO Output in High Impedance Part/Order Number Marking 8V19N407Z-19NLGI IDT8V19N407Z-19NLGI VCO Frequency Package Shipping Packaging Temperature 72 Lead VFQFN, Lead-Free Tray -40C to 85C 72 Lead VFQFN, Lead-Free Tape & Reel -40C to 85C 72 Lead VFQFN, Lead-Free Tray -40C to 85C 72 Lead VFQFN, Lead-Free Tape & Reel -40C to 85C 1900 - 2000MHz 8V19N407Z-19NLGI8 IDT8V19N407Z-19NLGI 8V19N407Z-24NLGI IDT8V19N407Z-24NLGI 2400 - 2500MHz 8V19N407Z-24NLGI8 IDT8V19N407Z-24NLGI FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER 55 REVISION 2 10/1/15 8V19N407 DATA SHEET Revision History Sheet Rev Table Page Table 6A 31 2 REVISION 2 10/1/15 Description of Change Date AC Characteristics Table - typographical spec errors for VO(pp):  LVPECL Output Voltage Swing  (400mV Amplitude Setting) minimum and maximum specs; LVPECL Differential Output Voltage Swing  (400mV Amplitude Setting) minimum, typical and maximum specs (1000mV Amplitude Setting) typical spec 56 10/1/15 FEMTOCLOCK® NG JITTER ATTENUATOR AND CLOCK SYNTHESIZER Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 USA 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com email: clocks@idt.com DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications, such as those requiring extended temperature ranges, high reliability or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments. Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Product specification subject to change without notice. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third party owners. Copyright ©2015 Integrated Device Technology, Inc.. All rights reserved.
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