932S825BGLFT

ICS932S825 Low Power Clock Chip for Serverworks HT2400 Servers Serverworks HT2400-based systems using AMD Opteron processors Output Features: • 7 - Pairs of AMD Low Power K8 Greyhound compliant clocks 7 - Pair of SRC/PCI Express* Gen 2 clocks 3 - 14.318 MHz REF clocks including 1 free-running 2 - 48MHz clocks 2 - PCI 33 MHz clocks 2 - 25MHz clocks • • • • • Features: • • • • • Spread Spectrum for EMI reduction Outputs may be disabled via SMBus M/N programming via SMBus PCIe clocks meet PCIe Gen 2. Low Power differential outputs Functionality CPU (MHz) Hi-Z X/6 180.00 220.00 100.00 133.33 Reserved 200.00 FS2 FS1 FS0 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 X1 X2 VDDREF_STB REF0_RUN_2x FS1/REF1_2x FS2/REF2_2x GNDREF VDD48 48MHz_0_2x 48MHz_1_2x GND48 SCLK SDATA VDDPCI PCICLK0_2x PCICLK1_2x GNDPCI CLKPWRGD/PD# GND VDDA GNDA GND PCIeT_L0 PCIeC_L0 PCIeT_L1 PCIeC_L1 GND VDDPCIe PCIeT_L2 PCIeC_L2 PCIeT_L3 PCIeC_L3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 932S825 Pin Configuration Recommended Application: 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 VDD25MHz FS0/25MHz_0_2x 25MHz_1_2x GND25MHz SPREAD_EN CPUK8GT_L6 CPUK8GC_L6 CPUK8GT_L5 CPUK8GC_L5 VDDCPU GND CPUK8GT_L4 CPUK8GC_L4 CPUK8GT_L3 CPUK8GC_L3 CPUK8GT_L2 CPUK8GC_L2 VDDCPU GND CPUK8GT_L1 CPUK8GC_L1 CPUK8GT_L0 CPUK8GC_L0 GND PCIeT_L6 PCIeC_L6 PCIeT_L5 PCIeC_L5 VDDPCIe GND PCIeT_L4 PCIeC_L4 64-TSSOP Power Groups Pin Number VDD 8 64 14 20 36, 28 55, 47 3 1276F—12/02/08 GND 11 61 17 21 35, 27 54, 46 7 Description 48MHz Clocks 25MHz Clocks 33 MHz PCI Clocks Analog Core PCIe clocks K8G CPU Clocks REF Clocks, Xtal Osc. *Other names and brands may be claimed as the property of others. ICS932S825 Pin Description PIN # PIN NAME TYPE 1 2 3 X1 X2 VDDREF_STB IN OUT PWR 4 REF0_RUN_2x OUT 5 FS1/REF1_2x I/O 6 FS2/REF2_2x I/O 7 8 9 10 11 12 13 14 15 16 17 GNDREF VDD48 48MHz_0_2x 48MHz_1_2x GND48 SCLK SDATA VDDPCI PCICLK0_2x PCICLK1_2x GNDPCI PWR PWR OUT OUT PWR IN I/O PWR OUT OUT PWR 18 CLKPWRGD/PD# 19 20 21 22 GND VDDA GNDA GND PWR PWR PWR PWR 23 PCIeT_L0 OUT 24 PCIeC_L0 OUT 25 PCIeT_L1 OUT 26 PCIeC_L1 OUT 27 28 GND VDDPCIe PWR PWR 29 PCIeT_L2 OUT 30 PCIeC_L2 OUT 31 PCIeT_L3 OUT 32 PCIeC_L3 OUT IN DESCRIPTION Crystal input, Nominally 14.318MHz. Crystal output, Nominally 14.318MHz Ref, XTAL power supply, nominal 3.3V standby power 14.318MHz Free Running XTAL Output. This output runs as long as standby VDD is applied to the part. Default drive is 2 loads. Frequency select latch input pin / 14.318 MHz reference clock. Default 2 load drive. Frequency select latch input pin / 14.318 MHz reference clock. Default 2 load drive. Ground pin for the REF outputs. Power pin for the 48MHz output.3.3V 48MHz clock output. Default 2 load drive strength 48MHz clock output. Default 2 load drive strength Ground pin for the 48MHz outputs Clock pin of SMBus circuitry, 5V tolerant. Data pin for SMBus circuitry, 3.3V tolerant. Power supply for PCI clocks, nominal 3.3V 3.3V PCI clock output. Default 2 load drive strength. 3.3V PCI clock output. Default 2 load drive strength. Ground pin for the PCI outputs This 3.3V LVTTL input is a level sensitive strobe used to determine when latch inputs are valid and are ready to be sampled. This is an active high input. / Asynchronous active low input pin used to power down the device into a low power state. Ground pin. 3.3V power for the PLL core. Ground pin for the PLL core. Ground pin. True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm resistor to GND needed) Complement clock of 0.8V differential push-pull PCI_Express pair. (no 50ohm resistor to GND needed) True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm resistor to GND needed) Complement clock of 0.8V differential push-pull PCI_Express pair. (no 50ohm resistor to GND needed) Ground pin. Power supply for PCI Express clocks, nominal 3.3V True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm resistor to GND needed) Complement clock of 0.8V differential push-pull PCI_Express pair. (no 50ohm resistor to GND needed) True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm resistor to GND needed) Complement clock of 0.8V differential push-pull PCI_Express pair. (no 50ohm resistor to GND needed) 1276F—12/02/08 2 ICS932S825 Pin Description (continued) PIN # PIN NAME TYPE 33 PCIeC_L4 OUT 34 PCIeT_L4 OUT 35 36 GND VDDPCIe PWR PWR 37 PCIeC_L5 OUT 38 PCIeT_L5 OUT 39 PCIeC_L6 OUT 40 PCIeT_L6 OUT 41 GND PWR 42 CPUK8GC_L0 OUT 43 CPUK8GT_L0 OUT 44 CPUK8GC_L1 OUT 45 46 47 CPUK8GT_L1 GND VDDCPU OUT PWR PWR 48 CPUK8GC_L2 OUT 49 CPUK8GT_L2 OUT 50 CPUK8GC_L3 OUT 51 CPUK8GT_L3 OUT 52 CPUK8GC_L4 OUT 53 54 55 CPUK8GT_L4 GND VDDCPU OUT PWR PWR 56 CPUK8GC_L5 OUT 57 CPUK8GT_L5 OUT 58 CPUK8GC_L6 OUT 59 60 61 62 CPUK8GT_L6 SPREAD_EN GND25MHz 25MHz_1_2x OUT IN PWR OUT 63 FS0/25MHz_0_2x 64 VDD25MHz I/O PWR DESCRIPTION Complement clock of 0.8V differential push-pull PCI_Express pair. (no 50ohm resistor to GND needed) True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm resistor to GND needed) Ground pin. Power supply for PCI Express clocks, nominal 3.3V Complement clock of 0.8V differential push-pull PCI_Express pair. (no 50ohm resistor to GND needed) True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm resistor to GND needed) Complement clock of 0.8V differential push-pull PCI_Express pair. (no 50ohm resistor to GND needed) True clock of 0.8V differential push-pull PCI_Express pair (no 50ohm resistor to GND needed) Ground pin. Complementary signal of low-power differential push-pull AMD K8 "Greyhound" clock True signal of low-power differential push-pull AMD K8 "Greyhound" clock Complementary signal of low-power differential push-pull AMD K8 "Greyhound" clock True signal of low-power differential push-pull AMD K8 "Greyhound" clock Ground pin. Supply for CPU clocks, 3.3V nominal Complementary signal of low-power differential push-pull AMD K8 "Greyhound" clock True signal of low-power differential push-pull AMD K8 "Greyhound" clock Complementary signal of low-power differential push-pull AMD K8 "Greyhound" clock True signal of low-power differential push-pull AMD K8 "Greyhound" clock Complementary signal of low-power differential push-pull AMD K8 "Greyhound" clock True signal of low-power differential push-pull AMD K8 "Greyhound" clock Ground pin. Supply for CPU clocks, 3.3V nominal Complementary signal of low-power differential push-pull AMD K8 "Greyhound" clock True signal of low-power differential push-pull AMD K8 "Greyhound" clock Complementary signal of low-power differential push-pull AMD K8 "Greyhound" clock True signal of low-power differential push-pull AMD K8 "Greyhound" clock Asynchronous, active high input to enable spread spectrum functionality. Ground pin for the 25Mhz outputs 25MHz clock output, 3.3V. Default 2 load drive Frequency select latch input pin / Fixed 25MHz 3.3V clock output. Default 2 load drive Power supply for 25MHz clocks, 3.3V nominal. 1276F—12/02/08 3 ICS932S825 General Description The ICS932S825 is a main clock synthesizer chip that all clocks required by Serverworks HT2400-based servers. An SMBus interface allows full control of the device. Block Diagram REF (2:1), REF 0_RUN X1 X2 FS(2:0) CKPWRGD/PD# SPREAD_EN XTAL OSC. 48MHz(1:0) FIXED PLL 25MHz PLL 25M DIV CPU/SRC/ PCI PLL CPU DIV 25MHz(1:0) CPUK8G(6:0) CONTROL LOGIC PCI33 DIV SDATA SCLK SRC DIV Single-ended Terminations (All Single-Ended Outputs) Series Resistor for Proper Termination Single-ended Number of Zo = 50 ohms Output Strength Loads on Board 1 Load 1 33 2 Load 1 39 (Default) 2 22 Differential Terminations Number of Differential Series Resistor for Proper Termination Zo = 50 ohms Loads on Board Output CPUK8Gx 1 33 PCIe_Lx 1 33 1276F—12/02/08 4 PCICLK(1:0) PCIe(6:0) ICS932S825 Frequency Selection Table Byte 0 Bit 4 Bit 3 Bit2 Bit1 Bit0 SS_EN FS3 FS2 FS1 FS0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 CPU (MHz) SRC (MHz) Hi-Z X/4 180.00 220.00 100.00 133.33 Hi-Z X/8 90.00 110.00 100.00 100.00 200.00 184.00 188.00 192.00 196.00 204.00 208.00 212.00 216.00 Hi-Z X/4 180.00 220.00 100.00 133.33 100.00 92.00 94.00 96.00 98.00 102.00 104.00 106.00 108.00 Hi-Z X/8 90.00 110.00 100.00 100.00 200.00 184.00 188.00 192.00 196.00 204.00 208.00 212.00 216.00 100.00 92.00 94.00 96.00 98.00 102.00 104.00 106.00 108.00 PCI (MHz) Hi-Z x/24 30.00 36.67 33.33 33.33 Reserved 33.33 30.67 31.33 32.00 32.67 34.00 34.67 35.33 36.00 Hi-Z x/24 30.00 36.67 33.33 33.33 Reserved 33.33 30.67 31.33 32.00 32.67 34.00 34.67 35.33 36.00 1276F—12/02/08 5 Spread % OverClock Amount N/A N/A 0 0 0 0 N/A N/A 0.90 1.10 1.00 1.00 0 0 0 0 0 0 0 0 0 N/A N/A -0.5% -0.5% -0.5% -0.5% 1.00 0.92 0.94 0.96 0.98 1.02 1.04 1.06 1.08 N/A N/A 1.00 1.00 1.00 1.00 -0.5% -0.5% -0.5% -0.5% -0.5% -0.5% -0.5% -0.5% -0.5% 1.00 0.92 0.94 0.96 0.98 1.02 1.04 1.06 1.08 ICS932S825 CPU Divider Ratios Divider (1:0) Divider (3:2) Bit 00 01 10 11 LSB 00 0000 0001 0010 0011 Address 2 3 5 15 Div 01 0100 0101 0110 0111 Address 4 3 5 15 Div 01 0100 0101 0110 0111 Address 4 6 10 30 Div 10 1000 1001 1010 1011 Address 8 12 20 60 Div 11 1100 1101 1110 1111 Address MSB 16 24 40 120 Div 10 1000 1001 1010 1011 Address 16 12 20 60 Div 11 1100 1101 1110 1111 Address MSB 32 24 40 120 Div 10 1000 1001 1010 1011 Address 8 12 20 28 Div 11 1100 1101 1110 1111 Address MSB 16 24 40 56 Div PCI Divider Ratios Divider (1:0) Divider (3:2) Bit 00 01 10 11 LSB 00 0000 0001 0010 0011 Address 8 6 10 30 Div SRC Divider Ratios Divider (1:0) Divider (3:2) Bit 00 01 10 11 LSB 00 0000 0001 0010 0011 Address 2 3 5 7 Div 01 0100 0101 0110 0111 Address 4 6 10 14 Div 1276F—12/02/08 6 ICS932S825 Absolute Maximum Ratings Parameter 3.3V Core Supply Voltage 3.3V Logic Input Supply Voltage Storage Temperature Ambient Operating Temp Ts Input ESD protection human body model 1 Symbol Min Max Units Notes VDDA GND + 4.5V V 1 VDD GND +4.5V V 1 -50 150 °C Tambient 0 70 °C ESD prot 2000 V 1 Operation at these extremes is neither implied nor guaranteed Electrical Characteristics - Input/Supply/Common Output Parameters TA = 0 - 70°C; Supply Voltage VDD = 3.3 V +/-5% PARAMETER SYMBOL Input High Voltage VIH Input Low Voltage Input High Current VIL IIH IIL1 Input Low Current IIL2 Operating Current Powerdown Current 3 Input Frequency 1 Pin Inductance Input Capacitance1 Clk Stabilization1,2 Modulation Frequency SMBus Voltage Low-level Output Voltage Current sinking at VOL = 0.4 V SCLK/SDATA Clock/Data Rise Time3 SCLK/SDATA 3 Clock/Data Fall Time IDD3.3OP IDD3.3PD Fi Lpin CIN COUT CINX TSTAB VDD VOL Conditions VIN = VDD VIN = 0 V; Inputs with no pull-up resistors VIN = 0 V; Inputs with pull-up resistors all outputs driven all diff pairs Low/Low VDD = 3.3 V Logic Inputs Output pin capacitance X1 & X2 pins From VDD Power-Up or de-assertion of PD# to 1st clock Triangular Modulation MIN 2 TYP VSS - 0.3 -5 MAX UNITS NOTES VDD + 0.3 V 1 0.8 5 V uA 1 1 -5 uA 1 -200 uA 1 7 5 6 5 mA mA MHz nH pF pF pF 3 1 1 1 1 3 ms 1,2 33 5.5 0.4 kHz V V 1 1 1 mA 1 250 15 14.318 30 2.7 @ IPULLUP 4 IPULLUP TRI2C (Max VIL - 0.15) to (Min VIH + 0.15) 1000 ns 1 TFI2C (Min VIH + 0.15) to (Max VIL - 0.15) 300 ns 1 1 Guaranteed by design and characterization, not 100% tested in production. See timing diagrams for timing requirements. 3 Input frequency should be measured at the REFOUT pin and tuned to ideal 14.31818MHz to meet ppm frequency accuracy on PLL outputs. 2 1276F—12/02/08 7 ICS932S825 AC Electrical Characteristics - Low Power Differential PCIe Outputs TA = 0 - 70°C; VDD = 3.3 V +/-5%; CL =2pF, RS=33.2Ω PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES Rising Edge Slew Rate t SLR Differential Measurement 0.5 2 V/ns 1,2 Falling Edge Slew Rate tFLR Differential Measurement 0.5 2 V/ns 1,2 Slew Rate Variation Maximum Output Voltage t SLVAR Single-ended Measurement 20 % 1 VHIGH Includes overshoot 1150 mV 1 Minimum Output Voltage VLOW Includes undershoot mV 1 mV 1 550 140 55 mV mV % 1,3,4 1,3,5 1 125 ps 1 250 ps 1 -300 Differential Voltage VSWING Differential Measurement 400 Swing Single-ended Measurement 300 Crossing Point Voltage VXABS Single-ended Measurement Crossing Point Variation VXABSVAR Differential Measurement 45 Duty Cycle DCYC PCIe Jitter - Cycle to Differential Measurement PCIeJ C2C Cycle Differential Measurement PCIe[6:0] Skew PCIeSKEW Notes on Electrical Characteristics: 1 Guaranteed by design and characterization, not 100% tested in production. 2 Slew rate measured through Vswing centered around differential zero 3 Vxabs is defined as the voltage where CLK = CLK# 4 Only applies to the differential rising edge (CLK rising and CLK# falling) 5 Defined as the total variation of all crossing voltages of CLK rising and CLK# falling. 6 All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REFOUT is at 14.31818MHz PCIe Phase Jitter Impact Parameter Conditions Min Typical Max Units Notes Output phase jitter impact – PCIe* Gen1 θPCIe1 (including PLL BW 1.5-22 MHz, z = 0.54, Td=10 ns, Ftrk=1.5 MHz ) 0 108 ps 1,2,3,4 Output phase jitter impact - PCIe Gen2 θPCIe2 (including PLL BW5-16 MHz, 8 – 16 MHz, z = 0.54, Td=10 ns) 0 3.1 ps RMS 1,2,3,4 NOTES: 1. Post processed evaluation through Intel supplied Matlab scripts. 2. PCIe* Gen2 filter characteristics are subject to final ratification by PC ISIG. Please check the PCI* SIG for the latest specification. 3. These jitter numbers are defined for a BER of 1E-12. Measured numbers at a smaller sample size have to be extrapolated to this BER target. 4. Guaranteed by design and characterization, not 100% tested in production. 1276F—12/02/08 8 ICS932S825 AC Electrical Characteristics - Low Power Differential CPU Outputs TA = 0 - 70°C; VDD = 3.3 V +/-5%; CL =AMD64 Processor Test Load PARAMETER SYMBOL CONDITIONS ∆VCROSS Crossing Point Variation Single-ended Measurement f Frequency Long Term Accuracy ppm MIN TYP 198.8 -300 MAX 140 200 300 UNITS mV MHz ppm NOTES 1 2 3 Rising Edge Slew Rate tSLR Differential Measurement 0.5 10 V/ns 4,5 Falling Edge Slew Rate tFLR Differential Measurement 0.5 10 V/ns 4,5 CPU Jitter - Cycle to Cycle CPUJC2C Differential Measurement 150 ps 6 CPU Jitter - Accumulated CPUJACC Over a 10 uS period 1 ns 7 Maximum Output Voltage VHIGH 1150 mV 1 Minimum Output Voltage VLOW mV 1 Differential Voltage Swing Peak-to-Peak VDPK-PK mV 8 Includes overshoot, single-ended measurement Includes undershoot, single-ended measurement Differential Measurement -1 -300 400 2400 VD Differential Measurement 200 1200 mV Differential Voltage Change in VD DC cycle-to∆VD Single-ended Measurement -75 75 mV cycle DCYC Duty Cycle Differential Measurement 45 55 % CPUSKEW10 CPU[6:0] Skew Differential Measurement 250 ps Notes on Electrical Characteristics (Guaranteed by design and characterization, not 100% tested in production): 1 9 10 11 Single-ended measurement at crossing point. Value is max-min over all time. DC value of common mode is not important due to the blocking cap. 2 Minimum frequency results from 0.5% down spread. Measured with spread spectrum off. 4 This parameter is intended to give guidance for simulation. 5 Differential measurement through the range of +/-100mV 6 Between any two adjacent cycles. 7 Accumulated over a 10 uS time periode, measured with JIT2 TIE at 50ps interval. 8 VDPK-PK is the overall magnitude of the differential signal. 9 VDMIN is the amplitude of the ring-back differential measurement, guaranteed by design, that ring-back will not cross 0V VD. VDMAX is the largest amplitude allowed. 10 The difference in magnitude of two adjacent VDDC measurements. VDDC is the stable post overshoot and ring-back part 11 Defined as tHIGH/tCYCLE 3 1276F—12/02/08 9 ICS932S825 Electrical Characteristics - 33 MHz PCICLK, 25MHz Outputs TA = 0 - 70°C; VDD=3.3V +/-5%; CL = 5 pF (unless otherwise specified) 1 2 PARAMETER PCI Long Accuracy SYMBOL ppm PCI Clock period Tperiod 25MHz Long Accuracy 25MHz Clock period Output High Voltage Output Low Voltage ppm Tperiod VOH VOL Output High Current IOH Output Low Current IOL Edge Rate Edge Rate Duty Cycle PCI Skew 25MHz Skew Jitter, Cycle to cycle δV/δt δV/δt dt1 tsk1 tsk1 tjcyc-cyc CONDITIONS see Tperiod min-max values 33.33MHz output nominal 33.33MHz output spread see Tperiod min-max values 25MHz output nominal IOH = -1 mA IOL = 1 mA V OH @MIN = 1.0 V VOH@ MAX = 3.135 V VOL @ MIN = 1.95 V VOL @ MAX = 0.4 V Rising edge rate Falling edge rate VT = 1.5 V VT = 1.5 V VT = 1.5 V VT = 1.5 V MIN -300 29.9910 29.9910 -50 TYP 40 2.4 -33 30 1 1 45 MAX UNITS 300 ppm 30.0090 ns 30.1598 ns 50 ns ns V 0.55 V mA -33 mA mA 38 mA 4 V/ns 4 V/ns 55 % 250 ps 250 ps 250 ps Notes 1,2 2 2 2 2 1 1 1 1 1 1 1 1 1 1 1 1 Guaranteed by design and characterization, not 100% tested in production. All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is at 14.31818MHz Electrical Characteristics - 48MHz TA = 0 - 70°C; VDD = 3.3 V +/-5%; CL = 5 pF (unless otherwise specified) PARAMETER SYMBOL CONDITIONS ppm see Tperiod min-max values Long Accuracy Tperiod 48.00MHz output nominal Clock period IOH = -1 mA VOH Output High Voltage VOL IOL = 1 mA Output Low Voltage V OH @ MIN = 1.0 V IOH Output High Current VOH@ MAX = 3.135 V VOL @MIN = 1.95 V IOL Output Low Current VOL @ MAX = 0.4 V Edge Rate δV/δt Rising edge rate Edge Rate δV/δt Falling edge rate VT = 1.5 V dt1 Duty Cycle tsk1 VT = 1.5 V Group Skew VT = 1.5 V tjcyc-cyc Jitter, Cycle to cycle 1 2 MIN -100 20.8257 2.4 -33 30 1 1 45 TYP MAX UNITS 100 ppm 20.8340 ns V 0.55 V mA -33 mA mA 38 mA 2 V/ns 2 V/ns 55 % 250 ps 250 ps Guaranteed by design and characterization, not 100% tested in production. All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is at 14.31818MHz 1276F—12/02/08 10 Notes 1,2 2 1 1 1 1 1 1 1 1 1 1 1 ICS932S825 Electrical Characteristics - REF-14.318MHz TA = 0 - 70°C; VDD = 3.3 V +/-5%; CL = 5 pF (unless otherwise specified) PARAMETER SYMBOL CONDITIONS ppm see Tperiod min-max values Long Accuracy Tperiod 14.318MHz output nominal Clock period IOH = -1 mA VOH Output High Voltage IOL = 1 mA VOL Output Low Voltage V OH @MIN = 1.0 V, V IOH Output High Current @MAX = 3.135 V OH VOL @MIN = 1.95 V, VOL IOL Output Low Current @MAX = 0.4 V Edge Rate δV/δt Rising edge rate Edge Rate Falling edge rate δV/δt tsk1 VT = 1.5 V Skew VT = 1.5 V dt1 Duty Cycle tjcyc-cyc VT = 1.5 V Jitter, Cycle to cycle 1 2 MIN -300 69.8270 2.4 TYP MAX UNITS 300 ppm 69.8550 ns V 0.4 V -29 -23 mA 1 29 27 mA 1 1 1 2 2 500 55 1000 V/ns V/ns ps % ps 1 1 1 1 1 45 Guaranteed by design and characterization, not 100% tested in production. All Long Term Accuracy and Clock Period specifications are guaranteed assuming that REF is at 14.31818MHz 1276F—12/02/08 11 Notes 1 2 1 1 ICS932S825 General SMBus serial interface information How to Write: How to Read: Controller (host) sends a start bit. Controller (host) sends the write address D2 (h) ICS clock will acknowledge Controller (host) sends the begining byte location = N ICS clock will acknowledge Controller (host) sends the data byte count = X ICS clock will acknowledge Controller (host) starts sending Byte N through Byte N + X -1 • ICS clock will acknowledge each byte one at a time • Controller (host) sends a Stop bit • • • • • • • • • • • • • • • • • • • • • • Index Block Read Operation Index Block Write Operation Controller (Host) starT bit T Slave Address D2(h) WR WRite Controller (host) will send start bit. Controller (host) sends the write address D2 (h) ICS clock will acknowledge Controller (host) sends the begining byte location = N ICS clock will acknowledge Controller (host) will send a separate start bit. Controller (host) sends the read address D3 (h) ICS clock will acknowledge ICS clock will send the data byte count = X ICS clock sends Byte N + X -1 ICS clock sends Byte 0 through byte X (if X(h) was written to byte 8). Controller (host) will need to acknowledge each byte Controllor (host) will send a not acknowledge bit Controller (host) will send a stop bit Controller (Host) T starT bit Slave Address D2(h) WR WRite ICS (Slave/Receiver) ICS (Slave/Receiver) ACK ACK Beginning Byte = N Beginning Byte = N ACK ACK RT Repeat starT Slave Address D3(h) RD ReaD Data Byte Count = X ACK Beginning Byte N ACK X Byte ACK Data Byte Count = X ACK Beginning Byte N ACK X Byte Byte N + X - 1 ACK P stoP bit Byte N + X - 1 N P 1276F—12/02/08 12 Not acknowledge stoP bit ICS932S825 SMBus Table: Frequency Select and Spread Control Register Pin # Name Control Function Byte 0 Reserved Reserved Bit 7 Reserved Reserved Bit 6 Reserved Reserved Bit 5 SS_EN Spread Spectrum Enable Bit 4 FS3 Freq Select Bit 3 Bit 3 FS2 Freq Select Bit 2 Bit 2 FS1 Freq Select Bit 1 Bit 1 FS0 Freq Select Bit 0 Bit 0 Type 0 1 RW Reserved Reserved RW Reserved Reserved RW Reserved Reserved RW RW See CPU Frequency Select RW Table RW RW SMBus Table: Output Control Register Byte 1 Pin # Name 6 REF2 Bit 7 5 REF1 Bit 6 4 REF0_RUN Bit 5 17 PCICLK1 Bit 4 16 PCICLK0 Bit 3 Reserved Bit 2 10 48MHz_1 Bit 1 9 48MHz_0 Bit 0 Control Function Output Enable Output Enable Output Enable Output Enable Output Enable Reserved Output Enable Output Enable Type RW RW RW RW RW RW RW RW 0 Hi-Z Hi-Z Disable (Low) Disable (Low) Disable (Low) Reserved Disable (Low) Disable (Low) 1 Enable Enable Enable Enable Enable Reserved Enable Enable PWD 1 1 1 1 1 1 1 1 Control Function Reserved Type RW RW RW RW RW RW RW RW 0 Reserved Disable Disable Disable Disable Disable Disable Disable 1 Reserved Enable Enable Enable Enable Enable Enable Enable PWD 0 1 1 1 1 1 1 1 Type RW RW RW RW RW RW RW RW 0 Reserved Disable Disable Disable Disable Disable Disable Disable 1 Reserved Enable Enable Enable Enable Enable Enable Enable PWD 0 1 1 1 1 1 1 1 SMBus Table: Output Control Register Byte 2 Pin # Name Reserved Bit 7 59/58 CPUK8G_L(6) Bit 6 57/56 CPUK8G_L(5) Bit 5 53/52 CPUK8G_L(4) Bit 4 51/50 CPUK8G_L(3) Bit 3 47/46 CPUK8G_L(2) Bit 2 45/44 CPUK8G_L(1) Bit 1 43/42 CPUK8G_L(0) Bit 0 SMBus Table: Output Control Register Byte 3 Pin # Name Reserved Bit 7 40/39 PCIe_L6 Bit 6 38/37 PCIe_L5 Bit 5 PCIe_L4 33/34 Bit 4 31/32 PCIe_L3 Bit 3 29/30 PCIe_L2 Bit 2 25/26 PCIe_L1 Bit 1 23/24 PCIe_L0 Bit 0 Output Enable When Disabled CPUK8GT_L = 0 CPUK8GC_L = 0 Control Function Reserved Output Enable When Disabled PCIeT_L = 0 PCIeC_L = 0 1276F—12/02/08 13 PWD 0 0 0 Latched 0 Latched Latched Latched ICS932S825 SMBus Table: Drive Strength Control Register Byte 4 Pin # Name Control Function REF2 Drive Strength Select 6 Bit 7 REF1 Drive Strength Select 5 Bit 6 REF0_RUN Drive Strength Select 4 Bit 5 17 PCICLK1 Drive Strength Select Bit 4 PCICLK0 Drive Strength Select 16 Bit 3 11 48MHz_2 Drive Strength Select Bit 2 10 48MHz_1 Drive Strength Select Bit 1 9 48MHz_0 Drive Strength Select Bit 0 Type RW RW RW RW RW RW RW RW 0 1 Load 1 Load 1 Load 1 Load 1 Load 1 Load 1 Load 1 Load 1 2 Loads 2 Loads 2 Loads 2 Loads 2 Loads 2 Loads 2 Loads 2 Loads PWD 1 1 1 1 1 1 1 1 SMBus Table: Drive Strength Control Register Pin # Name Control Function Byte 5 62 25MHz_1 Output Enable Bit 7 63 25MHz_0 Output Enable Bit 6 62 25MHz_1 Drive Strength Select Bit 5 63 25MHz_0 Drive Strength Select Bit 4 Reserved Reserved Bit 3 VDIFF2 VDIFF MSB Bit 2 VDIFF1 VDIFF Select Bit 0 Bit 1 VDIFF0 VDIFF LSB Bit 0 Type RW RW RW RW RW RW RW RW 0 Low Hi-Z 1 Load 1 Load Reserved 1 Enable Enable 2 Loads 2 Loads Reserved PWD 1 1 1 1 0 1 0 1 SMBus Table: Device ID Register Byte 6 Pin # Name DevID 7 Bit 7 DevID 6 Bit 6 DevID 5 Bit 5 DevID 4 Bit 4 DevID 3 Bit 3 DevID 2 Bit 2 DevID 1 Bit 1 DevID 0 Bit 0 Control Function Device ID MSB Device ID 6 Device ID 5 Device ID4 Device ID3 Device ID2 Device ID1 Device ID LSB Type R R R R R R R R 0 - 1 - PWD 0 0 1 0 0 1 0 1 Control Function Type R R R R R R R R 0 - 1 - PWD 0 0 0 1 0 0 0 1 SMBus Table: Vendor ID Register Byte 7 Pin # Name RID3 Bit 7 RID2 Bit 6 RID1 Bit 5 RID0 Bit 4 VID3 Bit 3 VID2 Bit 2 VID1 Bit 1 VID0 Bit 0 Revision ID VENDOR ID (0001 = ICS) 1276F—12/02/08 14 See VDIFF Select Table ICS932S825 SMBus Table: Byte Count Register Pin # Name Byte 8 BC7 Bit 7 BC6 Bit 6 BC5 Bit 5 BC4 Bit 4 BC3 Bit 3 BC2 Bit 2 BC1 Bit 1 BC0 Bit 0 SMBus Table: Reserved Register Pin # Name Byte 9 Reserved Bit 7 Reserved Bit 6 Reserved Bit 5 Reserved Bit 4 Reserved Bit 3 Reserved Bit 2 Reserved Bit 1 Reserved Bit 0 Control Function Byte Count Programming b(7:0) Control Function Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved SMBus Table: M/N Programming Enable Byte 10 Pin # Name Control Function CPU PLL M/N Programming M/N_EN Bit 7 Enable Reserved Reserved Bit 6 Reserved Reserved Bit 5 Reserved Reserved Bit 4 Reserved Reserved Bit 3 Reserved Reserved Bit 2 Reserved Reserved Bit 1 Reserved Reserved Bit 0 1276F—12/02/08 15 Type 0 1 RW RW Writing to this register will RW RW configure how many bytes RW will be read back, default is 9 bytes. RW RW RW PWD 0 0 0 0 1 0 0 1 Type RW RW RW RW RW RW RW RW 0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved 1 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved PWD 0 0 0 0 0 0 0 0 Type 0 1 PWD RW Disable Enable 0 RW RW RW RW RW RW RW - - 0 0 0 0 0 0 0 ICS932S825 Bytes 11:14 are Reserved Registers SMBus Table: CPU Frequency Control Register Byte 15 Pin # Name Control Function N Div8 N Divider Prog bit 8 Bit 7 Type RW Bit 6 - N Div9 Bit 5 - M Div5 RW Bit 4 - M Div4 RW Bit 3 - M Div3 RW Bit 2 - M Div2 Bit 1 - M Div1 RW M Div0 RW Bit 0 N Divider Prog bit 9 M Divider Programming bit (5:0) SMBus Table: CPU Frequency Control Register Pin # Name Control Function Byte 16 N Div7 Bit 7 RW RW Type RW - N Div6 Bit 5 - N Div5 Bit 4 - N Div4 Bit 3 - N Div3 Bit 2 - N Div2 RW Bit 1 - N Div1 RW N Div0 RW Bit 6 Bit 0 RW N Divider Programming Byte12 bit(7:0) and Byte11 bit(7:6) SMBus Table: CPU Spread Spectrum Control Register Byte 17 Pin # Name Control Function SSP7 Bit 7 SSP6 Bit 6 SSP5 Bit 5 Spread Spectrum SSP4 Bit 4 Programming bit(7:0) SSP3 Bit 3 SSP2 Bit 2 SSP1 Bit 1 SSP0 Bit 0 1276F—12/02/08 16 RW RW RW 0 1 The decimal representation of M and N Divier in Byte 11 and 12 will configure the CPU VCO frequency. Default at power up = latchin or Byte 0 Rom table. VCO Frequency = 14.318 x [NDiv(9:0)+8] / [MDiv(5:0)+2] 0 1 The decimal representation of M and N Divier in Byte 11 and 12 will configure the CPU VCO frequency. Default at power up = latchin or Byte 0 Rom table. VCO Frequency = 14.318 x [NDiv(9:0)+8] / [MDiv(5:0)+2] Type 0 1 RW RW RW These Spread Spectrum bits in Byte 13 and 14 will RW program the spread RW pecentage of CPU RW RW RW PWD X X X X X X X X PWD X X X X X X X X PWD X X X X X X X X ICS932S825 SMBus Table: CPU Spread Spectrum Control Register Byte 18 Pin # Name Control Function Reserved Reserved Bit 7 SSP14 Bit 6 SSP13 Bit 5 SSP12 Bit 4 Spread Spectrum SSP11 Bit 3 Programming bit(14:8) SSP10 Bit 2 SSP9 Bit 1 SSP8 Bit 0 0 1 Type R RW RW These Spread Spectrum bits RW in Byte 13 and 14 will RW program the spread RW pecentage of CPU RW RW PWD 0 X X X X X X X SMBus Table: Programmable Output Divider Register Pin # Name Control Function Byte 19 CPUDiv3 Bit 7 CPU Divider Ratio CPUDiv2 Bit 6 Programming Bits CPUDiv1 Bit 5 CPUDiv0 Bit 4 Reserved Reserved Bit 3 Reserved Reserved Bit 2 Reserved Reserved Bit 1 Reserved Reserved Bit 0 Type RW RW RW RW R R R R PWD X X X X 0 0 0 0 SMBus Table: Programmable Output Divider Register Pin # Name Control Function Byte 20 33MHzDiv3 Bit 7 33MHz Divider Ratio 33MHzDiv2 Bit 6 Programming Bits 33MHzDiv1 Bit 5 33MHzDiv0 Bit 4 SRC_Div3 Bit 3 SRC_ Divider Ratio SRC_Div2 Bit 2 Programming Bits SRC_Div1 Bit 1 SRC_Div0 Bit 0 Type 0 1 RW RW 33MHz Divider Ratio Table RW RW RW RW SRC Divider Ratio Table RW RW SMBusTable: Reserved Regsiter Byte 21 is reserved do not write this register! 1276F—12/02/08 17 0 1 See CPU Divider Ratios Table - - PWD X X X X X X X X ICS932S825 Shared Pin Operation Input/Output Pins Figure 1 shows a means of implementing this function when a switch or 2 pin header is used. With no jumper is installed the pin will be pulled high. With the jumper in place the pin will be pulled low. If programmability is not necessary, than only a single resistor is necessary. The programming resistors should be located close to the series termination resistor to minimize the current loop area. It is more important to locate the series termination resistor close to the driver than the programming resistor. The I/O pins designated by (input/output) on the ICS932S825 serve as dual signal functions to the device. During initial power-up, they act as input pins. The logic level (voltage) that is present on these pins at this time is read and stored into a 5-bit internal data latch. At the end of Power-On reset, (see AC characteristics for timing values), the device changes the mode of operations for these pins to an output function. In this mode the pins produce the specified buffered clocks to external loads. To program (load) the internal configuration register for these pins, a resistor is connected to either the VDD (logic 1) power supply or the GND (logic 0) voltage potential. A 10 Kilohm (10K) resistor is used to provide both the solid CMOS programming voltage needed during the power-up programming period and to provide an insignificant load on the output clock during the subsequent operating period. Via to VDD Programming Header 2K W Via to Gnd Device Pad 8.2K W Clock trace to load Series Term. Res. Fig. 1 1276F—12/02/08 18 ICS932S825 c N SYMBOL L E1 A A1 A2 b c D E E1 e L N α aaa E INDEX AREA 1 2
D A A2 6.10 mm. Body, 0.50 mm. Pitch TSSOP (240 mil) (20 mil) In Millimeters In Inches COMMON DIMENSIONS COMMON DIMENSIONS MIN MAX MIN MAX -1.20 -.047 0.05 0.15 .002 .006 0.80 1.05 .032 .041 0.17 0.27 .007 .011 0.09 0.20 .0035 .008 SEE VARIATIONS SEE VARIATIONS 8.10 BASIC 0.319 BASIC 6.00 6.20 .236 .244 0.50 BASIC 0.020 BASIC 0.45 0.75 .018 .030 SEE VARIATIONS SEE VARIATIONS 0° 8° 0° 8° -0.10 -.004 VARIATIONS A1 -Ce N 64 SEATING PLANE b aaa C D mm. MIN 16.90 D (inch) MAX 17.10 Reference Doc.: JEDEC Publication 95, MO-153 10-0039 Ordering Information 932S825yGLFT Example: XXXX y G LF T Designation for tape and reel packaging Lead Free, RoHS Compliant (Optional) Package Type G = TSSOP Revision Designator (will not correlate with datasheet revision) Device Type 1276F—12/02/08 19 MIN .665 MAX .673 ICS932S825 Revision History Rev. A B C Issue Date Description 1. Updated Electrical Characteristics. 2. Going to Preliminary. 2/28/2007 3. Updated Idd to reflect low power outputs 9/11/2007 1. Updated pin description 9/12/2007 1. Updated quantity of PCIEX outputs listed under "Output Features" D 1. 2. 10/25/2007 3. 4. 5. E F 12/14/2007 Updated SMBus serial Interface Information 12/2/2008 Removed ICS prefix from ordering information. Corrected CPU/SRC/PCI PLL control bytes to B(15:18) from B(11:14) Changed pin names to indicate default drive strength. NO silicon changes. Corrected Byte 0 SS_EN and FS3 reference in FS table. Simplified the Terminations Table.. Release to Final 1276F—12/02/08 20 Page # Various 2, 3 1 1, 2, 3, 4, 5, 16,17 12 19 IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.