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9DB206CFLFT

9DB206CFLFT

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    SSOP-28

  • 描述:

    IC JITTER ATTENUATOR 28-SSOP

  • 数据手册
  • 价格&库存
9DB206CFLFT 数据手册
9DB206 PCI Express Jitter Attenuator Data Sheet PRODUCT DISCONTINUATION NOTICE - LAST TIME BUY EXPIRES SEPTEMBER 7, 2016 GENERAL DESCRIPTION Features The 9DB206 is a high perfromance 1-to-6 Differential-to-HCSL Jitter Attenuator designed for use in PCI Express™ systems. In some PCI Express systems, such as those found in desktop PCs, the PCI Express clocks are generated from a low bandwidth, high phase noise PLL frequency synthesizer. In these systems, a jitter-attenuating device may be necessary in order to reduce high frequency random and deterministic jitter components from the PLL synthesizer and from the system board. The 9DB206 has two PLL bandwidth modes. In low bandwidth mode, the PLL loop bandwidth is 500kHz. This setting offers the best jitter attenuation and is still high enough to pass a triangular input spread spectrum profile. In high bandwidth mode, the PLL bandwidth is at 1MHz and allows the PLL to pass more spread spectrum modulation. • Six 0.7V current mode differential HCSL output pairs For serdes which have x10 reference multipliers instead of x12.5 multipliers, 5 of the 6 PCI Express outputs (PCIEX1:5) can be set for 125MHz instead of 100MHz by configuring the appropriate frequency select pins (FS0:1). Output PCIEX0 will always run at the reference clock frequency (usually 100MHz) in desktop PC PCI Express Applications. • RMS phase jitter @ 100MHz, (1.5MHz - 22MHz): 2.42ps (typical) • One differential clock input • CLK and nCLK supports the following input types: LVPECL, LVDS, LVHSTL, SSTL, HCSL • Maximum output frequency: 140MHz • Input frequency range: 90MHz - 140MHz • VCO range: 450MHz - 700MHz • Output skew: 110ps (maximum) • Cycle-to-Cycle jitter: 110ps (maximum) • 3.3V operating supply • 0°C to 70°C ambient operating temperature • Available in lead-free RoHS compliant package • Industrial temperature information available upon request BLOCK DIAGRAM IREF Current Set + PIN ASSIGNMENT 1 HiZ 0 Enabled nOE0 ÷5 nCLK CLK Phase Detector Loop Filter VCO PCIEXT0 nPCIEXC0 PCIEXT1 nPCIEXC1 PCIEXT2 nPCIEXC2 0 ÷4 1 ÷5 ÷5 PLL_BW CLK nCLK FS0 PCIEXT0 PCIEXC0 VDD GND PCIEXT1 PCIEXC1 PCIEXT2 PCIEXC2 VDD nOE0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VDDA GND IREF FS1 PCIEXT5 PCIEXC5 VDD GND PCIEXT4 PCIEXC4 PCIEXT3 PCIEXC3 VDD nOE1 Internal Feedback FS0 9DB206 PCIEXT3 nPCIEXC3 0 ÷5 1 ÷4 PCIEXT4 nPCIEXC4 PCIEXT5 nPCIEXC5 FS1 nOE1 1 HiZ 0 Enabled ©2016 Integrated Device Technology, Inc 1 28-Lead TSSOP, 173-MIL 4.4mm x 9.7mm x 0.92mm body package L Package Top View 9DB206 28-Lead, 209-MIL SSOP 5.3mm x 10.2mm x 1.75mm body package F Package Top View Revision B March 11, 2016 9DB206 Data Sheet TABLE 1. PIN DESCRIPTIONS Number Name 1 PLL_BW Input 2 CLK Input Pulldown Non-inverting differential clock input. 3 nCLK Input Pullup/ Inverting differential clock input. V /2 default when left floating. Pulldown 4 FS0 Input 5, 6 PCIEXT0, PCIEXC0 Output Differential output pairs. HCSL interface levels. 7, 13, 16, 22 VDD Power Core supply pins. GND Power Power supply ground. Output Differential output pairs. HCSL interface levels. Output Differential output pairs. HCSL interface levels. 8, 21 9, 10 11, 12 14, 15 17, 18 19, 20 23, 24 Type PCIEXT1, PCIEXC1 PCIEXT2, PCIEXC2 nOE0, nOE1 Input PCIEXC3, PCIEXT3 PCIEXC4, PCIEXT4 PCIEXC5, PCIEXT5 Description Pullup Selects PLL Bandwidth input. LVCMOS/LVTTL interface levels. DD Pullup Pulldown Frequency select pin. LVCMOS/LVTTL interface levels. Output enable. When HIGH, forces outputs to HiZ state. When LOW, enables outputs. LVCMOS/LVTTL interface levels. Output Differential output pairs. HCSL interface levels. Output Differential output pairs. HCSL interface levels. Output Differential output pairs. HCSL interface levels. 25 FS1 Input Pulldown Frequency select pin. LVCMOS/LVTTL interface levels. 26 IREF Input A fixed precision resistor (475Ω) from this pin to ground provides a reference current used for differential current-mode PCIEX clock outputs. 27 GND Power Power supply ground. 28 VDDA Power Analog supply pin. Requires 24Ω series resistor. NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. TABLE 2. PIN CHARACTERISTICS Symbol Parameter Test Conditions Minimum CIN Input Capacitance 4 pF RPULLUP Input Pullup Resistor 51 kΩ RPULLDOWN Input Pulldown Resistor 51 kΩ TABLE 3A. RATIO OF OUTPUT FREQUENCY TO INPUT FREQUENCY FUNCTION TABLE, FS0 Inputs Typical Maximum Units TABLE 3B. RATIO OF OUTPUT FREQUENCY TO INPUT FREQUENCY FUNCTION TABLE, FS1 Outputs Inputs Outputs FS0 PCIEX0 PCIEX1 PCIEX2 FS1 0 1 5/4 5/4 0 1 1 1 1 1 1 1 1 5/4 5/4 5/4 TABLE 3C. OUTPUT ENABLE FUNCTION TABLE, nOE0 TABLE 3D. OUTPUT ENABLE FUNCTION TABLE, nOE1 PCIEX3 PCIEX5 TABLE 3E. PLL BANDWIDTH TABLE Inputs Outputs Inputs Outputs Inputs nOE0 PCIEX0:2 nOE1 PCIEX3:5 PLL_BW 0 Enabled 0 Enabled 0 500kHz 1 HiZ 1 HiZ 1 1MHz ©2016 Integrated Device Technology, Inc PCIEX4 2 Bandwidth Revision B March 11, 2016 9DB206 Data Sheet ABSOLUTE MAXIMUM RATINGS Supply Voltage, VDD 4.6V Inputs, VI -0.5V to VDD + 0.5 V Outputs, VO -0.5V to VDD + 0.5V Package Thermal Impedance, θJA 28 Lead TSSOP 28 Lead SSOP 49.8°C/W (0 lfpm) 49°C/W (0 lfpm) Storage Temperature, TSTG -65°C to 150°C N OT E : S t r e s s e s b eyo n d t h o s e l i s t e d u n d e r A b s o l u t e Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. TABLE 4A. POWER SUPPLY DC CHARACTERISTICS, VDD = VDDA = 3.3V±5%, TA = 0°C TO 70°C, RREF = 475Ω Symbol Parameter Minimum Typical Maximum Units VDD Core Supply Voltage Test Conditions 3.135 3.3 3.465 V VDDA Analog Supply Voltage 3.135 3.3 3.465 V IDD Power Supply Current 112 mA IDDA Analog Supply Current 22 mA TABLE 4B. LVCMOS / LVTTL DC CHARACTERISTICS, VDD = VDDA = 3.3V±5%, TA = 0°C TO 70°C Symbol Parameter Maximum Units VIH Input High Voltage Test Conditions 2 VDD + 0.3 mV VIL Input Low Voltage -0.3 0.8 mV IIH Input High Current 150 µA 5 µA IIL Input Low Current FS1, nOE0, nOE1 Minimum Typical VDD = VIN = 3.465V FS0, PLL_BW FS1, nOE0, nOE1 VDD = 3.465V, VIN = 0V FS0, PLL_BW -5 µA -150 µA TABLE 4C. DIFFERENTIAL DC CHARACTERISTICS, VDD = VDDA = 3.3V±5%, TA = 0°C TO 70°C, RREF = 475Ω Symbol Parameter Maximum Units IIH Input High Current CLK, nCLK VDD = VIN = 3.465V Test Conditions Minimum Typical 150 µA IIL Input Low Current CLK, nCLK VDD = 3.465V, VIN = 0V 150 µA VPP Peak-to-Peak Input Voltage VCMR Common Mode Input Voltage; NOTE 1, 2 0.15 1.3 V GND + 0.5 VDD - 0.85 V NOTE 1: Common mode voltage is defined as VIH. NOTE 2: For single ended applications, the maximum input voltage for CLK, nCLK is VDD + 0.3V. ©2016 Integrated Device Technology, Inc 3 Revision B March 11, 2016 9DB206 Data Sheet TABLE 4D. HCSL DC CHARACTERISTICS, VDD = VDDA = 3.3V±5%, TA = 0°C TO 70°C, RREF = 475Ω Symbol Parameter I V V Output Low Voltage I High Impedance Leakage Current -10 Output Crossover Voltage 250 OH OH OL OZ V OX Test Conditions Minimum Typical Output Current 12 14 Output High Voltage 610 Maximum Units 16 mA 780 mV 65 mV 10 µA 550 mV Maximum Units 140 MHz 110 ps TABLE 5. AC CHARACTERISTICS, VDD = VDDA = 3.3V±5%, TA = 0°C TO 70°C, RREF = 475Ω Symbol Parameter f Output Frequency tsk(o) Output Skew; NOTE 1, 2 tjit(cc) Cycle-to-Cycle Jitter tjit(Ø) RMS Phase Jitter (Random); NOTE 3 t /t Output Rise/Fall Time odc Output Duty Cycle MAX R F Test Conditions Minimum Typical 50 Outputs @ Different Frequencies 110 ps Outputs @ Same Frequencies 50 ps Integration Range: 1.5MHz - 22MHz 20% to 80% 2.42 ps 300 1100 ps 48 52 % NOTE 1: Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the output differential cross points. NOTE 2: This parameter is defined in accordance with JEDEC Standard 65. NOTE 3: Please refer to the Phase Noise Plot following this section. ©2016 Integrated Device Technology, Inc 4 Revision B March 11, 2016 9DB206 Data Sheet TYPICAL PHASE NOISE AT 100MHZ ➤ 0 -10 -20 PCI Express™ Filter -30 -40 100MHz RMS Phase Jitter (Random) 1.5MHz to 22MHz = 2.42ps (typical) -70 -80 -90 -100 Raw Phase Noise Data -110 -120 ➤ NOISE POWER dBc Hz -50 -60 -130 -140 -150 ➤ -160 -170 -180 Phase Noise Result by adding PCI Express™ Filter to raw data -190 1k 10k 100k 1M 10M 100M OFFSET FREQUENCY (HZ) to the tracking ability of a PLL, it will track the input signal up to its loop bandwidth. Therefore, if the input phase noise is greater than that of the PLL, it will increase the output phase noise performance of the device. It is recommended that the phase noise performance of the input is verified in order to achieve the above phase noise performance. The illustrated phase noise plot was taken using a low phase noise signal generator, the noise floor of the signal generator is less than that of the device under test. Using this configuration allows one to see the true spectral purity or phase noise performance of the PLL in the device under test. Due ©2016 Integrated Device Technology, Inc 5 Revision B March 11, 2016 9DB206 Data Sheet PARAMETER MEASUREMENT INFORMATION 3.3V HCSL OUTPUT LOAD AC TEST CIRCUIT DIFFERENTIAL INPUT LEVEL OUTPUT SKEW CYCLE-TO-CYCLE JITTER OUTPUT RISE/FALL TIME OUTPUT DUTY CYCLE/PULSE WIDTH/PERIOD ©2016 Integrated Device Technology, Inc 6 Revision B March 11, 2016 9DB206 Data Sheet APPLICATION INFORMATION POWER SUPPLY FILTERING TECHNIQUES As in any high speed analog circuitry, the power supply pins are vulnerable to random noise. The 9DB206 provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. VDD and VDDA should be individually connected to the power supply plane through vias, and bypass capacitors should be used for each pin. To achieve optimum jitter performance, power supply isolation is required. Figure 1 illustrates how a 24Ω resistor along with a 10μF and a .01μF bypass capacitor should be connected to each VDDA pin. The 10Ω resistor can also be replaced by a ferrite bead. 3.3V VDD .01μF 24Ω VDDA .01μF 10μF FIGURE 1. POWER SUPPLY FILTERING WIRING THE DIFFERENTIAL INPUT TO ACCEPT SINGLE ENDED LEVELS Figure 2 shows how the differential input can be wired to accept single ended levels. The reference voltage V_REF = VDD/2 is generated by the bias resistors R1, R2 and C1. This bias circuit should be located as close as possible to the input pin. The ratio of R1 and R2 might need to be adjusted to position the V_REF in the center of the input voltage swing. For example, if the input clock swing is only 2.5V and VDD = 3.3V, V_REF should be 1.25V and R2/ R1 = 0.609. FIGURE 2. SINGLE ENDED SIGNAL DRIVING DIFFERENTIAL INPUT ©2016 Integrated Device Technology, Inc 7 Revision B March 11, 2016 9DB206 Data Sheet DIFFERENTIAL CLOCK INPUT INTERFACE The CLK /nCLK accepts LVDS, LVPECL, LVHSTL, SSTL, HCSL and other differential signals. Both VSWING and VOH must meet the VPP and VCMR input requirements. Figures 3A to 3D show interface examples for the HiPerClockS CLK/nCLK input driven by the most common driver types. The input interfaces suggested here are examples only. Please consult with the vendor of the driver component to confirm the driver termination requirements. For example in Figure 3A, the input termination applies for ICS HiPerClockS LVHSTL drivers. If you are using an LVHSTL driver from another vendor, use their termination recommendation. 1.8V 3.3V 3.3V 3.3V Zo = 50 Ohm CLK Zo = 50 Ohm CLK Zo = 50 Ohm nCLK Zo = 50 Ohm nCLK LVHSTL ICS HiPerClockS LVHSTL Driver R1 50 LVPECL HiPerClockS Input R1 50 R2 50 3.3V Zo = 50 Ohm R2 50 R3 50 FIGURE 3A. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY ICS HIPERCLOCKS LVHSTL DRIVER 3.3V HiPerClockS Input R3 125 FIGURE 3B. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY 3.3V LVPECL DRIVER 3.3V 3.3V 3.3V R4 125 Zo = 50 Ohm LVDS_Driv er CLK CLK R1 100 Zo = 50 Ohm nCLK LVPECL R1 84 HiPerClockS Input Zo = 50 Ohm nCLK Receiv er R2 84 FIGURE 3C. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY 3.3V LVPECL DRIVER FIGURE 3D. HIPERCLOCKS CLK/NCLK INPUT DRIVEN BY 3.3V LVDS DRIVER RECOMMENDATIONS FOR UNUSED INPUT AND OUTPUT PINS INPUTS: OUTPUTS: LVCMOS CONTROL PINS: All control pins have internal pull-ups or pull-downs; additional resistance is not required but can be added for additional protection. A 1kW resistor can be used. ©2016 Integrated Device Technology, Inc HCSL OUTPUT All unused HCSL outputs can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated. 8 Revision B March 11, 2016 9DB206 Data Sheet SCHEMATIC EXAMPLE has a slightly better signal integrity, is recommended for all other applications. The schematic below illustrates two different terminations. Both are reliable and adequate. The PCI Express termination is recommended for all PCI Express application. The optional termination, which VCC VCC R11 1K VCC 1K 33 Zo = 50 R20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 FS0 33 R1 50 C11 0.1uF U1 Zo = 50 R19 HCSL R12 R7 VCCA R2 50 nOE0 R13 1K PLL_BW CLK nCLK FS0 PCIEXT0 PCIEXC0 VDD GND PCIEXT1 PCIEXC1 PCIEXT2 PCIEXC2 VDD nOE0 VDDA GNDA IREF FS1 PCIEXT5 PCIEXC5 VDD GND PCIEXT4 PCIEXC4 PCIEXT3 PCIEXC3 VDD nOE1 ICS9DB206 VCC=3.3V 28 27 26 25 24 23 22 21 20 19 18 17 16 15 FS1 24 VCC C16 10uF Zo = 50 + Zo = 50 HCSL nOE1 R10 475 R14 1K R4 50 R15 1K R5 50 Optional Termination (U1-7) VCC C1 0.1uF (U1-16) C2 0.1uF (U1-22) C3 0.1uF Zo = 50 R3 + 33 Zo = 50 R6 - 33 HCSL R17 50 R18 50 PCI Express Termination should be as close the device as possible PCI Express Termination FIGURE 4. EXAMPLE OF 9DB206 SCHEMATIC ©2016 Integrated Device Technology, Inc 9 Revision B March 11, 2016 9DB206 Data Sheet RELIABILITY INFORMATION TABLE 6A. θJAVS. AIR FLOW TABLE FOR 28 LEAD TSSOP PACKAGE θJA by Velocity (Linear Feet per Minute) 0 Single-Layer PCB, JEDEC Standard Test Boards Multi-Layer PCB, JEDEC Standard Test Boards 82.9°C/W 49.8°C/W 200 500 68.7°C/W 43.9°C/W 60.5°C/W 41.2°C/W NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs. TABLE 6B. θJAVS. AIR FLOW TABLE FOR 28 LEAD SSOP PACKAGE θJA by Velocity (Linear Feet per Minute) Multi-Layer PCB, JEDEC Standard Test Boards 0 200 500 49°C/W 36°C/W 30°C/W TRANSISTOR COUNT The transistor count for 9DB206 is: 2471 ©2016 Integrated Device Technology, Inc 10 Revision B March 11, 2016 9DB206 Data Sheet PACKAGE OUTLINE - G SUFFIX FOR 20 LEAD TSSOP PACKAGE OUTLINE - F SUFFIX FOR 20 LEAD SSOP TABLE 7A. PACKAGE DIMENSIONS TABLE 7B. PACKAGE DIMENSIONS SYMBOL Millimeters Millimeters Minimum N Maximum Minimum 20 N A -- 1.20 A1 0.05 0.15 A2 0.80 1.05 b 0.19 0.30 c 0.09 0.20 D 6.40 6.60 E E1 SYMBOL 6.40 BASIC 4.30 e 4.50 0.65 BASIC L 0.45 α aaa Maximum 20 A -- 2.0 A1 0.05 -- A2 1.65 1.85 b 0.22 0.38 c 0.09 0.25 D 6.90 7.50 E 7.40 8.20 E1 5.0 5.60 0.75 e 0° 8° L 0.55 0.95 -- 0.10 α 0° 8° Reference Document: JEDEC Publication 95, MO-153 ©2016 Integrated Device Technology, Inc 0.65 BASIC Reference Document: JEDEC Publication 95, MO-150 11 Revision B March 11, 2016 9DB206 Data Sheet TABLE 8. ORDERING INFORMATION Part/Order Number Marking Package Shipping Packaging Temperature 9DB206CLLF ICS9DB206CLLF 28 Lead “Lead-Free” TSSOP Tube 0°C to 70°C 9DB206CLLFT ICS9DB206CLLF 28 Lead “Lead-Free” TSSOP Tape & Reel 0°C to 70°C 9DB206CFLF ICS9DB206CFLF 28 Lead “Lead-Free” SSOP Tube 0°C to 70°C 9DB206CFLFT ICS9DB206CFLF 28 Lead “Lead-Free” SSOP Tape & Reel 0°C to 70°C ©2016 Integrated Device Technology, Inc 12 Revision B March 11, 2016 9DB206 Data Sheet REVISION HISTORY SHEET Rev Table Page A T7 12 B T4D B T7 T8 1 8 12 T8 12 Features Section - added Input Frequency Range and VCO Range bullets. Added Recommendations for Unused Input and Output Pins. Ordering Information - removed leaded devices. Updated data sheet format. Ordering Information - Deleted LF note below table. Updated header and footer. Product Discontinuation Notice - Last time buy expires September 7, 2016. PDN N-16-02 B B B B Description of Change Date Ordering Information Table - added Lead-Free marking for TSSOP package. 11/29/04 4 HCSL Table -adjusted VOH min from 680mV to 610mV and added VOH max. 12/21/04 12 Ordering Information Table - added Lead-Free marking for SSOP package. 3/21/05 1 ©2016 Integrated Device Technology, Inc 13 7/14/06 7/22/15 2/18/16 3/11/16 Revision B March 11, 2016 Part Number Data Sheet Corporate Headquarters 6024 Silver Creek Valley Road San Jose, CA 95138 USA www.IDT.com Sales 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com/go/sales Tech Support www.idt.com/go/support DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. Copyright ©2016 Integrated Device Technology, Inc. All rights reserved. IMPORTANT NOTICE AND DISCLAIMER RENESAS ELECTRONICS CORPORATION AND ITS SUBSIDIARIES (“RENESAS”) PROVIDES TECHNICAL SPECIFICATIONS AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for developers skilled in the art designing with Renesas products. You are solely responsible for (1) selecting the appropriate products for your application, (2) designing, validating, and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. Renesas grants you permission to use these resources only for development of an application that uses Renesas products. Other reproduction or use of these resources is strictly prohibited. No license is granted to any other Renesas intellectual property or to any third party intellectual property. Renesas disclaims responsibility for, and you will fully indemnify Renesas and its representatives against, any claims, damages, costs, losses, or liabilities arising out of your use of these resources. Renesas' products are provided only subject to Renesas' Terms and Conditions of Sale or other applicable terms agreed to in writing. No use of any Renesas resources expands or otherwise alters any applicable warranties or warranty disclaimers for these products. (Rev.1.0 Mar 2020) Corporate Headquarters Contact Information TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan www.renesas.com For further information on a product, technology, the most up-to-date version of a document, or your nearest sales office, please visit: www.renesas.com/contact/ Trademarks Renesas and the Renesas logo are trademarks of Renesas Electronics Corporation. All trademarks and registered trademarks are the property of their respective owners. © 2020 Renesas Electronics Corporation. All rights reserved.
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