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9P960AFLFT

9P960AFLFT

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    BSSOP48

  • 描述:

    IC CLK BUFF DUAL DDR 48SSOP

  • 数据手册
  • 价格&库存
9P960AFLFT 数据手册
IDT - Integrated Device Technology - DDR Solutions > 9P960 > 9P960AFLF Integrated Device Technology Products | Applications Memory Interface Products | Search DDR Solutions | 9P960 Support Page 1 of 2 The Analog and Digital Company ™ | Investor | About IDT 9P960AFLF 9P960AFLF Description | Parameters | Package | Documents | Distributor Inventory | Contacts Customer Support / Technical Support DESCRIPTION PC BUFFER Recommended Application:: Dual DDR zero delay buffer Product Description/Features: High performance, low jitter zero delay buffer I2C for functional and output control Dual bank 1-6 differential clock distribution 2 separate feedback in & out for input to output synchronization for each bank Supports up to 4 DDR DIMMs Supports up to DDRII - 1066MHz Supports up to DDRIII (1.8V core) - 1333MHz Generic Part: 9P960 Category: DDR Solutions PARAMETERS Temperature C Voltage 1.8 V Package SSOP 48 Speed NA Output Style Core Supply Voltage (VDD) No. of Outputs Min. Output Frequency Min. Input Frequency Output Supply Voltage (VDDO) No. of Inputs Input Style Max. Output Frequency Max. Input Frequency Temp. Grade Multiplication/Divide Value CPU Manufacturer Chipset Yellow Cover Spec. Embedded Suggested - Pkg. Voltage Temp. Range PACKAGE Package SSOP 48 (PVG48) Description SSOP 300 MIL Status Active Class PLASTIC Category Green Pb (Lead) Free Yes Pb Free Category e3 Sn Mark F Package Type SSOP Lead Count 48 Length 15.9 mm Width 7.5 mm Thickness 2.3 mm Pitch 0.64 mm Tube / Tray TUBE Quantity per 30 Tube/Tray Quantity per 1000 Reel Moisture Sensitivity 1 Level (MSL) Moisture Unlimited@ 9P960 > 9P960AFLF Exposure Floor Life Page 2 of 2 RH Peak Reflow 260°C Temperature Rebake Conditions NA Related Package Documents view documents DOCUMENTS Type Misc Product Change Notice Product Delete Notice Title PC Clocks Contact Info PCN# : TB1010-01 Remove Country of Origin from Package Bottom PCN# : A0807-02R1 Copper Bond Wire for SSOP, SOIC and TSSOP PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP PDN# : M-07-01 SELECTED DIMM PRODUCT DISCONTINUANCE NOTICE Size Revision Date 61 KB 05/29/2007 677 KB 11/21/2010 144 KB 01/06/2009 144 KB 07/30/2008 144 KB 07/24/2007 DISTRIBUTOR INVENTORY Part Distributor Qty Date RFQ Order No matches found. CONTACTS Sales Offices Sales Offices and authorized distributors Technical Support Clock Help WWW: Clock Help Copyright © 2011 Integrated Device Technology, Inc. http://www.idt.com/?partID=9P960AFLF | Legal | Careers | Contact Us | myIDT | Press Room 1/25/2011
9P960AFLFT 价格&库存

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9P960AFLFT

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