DATASHEET
ACTS240MS
Rev X.00
Jan 13, 2017
High Reliability, Radiation Hardened Octal Buffer/Line Driver, Three-State
Features
Pinouts
• Devices QML Qualified in Accordance with MIL-PRF-38535
20 PIN CERAMIC DUAL-IN-LINE
MIL-STD-1835 DESIGNATOR CDIP2-T20,
LEAD FINISH C
TOP VIEW
• Detailed Electrical and Screening Requirements are
Contained in SMD# 5962-96717 and Intersil’s QM Plan
• 1.25 Micron Radiation Hardened SOS CMOS
• Total Dose >300K RAD (Si)
• Single Event Upset (SEU) Immunity: 100 MEV-cm
• Dose Rate Upset>1011 RAD (Si)/s, 20ns Pulse
AEN
1
AI1
2
19 BEN
BO4
3
18 AO1
AI2
4
17 BI4
BO3
5
16 AO2
AI3
6
15 BI3
BO2
7
14 AO3
AI4
8
13 BI2
BO1
9
12 AO4
• Dose Rate Survivability>1012 RAD (Si)/s, 20ns Pulse
• Latch-Up Free Under Any Conditions
20 VCC
GND 10
• Military Temperature Range-55oC to +125oC
11 BI1
• Significant Power Reduction Compared to ALSTTL
Logic
20 PIN CERAMIC FLATPACK
MIL-STD-1835 DESIGNATOR CDFP4-F20,
LEAD FINISH C
TOP VIEW
• DC Operating Voltage Range 4.5V to 5.5V
• Input Logic Levels
- VIL = 0.8V Max
- VIH = VCC/2 Min
AEN
1
20
VCC
AI1
2
19
BEN
BO4
3
18
AO1
AI2
4
17
BI4
Description
BO3
5
16
AO2
AI3
6
15
BI3
The Intersil ACTS240MS is a Radiation Hardened High Reliability, High-Speed CMOS/SOS having two active low enable
inputs.
BO2
7
14
AO3
AI4
8
13
BI2
BO1
9
12
AO4
The ACTS240MS utilizes advanced CMOS/SOS technology to
achieve high-speed operation. This device is a member of a
radiation hardened, high-speed, CMOS/SOS Logic Family.
GND
10
11
BI1
• Input Current 1A at VOL, VOH
• Fast Propagation Delay17.5ns (Max), 12ns (Typ)
The ACTS240MS is supplied in a 20 lead Ceramic Flatpack (K
suffix) or a Dual-In-Line Ceramic Package (D suffix).
Ordering Information
PART NUMBER
TEMPERATURE RANGE
SCREENING LEVEL
PACKAGE
5962F9671701VRC
-55oC to +125oC
MIL-PRF-38535 Class V
20 Lead SBDIP
5962F9671701VXC
-55oC to +125oC
MIL-PRF-38535 Class V
20 Lead Ceramic Flatpack
ACTS240D/Sample
25oC
Sample
20 Lead SBDIP
ACTS240K/Sample
25oC
Sample
20 Lead Ceramic Flatpack
ACTS240HMSR
25oC
Die
Die
Rev X.00
Jan 13, 2017
Page 1 of 3
ACTS240MS
ACTS240MS
Functional Diagram
NOTE: (1 of 2)
AE
1(19)
P
AO1
N 18(9)
AI1
2(11)
P
AO2
N 16(7)
AI2
4(13)
P
AO3
N 14(5)
AI3
6(15)
P
AO4
N 12(3)
AI4
8(17)
TRUTH TABLE
INPUTS
OUTPUT
AE, BE
AIn, BIn
AOn, BOn
L
L
H
L
H
L
H
X
Z
NOTE: H = High Voltage Level, L = Low Voltage Level,
X = Immaterial, Z = High Impedance
Rev X.00
Jan 13, 2017
Page 2518783
of 3
Spec Number
ACTS240MS
GLASSIVATION:
Type: SiO2
Thickness: 8kÅ 1kÅ
Die Characteristics
DIE DIMENSIONS:
100 mils x 100 mils
2.54mm x 2.54mm
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
METALLIZATION:
Type: AlSi
Metal 1 Thickness: 7.125kÅ 1.125kÅ
Metal 2 Thickness: 9kÅ 1kÅ
BOND PAD SIZE:
110m x 110m
4.4 mils x 4.4 mils
Metallization Mask Layout
ACTS240MS
AI1
(2)
AEN
(1)
VCC
(20)
VCC
(20)
BEN
(19)
(18) AO1
BO4 (3)
(17) BI4
AI2 (4)
(16) AO2
BO3 (5)
(15) BI3
AI3 (6)
(14) AO3
BO2 (7)
(13) BI2
AI4 (8)
BO1 (9)
AO4 (12)
(10) (10)
GND GND
(11)
BI1
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For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such
modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are
current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its
subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Rev X.00
Jan 13, 2017
Page 3 of 3
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