AT25QF641-SUB-T

AT25QF641 64-Mbit, 2.7V Minimum SPI Serial Flash Memory with Dual I/O, Quad I/O and QPI Support Features Single 2.7V - 3.6V Supply Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) Compatible Supports SPI Modes 0 and 3 Supports Dual Output Read and Quad I/O Program and Read Supports QPI Program and Read 104 MHz* Maximum Operating Frequency Clock-to-Output (tV1) of 6 ns Up tp 52MB/S continuous data transfer rate Quad Enabled (factory default setting: see Section 6-7) Full Chip Erase Flexible, Optimized Erase Architecture for Code and Data Storage Applications 0.6 ms Typical Page Program (256 Bytes) Time 60 ms Typical 4-Kbyte Block Erase Time 350 ms Typical 32-Kbyte Block Erase Time 700 ms Typical 64-Kbyte Block Erase Time Hardware Controlled Locking of Protected Blocks via WP Pin 4K-bit secured One-Time Programmable Security Register Software and Hardware Write Protection Serial Flash Discoverable Parameters (SFDP) Register Flexible Programming Byte/Page Program (1 to 256 Bytes) Dual or Quad Input Byte/Page Program (1 to 256 Bytes) Erase/Program Suspend and Resume JEDEC Standard Manufacturer and Device ID Read Methodology Low Power Dissipation 2µA Deep Power-Down Current (Typical) 10µA Standby current (Typical) 5mA Active Read Current (Typical) Endurance: 100,000 program/erase cycles (4KB, 32KB or 64KB blocks) Data Retention: 20 Years Industrial Temperature Range: -40°C to +85°C Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options 8-lead SOIC (208-mil) 8-pad DFN (6 x 5 x 0.6 mm) Die in Wafer Form DS-25QF641–127E–3/2018 1. Introduction The Adesto® AT25QF641 is a serial interface Flash memory device designed for use in a wide variety of high-volume consumer based applications in which program code is shadowed from Flash memory into embedded or external RAM for execution. The flexible erase architecture of the AT25QF641 is ideal for data storage as well, eliminating the need for additional data storage devices. The erase block sizes of the AT25QF641 have been optimized to meet the needs of today's code and data storage applications. By optimizing the size of the erase blocks, the memory space can be used much more efficiently. Because certain code modules and data storage segments must reside by themselves in their own erase regions, the wasted and unused memory space that occurs with large block erase Flash memory devices can be greatly reduced. This increased memory space efficiency allows additional code routines and data storage segments to be added while still maintaining the same overall device density. SPI clock frequencies of up to 104MHz are supported allowing equivalent clock rates of 208 MHz for Dual Output and 416MHz for Quad Output when using the QPI and Fast Read Dual/Quad I/O instructions.The AT25QF641 array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instructions. Pages can be erased 4KB Block, 32KB Block, 64KB Block or the entire chip. The devices operate on a single 2.7V to 3.6V power supply with current consumption as low as 5 mA active and 3 µA for Deep Power Down. All devices offered in space-saving packages. The device supports JEDEC standard manufacturer and device identification with a 4K-bit Secured OTP. AT25QF641 DS-25QF641–127E–3/2018 2 2. Pinouts and Pin Descriptions The following figures show the available package types. Figure 1-1. 8-SOIC (Top View) CS SO (IO1) WP (IO2) GND 1 2 3 4 8 7 6 5 VCC HOLD OR RESET (IO SCK SI (IO0) During all operations, VCC must be held stable and within the specified valid range: VCC (min) to VCC (max). All of the input and output signals must be held high or low (according to voltages of VIH, VOH, VIL or VOL. Table 1-1. Pin Descriptions Symbol Name and Function CS CHIP SELECT Asserted State Type Low Input - Input - Input/Output When this input signal is high, the device is deselected and serial data output pins are at high impedance. Unless an internal program, erase or write status register cycle is in progress, the device will be in the standby power mode (this is not the deep power down mode). Driving Chip Select (CS) low enables the device, placing it in the active power mode. After power-up, a falling edge on Chip Select (CS) is required prior to the start of any instruction. SCK SERIAL CLOCK This input signal provides the timing for the serial interface. Instructions, addresses, or data present at serial data input are latched on the rising edge of Serial Clock (SCK). Data are shifted out on the falling edge of the Serial Clock (SCK). SI (I/O0) SERIAL INPUT The SI pin is used to shift data into the device. The SI pin is used for all data input including command and address sequences. Data on the SI pin is always latched in on the rising edge of SCK. With the Dual-Output and Quad-Output Read commands, the SI Pin becomes an output pin (I/O0) in conjunction with other pins to allow two or four bits of data on (I/O3-0) to be clocked in on every falling edge of SCK To maintain consistency with the SPI nomenclature, the SI (I/O0) pin is referenced as the SI pin unless specifically addressing the Dual-I/O and QuadI/O modes in which case it is referenced as I/O0. Data present on the SI pin is ignored whenever the device is deselected (CS is deasserted). AT25QF641 DS-25QF641–127E–3/2018 3 Table 1-1. Pin Descriptions (Continued) Symbol Name and Function SO (I/O1) SERIAL OUTPUT Asserted State Type - Input/Output - Input/Output - Input/Output The SO pin is used to shift data out from the device. Data on the SO pin is always clocked out on the falling edge of SCK. With the Dual-Output Read commands, the SO Pin remains an output pin (I/O0) in conjunction with other pins to allow two bits of data on (I/O1-0) to be clocked in on every falling edge of SCK To maintain consistency with the SPI nomenclature, the SO (I/O1) pin is referenced as the SO pin unless specifically addressing the Dual-I/O modes in which case it is referenced as I/O1. The SO pin is in a high-impedance state whenever the device is deselected (CS is deasserted). WP (I/O2) WRITE PROTECT The Write Protect (WP) pin can be used to protect the Status Register against data modification. Used in company with the Status Register's Block Protect (SEC, TB, BP2, BP1 and BP0) bits and Status Register Protect SRP) bits, a portion or the entire memory array can be hardware protected. The WP pin is active low. When the QE bit of Status Register-2 is set for Quad I/O, the WP pin (Hardware Write Protect) function is not available since this pin is used for IO2. See figures 1-1, 1-2, and 1-3 for the pin configuration of Quad I/O and QPI operation. HOLD (I/O3) HOLD The HOLD pin is used to pause a serial sequence of the SPI flash memory without resetting the clocking sequence. To enable the HOLD mode, the CS must be in low state. The HOLD mode effects on with the falling edge of the HOLD signal with CLK being low. The HOLD mode ends on the rising edge of HOLD signal with SCK being low. In other words, HOLD mode can't be entered unless SCK is low at the falling edge of the HOLD signal. And HOLD mode can't be exited unless SCK is low at the rising edge of the HOLD signal. If CS is driven high during a HOLD condition, it resets the internal logic of the device. As long as HOLD signal is low, the memory remains in the HOLD condition. To re-work communication with the device, HOLD must go high, and CS must go low. See Figure 8.10 for HOLD timing. VCC DEVICE POWER SUPPLY: VCC is the supply voltage. It is the single voltage used for all device functions including read, program, and erase. The VCC pin is used to supply the source voltage to the device. Operations at invalid VCC voltages may produce spurious results and should not be attempted. - Power GND GROUND: VSS is the reference for the VCC supply voltage. The ground reference for the power supply. GND should be connected to the system ground. - Power AT25QF641 DS-25QF641–127E–3/2018 4 Block Diagram Figure 2-1 shows a block diagram of the AT25QF641 serial Flash. Figure 2-1. AT25QF641 Block Diagram Control and Protection Logic CS I/O Buffers and Latches SRAM Data Buffer SCK SI (I/O0) SO (I/O1) WP (I/O2) Interface Control And Logic Address Latch 2. Y-Decoder Y-Gating X-Decoder Flash Memory Array HOLD (I/O3) Note: I/O3-0 pin naming convention is used for Dual-I/O and Quad-I/O commands. AT25QF641 DS-25QF641–127E–3/2018 5 Memory Array To provide the greatest flexibility, the memory array of the AT25QF641 can be erased in four levels of granularity including a full chip erase. The size of the erase blocks is optimized for both code and data storage applications, allowing both code and data segments to reside in their own erase regions. The Memory Architecture Diagram illustrates the breakdown of each erase level. Figure 3-1. Memory Architecture Diagram 32KB 32KB 64KB 32KB 32KB 64KB ••• 32KB 32KB 64KB 32KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB Block Address Range 7F F F F F h 7F E F F F h 7F DF F F h 7F CF F F h 7F BF F F h 7F AF F F h 7F 9F F F h 7F 8F F F h 7F 7F F F h 7F 6F F F h 7F 5F F F h 7F 4F F F h 7F 3F F F h 7F 2F F F h 7F 1F F F h 7F 0F F F h 7E F F F F h 7E E F F F h 7E DF F F h 7E CF F F h 7E BF F F h 7E AF F F h 7E 9F F F h 7E 8F F F h 7E 7F F F h 7E 6F F F h 7E 5F F F h 7E 4F F F h 7E 3F F F h 7E 2F F F h 7E 1F F F h 7E 0F F F h – 7F F 000h – 7F E 000h – 7F D000h – 7F C000h – 7F B000h – 7F A000h – 7F 9000h – 7F 8000h – 7F 7000h – 7F 6000h – 7F 5000h – 7F 4000h – 7F 3000h – 7F 2000h – 7F 1000h – 7F 0000h – 7E F 000h – 7E E 000h – 7E D000h – 7E C000h – 7E B000h – 7E A000h – 7E 9000h – 7E 8000h – 7E 7000h – 7E 6000h – 7E 5000h – 7E 4000h – 7E 3000h – 7E 2000h – 7E 1000h – 7E 0000h 00F F F F h 00E F F F h 00DF F F h 00CF F F h 00BF F F h 00AF F F h 009F F F h 008F F F h 007F F F h 006F F F h 005F F F h 004F F F h 003F F F h 002F F F h 001F F F h 000F F F h – 00F 000h – 00E 000h – 00D000h – 00C000h – 00B000h – 00A000h – 009000h – 008000h – 007000h – 006000h – 005000h – 004000h – 003000h – 002000h – 001000h – 000000h ••• 64KB Page Program Detail 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 4KB 1-256 byte 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes Page Address Range 7F F F F F h 7F F E F F h 7F F DF F h 7F F CF F h 7F F BF F h 7F F AF F h 7F F 9F F h 7F F 8F F h 7F F 7F F h 7F F 6F F h 7F F 5F F h 7F F 4F F h 7F F 3F F h 7F F 2F F h 7F F 1F F h 7F F 0F F h 7F E F F F h 7F E E F F h 7F E DF F h 7F E CF F h 7F E BF F h 7F E AF F h 7F E 9F F h 7F E 8F F h – 7F F F 00h – 7F F E 00h – 7F F D00h – 7F F C00h – 7F F B00h – 7F F A00h – 7F F 900h – 7F F 800h – 7F F 700h – 7F F 600h – 7F F 500h – 7F F 400h – 7F F 300h – 7F F 200h – 7F F 100h – 7F F 000h – 7F E F 00h – 7F E E 00h – 7F E D00h – 7F E C00h – 7F E B00h – 7F E A00h – 7F E 900h – 7F E 800h 0017F F h 0016F F h 0015F F h 0014F F h 0013F F h 0012F F h 0011F F h 0010F F h 000F F F h 000E F F h 000DF F h 000CF F h 000BF F h 000AF F h 0009F F h 0008F F h 0007F F h 0006F F h 0005F F h 0004F F h 0003F F h 0002F F h 0001F F h 0000F F h – 001700h – 001600h – 001500h – 001400h – 001300h – 001200h – 001100h – 001000h – 000F 00h – 000E 00h – 000D00h – 000C00h – 000B00h – 000A00h – 000900h – 000800h – 000700h – 000600h – 000500h – 000400h – 000300h – 000200h – 000100h – 000000h ••• Block Erase Detail ••• 3. 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes AT25QF641 DS-25QF641–127E–3/2018 6 4. Device Operation 4.1 Standard SPI Operation The AT25QF641 features a serial peripheral interface on four signals: Serial Clock (SCK). Chip Select (CS), Serial Data Input (SI) and Serial Data Output (SO). Standard SPI instructions use the SI input pin to serially write instructions, addresses or data to the device on the rising edge of SCK. The SO output pin is used to read data or status from the device on the falling edge of SCK. SPI bus operation Modes 0 (0, 0) and 3 (1, 1) are supported. The primary difference between Mode 0 and Mode 3 concerns the normal state of the SCK signal when the SPI bus master is in standby and data is not being transferred to the Serial Flash. For Mode 0 the SCK signal is normally low on the falling and rising edges of CS. For Mode 3 the SCK signal is normally high on the falling and rising edges of CS. 4.2 Dual SPI Operation The AT25QF641 supports Dual SPI operation. This instruction allows data to be transferred to or from the device at two times the rate of the standard SPI. The Dual Read instruction is ideal for quickly downloading code to RAM upon powerup (code-shadowing) or for executing non-speed- critical code directly from the SPI bus (XIP). When using Dual SPI instructions the SI and SO pins become bidirectional I/0 pins; IO0 and IO1. 4.3 Quad SPI Operation The AT25QF641 supports Quad SPI operation. This instruction allows data to be transferred to or from the device at four times the rate of the standard SPI. The Quad Read instruction offers a significant improvement in continuous and random access transfer rates allowing fast code- shadowing to RAM or execution directly from the SPI bus (XIP). When using Quad SPI instruction the SI and SO pins become bidirectional IO0 and IO1, and the WP and HOLD pins become IO2 and IO3 respectively. Quad SPI instructions require the non-volatile Quad Enable bit (QE) in Status Register-2 to be set. 4.4 QPI Operation The AT25QF641 supports Quad Peripheral Interface (QPI) operation when the device is switched from Standard/ Dual/ Quad SPI mode to QPI mode using the “Enable QPI (38h)” instruction. To enable QPI mode, the non-volatile Quad Enable bit (QE) in Status Register-2 is required to be set. When using QPI instructions, the SI and SO pins become bidirectional IO0 and IO1, and the WP and HOLD pins become IO2 and IO3 respectively. The typical SPI protocol requires that the byte-long instruction code being shifted into the device only via SI pin in eight serial clocks. The QPI mode utilizes all four IO pins to input the instruction code, thus only two serial clocks are required. This can significantly reduce the SPI instruction overhead and improve system performance in an XIP environment. Standard/ Dual/ Quad SPI mode and QPI mode are exclusive. Only one mode can be active at any given time, “Enable QPI” and “Disable QPI/ Disable QPI 2” instructions are used to switch between these two modes. Upon power-up or after software reset using “Reset (99h) instruction, the default state of the device is Standard/ Dual/ Quad SPI mode. AT25QF641 DS-25QF641–127E–3/2018 7 5. Write Protection To protect inadvertent writes by the possible noise, several means of protection are applied to the Flash memory. 5.1 Write Protect Features While Power-on reset, all operations are disabled and no instruction is recognized. An internal time delay of tPUW can protect the data against inadvertent changes while the power supply is outside the operating specification. This includes the Write Enable, Page program, Block Erase, Chip Erase, Write Security Register and the Write Status Register instructions. For data changes, Write Enable instruction must be issued to set the Write Enable Latch (WEL) bit to “0”. Powerup, Completion of Write Disable, Write Status Register, Page program, Block Erase and Chip Erase are subjected to this condition. Status Register protect (SRP) and Block protect (SEC, TB, BP2, BP1, and BP0) bits may be used to configure a portion of the memory as read-only (software protection). The Write Protect (WP) pin can be used to change the Status Register (hardware control). The Deep Power Down mode provides extra software protection from unexpected data changes as all instructions are ignored under this status except for Release Deep Power Down instruction. AT25QF641 DS-25QF641–127E–3/2018 8 6. Status Registers The Read Status Register instruction can be used to provide status on the availability of the Flash memory array, if the device is write enabled or disabled the state of write protection and the Quad SPI setting. The Write Status Register instruction can be used to configure the devices writes protection features and Quad SPI setting. Write access to the Status Register is controlled by in some cases of the WP pin. Table 6-1. Status Register 1 S7 S6 S5 S4 S3 S2 S1 S0 SRP0 SEC TB BP2 BP1 BP0 WEL BUSY Block Protect 1 (NonVolatile) Block Protect 0 (NonVolatile) Write Enable Latch Erase or Write in Progress Status Sector Protect Top/Bottom Block Protect Register (Non- Volatile) Write Protect 2 (NonProtect 0 (Non- Volatile) Volatile) (Non- Volatile) Table 6-2. S15 S14 S13 S12 S11 S10 S9 S8 SUS CMP (R) (R) (R) (R) QE SRP1 Suspend Complement Protect (NonVolatile) Reserved Reserved Reserved Reserved Quad Enable (Non- Volatile) Status Register Protect 1 (Non- Volatile) Status 6.1 Status Register 2 Busy BUSY is a read only bit in the status register (S0) that is set to a 1 state when the device is executing a Page Program, Erase, Write Status Register or Write Security Register instruction. During this time the device will ignore further instruction except for the Read Status Register and Erase / Program Suspend instruction (see tW, tPP, tSE, tBE1, tBE2 and tCE in Section , ). When the Program, Erase, Write Status Register or Write Security Register instruction has completed, the BUSY bit will be cleared to a 0 state indicating the device is ready for further instructions. 6.2 Write Enable Latch (WEL) Write Enable Latch (WEL) is a read only bit in the status register (S1) that is set to a 1 after executing a Write Enable instruction. The WEL status bit is cleared to a 0 when device is write disabled. A write disable state occurs upon power-up or after any of the following instructions: Write Disable, Page Program, Erase and Write Status Register. 6.3 Block Protect Bits (BP2, BP1, BP0) The Block Protect Bits (BP2, BP1, BP0) are non-volatile read/write bits in the status register (S4, S3, and S2) that provide write protection control and status. Block protect bits can be set using the Write Status Register Instruction (see tW in Section , ). All, none or a portion of the memory array can be protected from Program and Erase instructions (see Status Register Memory Protection table). The factory default setting for the Block Protection Bits is 0, none of the array protected. 6.4 Top/Bottom Block protect (TB) The Top/Bottom bit (TB) is non-volatile bits in the status register (S5) that controls if the Block Protect Bits (BP2, BP1, BP0) protect from the Top (TB = 0) or the Bottom (TB = 1) of the array as shown in the Status Register Memory Protection table. The factory default setting is TB = 0. The TB bit can be set with the Write Status Register Instruction depending on the state of the SRP0, SRP1 and WEL bits. AT25QF641 DS-25QF641–127E–3/2018 9 6.5 Sector/Block Protect (SEC) The Sector protect bit (SEC) is non-volatile bits in the status register (S6) that controls if the Block Protect Bits (BP2, BP1, BP0) protect 4KB Sectors (SEC = 1)or 64KB Blocks (SEC = 0) in the Top (TB = 0) or the Bottom (TB = 1) of the array as shown in the Status Register Memory protection table. The default setting is SEC = 0. 6.6 Status Register Protect (SRP1, SRP0) The Status Register Protect bits (SRP1 and SRP0) are non-volatile read/write bits in the status register (S8 and S7). The SRP bits control the method of write protection: software protection, hardware protection, power supply lock-down or one time programmable (OTP) protection. Table 6-3. Status Register Protect Field Encoding SRP1 SRP0 WP 0 0 X Status Register Software Protection 0 1 0 Hardware Protected 0 1 1 Hardware Unprotected 1 1 0 1 X Description WP pin no control. The register can be written to and is not affected by the state of the WP pin. When WP pin is low the Status Register locked and cannot be written to. When WP pin is high the Status register is unlocked and can be written to after a Write Enable instruction, WEL=1 Lock-Down Status Register is protected and cannot be written to again until the next power down, power-up cycle(1) One Time Status Register is permanently protected and cannot be written to. Power Supply X Program Note: 1. When SRP1, SRP0 = (1,0), a power down, the power-up cycle changes SRP1, SRP0 to (0,0) state. 6.7 Quad Enable (QE) The Quad Enable (QE) bit is a non-volatile read/write bit in the status register (S9) that allows Quad operation. When the QE pin is set to a 1 (factory default setting) the Quad IO2 and IO3 pins are enabled. WARNING: The QE bit should never be set to a 1 during standard SPI or Dual SPI operation if the WP or HOLD pins are tied directly to the power supply or ground. 6.8 Complement Protect (CMP) The Complement Protect bit (CMP) is a non-volatile read/write bit in the status register (S14). It is used in conjunction with SEC, TB, BP2, BP1 and BP0 bits to provide more flexibility for the array protection. Once CMP is set to 1, previous array protection set by SEC, TB, BP2, BP1 and BP0 is reversed. For instance, when CMP = 0, a top 4KB sector can be protected while the rest of the array is not; when CMP = 1, the top 4KB sector will become unprotected while the rest of the array become read-only. Please refer to the Status Register Memory Protection table for details. The default setting is CMP = 0. 6.9 Erase/Program Suspend Status (SUS) The Suspend Status bit (SUS) is a read only bit in the status register (S15) that is set to 1 after executing an Erase/Program Suspend (75h) instruction. The SUS status bit is cleared to 0 by Erase/Program Resume (7Ah) instruction as well as a power down, power-up cycle. AT25QF641 DS-25QF641–127E–3/2018 10 Table 6-4. Status Register Memory Protection (CMP = 0) Status Register Memory Protection SEC TB BP2 BP1 BP0 Block(s) Addresses Density Portion X X 0 0 0 NONE NONE NONE NONE 0 0 0 0 1 126 and 127 7E0000h-7FFFFFh 128KB Upper 1/64 0 0 0 1 0 124 thru 127 7C0000h-7FFFFFh 256KB Upper 1/32 0 0 0 1 1 120 thru 127 780000h-7FFFFFh 512KB Upper 1/16 0 0 1 0 0 112 thru 127 700000h-7FFFFFh 1MB Upper 1/8 0 0 1 0 1 96 thru 127 600000h-7FFFFFh 2MB Upper 1/4 0 0 1 1 0 64 thru 127 400000h-7FFFFFh 4MB Upper 1/2 0 1 0 0 1 0 and 1 000000h-01FFFFh 128KB Lower 1/64 0 1 0 1 0 0 thru 3 000000h-03FFFFh 256KB Lower 1/32 0 1 0 1 1 0 thru 7 000000h-07FFFFh 512KB Lower 1/16 0 1 1 0 0 0 thru 15 000000h-0FFFFFh 1MB Lower 1/8 0 1 1 0 1 0 thru 31 000000h-1FFFFFh 2MB Lower 1/4 0 1 1 1 0 0 thru 63 000000h-3FFFFFh 4MB Lower 1/2 X X 1 1 1 0 thru 127 000000h-7FFFFFh 8MB ALL 1 0 0 0 1 127 7FF000h-7FFFFFh 4KB U – 1/2048 1 0 0 1 0 127 7FE000h-7FFFFFh 8KB U – 1/1024 1 0 0 1 1 127 7FC000h-7FFFFFh 16KB U – 1/512 1 0 1 0 X 127 7F8000h-7FFFFFh 32KB U – 1/256 1 1 0 0 1 0 000000h-000FFFh 4KB L – 1/2048 1 1 0 1 0 0 000000h-001FFFh 8KB L – 1/1024 1 1 0 1 1 0 000000h-003FFFh 16KB L – 1/512 1 1 1 0 X 0 000000h-007FFFh 32KB L – 1/256 Note: 1. X = Don’t care 2. L = Lower; U = Upper 3. If any Erase or Program instruction specifies a memory region that contains protected data portion, this instruction will be ignored. Table 6-5. Status Register Memory Protection (CMP = 1) Status Register Memory Protection SEC TB BP2 BP1 BP0 Block(s) Addresses Density Portion X X 0 0 0 0 thru 127 000000h - 7FFFFFh 8MB ALL 0 0 0 0 1 0 thru 125 000000h – 7DFFFFh 8,064KB Lower 63/64 0 0 0 1 0 0 thru 123 000000h – 7BFFFFh 7,936KB Lower 31/32 0 0 0 1 1 0 thru 119 000000h – 77FFFFh 7,680KB Lower 15/16 AT25QF641 DS-25QF641–127E–3/2018 11 Table 6-5. Status Register Memory Protection (CMP = 1) (Continued) Status Register Memory Protection SEC TB BP2 BP1 BP0 Block(s) Addresses Density Portion 0 0 1 0 0 0 thru 111 000000h – 6FFFFFh 7,168KB Lower 7/8 0 0 1 0 1 0 thru 95 000000h – 5FFFFFh 6MB Lower 3/4 0 0 1 1 0 0 thru 63 000000h – 3FFFFFh 4MB Lower 1/2 0 1 0 0 1 2 thru 127 020000h - 7FFFFFh 8,064KB Upper 63/64 0 1 0 1 0 4 and 127 040000h - 7FFFFFh 7,936KB Upper 31/32 0 1 0 1 1 8 thru 127 080000h - 7FFFFFh 7,680KB Upper 15/16 0 1 1 0 0 16 thru 127 100000h - 7FFFFFh 7,168KB Upper 7/8 0 1 1 0 1 32 thru 127 200000h - 7FFFFFh 6MB Upper 3/4 0 1 1 1 0 64 thru 127 400000h - 7FFFFFh 4MB Upper 1/2 X X 1 1 1 NONE NONE NONE NONE 1 0 0 0 1 0 thru 127 000000h - 7FEFFFh 8,188KB L – 2047/2048 1 0 0 1 0 0 thru 127 000000h - 7FDFFFh 8,184KB L – 1023/1024 1 0 0 1 1 0 thru 127 000000h - 7FBFFFh 8,176KB L – 511/512 1 0 1 0 X 0 thru 127 000000h - 7F7FFFh 8,160KB L – 255/256 1 1 0 0 1 0 thru 127 001000h - 7FFFFFh 8,188KB U – 2047/2048 1 1 0 1 0 0 thru 127 002000h - 7FFFFFh 8,184KB U – 1023/1024 1 1 0 1 1 0 thru 127 004000h - 7FFFFFh 8,176KB U – 511/512 1 1 1 0 X 0 thru 127 008000h - 7FFFFFh 8,160KB U – 255/256 Notes: 1. X = don’t care 2. L = Lower; U = Upper 3. If any Erase or Program instruction specifies a memory region that contains protected data portion, this instruction will be ignored. AT25QF641 DS-25QF641–127E–3/2018 12 7. Instructions The SPI instruction set of the AT25QF641 consists of thirty eight basic instructions and the QPI instruction set of the AT25QF641 consists of thirty one basic instructions that are fully controlled through the SPI bus (see Instruction Set table). Instructions are initiated with the falling edge of Chip Select (CS). The first byte of data clocked into the input pins (SI or IO [3:0]) provides the instruction code. Data on the SI input is sampled on the rising edge of clock with most significant bit (MSB) first. Instructions are completed with the rising edge of edge CS. Clock relative timing diagrams for each instruction are included in figures 8-1 through 8-66 All read instructions can be completed after any clocked bit. However, all instructions that Write, Program or Erase must complete on a byte (CS driven high after a full 8-bit have been clocked) otherwise the instruction will be terminated. This feature further protects the device from inadvertent writes. Additionally, while the memory is being programmed or erased, or when the Status Register is being written, all instructions except for Read Register will be ignored until the program or erase cycle has completed. Table 7-1. 7.1 Manufacturer and Device Identification ID Type Name ID Code Instruction(s) Manufacturer ID Adesto 1Fh 90h, 92h, 94h, 9Fh Device ID AT25QF641 16h 90h, 92h, 94h, ABh Memory Type ID SPI / QPI 32h 9Fh Capacity Type ID 64M 17h 9Fh Instruction Set Tables Table 7-2. Instruction Set Table 1 (SPI instruction)(1) Instruction Name Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 (Clock Number) (0 – 7) (8 - 15) (16 - 23) (24 - 31) (32 - 39) (40 - 47) Write Enable 06h Write Enable 50h Write Disable 04h Read Status Register 1 05h (SR7-SR0)(2) Read Status Register 2 35h (SR15-SR8)(2) Write Status Register 1 01h (SR7-SR0) Write Status Register 2 31h (SR15-SR8) Read Data 03h A23-A16 A15-A8 A7-A0 (D7-D0) Fast Read Data 0Bh A23-A16 A15-A8 A7-A0 dummy Page Program 02h A23-A16 A15-A8 A7-A0 (D7-D0)(3) Enable QPI 38h Block Erase (4KB) 20h A23-A16 A15-A8 A7-A0 Block Erase (32KB) 52h A23-A16 A15-A8 A7-A0 Block Erase(64KB) D8h A23-A16 A15-A8 A7-A0 (SR15-SR8) (D7-D0) AT25QF641 DS-25QF641–127E–3/2018 13 Instruction Set Table 1 (SPI instruction)(1) (Continued) Table 7-2. Instruction Name Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 (Clock Number) (0 – 7) (8 - 15) (16 - 23) (24 - 31) (32 - 39) (40 - 47) Chip Erase 60h/C7h Erase/Program 75h Suspend Erase/Program 7Ah Resume Deep Power Down B9h Release Deep power ABh dummy dummy dummy (ID7-ID0)(2) 90h 00h 00h 00h or 01h (MID7- down/ Device ID(4) Read Manufacturer/ Device ID (4) (DID7-DID0) MID0) Read JEDEC ID 9Fh Reset Enable 66h Reset 99h Enter Secured OTP B1h Exit Secured OTP C1h Read 2Bh (MID7-MID0) (D7-D0) (D7-D0) A15-A8 A7-A0 dummy (D7-D0) (SC7-SC0) (10) Security Register 2Fh Write Security Register Read Serial Flash 5Ah A23-A16 Discovery Parameter Table 7-3. Instruction Set Table 2 (Dual SPI Instruction) Instruction Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 (Clock Number) (0 – 7) (8 - 15) (16 - 23) (24 - 31) (32 - 39) (40 - 47) Fast Read Dual Output 3Bh A23-A16 A15-A8 A7-A0 dummy (D7-D0)(6) Fast Read Dual I/O BBh A23-A8(5) A7-A0, (D7-D0, T)(6) Read Dual Manufacturer/ 92h 0000h (00h, xxxx) or (MID7-MID0) (01h, xxxx) (DID7-DID0)(6) Device ID (4) AT25QF641 DS-25QF641–127E–3/2018 14 Table 7-4. Instruction Set Table 3 (Quad SPI Instruction) Instruction Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 (Clock Number) (0 – 7) (8 - 15) (16 - 23) (24 - 31) (32 - 39) (40 - 47) Fast Read Quad Output 6Bh A23-A16 Fast Read Quad I/O EBh A23-A0, M7-M0(7) Quad Page Program 33h A23-A0 (D7-D0, T)(8) Read Quad 94h Manufacturer /Device ID(4) (00_0000h, xx) or (00_0001h, xx) Word Read Quad I/O E7h A23-A0, M7-M0(7) Set Burst with Wrap 77h xxxxxx, W6W4(7) Table 7-5. A15-A8 A7-A0 (xxx, D7-D0,T)(9) (D7-D0) (8) dummy (D7-D0, T)(8) (xxxx, MID7-MID0) (xxxx, DID7-DID0)(9) (xx, D7-D0..) (D7-D0)(8) Instruction Set Table 4 (QPI instruction) Instruction (Clock Number) Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7 Byte 8 Byte 9 (0 – 1) (2 - 3) (4 - 5) (6 - 7) (8 - 9) (10 - 11) (12 - 13) (14 - 15) (16 - 17) Write Enable 06h Write Enable for Volatile 50h Write Disable 04h Read Status Register-1 05h (SR7SR0) (2) Read Status Register-2 35h (SR15SR8)(2) Write Status Register-1(5) Write Status Register-2 01h 31h (SR7- (SR15- SR0) SR8) (SR15SR8) Fast Read >80MHz Data >104MHz 0Bh A23-A16 A15-A8 A7-A0 dummy dummy (D7-D0) A23-A16 A15-A8 A7-A0 dummy dummy dummy (D7D0) Page Program 02h A23-A16 A15-A8 A7-A0 Block Erase(4KB) 20h A23-A16 A15-A8 A7-A0 Block Erase(32KB) 52h A23-A16 A15-A8 A7-A0 Block Erase(64KB) D8h A23-A16 A15-A8 A7-A0 Chip Erase Erase/Program Suspend (D7-D0)(3) 60h/C7h 75h AT25QF641 DS-25QF641–127E–3/2018 15 Table 7-5. Instruction Set Table 4 (QPI instruction) Instruction (Clock Number) Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7 Byte 8 Byte 9 (0 – 1) (2 - 3) (4 - 5) (6 - 7) (8 - 9) (10 - 11) (12 - 13) (14 - 15) (16 - 17) 00h 00h 00h or (MID7- (DID7- 01h MID0) DID0) Erase/Program Resume 7Ah Deep Power Down B9h Release Deep Power ABh Read Manufacturer/Device ID(4) Read JEDEC ID(4) 90h 9Fh Enter Security B1h Exit Security C1h Read Security Register 2Bh (MID7-MID0) Manufacturer (D7-D0) Memory Type (D7-D0) Capacity Type A23-A16 A15-A8 A7-A0 (M7-M0) dummy (D7-D0) A23-A16 A15-A8 A7-A0 (M7- dummy dummy (SC7-SC0) (10) Write Security Register 2Fh Fast Read Quad I/O EBh >80MHz >104MHz M0) Reset Enable 66h Reset 99h Disable QPI FFh Burst Read >80MHz with Wrap >104MHz 0Ch Set Read Parameter C0h P7-P0 Quad Page Program 33h A23-A16 Notes: 1. on the 2. 3. 4. 5. 6. 7. (D7D0) A23-A16 A15-A8 A7-A0 dummy dummy (D7-D0) A23-A16 A15-A8 A7-A0 dummy dummy dummy A15-A8 A7-A0 (D7-D0) (D7 - D0) Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “()” indicate data being read from the device IO pin. SR = status register, The Status Register contents and Device ID will repeat continuously until CS terminates the instruction. At least one byte of data input is required for Page Program, Quad Page Program and Program Security Register, up to 256 bytes of data input. If more than 256 bytes of data are sent to the device, the addressing will wrap to the beginning of the page and overwrite previously sent data. See Manufacturer and Device Identification table for Device ID information. Dual Input Address IO0 = A22, A20, A18, A16, A14, A12, A10, A8, A6, A4, A2, A0, M6, M4, M2, M0 IO1 = A23, A21, A19, A17, A15, A13, A11, A9, A7, A5, A3, A1, M7, M5, M3, M1 Dual Output data IO0 = (D6, D4, D2, D0) IO1 = (D7, D5, D3, D1) Quad Input Address Set Burst with Wrap Input IO0 = A20, A16, A12, A8, A4, A0, M4, M0 IO1 = A21, A17, A13, A9, A5, A1, M5, M1 IO2 = A22, A18, A14, A10, A6, A2, M6, M2 IO0 = x, x, x, x, x, x, W4, IO1 = x, x, x, x, x, x, W5, IO2 = x, x, x, x, x, x, W6, x x x AT25QF641 DS-25QF641–127E–3/2018 16 IO3 = A23, A19, A15, A11, A7, A3, M7, M3 7.2 8. Quad Input/ Output Data IO0 = (D4, D0T) IO1 = (D5, D1T) IO2 = (D6, D2T) IO3 = (D7, D3T) 9. Fast Read Quad I/O Data Output IO0 = (x, x, x, x, D4, D0T) IO1 = (x, x, x, x, D5, D1T) IO2 = (x, x, x, x, D6, D2T) IO3 = (x, x, x, x, D7, D3T) 10. SC = security register IO3 = x, x, x, x, x, x, x x Write Enable (06h) Write Enable instruction is for setting the Write Enable Latch (WEL) bit in the Status Register. The WEL bit must be set prior to every Program, Erase and Write Status Register instruction. To enter the Write Enable instruction, CS goes low prior to the instruction “06h” into Data Input (SI) pin on the rising edge of SCK, and then driving CS high. Figure 7-1. Write Enable Instruction for SPI Mode (left) and QPI Mode (right) 7.3 Write Enable for Volatile Status Register (50h) This gives more flexibility to change the system configuration and memory protection schemes quickly without waiting for the typical non-volatile bit write cycles or affecting the endurance of the Status Register non-volatile bits. To write the volatile values into the Status Register bits, the Write Enable for Volatile Status Register (50h) instruction must be issued prior to a Write Status Register (01h) instruction. Write Enable for Volatile Status Register instruction (Figure 7-2) will not set the Write Enable Latch (WEL) bit. Once Write Enable for Volatile Status Register is set, a Write Enable instruction should not have been issued prior to setting Write Status Register instruction (01h or 31h). AT25QF641 DS-25QF641–127E–3/2018 17 Figure 7-2. Write Enable for Volatile Status Register Instruction for SPI Mode (left) and QPI Mode (right) 7.4 Write Disable (04h) The Write Disable instruction is to reset the Write Enable Latch (WEL) bit in the Status Register. To enter the Write Disable instruction, CS goes low prior to the instruction “04h” into Data Input (SI) pin on the rising edge of SCK, and then driving CS high. WEL bit is automatically reset write- disable status of “0” after Power-up and upon completion of the every Program, Erase and Write Status Register instructions. Figure 7-3. Write Disable Instruction for SPI Mode (left) and QPI Mode (right) 7.5 Read Status Register-1 (05h) and Read Status Register-2 (35h) The Read Status Register instructions are to read the Status Register. The Read Status Register can be read at any time (even in program/erase/write Status Register and Write Security Register condition). It is recommended to check the BUSY bit before sending a new instruction when a Program, Erase, Write Status Register or Write Status Register operation is in progress. AT25QF641 DS-25QF641–127E–3/2018 18 The instruction is entered by driving CS low and sending the instruction code “05h” for Status Register-1 or “35h” for Status Register-2 into the SI pin on the rising edge of SCK. The status register bits are then shifted out on the SO pin at the falling edge of SCK with most significant bit (MSB) first as shown in (Figure 7-4 and Figure 7-5). The Status Register can be read continuously. The instruction is completed by driving CS high. Figure 7-4. Read Status Register Instruction (SPI Mode) Figure 7-5. Read Status Register Instruction (QPI Mode) 7.6 Write Status Register (01h - See Errata) The Write Status Register instruction is to write only non-volatile Status Register-1 bits (SRP0, SEC, TB, BP2, BP1 and BP0) and Status Register-2 bits (CMP, QE and SRP1). All other Status Register bit locations are read-only and will not be affected by the Write Status Register instruction. A Write Enable instruction must previously have been issued prior to setting Write Status Register Instruction (Status Register bit WEL must equal 1). Once write is enabled, the instruction is entered by driving CS low, sending the instruction code, and then writing the status register data byte as illustrated in Figure 7-6 and Figure 7-7. The CS pin must be driven high after the eighth or sixteenth bit of data that is clocked in. If this is not done the Write Status Register instruction will not be executed. After CS is driven high, the self- timed Write Status Register cycle commences for a time duration of tW (refer to Section , ). While the Write Status Register cycle is in progress, the Read Status Register instruction may still be accessed to check the status of the BUSY bit. The BUSY bit is a 1 during the Write Status Register cycle and a 0 when the AT25QF641 DS-25QF641–127E–3/2018 19 cycle is finished and ready to accept other instructions again. When the BUSY bit is asserted, the Write Enable Latch (WEL) bit in Status Register will be cleared to 0. Figure 7-6. Write Status Register Instruction (SPI Mode) Figure 7-7. Write Status Register Instruction (QPI Mode) 7.7 Write Status Register-2 (31h) The Write Status Register-2 instruction is to write only non-volatile Status Register-2 bits (CMP, QE and SRP1). A Write Enable instruction must previously have been issued prior to setting Write Status Register Instruction (Status Register bit WEL must equal 1). Once write is enabled, the instruction is entered by driving CS low, sending the instruction code, and then writing the status register data byte as illustrated in Figure 7-8 and Figure 7-9. Using Write Status Register-2 (31h) instruction, software can individually access each one-byte status registers via different instructions. AT25QF641 DS-25QF641–127E–3/2018 20 Figure 7-8. Write Status Register-2 Instruction (SPI Mode) Figure 7-9. Write Status Register-2 Instruction (QPI Mode) 7.8 Read Data (03h) The Read Data instruction is to read data out from the device. The instruction is initiated by driving the CS pin low and then sending the instruction code “03h” with following a 24-bit address (A23- A0) into the SI pin. After the address is received, the data byte of the addressed memory location will be shifted out on the SO pin at the falling edge of SCK with most significant bit (MSB) first. The address is automatically incremented to the next higher address after byte of data is shifted out allowing for a continuous stream of data. This means that the entire memory can be accessed with a single instruction as long as the clock continues. The instruction is completed by driving CS high. The Read Data instruction sequence is shown in Figure 7-10. If a Read Data instruction is issued while an Erase, Program or Write Status Register cycle is in process (BUSY = 1) the instruction is ignored and will not have any effects on the current cycle. The Read Data instruction allows clock rates from D.C to a maximum of fR (see Section , ). AT25QF641 DS-25QF641–127E–3/2018 21 Figure 7-10. Read Data Instruction 7.9 Fast Read (0Bh) The Fast Read instruction is high speed reading mode that it can operate at the highest possible frequency of fR. The address is latched on the rising edge of the SCK. After the 24-bit address, this is accomplished by adding “dummy” clocks as shown in Figure 7-11. The dummy clocks means the internal circuits require time to set up the initial address. During the dummy clocks, the data value on the SO pin is a “don’t care”. Data of each bit shifts out on the falling edge of SCK. Figure 7-11. Fast Read Instruction (SPI Mode) 7.10 Fast Read in QPI Mode When QPI mode is enabled, the number of dummy clock is configured by the “Set Read Parameters (C0h)” instruction to accommodate wide range applications with different needs for either maximum Fast Read frequency or minimum data access latency. Depending on the Read Parameter Bit P[4] and P[5] setting, the number of dummy clocks can be configured as either 4, or 6 or 8. The default number of dummy clocks upon power up or after a Reset instruction is 4. (Please refer to Figure 7-12 and Figure 7-13). AT25QF641 DS-25QF641–127E–3/2018 22 Figure 7-12. Fast Read instruction (QPI Mode, 80MHz) Figure 7-13. Fast Read instruction (QPI Mode, 104MHz) 7.11 Fast Read Dual Output (3Bh) By using two pins (IO0 and IO1, instead of just IO0), The Fast Read Dual Output instruction allows data to be transferred from the AT25QF641 at twice the rate of standard SPI devices. The Fast Read Dual Output instruction is ideal for quickly downloading code from Flash to RAM upon power-up or for application that cache code-segments to RAM for execution. The Fast Read Dual Output instruction can operate at the highest possible frequency of F R (see Section , ). After the 24-bit address, this is accomplished by adding eight “dummy” clocks as shown in Figure 7-14. The dummy clocks allow the internal circuits additional time for setting up the initial address. During the dummy clocks, the data value on the SO pin is a “don’t care”. However, the IO0 pin should be high-impedance prior to the falling edge of the first data out clock. AT25QF641 DS-25QF641–127E–3/2018 23 Figure 7-14. Fast Read Dual Output instruction (SPI Mode) 7.12 Fast Read Quad Output (6Bh) By using four pins (IO0, IO1, IO2, and IO3), The Fast Read Quad Output instruction allows data to be transferred from the AT25QF641 at four times the rate of standard SPI devices. A Quad enable of Status Register-2 must be executed before the device will accept the Fast Read Quad Output instruction (Status Register bit QE must equal 1). The Fast Read Quad Output instruction can operate at the highest possible frequency of F R (see Section , ). This is accomplished by adding eight “dummy” clocks after the 24- bit address as shown in Figure 7-15. The dummy clocks allow the internal circuits additional time for setting up the initial address. During the dummy clocks, the data value on the SO pin is a “don’t care”. However, the IO0 pin should be high-impedance prior to the falling edge of the first data out clock. AT25QF641 DS-25QF641–127E–3/2018 24 Figure 7-15. Fast Read Quad Output instruction (SPI Mode) 7.13 Fast Read Dual I/O (BBh) The Fast Read Dual I/O instruction reduces cycle overhead through double access using two IO pins: IO0 and IO1. Continuous read mode The Fast Read Dual I/O instruction can further reduce cycle overhead through setting the Mode bits (M7-0) after the input Address bits (A23-0). The upper nibble of the Mode (M7-4) controls the length of the next Fast Read Dual I/O instruction through the inclusion or exclusion of the first byte instruction code. The lower nibble bits of the Mode (M3-0) are don’t care (“X”), However, the IO pins should be high-impedance prior to the falling edge of the first data out clock. If the Mode bits (M7-0) equal “Ax” hex, then the next Fast Dual I/O instruction (after CS is raised and then lowered) does not require the instruction (BBh) code, as shown in Figure 7-16 and Figure 7-17. This reduces the instruction sequence by eight clocks and allows the address to be immediately entered after CS is asserted low. If Mode bits (M7-0) are any value other “Ax” hex, the next instruction (after CS is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. A Mode Bit Reset can be used to reset Mode Bits (M7-0) before issuing normal instructions. AT25QF641 DS-25QF641–127E–3/2018 25 Figure 7-16. Fast Read Dual I/O Instruction (initial instruction or previous M7-0 ≠ Axh) Figure 7-17. Fast Read Dual I/O Instruction (previous M7-0= Axh) AT25QF641 DS-25QF641–127E–3/2018 26 7.14 Fast Read Quad I/O (EBh) The Fast Read Quad I/O instruction reduces cycle overhead through quad access using four IO pins: IO0, IO1, IO2, and IO3. The Quad Enable bit (QE) of Status Register-2 must be set to enable the Fast read Quad I/O Instruction. Continuous read mode The Fast Read Quad I/O instruction can further reduce instruction overhead through setting the Mode bits (M7-0) with following the input Address bits (A23-0), as shown in Figure 7-18. The upper nibble of the Mode (M7-4) controls the length of the next Fast Read Quad I/O instruction through the inclusion or exclusion of the first byte instruction code. The lower nibble bits of the Mode (M3-0) are don’t care (“X”). However, the IO pins should be high-impedance prior to the falling edge of the first data out clock. If the Mode bits (M7-0) equal “Ax” hex, then the next Fast Read Quad I/O instruction (after CS is raised and then lowered) does not require the EBh instruction code, as shown in Figure 7-19. This reduces the instruction sequence by eight clocks and allows the address to be immediately entered after CS is asserted low. If the Mode bits (M7-0) are any value other than “Ax” hex, the next instruction (after CS is raised and then lowered) requires the first byte instruction code, thus retuning normal operation. A Mode Bit Reset can be used to reset Mode Bits (M7-0) before issuing normal instructions. Figure 7-18. Fast Read Quad I/O Instruction (Initial instruction or previous M7-0 ≠ Axh, SPI mode) AT25QF641 DS-25QF641–127E–3/2018 27 Figure 7-19. Fast Read Quad I/O Instruction (previous M7-0 = Axh, SPI mode) Wrap Around in SPI Mode The Fast Read Quad I/O instruction can also be used to access specific portion within a page by issuing a “Set Burst with Wrap” (77h) instruction prior Fast Read Quad I/O (EBh) instruction. The “Set Burst with Wrap” (77h) instruction can either enable or disable the “Wrap Around” feature for the following Fast Read Quad I/O instruction. When “Wrap Around” is enabled, the data being accessed can be limited to an 8/16/32/64-byte section of a 256-byte page. The output data starts at the initial address specified in the instruction, once it reaches the ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary automatically until CS is pulled high to terminate the instruction. The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read instructions. (Please refer to Section 7.31 Set Burst with Wrap). Fast Read Quad I/O in QPI Mode When QPI mode in enabled, the number of dummy clocks is configured by the “Set Read Parameters (C0h)” instruction to accommodate a wide range applications with different needs for either maximum Fast Read frequency or minimum data access latency. Depending on the Read Parameter Bits P [4] and P [5] setting, the number of dummy clocks can be configured as either 4 or 6 or 8. The default number of dummy clocks upon power up or after a Reset (99h) instruction is 4. “Continuous Read Mode” feature is also available in QPI mode for Fast Read Quad I/O instruction. In QPI mode, the “Continuous Read Mode” bits M7-0 are also considered as dummy clocks. In the default setting, the data output will follow the Continuous Read Mode bits immediately. “Wrap Around” feature is not available in QPI mode for Fast Read Quad I/O instruction. To perform a read operation with fixed data length wrap around in QPI mode, a “Burst Read with Wrap” (0Ch) instruction must be used. (Please refer to Section 7.32 Burst Read with Wrap). AT25QF641 DS-25QF641–127E–3/2018 28 Figure 7-20. Fast Read Quad I/O Instruction (Initial instruction or previous M7-0 ≠ Axh, QPI mode, 80MHz) Figure 7-21. Fast Read Quad I/O Instruction (Initial instruction or previous M7-0 ≠ Axh, QPI mode, 104MHz) 7.15 Page Program (02h) The Page Program instruction is for programming the memory to be “0”. A Write Enable instruction must be issued before the device accept the Page Program Instruction (Status Register bit WEL=1). After the Write Enable (WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL). The instruction is entered by driving the CS pin low and then sending the instruction code “02h” with following a 24-bits address (A23-A0) and at least one data byte, into the SI pin. The CS pin must be driven low for the entire time of the instruction while data is being sent to the device. (Please refer to Figure 7-22 and Figure 7-23). If an entire 256 byte page is to be programmed, the last address byte (the 8 least significant address bits) should be set to 0. If the last address byte is not zero, and the number of clocks exceeds the remaining page length, the addressing will wrap to the beginning of the page. In some cases, less than 256 bytes (a partial page) can be programmed without having any effect on other bytes within the same page. One condition to perform a partial page program is that the AT25QF641 DS-25QF641–127E–3/2018 29 number of clocks cannot exceed the remaining page length. If more than 256 bytes are sent to the device the addressing will wrap to the beginning of the page and overwrite previously sent data The CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done the Page Program instruction will not be executed. After CS is driven high, the self-timed Page Program instruction will commence for a time duration of tPP (See AC Characteristics). While the Page Program cycle is in progress, the Read Status Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the Page Program cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. When the BUSY bit is asserted, the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Page Program instruction will not be executed if the addressed page is protected by the Protect (CMP, SEC, TB, BP2, BP1 and BP0) bits. Figure 7-22. Page Program Instruction (SPI Mode) Figure 7-23. Page Program Instruction (QPI Mode) AT25QF641 DS-25QF641–127E–3/2018 30 7.16 Quad Page Program (33h) The Quad Page Program instruction is to program the memory as being “0” at previously erased memory areas. The Quad Page Program takes four pins: IO0, IO1, IO2 and IO3 as address and data input, which can improve programmer performance and the effectiveness of application of lower clock less than 5MHz. System using faster clock speed will not get more benefit for the Quad Page Program as the required internal page program time is far more than the time data clock-in. To use Quad Page Program, the Quad Enable bit must be set, A Write Enable instruction must be executed before the device will accept the Quad Page Program instruction (Status Register-1, WEL=1). The instruction is initiated by driving the CS pin low then sending the instruction code “33h” with following a 24-bit address (A23-A0) and at least one data, into the IO pins. The CS pin must be held low for the entire length of the instruction while data is being sent to the device. All other functions of Quad Page Program are perfectly same as standard Page Program. (Please refer to Figure 724 and Figure 7-25). Figure 7-24. Quad Page Program Instruction (SPI mode) AT25QF641 DS-25QF641–127E–3/2018 31 Figure 7-25. Quad Page Program Instruction (QPI mode) 7.17 Block Erase (20h) The Block Erase instruction is to erase the data of the selected sector as being “1”. The instruction is used for 4K-byte Block. Prior to the Block Erase Instruction, the Write Enable instruction must be issued. The instruction is initiated by driving the CS pin low and shifting the instruction code “20h” followed a 24-bit Block address (A23-A0). (Please refer to Figure 7-26 and Figure 7-27). The CS pin must go high after the eighth bit of the last byte has been latched in, otherwise, the Block Erase instruction will not be executed. After CS goes high, the self-timed Block Erase instruction will commence for a time duration of tSE (See Section , ). While the Block Erase cycle is in progress, the Read Status Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. When the BUSY bit is asserted, the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase instruction will not be executed if the addressed page is protected by the Protect (CMP, SEC, TB, BP2, BP1 and BP0) bits. Figure 7-26. Block Erase Instruction (SPI Mode) AT25QF641 DS-25QF641–127E–3/2018 32 Figure 7-27. Block Erase Instruction (QPI Mode) 7.18 32KB Block Erase (52h) The Block Erase instruction is to erase the data of the selected block as being “1”. The instruction is used for 32K-byte Block erase operation. Prior to the Block Erase Instruction, a Write Enable instruction must be issued. The instruction is initiated by driving the CS pin low and shifting the instruction code “52h” followed a 24-bit block address (A23-A0). (Please refer to Figure 7-28 and Figure 7-29). The CS pin must go high after the eighth bit of the last byte has been latched in, otherwise, the Block Erase instruction will not be executed. After CS is driven high, the self-timed Block Erase instruction will commence for a time duration of tBE1 (See Section , ). While the Block Erase cycle is in progress, the Read Status Register instruction may still be read the status of the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. When the BUSY bit is asserted, the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block erase instruction will not be executed if the addressed page is protected by the Protect (CMP, SEC, TB, BP2, BP1 and BP0) bits. Figure 7-28. 32KB Block Erase Instruction (SPI Mode) AT25QF641 DS-25QF641–127E–3/2018 33 Figure 7-29. 32KB Block Erase Instruction (QPI Mode) 7.19 64KB Block Erase (D8h) The Block Erase instruction is to erase the data of the selected block as being “1”. The instruction is used for 64K-byte Block erase operation. Prior to the Block Erase Instruction, a Write Enable instruction must be issued. The instruction is initiated by driving the CS pin low and shifting the instruction code “D8h” followed a 24-bit block address (A23-A0). (Please refer to Figure 7-30 and Figure 7-31). The CS pin must go high after the eighth bit of the last byte has been latched in, otherwise, the Block Erase instruction will not be executed. After CS is driven high, the self-timed Block Erase instruction will commence for a time duration of tBE2 (See Section , ). While the Block Erase cycle is in progress, the Read Status Register instruction may still be read the status of the BUSY bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. When the BUSY bit is asserted, the Write Enable Latch (WEL) bit in the Status Register is cleared to 0. The Block erase instruction will not be executed if the addressed page is protected by the Protect (CMP, SEC, TB, BP2, BP1 and BP0) bits. Figure 7-30. 64KB Block Erase Instruction (SPI Mode) AT25QF641 DS-25QF641–127E–3/2018 34 Figure 7-31. 64KB Block Erase Instruction (QPI Mode) 7.20 Chip Erase (C7h / 60h) The Chip Erase instruction clears all bits in the device to be FFh (all 1s). Prior to the Chip Erase Instruction, a Write Enable instruction must be issued. The instruction is initiated by driving the CS pin low and shifting the instruction code “C7h” or “60h”. (Please refer to Figure 7-32). The CS pin must go high after the eighth bit of the last byte has been latched in, otherwise, the Chip Erase instruction will not be executed. After CS is driven high, the self-timed Chip Erase instruction will commence for a duration of tCE (See Section , ). While the Chip Erase cycle is in progress, the Read Status Register instruction may still be accessed to check the status of the BUSY bit. The BUSY bit is a 1 during the Chip Erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. When the BUSY bit is asserted, the Write Enable Latch (W EL) bit in the Status Register is cleared to 0. The Chip erase instruction will not be executed if any page is protected by the Protect (CMP, SEC, TB, BP2, BP1 and BP0) bits. Figure 7-32. Chip Erase Instruction for SPI Mode (left) and QPI Mode (right) AT25QF641 DS-25QF641–127E–3/2018 35 7.21 Erase / Program Suspend (75h) The Erase/Program Suspend instruction allows the system to interrupt a Block Erase operation or a Page Program, Quad Data Input Page Program, Quad Page Program operation. Erase Suspend is valid only during the Block erase operation. The Write Status Register-1 (01h), Write Status Register2 (31h) instruction and Erase instructions (20h, 52h, D8h, C7h, 60h) are not allowed during Erase Suspend. During the Chip Erase operation, the Erase Suspend instruction is ignored. Program Suspend is valid only during the Page Program, Quad Data Input Page Program or Quad Page Program operation. The Write Status Register-1(01h), Write Status Register-2 (31h) instruction and Program instructions (02h and 33h) and Erase instructions (20h, 52h, D8h, C7h and 60h) are not allowed during Program Suspend. The Erase/Program Suspend instruction “75h” will be accepted by the device only if the SUS bit in the Status Register equals to 0 and the BUSY bit equals to 1 while a Block Erase or a Page Program operation is on-going. If the SUS bit equals to 1 or the BUSY bit equals to 0, the Suspend instruction will be ignored by the device. A maximum of time of “tSUS” (See AC Characteristics) is required to suspend the erase or program operation. After Erase/Program Suspend, the SUS bit in the Status Register will be set from 0 to 1 immediately and The BUSY bit in the Status Register will be cleared from 1 to 0 within “tSUS”. For a previously resumed Erase/Program operation, it is also required that the Suspend instruction “75h” is not issued earlier than a minimum of time of “tSUS” following the preceding Resume instruction “7Ah”. Unexpected power off during the Erase/Program suspend state will reset the device and release the suspend state. SUS bit in the Status Register will also reset to 0. The data within the page or block that was being suspended may become corrupted. It is recommended for the user to implement system design techniques against the accidental power interruption and preserve data integrity during erase/program suspend state. (Please refer to Figure 7-33 and Figure 7-34). Figure 7-33. Erase Suspend instruction (SPI Mode) AT25QF641 DS-25QF641–127E–3/2018 36 Figure 7-34. Erase Suspend instruction (QPI Mode) 7.22 Erase / Program Resume (7Ah) The Erase/Program Resume instruction “7Ah” is to re-work the Block Erase operation or the Page Program operation upon an Erase/Program Suspend. The Resume instruction “7Ah” will be accepted by the device only if the SUS bit in the Status Register equals to 1 and the BUSYbit equals to 0. After issued, the SUS bit will be cleared from 1 to 0 immediately, the BUSY bit will be set from 0 to 1 within 200ns and the Block will complete the erase operation or the page will complete the program operation. If the SUS bit equals to 0 or the BUSY bit equals to 1, the Resume instruction “7Ah” will be ignored by the device. Resume instruction cannot be accepted if the previous Erase/Program Suspend operation was interrupted by unexpected power off. It is also required that a subsequent Erase/Program Suspend instruction not to be issued within a minimum of time of “tSUS” following a previous Resume instruction. (Please refer to Figure 7-35 and Figure 7-36). Figure 7-35. Erase / Program Resume instruction (SPI Mode) AT25QF641 DS-25QF641–127E–3/2018 37 Figure 7-36. Erase / Program Resume instruction (QPI Mode) 7.23 Deep Power Down (B9h) Executing the Deep Power Down instruction is the best way to put the device in the lowest power consumption. The Deep Power Down instruction reduces the standby current (from ICC1 to ICC2, as specified in Section , ). The instruction is entered by driving the CS pin low with following the instruction code “B9h”. (Please refer to Figure 7-37 and Figure 7-38). The CS pin must go high exactly at the byte boundary (the latest eighth bit of instruction code been latched-in); otherwise, the Deep Power Down instruction is not executed. After CS goes high, it requires a delay of tDP and the Deep Power Down mode is entered. While in the Release Deep Power Down / Device ID instruction, which restores the device to normal operation, will be recognized. All other instructions are ignored including the Read Status Register instruction, which is always available during normal operation. Deep Power Down Mode automatically stops at Power-Down, and the device always Power-up in the Standby Mode. Figure 7-37. Deep Power Down Instruction (SPI Mode) AT25QF641 DS-25QF641–127E–3/2018 38 Figure 7-38. Deep Power Down Instruction (QPI Mode) 7.24 Release Deep Power Down / Device ID (ABh) The Release Deep Power Down / Device ID instruction is a multi-purpose instruction. It can be used to release the device from the Deep Power Down state or obtain the device identification (ID). The instruction is issued by driving the CS pin low, sending the instruction code “ABh” and driving CS high as shown in figure Figure 7-39 and Figure 7-40. Release from Deep Power Down require the time duration of tRES1 (See AC Characteristics) for re-work a normal operation and accepting other instructions. The CS pin must keep high during the tRES1 time duration. The Device ID can be read during SPI mode only. In other words, Device ID feature is not available in QPI mode for Release Deep Power Down/Device ID instruction. To obtain the Device ID in SPI mode, instruction is initiated by driving the CS pin low and sending the instruction code “ABh” with following 3-dummy bytes. The Device ID bits are then shifted on the falling edge of SCK with most significant bit (MSB) first as shown in Figure 7-41. After CS is driven high it must keep high for a time duration of tRES2 (See Section , ). The Device ID can be read continuously. The instruction is completed by driving CS high. If the Release from Deep Power Down /Device ID instruction is issued while an Erase, Program or Write cycle is in process (when BUSY equals 1) the instruction is ignored and will not have any effects on the current cycle. Figure 7-39. Release Power Down Instruction (SPI Mode) AT25QF641 DS-25QF641–127E–3/2018 39 Figure 7-40. Release Power Down Instruction (QPI Mode) Figure 7-41. Release Power Down / Device ID Instruction (SPI Mode) 7.25 Read Manufacturer / Device ID Dual I/O (90h) The Read Manufacturer/ Device ID Dual I/O instruction provides both the JEDEC assigned manufacturer ID and the specific device ID. The Read Manufacturer/ Device ID instruction is very similar to the Fast Read Dual I/O instruction. The instruction is initiated by driving the CS pin low and shifting the instruction code “90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Adesto (1Fh) and the Device ID (17h) are shifted out on the falling edge of SCK with most significant bit (MSB) first as shown in Figure 7-42 and Figure 7-43. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device ID can be read continuously, alternating from one to the other. The instruction is completed by driving CS high. AT25QF641 DS-25QF641–127E–3/2018 40 Figure 7-42. Read Manufacturer/ Device ID instruction (SPI Mode) Figure 7-43. Read Manufacturer/ Device ID instruction (QPI Mode) 7.26 Read Manufacturer / Device ID Dual I/O (92h) The Read Manufacturer/ Device ID Dual I/O instruction provides both the JEDEC assigned manufacturer ID and the specific device ID. The Read Manufacturer/ Device ID instruction is very similar to the Fast Read Dual I/O instruction. The instruction is initiated by driving the CS pin low and shifting the instruction code “92h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Adesto (1Fh) and the Device ID (17h) are shifted out on the falling edge of AT25QF641 DS-25QF641–127E–3/2018 41 SCK with most significant bit (MSB) first as shown in Figure 7-44. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device ID can be read continuously, alternating from one to the other. The instruction is completed by driving CS high. Figure 7-44. Read Dual Manufacturer/ Device ID Dual I/O instruction (SPI Mode) 7.27 Read Manufacturer / Device ID Quad I/O (94h) The Read Manufacturer/ Device ID Quad I/O instruction provides both the JEDEC assigned manufacturer ID and the specific device ID. The Read Manufacturer/ Device ID instruction is very similar to the Fast Read Quad I/O instruction. The instruction is initiated by driving the CS pin low and shifting the instruction code “94h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Adesto (1Fh) and the Device ID(17h) are shifted out on the falling edge of SCK with most significant bit (MSB) first as shown in Figure 7-45. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device ID can be read continuously, alternating from one to the other. The instruction is completed by driving CS high. AT25QF641 DS-25QF641–127E–3/2018 42 Figure 7-45. Read Quad Manufacturer/ Device ID Quad I/O instruction (SPI Mode) JEDEC ID (9Fh) For compatibility reasons, the AT25QF641 provides several instructions to electronically determine the identity of the device. The Read JEDEC ID instruction is congruous with the JEDEC standard for SPI compatible serial flash memories that was adopted in 2003. The instruction is entered by driving the CS pin low with following the instruction code “9Fh”. JEDEC assigned Manufacturer ID byte for Adesto (1Fh) and two Device ID bytes, Memory Type (ID-15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of SCK with most significant bit (MSB) first shown in Figure 7-46 and Figure 7-47. For memory type and capacity values refer to Manufacturer and Device Identification table. The JEDEC ID can be read continuously. The instruction is terminated by driving CS high. AT25QF641 DS-25QF641–127E–3/2018 43 Figure 7-46. Read JEDEC ID instruction (SPI Mode) Figure 7-47. Read JEDEC ID instruction (QPI Mode) 7.28 Enable QPI (38h) The AT25QF641 support both Standard/Dual/Quad Serial Peripheral interface (SPI) and Quad Peripheral Interface (QPI). However, SPI mode and QPI mode cannot be used at the same time. Enable QPI instruction is the only way to switch the device from SPI mode to QPI mode. AT25QF641 DS-25QF641–127E–3/2018 44 In order to switch the device to QPI mode, the Quad Enable (QE) bit in Status Register 2 must be set to 1 first, and an Enable QPI instruction must be issued. If the Quad Enable (QE) bit is 0, the Enable QPI instruction will be ignored and the device will remain in SPI mode. After power-up, the default state of the device is SPI mode. See the instruction Set Table 7-2 for all the commands supported in SPI mode and the instruction Set Table 7-5 for all the instructions supported in QPI mode. When the device is switched from SPI mode to QPI mode, the existing Write Enable and Program/Erase Suspend status, and the Wrap Length setting will remain unchanged. Figure 7-48. Enable QPI instruction (SPI Mode only) 7.29 Disable QPI (FFh) By issuing Disable QPI (FFh) instruction, the device is reset SPI mode. When the device is switched from QPI mode to SPI mode, the existing Write Enable Latch (WEL) and Program/Erase Suspend status, and the Wrap Length setting remains unchanged. Figure 7-49. Disable QPI instruction for QPI mode AT25QF641 DS-25QF641–127E–3/2018 45 7.30 Word Read Quad I/O (E7h) The Quad I/O dramatically reduces instruction overhead allowing faster random access for code execution (XIP) directly from the Quad SPI. The Quad Enable bit (QE) of Status Register-2 must be set to enable the Word Read Quad I/O instruction. The lowest Address bit (A0) must equal 0 and only two dummy clocks are required prior to the data output. Continuous Read Mode The Word Read Quad I/O instruction can further reduce instruction overhead through setting the “Continuous Read Mode” bits (M7-0) after the input Address bits (A23-0), as shown in Figure 7-50. The upper nibble of the (M7-4) controls the length of the next Word Read Quad I/O instruction through the inclusion or exclusion of the first byte instruction code. The lower nibble bits of the (M[3:0]) are don’t care (“X”). However, the IO pins should be highimpedance prior to the falling edge of the first data out clock. If the “Continuous Read Mode” bits M[7-4]= Ah, then the next Fast Read Quad I/O instruction (after CS is raised and then lowered) does not require the E7h instruction code, as shown in Figure 7-51. This reduces the instruction sequence by eight clocks and allows the Read address to be immediately entered after CS is asserted low. If the “Continuous Read Mode” bits M[7:4] do not equal to Ah (1,0,1,0) the next instruction (after CS is raised and then lowered) requires the first byte instruction code, thus returning to normal operation. Figure 7-50. Word Read Quad I/O instruction (Initial instruction or previous set M7-0 ≠ Axh, SPI Mode) Figure 7-51. Word Read Quad I/O instruction (Previous instruction set M7-0= Axh, SPI Mode) AT25QF641 DS-25QF641–127E–3/2018 46 Wrap Around in SPI mode The Word Read Quad I/O instruction can also be used to access a specific portion within a page by issuing a “Set Burst with Wrap” (77h) instruction prior to E7h. The “Set Burst with Wrap” (77h) instruction can either enable or disable the “Wrap Around” feature for the following E7h commands. When “Wrap Around” is enabled, the output data starts at the initial address specified in the instruction, once it reaches the ending boundary of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary automatically until CS is pulled high to terminate the instruction. The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing read instructions. The “Set Burst with Wrap” instruction allows three “Wrap Bits”, W6-4 to be set. The W4 bit is used to enable or disable the “Wrap Around” operation while W6-5 is used to specify the length of the wrap around section within a page. 7.31 Set Burst with Wrap (77h) The Set Burst with Wrap (77h) instruction is used in conjunction with “Fast Read Quad I/O” and “Word Read Quad I/O” instructions to access a fixed length of 8/16/32/64-byte section within a 256-byte page. Certain applications can benefit from this feature and improve the overall system code execution performance. Before the device will accept the Set Burst with Wrap instruction, a Quad enable of Status Register-2 must be executed (Status Register bit QE must equal 1). The Set Burst with Wrap instruction is initiated by driving the CS pin low and then shifting the instruction code “77h” followed by 24 dummy bits and 8 “Wrap Bits”, W7-0. The instruction sequence is shown in Set Burst with Wrap Instruction Sequence. Wrap bit W7 and W3-0 are not used. Table 7-6. Set Burst with Wrap W6:W4 Encoding W6, W5 W4 = 0 W4 = 1(Default) Wrap Around Wrap Length Wrap Around Wrap Length 00 Yes 8-byte No N/A 01 Yes 16-byte No N/A 10 Yes 32-byte No N/A 11 Yes 64-byte No N/A Once W6-4 is set by a Set Burst with Wrap instruction, all the following “Fast Read Quad I/O” and Word Read Quad I/O instructions will use the W6-4 setting to access the 8/16/32/64-byte section within any page. To exit the “Wrap Around” function and return to normal read operation, another Set Burst with Wrap instruction should be issued to set W4 = 1. The default value of W4 upon power on is 1. In the case of a system Reset while W4 = 0, it is recommended that the controller issues a Set Burst with Wrap instruction or Reset (99h) instruction to reset W4 = 1 prior to any normal Read instructions since AT25QF641 does not have a hardware Reset Pin. AT25QF641 DS-25QF641–127E–3/2018 47 Figure 7-52. Set Burst with Wrap Instruction Sequence 7.32 Burst Read with Wrap (0Ch) The “Burst Read with Wrap (0Ch)” instruction provides an alternative way to perform the read operation with “Wrap Around” in QPI mode. The instruction is similar to the “Fast Read (0Bh)” instruction in QPI mode, except the addressing of the read operation will “Wrap Around” to the beginning boundary of the “Wrap Length” once the ending boundary is reached. The “Wrap Length” and the number of dummy of clocks can be configured by the “Set Read Parameters (C0h)” instruction. Figure 7-53. Burst Read with Wrap instruction (QPI Mode, 80MHz) AT25QF641 DS-25QF641–127E–3/2018 48 Figure 7-54. Burst Read with Wrap instruction (QPI Mode, 104MHz) 7.33 Set Read Parameters (C0h) In QPI mode, to accommodate a wide range of applications with different needs for either maximum read frequency or minimum data access latency, “Set Read Parameters (C0h)” instruction can be used to configure the number of dummy clocks for “Fast Read (0Bh)”, “Fast Read Quad I/O (EBh)” & “Burst Read with Wrap (0Ch)” instructions, and to configure the number of bytes of “Wrap Length” for the “Burst Read with Wrap (0Ch)” instruction. In Standard SPI mode, the “Set Read Parameters (C0h)” instruction is not accepted. The dummy clocks for various Fast Read instructions in Standard/Dual/Quad SPI mode are fixed, please refer to the instruction. and for details Table 7-2, Table 7-3, Table 7-4, and Table 7-5. The “Wrap Length” is set by W6-5 bit in the “Set Burst with Wrap (77h)” instruction. This setting will remain unchanged when the device is switched from Standard SPI mode to QPI mode. The default “Wrap Length” after a power up or a Reset instruction is 8 bytes, the default number of dummy clocks is 4. Table 7-7. Dummy Clock Encoding P5, P4 Dummy Clocks Maximum Read Freq. 00 4 80MHz 01 4 80MHz 10 6 104MHz Table 7-8. Wrap Length Encoding P1, P0 Wrap Length 00 8-bytes 01 16-bytes 10 32-bytes 11 64-bytes AT25QF641 DS-25QF641–127E–3/2018 49 Figure 7-55. Set Read Parameters instruction (QPI Mode) 7.34 Enable Reset (66h) and Reset (99h) Because of the small package and the limitation on the number of pins, the AT25QF641 provide a software Reset instruction instead of a dedicated RESET pin. Once the Reset instruction is accepted, any on-going internal operations will be terminated and the device will return to its default power-on state and lose all the current volatile settings, such as Volatile Status Register bits, Write Enable Latch (WEL) status, Program/Erase Suspend status, Continuous Read Mode bit setting, Read parameter setting and Wrap bit setting. “Enable Reset (66h)” and “Reset (99h)” instructions can be issued in either SPI mode or QPI mode. To avoid accidental reset, both instructions must be issued in sequence. Any other instructions other than “Reset (99h)” after the “Enable (66h)” instruction will disable the “Reset Enable” state. A new sequence of “Enable Reset (66h)” and “Reset (99h)” is needed to reset the device. Once the Reset instruction is accepted by the device will take approximately tRST= 30us to reset. During this period, no instruction will be accepted. Data corruption may happen if there is an on-going or suspended internal Erase or Program operation when Reset instruction sequence is accepted by device. It is recommended to check the BUSY bit and the SUS bit in Status Register before issuing the Reset instruction sequence. Figure 7-56. Enable Reset and Reset Instruction (SPI Mode) AT25QF641 DS-25QF641–127E–3/2018 50 Figure 7-57. Enable Reset and Reset Instruction (QPI Mode) 7.35 Read Serial Flash Discovery Parameter (5Ah) The Read Serial Flash Discovery Parameter (SFDP) instruction allows reading the Serial Flash Discovery Parameter area (SFDP). This SFDP area is composed of 2048 read-only bytes containing operating characteristics and vendor specific information. The SFDP area is factory programmed. If the SFDP area is blank, the device is shipped with all the SFDP bytes at FFh. If only a portion of the SFDP area is written to, the portion not used is shipped with bytes in erased state (FFh). The instruction sequence for the read SFDP has the same structure as that of a Fast Read instruction. First, the device is selected by driving Chip Select (CS) Low. Next, the 8-bit instruction code (5Ah) and the 24-bit address are shifted in, followed by 8 dummy clock cycles. The bytes of SFDP content are shifted out on the Serial Data Output (SO) starting from the specified address. Each bit is shifted out during the falling edge of Serial Clock (SCK). The instruction sequence is shown here. The Read SFDP instruction is terminated by driving Chip Select (CS) High at any time during data output. AT25QF641 DS-25QF641–127E–3/2018 51 Figure 7-58. Read SFDP Register Instruction Table 7-9. SFDP Signature and Headers Description Comment SFDP Signature Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) 00h 07:00 0101 0011 53h 01h 15:08 0100 0110 46h 02h 23:16 0100 0100 44h 03h 31:24 0101 0110 50h SFDP Minor Revision Start from 00h 04h 07:00 0000 0110 06h SFDP Major Revision Start from 01h 05h 15:08 0000 0001 01h Number of Parameters Headers Start from 00h 06h 23:16 0000 0001 01h Reserved FFh 07h 31:24 1111 1111 FFh JEDEC Parameter ID (LSB) JEDEC Parameter ID (LSB) = 00H 08h 07:00 0000 0000 00h Parameter Table Minor Revision Start from 00H 09h 15:08 0000 0110 06h Parameter Table Major Revision Start from 01H 0Ah 23:16 0000 0001 01h 0Bh 31:24 0001 0000 10h Parameter Table Length (double words) How many DWORDs in the parameter table AT25QF641 DS-25QF641–127E–3/2018 52 Table 7-9. SFDP Signature and Headers Description Comment Parameter Table Pointer Address of Adesto Parameter Table Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) 0Ch 07:00 0011 0000 30h 0Dh 15:08 0000 0000 00h 0Eh 23:16 0000 0000 00h JEDEC Parameter ID (MSB) JEDEC Parameter ID (MSB):FFH 0Fh 31:24 1111 1111 FFh JEDEC Parameter ID (LSB) Adesto Manufacturer ID 10h 07:00 0001 1111 1Fh Parameter Table Minor Revision Start from 00H 11h 15:08 0000 0000 00h Parameter Table Major Revision Start from 01H 12h 23:16 0000 0001 01h 13h 31:24 0000 0010 02h 14h 07:00 1000 0000 80h 15h 15:08 0000 0000 00h 16h 23:16 0000 0000 00h 17h 31:24 0000 0001 01h Parameter Table Length (double words) Parameter Table Pointer (PTP) How many DWORDs in the parameter table Address of Adesto Parameter Table Reserved FFh Table 7-10. SFDP Parameters Table 1 Description Comment Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) Erase Granularity 01:4KB available 30h 01:00 01 E5h 11:4KB not available Write Granularity 0:1Byte, 1:64 bytes or larger 02 1 Volatile Status Register Block Protect Bits 0: Nonvolatile status bit 03 0 Volatile Status Register Write Enable Opcode 0:50H Opcode to enable, if bit-3 = 1 04 0 07:05 111 15:08 0010 0000 1: Volatile status bit Reserved 4KB Erase Opccde Opcode or FFh 31h 20h AT25QF641 DS-25QF641–127E–3/2018 53 Description Comment Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) Fast Dual Read Output (1 -1 -2) 0=Not supported, 1=Supported 32h 16 1 F1h 18:17 00 Number of Address Bytes 00:3 Byte only 01:3 or 4 Byte 10:4 Byte only 11:Reserved Double Transfer Rate (DTR) Clocking 0=Not supported, 1=Supported 19 0 Fast Dual I/O Read (1-2- 2) 0=Not supported, 1=Supported 20 1 Fast Quad I/O Read (1-4-4) 0=Not supported, 1=Supported 21 1 Fast Quad Output Read (1-1-4) 0=Not supported, 1=Supported 22 1 FFh 23 1 33h 31:24 1111 1111 FFh 34h 07:00 1111 1111 FFh 35h 15:08 1111 1111 FFh 36h 23:16 1111 1111 FFh 37h 31:24 0000 0011 03h 38h 04:00 00100 44h 07:05 010 Reserved Reserved FFh Flash Memory Density Fast Quad I/O (1-4-4) Number of dummy clocks number of dummy clocks Fast Quad I/O (1-4-4) Number of mode bits number of mode bits Fast Quad I/O (1-4-4) Opcode or FFh 39h 15:08 1110 1011 EBh Fast Quad Output (1-1-4) Number of dummy clocks number of dummy clocks 3Ah 20:16 01000 08h Fast Quad Output (1-1-4) Number of mode bits number of mode bits 23:21 000 Fast Quad Output (1-1-4) Opcode or FFh 3Bh 31:24 0110 1011 6Bh Fast Dual Output (1-1-2) Number of dummy clocks number of dummy clocks 3Ch 04:00 01000 08h Fast Dual Output (1-1-2) Number of mode bits number of mode bits 07:05 000 Fast Dual Output (1-1-2) Opcode or FFh 15:08 0011 1011 Read Opcode Read Opcode 3Dh 3Bh Read Opcode AT25QF641 DS-25QF641–127E–3/2018 54 Description Comment Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) Fast Dual I/O (1-2-2) Number of dummy clocks number of dummy clocks 3Eh 20:16 00000 80h Fast Dual I/O (1-2-2) Number of mode bits number of mode bits 23:21 100 Fast Dual I/O (1-2-2) Opcode or FFh 3Fh 31:24 1011 1011 BBh Fast Dual DPI (2-2-2) 0=Not supported, 1=Supported 40h 0 0 FEh Reserved FFh 03:01 111 Fast Quad QPI (4-4-4) 0=Not supported, 1=Supported 04 1 Reserved FFh 07:05 111 Reserved FFh 41h 15:08 1111 1111 FFh Reserved FFh 42h 23:16 1111 1111 FFh Reserved FFh 43h 31:24 1111 1111 FFh Reserved FFh 44h 07:00 1111 1111 FFh Reserved FFh 45h 15:08 1111 1111 FFh Fast Dual DPI (2-2-2) Number of dummy clocks number of dummy clocks 46h 20:16 0 0000 00h Fast Dual DPI (2-2-2) Number of mode bits number of mode bits 23:21 000 Fast Dual DPI(2-2-2) Opcode or FFh 47h 31:24 1111 1111 FFh Reserved FFh 48h 07:00 1111 1111 FFh Reserved FFh 49h 15:08 1111 1111 FFh Fast Quad QPI (4-4-4) Number of dummy clocks number of dummy clocks 4Ah 20:16 00010 42h Fast Quadl QPI (4-4-4) Number of mode bits number of mode bits 23:21 010 Fast Quad QPI(4-4-4) Opcode or FFh 4Bh 31:24 1110 1011 EBh 4KB=2^0Ch, 32KB=2^0Fh,64KB=2^10h; (2^Nbyte) 4Ch 07:00 0000 1100 0Ch Opcode or FFh 4Dh 15:08 0010 0000 20h 4KB=2^0Ch, 32KB=2^0Fh,64KB=2^10h; (2^Nbyte) 4Eh 23:16 0000 1111 0Fh Opcode or FFh 4Fh 31:24 0101 0010 52h Read Opcode Read Opcode Read Opcode Erase type-1 Size Erase type-1 Opcode Erase type-2 Size Erase type-2 Opcode AT25QF641 DS-25QF641–127E–3/2018 55 Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) 4KB=2^0Ch, 32KB=2^0Fh,64KB=2^10h; (2^Nbyte) 50h 07:00 0001 0000 10h Opcode or FFh 51h 15:08 1101 1000 D8h 4KB=2^0Ch, 32KB=2^0Fh,64KB=2^10h; (2^Nbyte) 52h 23:16 0000 0000 00h Erase Type-4 Opcode Opcode or FFh 53h 31:24 1111 1111 FFh Erase Maximum/Typical Ratio Maximum = 2 * (COUNT + 1) * Typical 54h 03:00 0011 33h Erase type-1 Typical time Count or 00h 56h 08:04 0 0011 C9h 00b: 1ms 57h 10:09 01 00h Description Erase Type-3 Size Erase Type-3 Opcode Erase Type-4 Size Erase type-1 Typical units Comment 55h 62h 01b: 16ms 10b: 128ms 11b: 1s Erase type-2 Typical time Count or 00h 15:11 0110 0 Erase type-2 Typical units 00b: 1ms 17:16 01 01b: 16ms 10b: 128ms 11b: 1s Erase type-3 Typical time Count or 00h 22:18 100 10 Erase type-3 Typical units 00b: 1ms 24:23 01 Count or 00h 29:25 00 000 00b: 1ms 31:30 00 03:00 0100 07:04 1000 01b: 16ms 10b: 128ms 11b: 1s Erase type-4 Typical time Erase type-4 Typical units 01b: 16ms 10b: 128ms 11b: 1s Program Maximum/Typical Ratio Maximum = 2 * (COUNT + 1) * Typical Page Size 2^N bytes 58h 84h AT25QF641 DS-25QF641–127E–3/2018 56 Description Comment Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) Program Page Typical time Count or 00h 59h 12:08 0 1001 29h Program Page Typical units 0: 8us, 5Ah 13 1 01h 1: 64us 5Bh C7h Program Byte Typical time, 1st byte Count or 00h 17:14 01 00 Program Byte Typical units, 1st byte 0: 1us, 18 0 Program Additional Byte Typical time Count or 00h 22:19 000 0 Program Additional Byte Typical units 0: 1us, 23 0 Erase Chip Typical time Count or 00h 28:24 0 1110 Erase Chip Typical units 00b: 16ms 30:29 10 31 1 03:00 11010 07:04 1110 1: 8us 1: 8us 01b: 256ms 10b: 4s 11b: 64s Reserved 1h Prohibited Op during Program Suspend see datasheet Prohibited Op during Erase Suspend see datasheet 5Ch ECh AT25QF641 DS-25QF641–127E–3/2018 57 Description Comment Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) Reserved 1h 5Dh 08 1 A1h 5Eh Program Resume to Suspend time Count of 64us Program Suspend Maximum time Program Suspend Maximum units 5Fh 07h 12:09 0 000 Count or 00h 17:13 11 101 00b: 128ns, 19:18 01 3Dh 01b: 1us, 10b: 8us, 11b: 64us Erase Resume to Suspend time Count of 64us 23:20 0000 Erase Suspend Maximum time Count or 00h 28:24 1 1101 Erase Suspend Maximum units 00b: 128ns, 30:29 01 31 0 01b: 1us, 10b: 8us, 11b: 64us Suspend / Resume supported 0: Program and Erase suspend supported 1: not supported Program Resume Opcode Opcode or FFh 60h 7:0 0111 1010 7Ah Program Suspend Opcode Opcode or FFh 61h 15:8 0111 0101 75h Resume Opcode Opcode or FFh 62h 23:16 0111 1010 7Ah Suspend Opcode Opcode or FFh 63h 31:24 0111 0101 75h Reserved 11b 64h 01:00 11 F7h Status Register Busy Polling xxxxx1b: Opcode = 05h, bit-0 = 1 Busy, 07:02 1111 01 xxxx1xb: Opcode = 70h, bit-7 = 0 Busy, others: reserved AT25QF641 DS-25QF641–127E–3/2018 58 Description Comment Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) Exit Deep Powerdown time Count or 00h 65h 12:08 0 0010 A2h Exit Deep Powerdown units 00b: 128ns, 66h 14:13 01 D5h 01b: 1us, 67h 5Ch 10b: 8us, 11b: 64us Exit Deep Powerdown Opcode Opcode or FFh 22:15 101 0101 1 Enter Deep Powerdown Opcode Opcode or FFh 30:23 101 1100 1 Deep Powerdown Supported 0: Deep Powerdown supported, 31 0 1: not supported Disable 4-4-4 Read Mode 68h 03:00 1001 19h Enable 4-4-4 Read Mode 69h 08:04 0 0001 F6h 09 1 Fast Quad I/O Continuous (0-4-4) Exit 15:10 1111 01 Fast Quad I/O Continuous (0-4-4) Enter 19:16 1100 Quad Enable Requirements (QER) 22:20 001 23 0 6Bh 31;24 1111 1111 FFh 6Ch 06:00 110 1000 E8h 07 1 Fast Quad I/O Continuous (0-4-4) supported HOLD or RESET Disable 0: not supported, 6Ah 1Ch 1: Quad I/O 0-4-4 supported 0: not supported, 1: use Configuration Register bit-4 Reserved FFh Status Register Opcode Reserved 1h Soft Reset Opcodes 6Dh 13:08 01 0000 4-Byte Address Exit 6Eh 23:14 1100 0000 00 4-Byte Address Enter 6Fh 31:24 1000 0000 10h C0h 80h AT25QF641 DS-25QF641–127E–3/2018 59 Table 7-11. SFDP Parameters Table 2 Description Comment Address (h) Byte Address (Bit) Data (b) (Bit) Data (h) (Byte) VCC Minimum Voltage 1650h: 1.65V, 80h 15:0 0000 0000 1700h: 1.70V, 81h 00h 27h 0001 0111 2300h: 2.30V, 2500h: 2.50V, 2700h: 2.70V VCC Maximum Voltage 1950h: 1.95V, 82h 3600h: 3.60V, 83h 31:16 0000 0000 0011 0110 00h 36h 4000h: 4.00V, 4400h: 4.40V Array Protection Method 10b: use non-volatile status register Power up Protection default 0: power up unprotected, 84h 01:00 10 85h 02 0 DAh 06h 1: power up protected Protection Disable Opcodes 011b: use status register 05:03 01 1 Protection Enable Opcodes 011b: use status register 08:06 0 11 Protection Read Opcodes 011b: use status register 11:09 011 Protection Register Erase Opcode 00b: not supported, 13:12 00 Protection Register Program Opcode 00b: not supported, 15:14 00 01b: Opcodes 3Dh,2Ah,7Fh,CFh, 01b: Opcodes 3Dh,2Ah,7Fh,FCh Reserved FFh 86h 23:16 1111 1111 FFh Reserved FFh 87h 31:24 1111 1111 FFh Reserved FFh 88h-FFh 7.36 Reserved Enter Secured OTP (B1h) The Enter Secured OTP instruction is for entering the additional 4K-bit secured OTP mode. The additional 4K-bit secured OTP is independent from main array, which may be used to store unique serial number for system identifier. After entering the Secured OTP mode, and then follow standard read or program, procedure to read out the data or update data. The Secured OTP data cannot be updated again once it is lock-down Please note that Write Status Register-1, Write Status Register-2 and Write Security Register instructions are not acceptable during the access of secure OTP region. Once security OTP is lock down, only commands related with read are valid. The Enter Secured OTP instruction sequence is shown in Figure 7-59. AT25QF641 DS-25QF641–127E–3/2018 60 Figure 7-59. Enter Secured OTP instruction for SPI Mode (left) and QPI Mode (right) 7.37 Exit Secured OTP (C1h) The Exit Secured OTP instruction is for exiting the additional 4K-bit secured OTP mode. (Please refer to Figure 7-60). Figure 7-60. Exit Secured OTP instruction for SPI Mode (left) and QPI Mode (right) 7.38 Read Security Register (2Bh) The Read Security Register can be read the value of Security Register bits at any time (even in program/erase/write status register-1 and write status register-2 condition) and continuously. Secured OTP Indicator bit. The Secured OTP indicator bit shows the chip is locked by factory before ex-factory or not. When it is “0”, it indicates non-factory lock, “1” indicates factory-lock. Lock-down Secured OTP (LDSO) bit. By writing Write Security Register instruction, the LDSO bit may be set to “1” for customer lock-down purpose. However, once the bit it set to “1” (Lock-down), the LDSO bit and the 4K-bit Secured OTP area cannot be updated any more. While it is in 4K-bit Secured OTP mode, array access is not allowed to write. AT25QF641 DS-25QF641–127E–3/2018 61 Table 7-12. Security Register Definition Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 x x x x x x LDSO (indicates if lock- down) Secured OTP indicator bit Reserved Reserved Reserved Reserved Reserved Reserved 0 = not lockdown 0 = non factory lock 1 = lock- down 1 = factory lock (cannot program/ erase OTP) Volatile bit Volatile bit Volatile bit Volatile bit Volatile bit Volatile bit Non- Volatile bit Non-Volatile bit Figure 7-61. Read Security Register instruction (SPI Mode) Figure 7-62. Read Security Register instruction (QPI Mode) 7.39 Write Security Register (2Fh) The Write Security Register instruction is for changing the values of Security Register bits. Unlike Write Status Register, the Write Enable instruction is not required before writing Write Security Register instruction. The Write Security Register instruction may change the value of bit1 (LDSO bit) for customer to lock-down the 4K-bit Secured OTP area. Once the LDSO bit is set to “1”, the Secured OTP area cannot be updated any more. AT25QF641 DS-25QF641–127E–3/2018 62 The CS must go high exactly at the boundary; otherwise, the instruction will be rejected and not executed. Figure 7-63. Write Security Register instruction for SPI Mode (left) and QPI Mode (right) 7.40 4K-bit Secured OTP It’s for unique identifier to provide 4K-bit one-time-program area for setting device unique serial number which may be set by factory or system customer. Please refer to table of “4K-bit secured OTP definition”. - Security register bit 0 indicates whether the chip is locked by factory or not. - To program the 4K-bit secured OTP by entering 4K-bit secured OTP mode (with ENSO command) and going through normal program procedure, and then exiting 4K-bit secured OTP mode by writing EXSO command - Customer may lock-down bit1 as “1”. Please refer to “table of security register definition” for security register bit definition and table of “4K-bit secured OTP definition” for address range definition. Note. Once lock-down whatever by factory or customer, it cannot be changed any more. While in 4K-bit secured OTP mode, array access is not allowed to write. Table 7-13. Secured OTP Address Range Size Standard Customer Lock 000000 ~ 00000F 128-bit ESN Determined by customer (Electrical Serial Number) 000010 ~ 0001FF 3968-bit N/A AT25QF641 DS-25QF641–127E–3/2018 63 8. Electrical Characteristics 8.1 Absolute Maximum Ratings(1) Parameter Symbol Conditions Range Unit -0.6 to VCC+0.4 V Supply Voltage VCC Voltage Applied to Any Pin VIO Relative to Ground -0.6 to VCC +0.4 V Transient Voltage on any Pin VIOT