AT25XV041B-XMHV-B

Following the acquisi�on of Adesto Technologies, Dialog Semiconductor offers memory products as part of its product por�olio. The exis�ng content from datasheets, including part numbers and codes should be used. Terms of Purchase are provided on the Dialog website https://www.dialog-semiconductor.com/general-terms-and-conditions-purchase View our Dialog memory products por�olio: www.dialog-semiconductor.com/products/memory Contacting Dialog Semiconductor United Kingdom (Headquarters) Dialog Semiconductor (UK) LTD Phone: +44 1793 757700 North America Dialog Semiconductor Inc. Phone: +1 408 845 8500 Hong Kong Dialog Semiconductor Hong Kong Phone: +852 2607 4271 China (Shenzhen) Dialog Semiconductor China Phone: +86 755 2981 3669 Germany Dialog Semiconductor GmbH Phone: +49 7021 805-0 Japan Dialog Semiconductor K. K. Phone: +81 3 5769 5100 Korea Dialog Semiconductor Korea Phone: +82 2 3469 8200 China (Shanghai) Dialog Semiconductor China Phone: +86 21 5424 9058 The Netherlands Dialog Semiconductor B.V. Phone: +31 73 640 8822 Taiwan Dialog Semiconductor Taiwan Phone: +886 281 786 222 Email: enquiry@diasemi.com Web site: www.dialog-semiconductor.com # AT25XV041B 4-Mbit, 1.65V – 4.4V Range SPI Serial Flash Memory with Dual-I/O Support Features  Single 1.65V - 4.4V Supply  Serial Peripheral Interface (SPI) Compatible Supports SPI Modes 0 and 3 Supports Dual-I/O Operation  85MHz Maximum Operating Frequency  Clock-to-Output (tV) of 7.5 ns  Flexible, Optimized Erase Architecture for Code + Data Storage Applications  Small (256-Byte) Page Erase  Uniform 4-Kbyte Block Erase  Uniform 32-Kbyte Block Erase  Uniform 64-Kbyte Block Erase  Full Chip Erase  Hardware Controlled Locking of Protected Sectors via WP Pin    128-byte, One-Time Programmable (OTP) Security Register 64 bytes factory programmed with a unique identifier 64 bytes user programmable  Flexible Programming  Byte/Page Program (1 to 256 Bytes)  Dual-Input Byte/Page Program (1 to 256 Bytes)  Sequential Program Mode Capability  Fast Program and Erase Times  1.85ms Typical Page Program (256 Bytes) Time  45ms Typical 4-Kbyte Block Erase Time  360ms Typical 32-Kbyte Block Erase Time  720ms Typical 64-Kbyte Block Erase Time  Automatic Checking and Reporting of Erase/Program Failures    Software Controlled Reset  JEDEC Standard Manufacturer and Device ID Read Methodology  Low Power Dissipation 200nA Ultra Deep Power Down current (Typical) 5µA Deep Power-Down Current (Typical) 25uA Standby Current (Typical) 3.5mA Active Read Current (Typical)  Endurance: 100,000 Program/Erase Cycles      Data Retention: 20 Years  Complies with Full Industrial Temperature Range  Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options      8-lead SOIC (150-mil) 8-pad Ultra Thin DFN (2 x 3 x 0.6 mm) 8-pad Ultra Thin DFN (5 x 6 x 0.6 mm) 8-lead TSSOP Package 8-ball WLCSP (3 x 2 x 3 ball matrix) DS-25XV041B–091D–2/2017 1. Description The Adesto® AT25XV041B is a serial interface Flash memory device for a wide variety of high-volume consumer and connected applications. It can be operated using modern Lithium battery technologies over a wide input voltage range of 1.65V to 4.4V. It is designed for:  systems in which program code is shadowed from Flash memory into embedded or external RAM (Code Shadow) for execution,  where code is updated over the air,  where small amounts of data are stored locally in the flash memory. The erase block sizes of the AT25XV041B have been optimized to meet the needs of today's code and data storage applications. The device supports 256-byte Page erase, as well as 4-kbyte, 32-kbyte, and 64-kbyte block erase operations. By optimizing the size of the erase blocks, the memory space can be used much more efficiently. This device’s innovative design features also include:  active interrupt (allowing the host to sleep during lengthy programming),  erase operations (allowing the memory device to wake the MCU when completed), as well as  optimized energy consumption and class-leading