CY25BAJ-8F

CY25BAJ-8F

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

  • 描述:

    CY25BAJ-8F - Nch IGBT for Strobe Flash - Renesas Technology Corp

  • 详情介绍
  • 数据手册
  • 价格&库存
CY25BAJ-8F 数据手册
CY25BAJ-8F Nch IGBT for Strobe Flash REJ03G0285-0200 Rev.2.00 May 23, 2005 Features • Small surface mount package (TSSOP-8)  Terminal Pb free: PTSP0008JA-A (8P2J-A)  Complete Pb free: PTSP0008JB-B (TTP-8DV) • VDSS : 400 V • ICM : 150 A • Drive voltage : 4 V Outline TSSOP-8 5 8 4 1 4 3 2 1 1,2,3,4 : Collector 5,6,7 : Emitter 8 : Gate 5 6 7 8 Applications Strobe flash for cameras Maximum Ratings (Tc = 25°C) Parameter Collector-emitter voltage Gate-emitter voltage Peak gate-emitter voltage Collector current (Pulse) Junction temperature Storage temperature Symbol VCES VGES VGEM ICM Tj Tstg Ratings 400 ±6 ±8 150 – 40 to +150 – 40 to +150 Unit V V V A °C °C Conditions VGE = 0 V VCE = 0 V VCE = 0 V, tw = 10 s CM = 400 µF (see performance curve) Rev.2.00, May 23,2005, page 1 of 3 CY25BAJ-8F Electrical Characteristics (Tj = 25°C) Parameter Collector-emitter breakdown voltage Collector-emitter leakage current Gate-emitter leakage current Gate-emitter threshold voltage Collector-emitter saturation voltage Symbol V(BR)CES ICES IGES VGE(th) VCE(sat) Min. 450 — — 0.5 — Typ. — — — 0.7 4.0 Max. — 10 ±10 1.5 6.0 Unit V µA µA V V Test conditions IC = 1 mA, VGE = 0 V VCE = 400 V, VGE = 0 V VGE = ±6 V, VCE = 0 V VCE = 10 V, IC = 1 mA VCE = 4 V, IC = 150 A Performance Curves Maximum Collector Current vs. Gate-Emitter Voltage 200 Pulse Collector Current ICM (A) Tc = 70°C CM = 400 µF RG = 30 Ω 150 100 50 0 0 2 4 6 8 Gate-Emitter Voltage VGE (V) Precautions on Usage 1. IGBT has MOS structure and its gate is insulated by thin silicon oxide. So please handle carefully to protect the device from electrostatic charge. 2. Gate drive voltage during on-period must be applied to satisfy the rating of maximum pulse collector current. And peak reverse gate current during turn-off must become less than 0.1 A. (In general, when RG (off) = 30 Ω, it is satisfied.) 3. The operation life should be endured 5,000 shots under the charge current (IXe ≤ 150 A : full luminescence condition) of main capacitor (CM = 400 µF) which can endure repeated discharge of 5,000 times. Repetition period under full luminescence condition is over 3 seconds. 4. Total operation hours applied to the gate-emitter voltage must be within 5,000 hours when VGE is driven at 6 V. Order Code Lead form Standard packing Quantity Standard order code Standard order code example CY25BAJ-8F-T13 Surface-mounted type Taping 3000 Type name – T +Direction (1 or 2) +3 Note: Please confirm the specification about the shipping in detail. Rev.2.00, May 23,2005, page 2 of 3 CY25BAJ-8F Package Dimensions JEITA Package Code P-TSSOP8-4.4x3-0.65 RENESAS Code PTSP0008JA-A Package Name 8P2J-A MASS[Typ.] 0.04g 8 5 *1 HE E F A2 1 4 Index mark A1 NOTE) 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. c *2 D Reference Symbol Dimension in Millimeters Min 2.9 4.3 Nom 3.0 4.4 1.0 1.2 0 0.2 0.14 0° 0.1 0.25 0.15 0.2 0.32 0.2 8° 6.4 0.65 0.13 0.10 0.3 0.5 0.7 6.6 Max 3.1 4.5 D A E A2 e y * 3 bp L A A1 x Detail F bp c HE e x y L 6.2 JEITA Package Code P-TSSOP8-4.4 × 3-0.65 RENESAS Code PTSP0008JB-B Package Name TTP-8DV MASS[Typ.] 0.034g *1 D 8 5 bp Index mark *2 E HE F 1 Z 4 *3 b p Terminal cross section NOTE) 1. DIMENSIONS "*1(Nom)" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. xM (Ni/Pd/Au plating) e c Reference Symbol Dimension in Millimeters Min Nom 3.00 4.40 Max 3.30 L1 D E A2 A1 A 0.03 0.07 0.10 1.10 A bp b1 0.15 0.20 0.25 A1 c 0.10 0.15 0.20 L c1 0° HE 6.20 6.40 0.65 0.13 0.10 0.805 0.40 0.50 1.0 0.60 8° 6.60 y Detail F e x y Z L L1 Rev.2.00, May 23,2005, page 3 of 3 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: (408) 382-7500, Fax: (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: (1628) 585-100, Fax: (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: 2265-6688, Fax: 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: (2) 2715-2888, Fax: (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: (21) 6472-1001, Fax: (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: 6213-0200, Fax: 6278-8001 http://www.renesas.com © 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .2.0
CY25BAJ-8F
1. 物料型号: - CY25BAJ-8F,这是一个Nch IGBT,用于闪光灯。

2. 器件简介: - 这是一个用于闪光灯的Nch IGBT,具有小表面积贴装封装(TSSOP-8),并且有铅(Pb)自由的终端选项,如PTSP0008JA-A(8P2J-A)和完全无铅的PTSP0008JB-B(TTP-8DV)。

3. 引脚分配: - 1,2,3,4:Collector(集电极) - 5,6,7:Emitter(发射极) - 8:Gate(栅极)

4. 参数特性: - 集电极-发射极电压(VCES):400V - 栅极-发射极电压(VGES):±6V - 峰值栅极-发射极电压(VGEM):±8V - 集电极电流(脉冲):ICM 150A - 结温范围:Tj -40至+150℃ - 存储温度范围:Tstg -40至+150℃

5. 功能详解: - 该IGBT具有MOS结构,栅极由薄的硅氧化物绝缘。因此,需要小心处理以防止静电损坏。 - 在导通期间,栅极驱动电压必须满足最大脉冲集电极电流的额定值。在关断期间,峰值反向栅极电流必须小于0.1A。 - 主电容器(CM=400μF)的操作寿命应在5000次重复放电下承受,全亮条件下的重复周期超过3秒。 - 当VGE以6V驱动时,总操作时间应在5000小时内。

6. 应用信息: - 用于相机的闪光灯。

7. 封装信息: - TSSOP-8封装,具体尺寸和重量信息如下: - JEITA Page Code: P-TSSOP3-443-0.65 - RENESAS Code: PTSP00JA-A - Mass: 0.04g
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