DG211CJ

DATASHEET NOT RECOMMENDED FOR NEW DESIGNS NO RECOMMENDED REPLACEMENT contact our Technical Support Center at 1-888-INTERSIL or www.intersil.com/tsc DG211 SPST 4-Channel Analog Switch The DG211 is a low cost, CMOS monolithic, Quad SPST analog switch. It can be used in general purpose switching applications for communications, instrumentation, process control and computer peripheral equipment and provides true bi-directional performance in the ON condition and blocks signals to 30VP-P in the OFF condition. Ordering Information PART NUMBER PART TEMP. MARKING RANGE (°C) FN3118 Rev 5.00 November 19, 2007 Features • Switches ±15V Analog Signals • TTL Compatibility • Logic Inputs Accept Negative Voltages • rON (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 • Pb-Free Available (RoHS Compliant) PACKAGE PKG. DWG. # DG211CJ DG211CJ 0 to +70 16 Ld PDIP E16.3 DG211CJZ (Note) DG211CJZ 0 to +70 16 Ld PDIP* (Pb-free) E16.3 DG211CY** DG211CY 0 to +70 16 Ld SOIC M16.15 DG211CYZ** DG211CYZ (Note) 0 to +70 16 Ld SOIC (Pb-free) M16.15 DG211CVZ** DG211 CVZ (Note) 0 to +70 16 Ld TSSOP (Pb-free) M16.173 Functional Block Diagram DG211 S1 IN1 *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. **Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications. NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Pinout D1 S2 IN2 D2 S3 IN3 D3 S4 IN4 D4 TRUTH TABLE LOGIC DG211 0 ON 1 OFF Logic “0” 0.8V, Logic “1”  2.4V DG211 (16 LD PDIP, SOIC, TSSOP) TOP VIEW IN1 1 16 IN2 D1 2 15 D2 S1 3 14 S2 V- 4 13 V+ (SUBSTRATE) GND 5 12 VL (+5V) S4 6 11 S3 D4 7 10 D3 IN4 8 9 IN3 FN3118 Rev 5.00 November 19, 2007 Page 1 of 8 DG211 Schematic Diagram DG211 (1/4 AS SHOWN) TTL IN -15V GND +15V +5V VL -15V V- -15V +15V IN FN3118 Rev 5.00 November 19, 2007 OUT Page 2 of 8 DG211 Absolute Maximum Ratings Thermal Information V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44V VIN to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V- to V+ VL to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 25V VS or VD to V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to -36V VS or VD to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 36V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V Current, any Terminal Except S or D . . . . . . . . . . . . . . . . . . . . 30mA Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA Peak Current, S or D (Pulsed 1ms, 10% Duty Cycle Max) . . . . . 70mA Thermal Resistance (Typical, Note 1) Operating Conditions JA (°C/W) PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120 TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications V+ = +15V, V- = -15V, VL = +5V, GND, TA = +25°C MIN (Notes 2, 6) TYP (Note 3) - 460 - ns tOFF1 - 360 - ns tOFF2 - 450 - ns - 70 - dB - -90 - dB - 5 - pF Drain OFF-Capacitance, CD(OFF) - 5 - pF Channel ON-Capacitance, CD(ON) + CS(ON) - 16 - pF VIN = 2.4V -1.0 -0.0004 - µA VIN = 15V - 0.003 1.0 µA VIN = 0V -1.0 -0.0004 - µA -15 - 15 V PARAMETER TEST CONDITIONS MAX (Notes 2, 6) UNITS DYNAMIC CHARACTERISTICS Turn-ON Time, tON Turn-OFF Time OFF Isolation, OIRR (Note 5) Crosstalk (Channel-to-Channel), CCRR Source OFF-Capacitance, CS(OFF) See Figure 1 VS = 10V, RL = 1k, CL = 35pF VIN = 5V, RL = 1k, CL = 15pF, VS = 1VRMS , f = 100kHz VD = VS = 0V, VIN = 5V, f = 1MHz DIGITAL INPUT CHARACTERISTICS Input Current with Voltage High, IIH Input Current with Voltage Low, IIL ANALOG SWITCH CHARACTERISTICS Analog Signal Range, VANALOG Drain-Source ON-Resistance, rDS(ON) VD = ±10V, IS = 1mA, VIN = 0.8V - 150 175  Source OFF Leakage Current, IS(OFF) VIN = 2.4V VS = 14V, VD = -14V - 0.01 5.0 nA VS = -14V, VD = 14V -5.0 -0.02 - nA VS = -14V, VD = 14V - 0.01 5.0 nA VS = 14V, VD = -14V -5.0 -0.02 - nA VS = VD = 14V - 0.1 5.0 nA VS = VD = -14V -5.0 -0.15 - nA Drain OFF Leakage Current, ID(OFF) Drain ON Leakage Current, ID(ON) (Note 4) FN3118 Rev 5.00 November 19, 2007 VIN = 0.8V Page 3 of 8 DG211 Electrical Specifications V+ = +15V, V- = -15V, VL = +5V, GND, TA = +25°C (Continued) MIN (Notes 2, 6) TYP (Note 3) - 0.1 10 µA Negative Supply Current, I- - 0.1 10 µA Logic Supply Current, IL - 0.1 10 µA PARAMETER TEST CONDITIONS MAX (Notes 2, 6) UNITS POWER SUPPLY CHARACTERISTICS Positive Supply Current, I+ VIN = 0V or 2.4V NOTES: 2. The algebraic convention whereby the most negative value is a minimum, and the most positive is a maximum, is used in this data sheet. 3. For design reference only, not 100% tested. 4. ID(ON) is leakage from driver into ON switch. VS 5. OFF Isolation = 20 log -------- , V S = Input to OFF switch, V D = output . VD 6. Parts are 100% tested at +25°C. Over-temperature limits established by characterization and are not production tested. Test Circuits and Waveforms Switch output waveform shown for VS = constant with logic input waveform as shown. Note the VS may be + or - as per switching time test circuit. VO is the steady state output with switch on. Feedthrough via gate capacitance may result in spikes at leading and trailing edge of output waveform. 5V 15V VL LOGIC† INPUT (IN1) tr < 20ns tf < 20ns SWITCH INPUT 50% S1 SWITCH OUTPUT VO D1 VS = 10V 0V tOFF1 SWITCH V INPUT S SWITCH OUTPUT (VO) V+ 90% 90% LOGIC INPUT RL 1k IN1 10% tON tOFF2 GND (REPEAT TEST FOR IN2 , IN3 AND IN4) V-15V VO = VS CL 35pF RL RL + rDS(ON) † Logic shown for DG211. FIGURE 1. SWITCHING TIME MEASUREMENT POINTS FN3118 Rev 5.00 November 19, 2007 FIGURE 2. SWITCHING TIME TEST CIRCUIT Page 4 of 8 DG211 Metallization Mask Layout DG211 PIN 1 IN1 PIN 16 IN2 PIN 2 D1 PIN 15 D2 PIN 3 S1 PIN 14 S2 PIN 4 V- PIN 13 V+ (SUBSTRATE) PIN 5 GND PIN 12 VL PIN 11 S3 PIN 6 S4 PIN 7 D4 PIN 8 IN 4 FN3118 Rev 5.00 November 19, 2007 PIN 9 IN 3 PIN 10 D3 Page 5 of 8 DG211 Thin Shrink Small Outline Plastic Packages (TSSOP) M16.173 N 16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE INDEX AREA E 0.25(0.010) M E1 2 INCHES GAUGE PLANE -B1 B M 0.05(0.002) -A- SYMBOL MIN MAX MIN MAX NOTES A - 0.043 - 1.10 - A1 3 L A D -C- e  A1 b 0.10(0.004) M 0.25 0.010 SEATING PLANE c 0.10(0.004) C A M 0.05 0.15 - A2 0.033 0.037 0.85 0.95 - b 0.0075 0.012 0.19 0.30 9 c 0.0035 0.008 0.09 0.20 - B S NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AB, Issue E. 0.002 0.006 D 0.193 0.201 4.90 5.10 3 E1 0.169 0.177 4.30 4.50 4 e A2 MILLIMETERS 0.026 BSC E 0.246 L 0.020 N  0.65 BSC 0.256 6.25 0.028 0.50 16 0o - 0.70 6 16 8o 0o - 6.50 7 8o Rev. 1 2/02 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees) FN3118 Rev 5.00 November 19, 2007 Page 6 of 8 DG211 Dual-In-Line Plastic Packages (PDIP) N E16.3 (JEDEC MS-001-BB ISSUE D) E1 INDEX AREA 1 2 3 16 LEAD DUAL-IN-LINE PLASTIC PACKAGE N/2 INCHES -B- SYMBOL -AE D BASE PLANE -C- SEATING PLANE A2 A L D1 e B1 D1 B 0.010 (0.25) M C L eA A1 eC C A B S C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. MILLIMETERS MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - B1 0.045 0.070 1.15 1.77 8, 10 C 0.008 0.014 0.204 0.355 - D 0.735 0.775 18.66 19.68 5 D1 0.005 - 0.13 - 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC 2.54 BSC - 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. eA 0.300 BSC 7.62 BSC 6 eB - 0.430 - 10.92 7 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. L 0.115 0.150 2.93 3.81 4 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . N 16 16 9 Rev. 0 12/93 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). FN3118 Rev 5.00 November 19, 2007 Page 7 of 8 DG211 Small Outline Plastic Packages (SOIC) M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.3859 0.3937 9.80 10.00 3 E 0.1497 0.1574 3.80 4.00 4 e  B S 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N  NOTES: MILLIMETERS 16 0° 16 8° 0° 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 7 8° Rev. 1 6/05 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. © Copyright Intersil Americas LLC 2002-2007. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN3118 Rev 5.00 November 19, 2007 Page 8 of 8