EL5001IRE-T13

EL5001 6-Channel Clock Driver DATASHEET IGNS EW DES N R O F DED EMENT OMMEN REPL AC D E NO T REC D N ter at E OMM port Cen /tsc p u S l NO REC a m nic tersil.co our Tech contact ERSIL or www.in T 1-888-IN The EL5001 is a 6-channel level shifting driver designed primarily for use as a clock driver in LTPS LCD displays. The EL5001 buffers and level shifts six logic level input signals. The six channels are grouped in to two sets, one of two channels and one of four channels. Each set can be configured in the inverting or non-inverting modes. Operating from 3.3V input logic, the output swing is set using two reference input pins. These pins can be up to 18V differential and are not buffered, so should therefore be bypassed effectively. Features The EL5001 is designed to drive capacitive loads of 500pF with rise and fall times of just 20ns. A three-state pin is provided to set all outputs in to a high impedance mode. The ENABLE pin can be used to put the device in to a power save mode where the power consumption drops to just 3µA. • Disable function The EL5001 is available in 20-pin QFN (4mm x 4mm) and HTSSOP packages. Both are specified for operation over the -40°C to +85°C temperature range. FN7376 Rev 2.00 January 31, 2005 • SIx inverting/non-inverting channels • 3.3V input logic • 18V output • 250µA typical supply current • Drives up to 500pF • TR/TF = 35ns max • 20-pin QFN (4mm x 4mm) and HTSSOP packages • Pb-free available (RoHS compliant) Applications • LTPS LCD clock drivers • CCD driving • Level shifters Ordering Information PART NUMBER PACKAGE TAPE & REEL PKG. DWG. # PART NUMBER PACKAGE TAPE & REEL PKG. DWG. # EL5001IL 20-Pin QFN (4mm x 4mm) - MDP0046 EL5001IRE 20-Pin HTSSOP - MDP0048 EL5001IL-T7 20-Pin QFN (4mm x 4mm) 7” MDP0046 EL5001IRE-T7 20-Pin HTSSOP 7” MDP0048 EL5001IL-T13 20-Pin QFN (4mm x 4mm) 13” MDP0046 EL5001IRE-T13 20-Pin HTSSOP 13” MDP0048 EL5001ILZ (See Note) 20-Pin QFN (4mm x 4mm) (Pb-Free) - MDP0046 EL5001IREZ (See Note) 20-Pin HTSSOP (Pb-Free) - MDP0048 EL5001ILZ-T7 (See Note) 20-Pin QFN (4mm x 4mm) (Pb-Free) 7” MDP0046 EL5001IREZ-T7 (See Note) 20-Pin HTSSOP (Pb-Free) 7” MDP0048 EL5001ILZ-T13 (See Note) 20-Pin QFN (4mm x 4mm) (Pb-Free) 13” MDP0046 EL5001IREZ-T13 (See Note) 20-Pin HTSSOP (Pb-Free) 13” MDP0048 NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pbfree peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020C. FN7376 Rev 2.00 January 31, 2005 Page 1 of 8 EL5001 Pinouts 16 NC 17 VH 18 GND 19 TRI 20 EN EL5001 [20-PIN QFN (4MM X 4MM)] TOP VIEW IN1 1 15 OUT1 IN2 2 14 OUT2 THERMAL PAD IN3 3 13 OUT3 FN7376 Rev 2.00 January 31, 2005 OUT6 10 VL 9 11 OUT5 INV2 8 IN5 5 INV1 7 12 OUT4 IN6 6 IN4 4 EL5001 (20-PIN HSSOP) TOP VIEW TRI 1 20 GND EN 2 19 VH IN1 3 18 OUT1 IN2 4 17 OUT2 IN3 5 IN4 6 THERMAL PAD 16 OUT3 15 OUT4 IN5 7 14 OUT5 IN6 8 13 OUT6 INV1 9 12 VL INV2 10 11 NC Page 2 of 8 EL5001 Absolute Maximum Ratings (TA = 25°C) Supply Voltage between VSD and GND . . . . . . . . . . . . . . . . . . .18V Maximum Continuous Output Current . . . . . . . . . . . . . . . . . . . 50mA Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER VH = 10V, VL = -5V, EN = 3V, unless otherwise specified. DESCRIPTION CONDITION MIN TYP MAX UNIT EN = 3V, INX = 0V 750 1200 µA EN = 3V, INX = 3V 250 500 µA EN = 0V, INX = 0V 3 POWER SUPPLY IS Supply Current IS_DIS Supply Current - Disabled VLR VL Range -13 0 V VHR VH Range 5 18 V VH-VL Maximum VH - VL Range 0 18 V µA INPUT VIH Logic ‘1’ Input Voltage IIH Logic ‘1’ Input Current VIL Logic ‘0’ Input Voltage IIL Logic ‘0’ Input Current 0.1 CIN Input Capacitance 3.5 pF RIN Input Resistance 50 M 9.88 V 2.0 V 0.1 10 µA 0.8 V 10 µA OUTPUT VOH VOUTL High INX = 10V, IL = 10mA VOL VOUTL Low INX = 0V, IL = -10mA ROH On Resistance VH to OUT ROL On Resistance VL to OUT IPEAK Peak Output Current 500 IL Out Leakage Current 0.1 0.5 µA 9.80 -4.90 -4.88 V IL = 50mA 11 15  IL = 50mA 11 15  mA SWITCHING CHARACTERISTICS tR Rise Time CL = 500pF 20 35 ns tF Fall Time CL = 500pF 20 35 ns tRFD TR, TF Matching CL = 500pF 5 ns tD+ Turn On Delay CL = 500pF 55 ns tD- Turn Off Delay CL = 500pF 55 ns tDD tD+, tD-, Matching CL = 500pF 5 ns tEN Enable Time 9.8 µs tDIS Disable Time 2.2 µs FN7376 Rev 2.00 January 31, 2005 Page 3 of 8 EL5001 RL=0 CL=500pF VS=V-=0V VS=V+=18V RISE TIME T=37.55ns VOLTAGE (1V/DIV) VOLTAGE (1V/DIV) Typical Performance Curves TIME (40ns/DIV) TIME (40ns/DIV) RISE TIME T=23.63ns FIGURE 2. FALL TIME OUTPUT 6VP-P VOLTAGE (2V/DIV) VOLTAGE (2V/DIV) FIGURE 1. RISE TIME OUTPUT 6VP-P RL=0 CL=500pF VS=V-=0V VS=V+=18V TIME (20ns/DIV) TIME (20ns/DIV) FIGURE 5. RISE TIME OUTPUT 5VP-P FN7376 Rev 2.00 January 31, 2005 FIGURE 4. FALL TIME OUTPUT 12VP-P VOLTAGE (2V/DIV) VOLTAGE (2V/DIV) RISE TIME T=40.08ns FALL TIME T=22.93ns RL=0 CL=500pF VS=V-=0V VS=V+=18V TIME (20ns/DIV) FIGURE 3. RISE TIME OUTPUT 12VP-P RL=0 CL=500pF VS=V-=0V VS=V+=18V FALL TIME T=29ns RL=0 CL=500pF VS=V-=0V VS=V+=18V RL=0 CL=500pF VS=V-=0V VS=V+=18V FALL TIME T=30.57ns TIME (20ns/DIV) FIGURE 6. FALL TIME OUTPUT 5VP-P Page 4 of 8 EL5001 Typical Performance Curves (Continued) DISABLE T=2.2µs CH2 VOLTAGE (1V/DIV) VOLTAGE (1V/DIV) CH2 CH3 RL=0 CL=500pF VS=V-=0V VS=V+=18V ENABLE T=9.8µs CH3 RL=0 CL=500pF VS=V-=0V VS=V+=18V TIME (10µs/DIV) TIME (10µs/DIV) FIGURE 8. ENABLE RESPONSE VOLTAGE (CH1-1V/DIV)(CH2-5V/DIV) VOLTAGE (CH1-1V/DIV)(CH2-5V/DIV) FIGURE 7. DISABLE RESPONSE CH2 TURN-OFF T=90ns CH3 RL=0 CL=500pF VS=V-=0V VS=V+=18V TURN-ON T=90ns CH2 CH3 RL=0 CL=500pF VS=V-=0V VS=V+=18V TIME (100ns/DIV) TIME (100ns/DIV) RL=0 CL=500pF VS=V-=0V VS=V+=18V CH3 1.78V FIGURE 10. TURN-ON (TRI) 1.32V GROUND CH2 TIME (2µs/DIV) FIGURE 11. ENABLE/DISABLE THRESHOLD FN7376 Rev 2.00 January 31, 2005 VOLTAGE (2V/DIV) VOLTAGE (CH2-5V/DIV)(CH3-1V/DIV) FIGURE 9. TURN-OFF (TRI) RL=0 CL=500pF VS=V-=0V VS=V+=18V PROPAGATION DELAY T=52ns TIME (40ns/DIV) FIGURE 12. PROPAGATION DELAY Page 5 of 8 EL5001 Typical Performance Curves (Continued) 150 RL=0 100 CL=500pF 50 0 IIN (mA) VOLTAGE (200mV/DIV) RL=0 CL=500pF VS=V-=0V VS=V+=18V MAXIMUM SKEW=5.0ns -50 -100 -150 -200 -250 -300 -2 -1 0 1 TIME (10ns/DIV) TS S 35 ° 1.5 O C P2 /W POWER DISSIPATION (W) POWER DISSIPATION (W) H JA = 2 0 1 0.5 0 1 0 25 50 75 85 100 125 0.7  JA 0.6 0.5 8 0.4 H TS S = 1 OP 25 2 °C 0 /W 0.3 0.2 0 150 0 25 3 POWER DISSIPATION (W)  (4 Q m F m N =1 x 4 20 50 m ° C m) /W JA 0.5 0.4 0.3 0.2 0.1 0 25 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 17. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE FN7376 Rev 2.00 January 31, 2005 75 85 100 125 150 AMBIENT TEMPERATURE (°C) JEDEC JESD51-3 AND SEMI G42-88 (SINGLE LAYER) TEST BOARD 0.6 50 FIGURE 16. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 0.7 667mW POWER DISSIPATION (W) 7 800mW 0.8 AMBIENT TEMPERATURE (°C) 0 6 0.1 FIGURE 15. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 0.8 5 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 0.9 3 2.857W  4 FIGURE 14. INPUT CURRENT vs VOLTAGE JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - HTSSOP EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 2.5 3 VIN (V) FIGURE 13. SKEW 3.5 2 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - QFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 2.500W 2.5 2  (4 Q m F m N 2 =4 x 4 0 0° mm C /W ) JA 1.5 1 0.5 0 0 25 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 18. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Page 6 of 8 EL5001 EL5001 Test Board Circuit Layout TRI R1 FERRITE BEAD 50 EN C2 33nF R11 3.3 R2 OPEN IN1 R3 1 TRI GND 20 50 2 EN VH 19 R4 3 IN1 OUT1 18 50 4 IN2 OUT2 17 R5 5 IN3 OUT3 16 50 6 IN4 OUT4 15 7 IN5 OUT5 14 8 IN6 OUT6 13 VS+ D1 MBRM120LT3 + C3 L 1 4.7µF C7 500pF OUT1 IN2 C8 500pF OUT2 IN3 R6 50 IN4 R7 50 IN5 9 INV1 VL 12 10 INV2 NC 11 C9 500pF C10 500pF C11 500pF R8 C12 500pF 50 IN6 R9 OUT3 OUT4 OUT5 OUT6 FERRITE BEAD 50 C5 33nF R12 3.3 INV1 R10 OPEN + C6 L 2 4.7µF VSD2 MBRM120LT3 INV2 GND Block Diagram OE VH VS+ INPUT GND LEVEL SHIFTER 3-STATE CONTROL OUTPUT VSVL FN7376 Rev 2.00 January 31, 2005 Page 7 of 8 EL5001 Applications Information Power Dissipation Calculation The EL5001, a six channel high performance buffer, is directed primarily as a clock driver to LPTS LCD display applications. The six input channels are grouped into one group of four inputs and one group of two inputs each with a single pin (INV1 or INV2) to toggle the polarity from inverting to non-inverting. Each channel consists of a single Nchannel low side driver and single P-channel high side driver. These 11 devices pull the output to either the high or low voltage on VH and VL respectively, depending on the logic input signal. When switching at high speeds, or driving heavy loads, the EL5001 drive capability is limited by the rise in die temperature brought about by internal power dissipation. For reliable operation die temperature must be kept below TJMAX (125°C). It is necessary to calculate the power dissipation for a given application prior to selecting package type. A common 3-state pin is available that when activated will pull all 6-channel outputs to the high impedance state. Enable and disable pins turn shutdown both inputs and outputs. Timing plots for 3-state, enable, and disable functions are included in the characterization documentation. The EL5001 is available in either a 20-pin HTSSOP or QFN (4mm x 4mm) packages to provide a choice for power dissipation considerations. Supply Voltage and Input Compatibility Power dissipation may be calculated: 4 2 2 PD =  V S  I S  +    C INT  V S  f  +  C L  V OUT  f  1 where: VS = Total power supply to the EL5001 (from VS+ to VS-) VOUT = Swing on the output (VH - VL) CL = Load capacitance CINT = Internal load capacitance (80pF max) IS = Quiescent supply current (3mA max) f = Frequency The EL5001 is designed to operate at a maximum potential range from 0V to 18V. Because the EL5001 does not contain a true analog switch, the positive supply must always be 4V higher than the negative supply. Having obtained the application's power dissipation, the maximum junction temperature can be calculated: All input pins are compatible with both 3V and 5V CMOS signals. With the positive supply set to VS = 5V the EL5001 is compatible with TTL inputs. where: T JMAX = T MAX +  JA  PD TJMAX = Maximum junction temperature (125°C) Power Supply Bypassing Due to the high switching currents generated by the EL5001 power supply bypassing is very important on both the positive and negative supplies. A 4.7µF tantalum capacitor can be used in parallel with a 0.1µF low-inductance ceramic MLC capacitor. As with all bypass components, these should be placed as close as possible to the supply pins. We also recommend the VL and VH pins have some level of bypassing especially when the device is driving highly capacitive loads. TMAX = Maximum ambient operating temperature PD = Power dissipation calculated above JA = Thermal resistance, junction to ambient, of the application (package + PCB combination) © Copyright Intersil Americas LLC 2004-2005. All Rights Reserved. All trademarks and registered trademarks are the property of their respective owners. For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil may modify the circuit design and/or specifications of products at any time without notice, provided that such modification does not, in Intersil's sole judgment, affect the form, fit or function of the product. Accordingly, the reader is cautioned to verify that datasheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com FN7376 Rev 2.00 January 31, 2005 Page 8 of 8